Vacuum insulated glazing unit

Abstract

The present disclosure relates to a method of producing a vacuum insulated glazing (VIG) unit, a VIG unit produced by means of the method and a bonded assembly for providing to an evacuation hole in a glass pane of a VIG unit, where an evacuation tube has an outer diameter (Dtube) which is less that the smallest internal diameter of the evacuation hole, the method including providing a support a supporting structure over an evacuation hole in a glass pane of the VIG unit, and a proximal end of the evacuation tube rests on the supporting structure so that the position of the evacuation tube in the direction perpendicular to the outer surface of the first pane is defined by the supporting structure, and so that the proximal opening of the evacuation tube is in correspondence with the evacuation hole.

Claims

1. A method of producing a vacuum insulated glazing (VIG) unit comprising the steps of: providing first and second substantially parallel panes of glass, a plurality of pillars, and a peripheral seal between the first and second panes; providing an evacuation hole in an outer surface of the first pane for evacuating a void formed between said panes through the evacuation hole to a pressure less than atmospheric pressure; providing on the first pane a supporting structure, an evacuation tube and a tube soldering material such that the supporting structure rests on the first pane and extends over the evacuation hole and a proximal end of the evacuation tube rests on the supporting structure so that a position of the evacuation tube in a direction perpendicular to an outer surface of the first pane is defined by the supporting structure and so that a proximal opening of the evacuation tube is in correspondence with the evacuation hole, the evacuation tube having an outer diameter which is less that a smallest internal diameter of the evacuation hole; heating the tube soldering material to a condition where the tube soldering material will flow, while maintaining the evacuation tube, the supporting structure and the first glass pane substantially stationary, subsequently cooling the tube soldering material to a solid condition so as to provide a gastight tube seal preventing passage of gas through the evacuation hole except via the evacuation tube, and so that a tube seal material bonds to the evacuation tube; evacuating the void through the evacuation hole and the evacuation tube; and heating a distal tip of the evacuation tube so as to seal the evacuation tube; wherein the supporting structure is provided as shape-stable at a melting point of the tube seal material.

2. The method according to claim 1, wherein said first and second substantially parallel panes comprise tempered glass.

3. The method according to claim 1, wherein the supporting structure comprises a metal or a metal alloy.

4. The method according to claim 1, wherein the supporting structure comprises a first structure configured to engage with the evacuation hole so as to ensure a horizontal positioning of the supporting structure with respect to the evacuation hole.

5. The method according to claim 1, wherein the supporting structure is formed with a second structure which is configured to engage with the evacuation tube so as to ensure a horizontal positioning of the evacuation tube with respect to the supporting structure.

6. The method according to claim 1, wherein a thermal expansion coefficient of the supporting structure is substantially the same as a thermal expansion coefficient of the tube seal.

7. The method according to claim 1, wherein the thermal expansion coefficient of the supporting structure is substantially the same as a thermal expansion coefficient of the first pane.

8. The method according to claim 1, wherein the tube soldering material comprises a solid pre-form of glass solder frit with a central opening provided therein for accommodating the evacuation tube.

9. The method according to claim 1, wherein the evacuation tube and the supporting structure are integrally formed of a same material.

10. The method according to claim 1, wherein the tube soldering material comprises a low-melting temperature glass solder frit and is substantially lead-free.

Description

BRIEF DESCRIPTION OF FIGURES

(1) Examples of the present disclosure are shown in the enclosed drawing of which

(2) FIG. 1 is a view in perspective of a vacuum insulated glazing (VIG) unit,

(3) FIG. 2 is a cross-sectional view of a first example of the disclosure before the tube soldering material has been heated,

(4) FIG. 3 is a cross-section of the example of FIG. 2, wherein the tube soldering material has been heated to form a tube seal,

(5) FIG. 4 is a cross-section of the example of FIGS. 2 and 3, wherein the evacuation tube has been heated so as to seal it off,

(6) FIG. 5 is a cross-section of a second example of the disclosure, wherein the supporting structure is provided with a first structure,

(7) FIG. 6 is a cross-section of a third example of the disclosure, wherein the supporting structure is provided with a first structure and a second structure,

