System and method for high power diode based additive manufacturing

Abstract

The present disclosure relates to a system for performing an Additive Manufacturing (AM) fabrication process on a powdered material (PM) forming a substrate. The system uses a first optical subsystem to generate an optical signal comprised of electromagnetic (EM) radiation sufficient to melt or sinter a PM of the substrate. The first optical subsystem is controlled to generate a plurality of different power density levels, with a specific one being selected based on a specific PM forming a powder bed being used to form a 3D part. At least one processor controls the first optical subsystem and adjusts a power density level of the optical signal, taking into account a composition of the PM. A second optical subsystem receives the optical signal from the first optical subsystem and controls the optical signal to help facilitate melting of the PM in a layer-by-layer sequence of operations.

Claims

1. A system for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate, the system comprising: a first optical subsystem for generating an optical signal comprised of electromagnetic radiation sufficient to melt or sinter a powdered material of the substrate, the first optical subsystem being controllable so as to generate a plurality of different power density levels, with a specific one of said power density levels being selectable based on a specific material forming a powder bed being used to form a 3D part; the first optical subsystem being able to generate the electromagnetic radiation with an average power density level of greater than 200 W/cm.sup.2 over a duration of the signal, and producing a beam having an area sufficient to illuminate at least a portion of the powdered material and to melt the powdered material; and at least one processor which dynamically controls the first optical subsystem, and is configured to adjust a power density level of the optical signal taking into account a composition of the powdered material; and a second optical subsystem arranged upstream of the powdered material, and downstream of the first optical subsystem, relative to a direction of travel of the optical signal, the second optical subsystem being configured to receive the optical signal from the first optical subsystem and to provide control over the optical signal to help facilitate melting of the powdered material in a layer-by-layer sequence of operations; and where the second optical subsystem comprises a relay telescope.

2. The system of claim 1, where the second optical subsystem comprises a relay telescope.

3. The system of claim 1, where the second optical subsystem generates the optical signal with a shape formed as a line focus.

4. The system of claim 1, where the first optical subsystem is comprised of one or more optical sources for generating the optical signal with its own controllable power supply which provides control over an output power of the first optical subsystem.

5. The system of claim 4, where the one or more optical sources is a laser.

6. The system of claim 4, where the one or more optical sources comprises an array of diode lasers including one or more bars of diode lasers.

7. The system of claim 4, wherein the one or more optical sources comprises a plurality of optical sources, where the output of the first optical subsystem is an array of optical signals from each one of the plurality of optical sources, forming a 2D array.

8. The system of claim 7, where the 2D array is comprised of an array of lines, where each said line is formed using at least one of the plurality of optical sources.

9. The system of claim 8, where each said source is controlled in the 2D array such that the output of the first optical subsystem is an image.

10. The system of claim 9, wherein: a full 2D image from the first optical subsystem is relayed to the powder bed by the relay telescope such that the full 2D image is incident on the powdered material and the specific one of the power density levels is tuned to melt the powdered material in a pattern corresponding to a full 2D image.

11. The system of claim 1, where a full 2D image from the first optical subsystem is relayed to the powder bed by the relay telescope such that the full 2D image is incident on the powdered material and the specific power density level is tuned to melt the powdered material in a pattern corresponding to a full 2D image.

12. The system of claim 9, wherein: the second optical subsystem forms a plurality of beams, each being formed as a line focus; and wherein a full 2D image is produced by the first optical subsystem and relayed by the first optical subsystem to the powder bed by the relay telescope, such that the full 2D image is incident on the powdered material and the specific power density level is tuned to melt the powdered material in a pattern corresponding to the full 2D image.

13. The system of claim 3, wherein: one or more of the lines of a full 2D image from the first optical subsystem is relayed to the powder bed; and the system further includes a second optical subsystem forming a plurality of beams, each one of said plurality of beams being formed as a line focus, such that each said beam formed as the line focus is incident on the powdered material and a power density level of the beams of the second optical subsystem is tuned to melt the powdered material in a pattern corresponding to the one or more lines.

14. The system of claim 10, further comprising a 2D mask configured to reside between the first and second optical subsystems.

15. The system of claim 7, further comprising a 2D mask configured to reside between the first and second optical subsystems.

16. The system of claim 14, wherein the 2D mask comprises a dynamic mask.

17. The system of claim 14, wherein the 2D mask comprises a non-addressable mask forming a static mask.

18. The system of claim 15, where the 2D mask comprises a dynamic mask.

19. The system of claim 15, where the 2D mask comprises a non-addressable mask forming a static mask.

20. An apparatus for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate, the apparatus comprising: a laser source for generating a laser beam providing electromagnetic radiation; an optical subsystem forming a relay telescope for shaping the laser beam into at least one line segment directed at the powdered material; the laser source being able to generate the electromagnetic radiation with an average power density level of greater than 200 W/cm.sup.2 which provides sufficient power to melt the powdered material; at least one processor which controls at least one of the laser source or the optical subsystem to adjust a power density level of the laser beam; and the line segment of the laser beam used to melt different linear segments of the powdered material, and repeating melting of additional linear segments of powdered material in a layer-by-layer sequence of operations using successively melted layers of the powdered material to form an additively manufactured part.

