Metamaterial Antenna Array With Isolated Antennas

Abstract

An antenna array that utilizes ground guard rings and metamaterial structures is disclosed. In certain embodiments, the antenna array is constructed from a plurality of antenna unit cells, wherein each antenna unit cell is identical. The antenna unit cell comprises a top surface, that contains a patch antenna and a ground guard ring. A reactive impedance surface (RIS) layer is disposed beneath the top surface and contains the metamaterial structures. The metamaterial structures are configured to present an inductance to the patch antennas, thereby allowing the patch antennas to be smaller than would otherwise be possible. In some embodiments, the metamaterial structures comprise hollow square frames. An antenna array constructed using this antenna unit cell has less coupling than conventional antenna arrays, which results in better performance. Furthermore, this new antenna array also requires less space than conventional antenna arrays.

Claims

1. An antenna unit cell, comprising: a top surface, comprising a patch antenna and a ground guard ring surrounding the patch antenna; a reactive impedance surface (RIS) layer disposed beneath the top surface, wherein the RIS layer comprises metamaterial structures; and a ground layer disposed beneath the RIS layer, wherein vias electrically connect the ground guard ring to the ground layer.

2. The antenna unit cell of claim 1, wherein the RIS layer is immediately adjacent to the top layer.

3. The antenna unit cell of claim 2, wherein the ground layer is immediately adjacent to the RIS layer.

4. The antenna unit cell of claim 1, wherein the metamaterial structures comprise hollow square frames.

5. The antenna unit cell of claim 1, wherein an integral number of metamaterial structures are disposed on the RIS layer in an area defined by the ground guard ring.

6. The antenna unit cell of claim 5, wherein the integral number is N.sup.2, wherein N is an integer.

7. The antenna unit cell of claim 1, further comprising a RIS ground guard ring disposed on the RIS layer, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer.

8. An antenna array comprising a plurality of the antenna unit cells of claim 1.

9. The antenna array of claim 8, comprising N×M antenna unit cells, wherein at least one of N and M is greater than 1.

10. An antenna unit cell, comprising: a top surface, comprising a patch antenna and a ground guard ring surrounding the patch antenna; a reactive impedance surface (RIS) layer disposed beneath the top surface, wherein the RIS layer comprises metamaterial structures; a ground layer disposed beneath the RIS layer, wherein vias electrically connect the ground guard ring to the ground layer; and one or more unused metal layers disposed between the top surface and the RIS layer and/or between the RIS layer and the ground layer.

11. The antenna unit cell of claim 10, further comprising a RIS ground guard ring disposed on the RIS layer, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer.

12. The antenna unit cell of claim 10, wherein the metamaterial structures comprise hollow square frames.

13. The antenna unit cell of claim 10, wherein an integral number of metamaterial structures are disposed on the RIS layer in an area defined by the ground guard ring.

14. The antenna unit cell of claim 13, wherein the integral number is N.sup.2, wherein N is an integer.

15. The antenna unit cell of claim 10, wherein one or more unused metal layers are disposed between the top surface and the RIS layer and between the ground layer and the RIS layer.

16. The antenna unit cell of claim 10, further comprising auxiliary ground guard rings disposed on at least one of the one of more unused metal layers, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer.

17. An antenna array comprising a plurality of the antenna unit cells of claim 10.

18. The antenna array of claim 17, comprising N×M antenna unit cells, wherein at least one of N and M is greater than 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] For a better understanding of the present disclosure, reference is made to the accompanying drawings, in which like elements are referenced with like numerals, and in which:

[0015] FIG. 1 shows an exploded view of the structure of one antenna unit cell in the antenna array;

[0016] FIG. 2 shows a top view of the antenna array;

[0017] FIG. 3 shows a top view of the patch antenna and ground guard ring;

[0018] FIG. 4 shows a top view of the RIS layer and metamaterial structures;

[0019] FIG. 5A shows an exploded view of the structure of one antenna unit cell according to another embodiment;

[0020] FIG. 5B shows an exploded view of the structure of one antenna unit cell according to a third embodiment;

[0021] FIG. 6 shows a top view of the RIS layer and metamaterial structures for the antenna unit cell shown in FIG. 5A;

[0022] FIG. 7 is a graph showing the return loss of each antenna in a 4×4 antenna array;

[0023] FIG. 8 shows the phase for each antenna in a 4×4 antenna array applying separate vertical and horizontal polarized signals; and

[0024] FIG. 9 shows a comparison of various parameters for the present antenna array and a conventional antenna array.

DETAILED DESCRIPTION

[0025] FIG. 1 shows an exploded view of one antenna unit cell 10 that may be part of an antenna array. FIG. 2 shows a top view of an antenna array utilizing a plurality of antenna unit cells 10.

