Multi-functional high-current circuit board

Abstract

A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer.

Claims

1. A multifunctional high current circuit board comprising: a. a high-current-conducting layer that includes a high current-carrying structure: and b. a switching layer that includes: two switching sub-layers electrically and thermally connected to the high current-carrying structure, and at least two heat sources arranged adjacent to one another, disposed below the two switching sub-layers, wherein the two switching sub-layers are configured to carry high current potentials; wherein the two switching sub-layers are interconnected by at least one micro through-hole plating; wherein high current-carrying potentials are conducted into the switching layer; and a monolithic passive cooling element configured to overlay the at least two heat sources, wherein the passive cooling element defines first and second partially enclosed spaces for receiving a first and a second of the at least two heat sources, respectively, wherein an interior of the first enclosed space is configured to compliment an outside surface of the first heat source, and an interior of the second enclosed space is configured to complement an outside surface of the second heat source to thereby efficiently draw heat generated by the respective heat sources away from the heat sources.

2. The multifunctional high current circuit board of claim 1, wherein the at least one heat source comprises an electrolyte capacitor and/or a power switch.

3. The multifunctional high current circuit board of claim 1, wherein the passive cooling element is at least in some sections attached to the high current circuit board by a heat-conducting medium.

4. The multifunctional high current circuit board of claim 1, wherein the passive cooling element is directly connected to one or both of: at least one of the at least two heat sources and the two switching sub-layers via a thermal connecting element.

5. The multifunctional high current circuit board of claim 4, wherein the thermal connecting element is a sealing compound and/or a heat-conducting medium.

6. The multifunctional high current circuit board of claim 1 further comprising an active cooling element.

7. The multifunctional high current circuit board of claim 6, wherein the active cooling element is designed as a cooling fan or as cooling water pump.

8. The multifunctional high current circuit board of claim 6, wherein the active cooling element is connected to the at least one heat source via a thermal connecting element and/or via a passive cooling element.

9. The multifunctional high current circuit board of claim 1, wherein the passing cooling element is designed as a heat dissipation layer.

10. The multifunctional high current circuit board of claim 1, wherein the passive cooling element is at least in some sections attached to the high current circuit board by a heat-conducting medium.

11. The multifunctional high current circuit board of claim 3, wherein the passive cooling element is directly connected to the one or both of: at least one of the at least two heat source and the two switching sub-layers via a thermal connecting element.

12. The multifunctional high current circuit board of claim 11, wherein the thermal connecting element is a sealing compound and/or a heat-conducting medium.

13. The multifunctional high current circuit board of claim 6, wherein the active cooling element is arranged adjacent to the at least one heat source.

14. The multifunctional high current circuit board of claim 13, wherein the active cooling element is designed as a cooling fan or as cooling water pump.

15. The multifunctional high current circuit board of claim 7, wherein the active cooling element is connected to the at least one heat source via a thermal connecting element and/or via a passive cooling element.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Further characteristics, advantages and details of the invention can be derived from the following description of exemplary embodiments by means of the drawing.

(2) It is shown:

(3) FIG. 1a schematic cross-sectional depiction of a multifunctional high current circuit board according to the invention,

(4) FIG. 2in accordance with FIG. 1, an enlarged section of a detail of a multifunctional high current circuit board according to a further embodiment and

(5) FIG. 3a schematic depiction of the heat flux for the high current circuit board according to FIG. 2.

DETAILED DESCRIPTION OF THE DRAWINGS AND THE PRESENTLY PREFERRED EMBODIMENTS

(6) Components that are corresponding to each other in FIGS. 1 to 3 are given the same reference signs. Individual features in the embodiments that are explained in more detail in the following can also present an invention as such or be part of a subject-matter of the invention.