21. An apparatus for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate, the apparatus comprising: an optical subsystem including at least one laser source and a relay telescope for producing a plurality of simultaneously generated laser beam line segments directed at the powdered material; the laser source being able to generate the laser beam with an average power density level of greater than 200 W/cm.sup.2 which provides sufficient power to melt the powdered material; at least one processor which controls the optical subsystem to help adjust a power density level of the laser beam line segments; and the laser beam line segments being used to simultaneously melt different linear segments of the powdered material, and repeating melting of different linear segments in a layer-by-layer sequence of operations using successively melted layers of the powdered material to form an additively manufactured part.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In the drawings:

(2) FIG. 1 is a diagrammatic view of one embodiment of the present system and method for performing an Additive Manufacturing (“AM”) fabrication process using a high power diode array and a mask;

(3) FIG. 2 is a diagrammatic side view of the system of FIG. 1 showing how a portion of the optical rays from the diode array are reflected by a polarizing mirror during the fabrication process to prevent them from reaching the substrate;

(4) FIG. 3 is a chart illustrating the average power flux required to melt various types of metals;

(5) FIG. 4 is a graph that shows a plurality of curves representing various temperatures required to melt various materials, along with the time required to melt each material;

(6) FIG. 5 shows an alternative form of the system of the present disclosure in which distinct “tiles” (predetermined areas) corresponding to pixels of the substrate are digitally controlled during the AM fabrication process;

(7) FIG. 6 is another alternative form of the system of the present disclosure in which a plurality of focusing lenses are used to simultaneously focus the output from the diode array onto specific sections of the substrate for simultaneously melting distinct, separate sheets of material; and

(8) FIG. 7 is a diagrammatic side view of a method of deposition of different material types in powder form prior to illumination by diode array generated light to melt/sinter the dissimilar powders together.

DETAILED DESCRIPTION

(9) The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.

(10) Referring to FIG. 1 a system 10 is shown in accordance with one embodiment of the present disclosure for performing an Additive Manufacturing (“AM”) fabrication process. The system 10 may include a high power diode array 12 and a computer controlled, selective area mask 14 (hereinafter simply “mask 14”). A suitable power supply 16 may be used for providing electrical power to the diode array 12. A computer 18 or other suitable form of processor or controller may be used for controlling the power supply 16 to control the on/off application of power to the diode array 12 as well as selectively (i.e., digitally) controlling the mask 14 and shaping or focusing the optical beam. Optionally, separate processors or computers may be used to control the diode array 12 and the mask 14. Selectively electronically controlling the mask 14 with the computer 18 allows the optical beam from the diode array 12 to be prevented from reaching specific selected portions of powder that forms a substrate 20 (i.e., powder bed) so that those portions are irradiated by the beam. In FIG. 1 portion 15 is cross hatched to represent a portion of the output from the diode array 12 that does not reach the powdered material of the substrate 20.

(11) In one preferred form the diode array 12 may comprise a single large diode bar. Alternatively a plurality of diode bars located adjacent one another may be used to form the diode array 12. In one preferred form the diode array may be made up of arrays of diode bars each being about 1 cm×0.015 cm to construct a 25 cm×25 cm diode array. However, any number of diode bars may be used, and the precise number and configuration may depend on the part being constructed as well as other factors. Suitable diode bars for forming the diode array 12 are available from Lasertel of Tucson, Ariz., Oclaro Inc. of San Jose, Calif., nLight Corp. of Vancouver, Wash., Quantel Inc. of New York, N.Y., DILAS Diode Laser, Inc. of Tucson, Ariz., and Jenoptik AG of Jena, Germany, as well as many others. The diode array 12 is able to provide a minimum power density of about 10 kW/cm.sup.2 and maximum>100 kW/cm.sup.2 at two percent duty cycle. This makes it feasible to generate sufficient optical power to melt a wide variety of materials. FIG. 3 provides a table of the average power flux that has been calculated to melt various types of materials. FIG. 4 shows a graph that illustrates the effectiveness of the diode array 12 on a variety of metal powders (i.e., Aluminum, Titanium, Iron and Tungsten), at a power flux sufficient to melt all the materials. The calculations to obtain the graphs shown in FIG. 4 were performed in MATLAB with conductive and radiative losses taken into account. A conservative 30% absorptivity was assumed along with a powder layer thickness of 100 μm.