(8) FIG. 7 is a cross-section of a fourth example of the disclosure, wherein the supporting structure is provided with a first structure and the supporting structure and the pre-form of tube soldering material are adapted to fit in a stepped evacuation hole,

(9) FIG. 8 is an end view of a first example of a supporting structure according to the disclosure,

(10) FIG. 9 is an end view of a second example of a supporting structure according to the disclosure,

(11) FIG. 10 is an end view of a third example of a supporting structure according to the disclosure,

(12) FIG. 11 is a cross-section of a first mold for preparing a bonded assembly according to the present disclosure,

(13) FIG. 12 is the mold of FIG. 11 with the assembly,

(14) FIG. 13 is a perspective view of the assembly of FIG. 12,

(15) FIG. 14 is a cross-section of a second mold for preparing a bonded assembly according to the present disclosure,

(16) FIG. 15 is the mold of FIG. 14 with the assembly, and

(17) FIG. 16 is a perspective view of the assembly of FIG. 15.

(18) The examples shown in the figures are not to scale and are to be regarded as sketches demonstrating the principles of the examples of the present disclosure.

DETAILED DESCRIPTION

(19) The vacuum insulated glazing (VIG) unit 1 of FIG. 1 comprises two parallel panes 2, 3 of tempered glass with a plurality of pillars 4 arranged between the two panes 2, 3 in order to provide a separation of the panes 2, 3 in the order of 0.2 millimeters. The periphery between the panes 2, 3 is provided with a gas proof sealing so that the void 7 formed between the two panes 2, 3 may be evacuated to a vacuum in the order of 0.001 millibar or even less. An evacuation hole 5 is provided in the upper surface 6 of the first pane 2 and through the pane 2 for evacuation of the void 7.

(20) In order to be able to seal off the evacuation hole 5 after evacuation of the void 7, the first pane 2 is provided with a supporting structure 8, an evacuation tube 9 and a tube soldering material 10 as shown in FIGS. 2 to 8. The supporting structure 8 rests on the first pane 2 and extends over the opening 10 of the evacuation hole 5 in the upper surface 6 of the first pane 2. The proximal end 11 of the evacuation tube 9 rests on the supporting structure 8 so that the position of the evacuation tube 9 in the direction perpendicular to the upwardly-facing outer surface 6 of the first pane 2 is defined by the supporting structure 8. The proximal opening 12 of the evacuation tube 9 is in correspondence with the evacuation hole 5 so that evacuation of the void 7 via the opening of the evacuation tube is enabled.

(21) The evacuation tube 9 has an outer diameter Dtube of about 2 millimeters, which is less that the smallest internal diameter d1 of the evacuation hole 5. The smallest diameter d1 of the evacuation hole 5 is defined by the fact that the pane 2 is tempered glass of a thickness t1 of normally at least 4 millimeters in order to be able to withstand the pressure difference between the atmospheric pressure on the outside and the vacuum in the void 7. As mentioned previously, the inner diameter of the through-hole in a pane of glass that is to be tempered should be at least equal to the thickness t1 of the pane in order to ensure that the tempering of the glass is correctly executed throughout the pane including the areas close to the hole for the VIG unit to be durable.

(22) The evacuation tube 9 has typically a longitudinal extent of about 6 to 8 millimeters. The evacuation of the void 7 is by means of an evacuation head 13 as shown in FIGS. 2 to 4 which is arranged around the evacuation hole 5 in a gas tight manner, and the heating of the distal end 14 of the evacuation tube 9 in order to seal it after the evacuation of the void 7 is performed by means of a heating element 15 right above the distal end 14 of the evacuation tube 9. Alternatively or additionally microwaves or laser can be employed to seal the distal end 14 of the tube 9.

(23) In a first step of the process as shown in FIG. 2, the supporting structure 8, the evacuation tube 9 and the tube soldering material 10 is situated on the upper surface 6 of the first pane 2 so that the supporting structure 8 rests on the upper surface 6 and the evacuation tube 9 is resting by its proximal end 11 on the supporting structure 8. The evacuation head 13 is situated on top of the upper surface 6 covering the evacuation hole 5 as well as the supporting structure 8, the evacuation tube 9 and the tube soldering material 10.

