Micro-electro-mechanical device with ion exchange polymer
20190225487 ยท 2019-07-25
Inventors
Cpc classification
B81B3/0089
PERFORMING OPERATIONS; TRANSPORTING
B81B3/0086
PERFORMING OPERATIONS; TRANSPORTING
B81B7/02
PERFORMING OPERATIONS; TRANSPORTING
B81C1/00206
PERFORMING OPERATIONS; TRANSPORTING
International classification
B81B7/02
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A micro-electro-mechanical device includes an ion exchange polymer coated onto a surface or within pores of a micro-electro-mechanical portion. The micro-electro-mechanical device may be an electrode, a sensor or a cantilever. The ion exchange polymer may comprise an additive, such as an inorganic particle or powder or a metal-organic framework compound. Gases may react with the ionomer and create voltage and/or current which can be measured. The incorporation of ion exchange polymer with a MEM to produce electrode can provide interesting chemical, mechanical and electrical properties, which may have promise in sensor application and some other applications. The ion exchange polymer may be either cation exchange polymer or anion exchange polymer. The ion exchange polymer can be chemically cross-linked, or reinforced by support material or additive.
Claims
1. A micro-electro-mechanical device comprising: a) micro-electro-mechanical portion; b) an ion exchange polymer coated onto the micro-electro-mechanical portion; wherein the MEMS portion has a length of between a hundred nanometers to about 990 microns.
2. The micro-electro-mechanical device of claim 1, wherein the ion exchange polymer is a cation exchange polymer.
3. The micro-electro-mechanical device of claim 2, wherein the ion exchange polymer is a perfluorinated sulfonic acid polymer.
4. The micro-electro-mechanical device of claim 1, wherein the ion exchange polymer is an anion exchange polymer.
5. The micro-electro-mechanical device of claim 4, wherein the anion exchange polymer is crosslinked.
6. The micro-electro-mechanical device of claim 4, wherein the ion exchange polymer is a quaternary ammonium-tethered poly(biphenyl alkylene).
7. The micro-electro-mechanical v of claim 1, further comprising an additive within the ion exchange polymer.
8. The micro-electro-mechanical device of claim 1, wherein the additive is an inorganic filler.
9. The micro-electro-mechanical device of claim 8, wherein the inorganic filler is selected from the group consisting of: silica, alumina, zirconia, titania, cerium oxide, boron oxide, and zirconium phosphate.
10. The micro-electro-mechanical v of claim 7, wherein the additive is a metal-organic compound (MOF).
11. The micro-electro-mechanical device of claim 1, wherein the ion exchange polymer is reinforced by support material.
12. The micro-electro-mechanical device of claim 1, wherein the support material is a porous support material and wherein at least a portion of the ion exchange polymer is configured within the support material.
13. The micro-electro-mechanical device of claim 12, wherein the support material comprises an expanded polytetrafluoroethylene membrane.
14. The micro-electro-mechanical device of claim 13, wherein the expanded polytetrafluoroethylene membrane has a thickness of no more than 1 micron.
15. The micro-electro-mechanical device of claim 1, wherein the micro-electro-mechanical device forms a portion of a sensor.
16. The micro-electro-mechanical device of claim 1, wherein the micro-electro-mechanical device is an electrode.
17. The micro-electro-mechanical device of claim 1, wherein the micro-electro-mechanical device is a cantilever.
18. A micro-electro-mechanical device comprising: a) micro-electro-mechanical portion; b) a metal-organic compound coated onto the micro-electro-mechanical portion.
19. The micro-electro-mechanical device of claim 18, further comprising an ionomer coupled between the micro-electro-mechanical portion and the metal-organic compound.
20. The micro-electro-mechanical device of claim 18, wherein the micro-electro-mechanical device is a cantilever.
Description
BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS
[0026] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention.
[0027]
[0028]
[0029]
[0030] Corresponding reference characters indicate corresponding parts throughout the several views of the figures. The figures represent an illustration of some of the embodiments of the present invention and are not to be construed as limiting the scope of the invention in any manner. Further, the figures are not necessarily to scale, some features may be exaggerated to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0031] As used herein, the terms comprises, comprising, includes, including, has, having or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Also, use of a or an are employed to describe elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This description should be read to include one or at least one and the singular also includes the plural unless it is obvious that it is meant otherwise.
[0032] Certain exemplary embodiments of the present invention are described herein and are illustrated in the accompanying figures. The embodiments described are only for purposes of illustrating the present invention and should not be interpreted as limiting the scope of the invention. Other embodiments of the invention, and certain modifications, combinations and improvements of the described embodiments, will occur to those skilled in the art and all such alternate embodiments, combinations, modifications, improvements are within the scope of the present invention.
[0033] As shown in
[0034] As shown in
[0035] The MEM portion shown in
[0036] The MEM devices shown in
[0037] As shown in
[0038] As shown in
[0039] It will be apparent to those skilled in the art that various modifications, combinations and variations can be made in the present invention without departing from the spirit or scope of the invention. Specific embodiments, features and elements described herein may be modified, and/or combined in any suitable manner. Thus, it is intended that the present invention cover the modifications, combinations and variations of this invention provided they come within the scope of the appended claims and their equivalents.