(12) It will also be appreciated that a significant advantage of using a diode array comprised of one or more diode bars is that such an assembly is readily scalable. Thus, diode arrays of various sizes can be constructed to meet the needs of making a specific sized part. For example, the diode array 12 may be constructed to have a one square meter area, which would allow correspondingly large scale components to be constructed through an AM fabrication process, provided of course that a suitably sized powder bed is available to support fabrication of the part. Another significant advantage is that the system 10 can be integrated into existing AM fabrication systems with the added benefit of no moving parts. The system 10 allows for the AM fabrication of traditionally difficult to fabricate and join metal such as ODS (oxide dispersion strengthened) steels or any alloy traditionally formed using solid state (i.e., non-melt) processing techniques.

(13) Referring to FIG. 2, in one preferred form the mask 14 forms a “liquid crystal polarization rotator” comprised of a liquid crystal module (LCM) 14a and a polarizing mirror 14b, in this example a polarizing mirror (hereinafter “polarizing mirror” 14b). The polarizing mirror 14b directs the light defined by the liquid crystal polarization rotator and shapes the optical pattern that irradiates the substrate 20. The LCM 14a that helps to form the mask 14 may be made up of one or more two dimensional, electronically (i.e., digitally) addressable arrays of pixels. Liquid crystal polarizers are commercially available and form two dimensional arrays of addressable pixels which work by changing the polarity of an incoming photon that is then rejected by a polarization element. However, with the system 10, the polarizing mirror 14b may form a discrete component of the mask 14 that may be used to help focus and/or shape the optical signal.

(14) In FIG. 2 the mask 14 receives light 22 being output from the diode array 12 as the light irradiates the LCM 14a. Pixels of the LCM 14a are independently addressed using the computer 18 to reject light at specific select areas of the substrate 20. Using the LCM 14a and the polarizing mirror 14b to form the mask 14 enables the light generated by the diode array 12 to be controllably directed onto only selected areas of the substrate 20 as needed. In FIG. 2 light indicated by lines 22a is able to pass through the polarizing mirror 14b while light indicated by lines 22b is rejected by the polarizing mirror. An important advantage of using a computer controlled LCM 14a is that only a very small amount of optical energy is absorbed into the polarizing mirror 14b, thus making it feasible to prevent damage to the mirror.

(15) During an actual AM fabrication operation, a first layer of powdered material may be acted on by the system by pulsing the diode array 12 to melt selected portions (or possibly the entire portion) of the first layer. A subsequent (i.e., second) layer of powdered material may then be added over the layer just acted on by the system 10 and the process would be repeated. The diode array 12 may be pulsed to melt one or more selected subportions (or possibly the entirety) of the second layer of material. With each layer the system 10 electronically controls the pixels of the mask 14 to selectively block specific, predetermined portions of the substrate 20 from being irradiated by the pulsed optical signal from the diode array 12. This process is repeated for each layer, with the computer 18 controlling the mask 14 so that, for each layer, one or more selected subportions (or possibly the entirety) of the powdered material is blocked by the mask 14 from being exposed to the pulsed optical signal. Preferably, an entire two dimensional area of each layer is melted or sintered at once by pulsing the diode array 12. However, it is just as feasible to raster scan the diode array 12 over the two dimensional area in the event the entire two dimensional area cannot be completely irradiated by the diode array.

(16) An alternative to the addressable mask 14 is a non-addressable mask. A non-addressable mask may be a precision cut piece of metal (e.g., tungsten) that would simply block portions of the light beam. While such a machined mask can be used to build simple geometries, the full potential of the system 10 described herein will be maximized if an addressable mask such as mask 14 is used.

(17) Referring to FIGS. 5 and 6, two alternative systems 100 and 200 in accordance with additional implementations of the present disclosure are shown. System 100 includes a diode array 102 and a diode relay telescope 104. The diode relay telescope 104 is used to provide digital control over “tiles” within an array image to the “pixels” in the substrate 20 (powder bed). FIG. 6 illustrates a system 200 having a diode array 202 and a plurality of focusing lenses 206 that are used to focus the optical energy from the array onto a corresponding plurality of “sheets” representing the substrate 20.

(18) The systems 10, 100 and 200 are able to melt and sinter each layer in a single “pass” or, put differently, in a single operation by pulsing the diode array 12. The need to raster scan an optical beam dozens, hundreds or more times, back and forth across a surface, is therefore eliminated. This significantly reduces the time required to melt and sinter each layer of powder material during the AM fabrication process.

(19) Referring to FIG. 7, a method of deposition of different material types in powder form is illustrated in system 300. Nozzles 301, 302, and 303 are capable of depositing layers of different material powders 304 onto the substrate 20. The nozzle heads 301, 302 and 303 are rastered across the part surface covering it with material addressed by a programmable source. Both the irradiation from the diode array 12 and operation of the mask 14, as described in connection with the system 10, can be controlled such that each material deposited from the nozzles 301, 302 and 303 receives the correct amount of optical energy for a controlled melt or sintering.

(20) While various embodiments have been described, those skilled in the art will recognize modifications or variations which might be made without departing from the present disclosure. The examples illustrate the various embodiments and are not intended to limit the present disclosure. Therefore, the description and claims should be interpreted liberally with only such limitation as is necessary in view of the pertinent prior art.