(24) In the next step, the tube soldering material 10 is heated to a temperature, such as in the range of 300 to 450 to a state where it will flow and come into contact with the upper surface 6 of the first pane 2. The temperature is subsequently lowered until the tube soldering material 10 a solid condition so as to provide an gastight tube seal 16 as shown in FIG. 3 preventing passage of gas through the evacuation hole 5 except via the evacuation tube 9, and so that the tube seal 16 material bonds to the evacuation tube 9.

(25) The heating of the tube soldering material 10 may be conducted by placing the VIG unit 1 in a furnace that heats up the entire unit 1 and thereby also the tube soldering material 10. Alternatively or additionally, the tube soldering material 10 may be heated by means of a source directed particularly to the tube soldering material 10, such as a laser beam, infrared radiation, microwave or induction heating.

(26) The evacuation of the void 7 through the evacuation tube 9 is now effectuated via an evacuation port 17 in the evacuation head 13 until the required vacuum in the void has been reached, in the order of 0.001 millibar or even less. In order to provide a gas tight closing of the evacuation tube 9 and thereby of the void 7, the distal end 14 of the evacuation tube 9 is heated by means of the heating element 15 to a temperature, typically in the range of 700 to 1200 C., in particular about 950 to 1000 C. for a glass tube, so that the distal end 14 of the tube 9 will flow and form a closure 18 of the evacuation tube 9 as shown in FIG. 4, which is also known as the tip off of the evacuation tube 9.

(27) The distance h between the heating element 15 and the distal end 14 of the evacuation tube 9 should be minimized in order to prevent the heat radiation from the heating element 15 from harming the tube seal 16, which may partly evaporate and/or become brittle or porous which may reduce the durability of the tube seal 16 and thus of the VIG unit 1 itself as the insulating properties of the VIG unit 1 depends on the state of vacuum in the void 7.

(28) By providing the supporting structure 8 in a material that is shape-stable in the temperature range that the tube soldering material 10 must be heated to in order to flow are create the tube seal 16, the position of the distal end 14 of the evacuation tube 9 with respect to the upper surface 6 of the first pane 2 can be predetermined with a very high degree of precision, and the distance h between the heating element 15 and the distal end 14 of the evacuation tube 9 can be reduced to a range of 0.5 to 1 millimeters or even less, such as in the range of 0.1 to 0.5 millimeters.

(29) The peripheral seal 19 provided between the two panes 2, 3 of tempered glass may be made from a soldering material containing glass solder frit with a low melting temperature, which by means of a thermal treatment is turned into a gas tight peripheral seal 19 as known from e.g. WO 02/27135 and EP 1 422 204. Alternatively, other materials may be employed, such as a metal band seal as disclosed e.g. in US 2015/218877.

(30) In the example shown in FIGS. 2 to 4, the supporting structure 8 is depicted as a flat entity. However, in a second example of the disclosure shown in FIG. 5 the supporting structure 8 is provided with a first structure 20, which is suited for engaging with the edges at the upper surface 6 of the first pane 2 around the evacuation hole 5 so as to ensure a correct horizontal positioning of the supporting structure 8 with respect to the evacuation hole 5.

(31) The supporting structure 8 may alternatively or additionally be provided with a second structure 21 as shown in FIG. 6 disclosing a third example of the disclosure, wherein the supporting structure 8 is provided with a first structure 20 as well as a second structure 21. The second structure is suited for engaging with the proximal end 11 of the evacuation tube 9, in particularly with the outer periphery of the evacuation tube 9 so as to ensure a correct horizontal positioning of the evacuation tube 9 with respect to the supporting structure 8. The second structure 21 is useful when providing the supporting structure 8, the evacuation tube 9 and the tube soldering material 10 to the first pane 2 as separate entities that are to be vertically aligned with each other as well as with the evacuation hole 5 or when producing a bonded assembly 22 of the three parts as discussed below.