[0026] As shown in FIG. 1, the structure of the antenna unit cell 10 utilizes three layers of a conventional printed circuit board. Other layers of the printed circuit board may be used to provide power planes, additional ground layers and signal layers. FIG. 3 is a top view of the top surface of the printed circuit board. FIG. 4 is a top view of the RIS layer 60.

[0027] The top surface of the printed circuit board is used for the patch antenna 20, while a lower layer is used for the ground layer 80. A reactive impedance surface (RIS) layer 60 is disposed beneath the top surface and above the ground layer 80. In certain embodiments, the RIS layer 60 is the layer immediately adjacent to the top surface. In some embodiments, the ground layer 80 is the layer immediately below the RIS layer 60, such that the top layer, the RIS layer 60 and the ground layer 80 are adjacent.

[0028] In other embodiments, there may be one or more intermediate layers between the RIS layer 60 and the ground layer 80, if thicker dielectric is required between them. In certain embodiments, no metal is disposed on these intermediate layers, except another instantiation of the top guard ring.

[0029] As stated above, in certain embodiments, a patch antenna 20 is disposed on the top layer of the printed circuit board. The patch antenna 20 may be square such that the patch antenna 20 may be used to receive and transmit both horizontally and vertically polarization signals. The size of the patch antenna 20 is typically defined by the desired resonant frequency, the thickness of the printed circuit board and the dielectric constant of the printed circuit board. In RIS antenna cell structures, additional tuning knobs may include the dielectric thickness between the patch antenna 20 and the RIS layer 60 and between the RIS layer 60 and the ground layer 80. Also, additional tuning knobs are the metamaterial structure frame size and width on the RIS layer.

[0030] The patch antenna 20 may be made of copper or another conductive material. The process of creating a plated area on a surface of a printed circuit board is well known.

[0031] As best seen in FIG. 3, in certain embodiments, the patch antenna 20 comprises two signal vias 40 which are used to electrically connect the patch antenna 20 to a signal layer or multiple signal layers. All signal layers are situated beneath the ground layer 80. In certain embodiments, the signal vias 40 pass through the ground layer 80 to a signal layer that is disposed beneath the ground layer 80. In certain embodiments, each signal via 40 may be disposed at or near the midpoint of the patch antenna 20 in one direction near an edge of the patch antenna 20. In this way, the patch antenna 20 may be used to transmit and receive horizontally and vertically polarized signals. In embodiments where only one polarization is required, only one signal via 40 may be used. In other embodiments, the one signal via 40 may be situated at the diagonal of the patch to generate circular polarized signal.

[0032] A ground guard ring 30 is disposed around the perimeter of the patch antenna 20. In certain embodiments, the ground guard ring 30 may be a hollow square frame, having a thickness of at least the half of the total thickness between the top layer and the ground layer 80. The inner dimension of the ground guard ring is larger than the outer dimension of the patch antenna 20, such that there may be a gap 25 separating the patch antenna 20 from the ground guard ring 30 on all sides. In certain embodiments, the gap 25 may be approximately three times the total thickness between the top layer and the ground layer 80 or higher.

[0033] As can be seen in FIG. 1, the ground guard ring 30 is electrically connected to the ground layer 80 using a plurality of vias 50, which are electrically conductive. These vias 50 extend from the top surface to the ground layer 80. In certain embodiments, the distance between adjacent vias 50 may be less than λ/8, where λ is the wavelength of interest.

[0034] Beneath the top surface is the RIS layer 60, which is also shown in FIG. 4. The RIS layer 60 comprises a plurality of periodic metamaterial structures 70, shaped so as to realize a reactive impedance for incident electromagnetic waves. Metamaterial is the term given to any material engineered (typically by varying its shape) to provide electromagnetic properties that are not found in the base material. These metamaterial structures 70 may be many different shapes, including a Hilbert fractal inclusion of a second-, third-, or fourth-order, a rectangular spiral, a square spiral, a rectangular ring, or a split ring resonator.

[0035] In one particular embodiment, the metamaterial structure 70 may be a hollow square frame, having an outer dimension and an inner dimension that defines a hollow interior portion 75. The width of the frame, defined as one half of the difference between the outer dimension and the inner dimension, may be adjusted to tune the resonant frequency of the metamaterial structure 70. Again, the dimensions of the metamaterial structure 70 may depend on the resonant frequency, the dielectric constant of the printed circuit board, the thickness of the dielectric between the RIS layer 60 and ground layer 80, the thickness of the applied metal, the spacing between the consecutive metamaterial structures and width of the frame of the metamaterial structures 70.