(7) A multifunctional high current circuit board 1, as it is depicted in FIG. 1, is mainly a planar component. Planar means, that a longitudinal expansion and a width expansion is much larger respectively than an expansion of the thickness. The longitudinal and width expansion of the high current circuit board 1 is particularly larger than the expansion of the thickness at least by the factor 5, in particular at least by the factor 10, in particular at least by the factor 20 and in particular at least by the factor 50. The expansion of the thickness of the high current circuit board 1 is symbolized by the double arrow 2 in FIG. 1.

(8) Along the thickness direction 2, the high current circuit board 1 comprises a switching layer 3, a current-conducting layer 4 and a control layer 5. The switching layer 3, the current-conducting layer 4 and the control layer 5 enable the multifunctionality of the high current circuit board. Each one of the layers 3, 4, 5 particularly enable at least one basic function of the high current circuit board 1, namely switching, conducting or controlling of the electrical current.

(9) The control layer 5 comprises two control sub-layers 6. An insulating layer 7 is arranged between the control sub-layers 6. The insolating layer 7 prevents the direct flow of electrical current between the adjacent control sub-layers 6. The insulating layer 7 is particularly designed as a plastic material structure between the two control sub-layers 6. In the expansion of the thickness 2, the control sub-layers 6 are electrically separated from each other by means of the insulating layer 7.

(10) At least one contacting element 8 is connected to the control sub-layer 6 that is facing away from the current-conducting layer 4. The control sub-layers 6 as such are known from the prior art. As an example, the control sub-layers 6 are interconnected by means of not depicted, micro through-hole platings that are filled with copper. The contacting element 8 is particularly arranged at an open surface of the high current circuit board 1. The contacting element 8 can easily be connected to in a direct and thus uncomplicated manner at the outer control sub-layer 6 of the control layer 5. The contacting of the high current circuit board 1 is simplified.

(11) The current-conducting layer 4 features a high current-carrying structure 9. The high current-carrying structure 9 particularly comprises several, not individually depicted current-conducting layers. It is essential that are least two current-conducting layers are provided. It is advantageous if an evenly numbered amount of current-conducting layers are provided. The current-conducting layers have the function to supply and dissipate the electrical current from and to a power source. The current-conducting layers are particularly made as copper layers and especially as thick film copper layers. The current-conducting layer 4 is also referred to as thick film copper layer or thick film copper section. An insulating layer 7 can be arranged between two adjacent current-conducting layers. The high current-carrying structure 9 is electromagnetically shielded against the control layer 5 by means of a first shielding layer 10. The high current-carrying structure 9 is electromagnetically shielded against the switching layer 3 by means of a second shielding layer 11.

(12) Switching layer 3 comprises two switching sub-layers 12. The switching sub-layers 12 are electrically separated from each other by means of an insulating layer 7. The switching sub-layers 12 are interconnected by means of several micro through-hole platings 13. The micro through-hole platings 13 are filled with copper. The switching sub-layers 12 that are interconnected by means of the micro through-hole platings 13 form a heat dissipation layer with an increased copper cross-section. The heat dissipation within the interconnected switching sub-layers 12 is improved. The switching sub-layers 12 are directly connected to the high current-carrying structure 9 of the current-conducting layer 4 by means of several feed throughs 14. A heat source in form of a power switch 15 is connected to the interconnected switching sub-layers 12. The power switch 15 is designed as a High-Side-(HS-)Switch. Alternatively, the power switch 15 can be designed as a Low-Side-(HS-)Switch. The power switch 15 connects the high current-carrying potentials of the switching sub-layers 12 in the switching layer 4 to a not depicted high current battery, in particular to DC+, by means of the contacting.

(13) Since high current-carrying potentials can be applied to the two adjacent switching sub-layers 12 and since the switching sub-layers 12 are interconnected by means of micro through-hole platings 13, an enlarged copper cross-section is provided for heat dissipation. The heat dissipation is improved.