(32) A fourth example of the disclosure is shown in FIG. 7 for use in a stepped evacuation hole 5. The upper part 23 of the evacuation hole 5 nearest the upper surface 6 of the first pane 2 has a wider diameter d2 than the smallest diameter d1 of the evacuation hole 5 so as to be able to accommodate the pre-form 24 of tube soldering material 10. The supporting structure 8, the pre-form 24 and the evacuation tube 9 are provided as a bonded assembly 22 as discussed below with reference to FIGS. 14 to 16, but could alternatively be provided as separate items to the evacuation hole 5. By providing the stepped evacuation hole 5 in the first pane 2 it is possible to minimize the extent out from the upper surface 6 of the final sealing of the evacuation hole 5 as shown in FIG. 4 because the tube seal 16 and the tipped off evacuation tube 9 will be at least partly embedded in the upper part 23 of the evacuation hole 5 and thus make the sealing of the evacuation hole 5 less vulnerable to external impacts.

(33) The supporting structure 8 may take a variety of different forms, of which some examples are shown in end views in FIGS. 8, 9 and 10, i.e. shown from the lower end of an assembly 22 including a pre-form 24 of tube soldering material 10. The maximum outer diameter Dsupport of the supporting structure 8 should be sufficient to ensure that the supporting structure 8 will be able to rest on the first pane 2, i.e. the maximum outer diameter Dsupport should exceed at least the smallest internal diameter d1 of the evacuation hole 5, preferably by at least 1 to 2 millimeters. In the examples shown in FIGS. 8-10, the maximum outer diameter Dsupport is 5.6 millimeters, which is suitable for use with an evacuation hole 5 having a smallest internal diameter d1 of 4 millimeters. The pre-form 24 shown has an outer diameter Dpre-form of 12 millimeters.

(34) In FIG. 8 is shown an end view of a first example of a supporting structure 8 according to the disclosure, where the supporting structure 8 is made from a 0.5 millimeters thick foil of titanium cut into a square form of a side length of 4 millimeters. The supporting structure 8 is provided with a central perforation 25 in order to allow for gas to flow from the evacuation hole 5 and to the interior of the evacuation tube 9. The outer contour of the evacuation tube 9 is indicated with a broken line in FIG. 8.

(35) A second example of a supporting structure according to the disclosure is shown in FIG. 9, comprising two lengths 26 of nickel-plated copper wire. Copper has a suitable thermal expansion coefficient with respect to the one of the glass pane 2 and that of a tube seal 16 made from a tube soldering material containing glass solder frit, and the copper is plated with nickel in order to prevent a chemical reaction between the glass and the copper. An alternative to nickel-plated copper could be a suitable type of stainless steel.

(36) In FIG. 10 an end view of a third example of a supporting structure according to the disclosure is shown, where the glass material of the evacuation tube 9 is fused with a glass supporting structure 8 having three tabs 27 so that the two are provided as a single unit made in the same material. Such a single unit may be manufactures as two parts that are fused together or it may be manufactured in one step, e.g. by molding in a suitable ceramic material.

(37) FIG. 11 shows a first mold 28 for preparing a bonded assembly according to the present disclosure, comprising a bottom plate 29, an upper plate 30 having an opening 31 defined therein with a suitable diameter Dmould and a guide 32 arranged extending from the bottom plate 29 and through the opening 31, the guide having a size suitable for allowing an evacuation tube 9 to slide over the guide 32.

(38) The mold 28 of FIG. 11 is shown in use in FIG. 12 with the assembly comprising a supporting structure 8, an evacuation tube 9 and tube soldering material in the form of a paste containing solder glass frit of about 70 wt %, an organic binder, inorganic fillers and solvents, for example water or alcohol based. The assembly 22 is heated to evaporate the solvents from the paste, which leaves a solid form disc of a tube soldering material 10 that binds to the supporting structure 8 as well as the evacuation tube 9 and a bonded assembly 22 is thus created. The assembly 22 may be heated further in order to perform a partially of substantially complete burn out of the binder material from the paste, so that the glass frit and the possible inorganic fillers are left or even further to a temperature, such as about 330 C., depending on the glass frit and the fillers, where the material sinters to form a more durable solid structure of the assembly 22. The aim of the heating is to create a bonded assembly 22 that is sufficiently durable to be removed from the mold 28 and be handled for arrangement on a first pane 2 on top of an evacuation hole 5. The type of bonded assembly 22 produced by means of a mold 22 as shown in FIG. 12 may be used as shown in FIG. 2.