[0036] In certain embodiments, the metamaterial structures 70 are sized such that an integral number of these structures may be arranged in the area defined by the ground guard ring 30 on the top surface of the printed circuit board. In certain embodiments, this integral number may be N.sup.2, where N is an integer. In other embodiments, this integral number may be N×M, where N and M are integers. In FIG. 1, it can be seen that four metamaterial structures 70 are disposed in the area defined by the ground guard ring 30 on the top surface. However, the disclosure is not limited to this embodiment. Further, as shown in FIG. 4, the vias 50 that connect the ground guard ring 30 to the ground layer 80 may be seen around the perimeter of the metamaterial structures. Additionally, the signal vias 40 are also shown. Note that if N is even, the signal vias 40 may pass between two adjacent metamaterial structures 70.

[0037] A top view of the antenna array is shown in FIG. 2. In this figure, there are 16 antenna unit cells 10, arranged as a 4×4 array. Note that the ground guard ring 30 surrounds each patch antenna 20. Further, note that the RIS layer 60 is aligned with the top surface, such that the configuration of the RIS layer 60 in each antenna unit cell 10 is identical. Of course, the antenna array may have an arbitrary number of antenna unit cells, and is not limited to this embodiment. For example, the antenna array may comprise N×M antenna unit cells 10, where at least one of N and M is greater than 1.

[0038] FIG. 5A shows a variation of the antenna unit cell 11 that is shown in FIG. 1. In this variation, there is a RIS ground guard ring 65 surrounding the metamaterial structures 70 on the RIS layer 60 to further improve the isolation. This RIS ground guard ring 65 may have the same dimensions as the ground guard ring 30 on the top surface and may be vertically aligned with that ring. This is also shown in FIG. 6. Note that in this embodiment, the vias 50 connect the ground guard ring 30 to the RIS ground guard ring 65 and to the ground layer 80. The rest of the antenna unit cell 11 is as described above. In this embodiment, the gap between the metamaterial structures 70 and the RIS ground guard ring 65 should be at least the dielectric thickness between the RIS layer 60 and the ground layer 80 to avoid any effect on the RIS resonant frequency. If the gap is smaller, then it shifts the RIS resonant frequency down, but also degrades the radiation efficiency.

[0039] FIG. 5B shows another variation of the antenna unit cell 11 that is shown in FIG. 1. In this variation, a 6 layer PCB is used to allow more flexibility in the design and some of the metal layers left unused beneath the antennas for better radiation. Of course, more layers may be used. Thus, practically, some of the dielectric layers are unified by this way to form a thicker dielectric layer. Optionally, auxiliary ground guard rings 66 can be applied in these unused metal layers as well. That is advantageous for two reasons. First, these auxiliary ground guard rings 66 further improve the isolation between antenna unit cells 11. Second, these additional auxiliary ground guard rings 66 makes the PCB manufacturing more balanced from PCB tension point of view: as leaving metal layers fully unused may cause metal unbalance and thus, unwanted mechanical tensions in the PCB. In FIG. 5B, the unused metal layers are disposed on opposite sides of the RIS layer 60. However, the unused layers may be disposed in other locations. For example, the unused metal layers may only be disposed between the top surface and the RIS layer 60 or only between the RIS layer 60 and the ground layer 80.

[0040] Thus, the present disclosure describes an antenna unit cell that utilizes three layers of a printed circuit board. The top layer comprises a patch antenna 20 and a ground guard ring 30 that surrounds the patch antenna 20. Beneath the top layer comprises a RIS layer 60 that comprises an integral number of metamaterial structures 70 that fit within the area defined by the ground guard ring 30 on the top layer. In some embodiments, the RIS layer 60 also includes a RIS ground guard ring 65. Below the RIS layer 60 is the ground layer.

[0041] Thus, in one embodiment, the present disclosure describes an antenna array that a utilizes a plurality of antennas wherein each antenna includes a ground guard ring and metamaterial structures disposed on a RIS layer.

[0042] Additionally, in another embodiment, the present disclosure describes an antenna unit cell, which is modular in design. In other words, an antenna array may be constructed simply by arranging the desired number of antenna unit cells 10 next to one another in one or two perpendicular directions. The metamaterial structures 70 are dimensioned such that an integral number of structures are contained in the area defined by the ground guard ring 30. In this way, the antenna unit cell is identical for each antenna in the antenna array.

[0043] Importantly, the RIS layer 60 has the effect of presenting a larger inductance. Therefore, a smaller patch antenna, having lower capacitance, can achieve the same resonant frequency as a larger patch antenna that does not utilize the RIS layer 60.

[0044] In one particular embodiment, the antenna array may be designed to transmit and receive radio frequency signals having a nominal frequency of about 2.45 GHz. This is the frequency used for many wireless protocols, including Bluetooth, WiFi, Zigbee, Thread and other 802.15.4 protocols.