(14) In the following, another embodiment of a high current circuit board 16 is explained. The switching layer 17 of the high current circuit board 16 is depicted in FIG. 2. Due to representational reasons, the remaining structure, in particular the current-conducting layer 4 and the control layer 5, is not depicted. The current-conducting layer 4 and the control layer 5 are arranged in accordance with the first embodiment. In contrast to the first embodiment, the connections to the high current battery are arranged in an alternating manner within the switching layer 17. The connections to the high current battery DC+ 18 and DC 19 are depicted in a symbolic manner in FIG. 2.

(15) A further difference to the first embodiment is a passive cooling element 20, which is arranged as a heat dissipation layer. The heat dissipation layer 20 is connected to the high current circuit board 16 by means of a heat conducting medium and facilitates heat dissipation.

(16) In addition to the power switch 15, an electrolyte capacitor 21 is provided as additional heat source for the high current circuit board 16. The electrolyte capacitor 21 is directly connected to the connectors 18, 19. The electrolyte capacitor 21 is attached to the passive cooling element 20 via a sealing compound 22. The sealing compound 22 functions as a thermal connecting element. A further thermal connecting element is a heat-conducting medium 23, which is particularly arranged between the high current battery connectors 18, 19 and the passive cooling element 20, between the switching sub-layers 12 and the passive cooling element 20 as well as between the power switch 15 and the passive cooling element 20. The sealing compound 22 and the heat-conducting medium 23 are thermal connecting elements.

(17) An active cooling element 24 is arranged adjacent to the power switch 15 and/or to the electrolyte capacitor 21. The active cooling element 24 is designed e.g. as a cooling water pump. The active cooling element 24 is attached to the electrolyte capacitor 21 and/or to the power switch 15 via the passive cooling element 20.

(18) The power switch 15 and the electrolyte capacitor 21 are heat sources.

(19) In the following, a heat flux that is occurring during the operation of the high current circuit board 16 is explained by means of FIG. 3. During the operation of the high current circuit board 16, the heat sources, i.e. the electrolyte capacitor 21 and the power switch 15, produce heat. A dissipation of the heat is carried out along the heat flux direction 25 that is depicted in a symbolic manner in FIG. 3. A substantial heat flux direction 25 is from the heat sources 15, 21 towards the active cooling element 24. The heat sources 15, 21 are particularly cooled on two sides. This ensures that impermissibly high temperatures occur at the power switch 15 and/or at the electrolyte capacitor 21. The two-sided cooling is made possible in that the heat can be dissipated in a horizontal direction through the optimized copper structure within the switching layer 17 along the switching sub-layers 12. A second additional heat flux is ensured via the passive cooling element 20 and the active cooling element 24 and in particular via the heat-conducting medium 23 or the sealing compound 22, which is arranged in between.

(20) The high current circuit board presents an optimized heat-conducting system. On the one hand, the heat dissipation structure is created by means of the integrated configuration of the high current-carrying potentials within the switching layer 17 and by means of the optimized attachment of cooling elements 20, 24. The high current circuit board can be used in high temperature applications and/or for applications of a circuit board with limited active cooling.

LIST OF REFERENCE SIGNS

(21) 1 High current circuit board

(22) 2 Expansion of the thickness

(23) 3 Switching layer

(24) 4 Current-conducting layer

(25) 5 Control layer

(26) 6 Control sub-layer

(27) 7 Insolating layer

(28) 8 Connecting element

(29) 9 High current-carrying structure

(30) 10 First shielding layer

(31) 11 Second shielding layer

(32) 12 Switching sub-layers

(33) 13 Micro through-hole platings

(34) 14 Feed through

(35) 15 Power switch

(36) 16 High current circuit board

(37) 17 Switching layer

(38) 18 DC+

(39) 19 DC

(40) 20 Passive cooling element

(41) 21 Electrolyte capacitor

(42) 22 Sealing compound

(43) 23 Heat-conducting medium

(44) 24 Active cooling element

(45) 25 Heat flux