[0045] In these embodiments, the patch antenna 20 may be a square having a dimension of 22×22 mm. Further, in these embodiments, the inner dimension of the metamaterial structure 70 may be 4×4 mm, while the outer dimension may be 16×16 mm. In certain embodiments, each of the metamaterial structures 70 may be dimensioned such that a side of the square structure is close to λ/4. This dimension may vary based on the distance between adjacent metamaterial structures and also on the cumulative dielectric thickness between the RIS layer 60 and the ground layer 80.

[0046] In some embodiments, the antenna array may be used in conjunction with an Angle of Arrival or Angle of Departure (collective, AoX) algorithm to determine a location of another wireless device. Various algorithms exist to determine the AoX of another device. For example, the MUSIC algorithm creates a one or two dimensional graph, depending on the configuration of the antenna array, where each peak on the graph represents a direction of arrival for an incoming signal. This one or two dimensional graph may be referred to as a pseudo-spectrum. The MUSIC algorithm calculates a value for each point on the graph.

[0047] In addition to the MUSIC algorithm, other algorithms may also be used. For example, the Minimum Variance Distortionless Response (MVDR) beamformer algorithm (also referred to as Capon's beamformer), the Bartlett beamformer algorithm, and variations of the MUSIC algorithm may also be used. In each of these, the algorithms use different mathematical formulas to calculate the angle of arrival.

[0048] This system and method have many advantages.

[0049] The use of a RIS layer 60, in conjunction with ground guard rings results in a smaller antenna array with improved performance.

[0050] First, with respect to size, a conventional antenna array, optimized for operation at 2.45 GHz, may utilize patch antennas that are each 27.50 mm squares, and are spaced apart by 12.5 mm. Thus, a conventional 4×4 antenna array may consume an area of about 170 mm×170 mm. In contrast, each of the present antenna unit cells, operating at the same frequency, has an area of 37.5 mm×37.5 mm. Thus, a 4×4 antenna array only occupies an area of about 150 mm×150 mm. Thus, the new antenna array consumes less than 80% of the area of a conventional antenna array.

[0051] Second, with respect to performance, as shown in FIG. 7, in one embodiment that utilizes a 4×4 antenna array configured to operate at 2.45 GHz, all of the antennas in the array have a return loss of less than −10 dB over the frequency range from 2.4 GHz to 2.49 GHz. Thus, the bandwidth of the antenna array is wider than that of a conventional antenna array, by as much as 30-50%. Further, as shown in FIG. 8, due to the reduced coupling, the reflection phase difference between the different antennas at 2.45 GHz is about 10°. Further, in another test, it was found that the total radiation efficiencies of the various antennas in the array was within about 1 dB of one another. This is roughly 1 dB better than can be achieved with a conventional antenna array. In this disclosure, total radiation efficiency (E.sub.T) is defined as radiation efficiency (E.sub.R), multiplied by the impedance mismatch loss (M.sub.L). Further, radiation efficiency is defined as the radiated power (P.sub.RAD) divided by the input power (P.sub.INPUT); in other words:

E.sub.R=P.sub.RAD/P.sub.INPUT

[0052] Third, as described above, in certain embodiments, the antenna array is used in conjunction with an AoX algorithm. In each of these algorithms, the algorithm utilizes phase information from each of the plurality of antennas in the antenna array. Because the phase error of each antenna is reduced due to the ground guard rings, the results of an AoX calculation are much improved.

[0053] FIG. 9 illustrates all of the above benefits. As can be seen, the return loss at both band edges is about −10 dB for the present antenna, while the conventional array achieves less than −6 dB at the higher frequency. Furthermore, the variation in total radiation efficiency is much reduced with the present antenna, due to less spreading because of improved isolation between antennas. Lastly, the AoX estimations are much improved by the present antenna due to the reduced error because of better antenna unit cell isolation.

[0054] Additionally, the improved isolation between adjacent antenna unit cells simplifies the design and simulation of the antenna array. With this well isolated unit cell building block concept the return loss, the bandwidth, the radiation pattern and the gain and efficiency spreading are minimized. Further, these RF properties are stable everywhere within the antenna array. Consequently, it is sufficient to tune and properly design only the unit cell building block and not the whole array. This saves simulation process time and makes the array design much simpler.

[0055] The present disclosure is not to be limited in scope by the specific embodiments described herein. Indeed, other various embodiments of and modifications to the present disclosure, in addition to those described herein, will be apparent to those of ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Further, although the present disclosure has been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize that its usefulness is not limited thereto and that the present disclosure may be beneficially implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be construed in view of the full breadth and spirit of the present disclosure as described herein.