(39) The mold 28 of FIG. 11 may be filled with one type of paste or alternatively with two different types of paste, wherein the lower one comprises a glass solder frit with a thermal expansion coefficient to match the material of the upper pane 2 and an upper layer of a second type of paste comprising a glass solder frit with a second thermal expansion coefficient matching the material of the evacuation tube 9 similarly to what is disclosed in WO 00/41980.

(40) FIG. 13 is a perspective view of the bonded assembly 22 of FIG. 12 when released from the mold 22.

(41) A second type of mold 28 is shown in FIG. 14 comprising a bottom plate 29, an upper plate 30 having an upper opening 31 defined therein with a suitable diameter Dmould and a lower opening 33 defined therein. The lower opening 33 has a diameter Dlower which is smaller than the opening diameter Dmould of the upper opening 31. A guide 32 arranged extending from the bottom plate 29 and through the opening 31, 33, the guide having a size suitable for allowing an evacuation tube 9 to slide over the guide 32. The diameter Dlower of the lower opening 33 is similar to the smallest internal diameter d1 of the evacuation hole 5 in the VIG the assembly 22 is supposed to be used so that the assembly 22 will fit.

(42) The mold 28 of FIG. 14 may be used similarly to the mold 28 shown in FIG. 11 as disclosed above with reference to FIG. 12. The mold 28 of FIG. 14 arranged with a supporting structure 8 comprising two lengths 26 of titanium wire, an evacuation tube 9 and tube soldering material 10 in the form of one or more pastes comprising glass solder frit is shown in FIG. 15. The supporting structure 8 is equipped with a first structure 20 as discussed previously to ensure a correct horizontal positioning of the assembly 22 with respect to the evacuation hole 5 of the upper pane 2 on which the assembly 22 is being applied, the first structure being in the form of bends in the wires 26. The mold 28 of FIG. 14 is used for producing a bonded assembly 22 as shown in FIG. 16.

(43) The bonded assembly 22 of FIG. 16 may be used with an upper pane 2 of a VIG unit 1 as shown in FIG. 5, where the evacuation hole 5 has a constant diameter d1 or it may be used with an upper pane 2 with a stepped evacuation hole 5 as shown in FIG. 7.

(44) Generally, the tube soldering material 10 may be a pre-form solid body 24 from solder glass frit, which for example is dried or heated (known as sinter) to form the solid body. The pre-form 24 rests on the supporting structure 8 which is shape-stable at the melting point of the pre-formed soldering material 10. Hereby an enhanced evacuation hole cover is provided with good positioning.

(45) Optionally, the supporting structure 8 which is shape-stable at the melting point of the soldering material 10 may be joined to the pre-formed solid body of solder glass frit 24.

(46) The supporting structure 8 can also support a getter material. Getter helps absorbing the impurities in the void and maintaining low pressure.

REFERENCE NUMERALS

(47) 1 Vacuum insulated glazing (VIG) unit 2 First panes of tempered glass 3 Second pane of tempered glass 4 Pillars 5 Evacuation hole 6 Upper surface of the first pane 7 Void formed between the two panes 8 Supporting structure 9 Evacuation tube 10 Tube soldering material 11 Proximal end of evacuation tube 12 Proximal opening of evacuation tube 13 Evacuation head 14 Distal end of the evacuation tube 15 Heating element 16 Tube seal 17 Evacuation port in evacuation head 18 Closure of evacuation tube 19 Peripheral seal 20 First structure of the supporting structure 21 Second structure of the supporting structure 22 Bonded assembly of supporting structure, evacuation tube and tube soldering material 23 Upper part of evacuation hole 24 Pre-form of tube soldering material 25 Perforation of supporting structure 26 Length of wire for supporting structure 27 Tabs of supporting structure 28 Mold for preparing a bonded assembly 29 Bottom plate of mold 30 Upper plate of mold 31 Opening in mold 32 Guide of mold 33 Lower opening in mold Dtube Outer diameter of evacuation tube Dsupport Maximum outer diameter of the supporting structure Dpre-form Outer diameter of pre-form Dmould Inner diameter of opening in mold d1 Smallest internal diameter of the evacuation hole d2 Diameter of upper part of evacuation hole h Distance between the heating element and the distal end of the evacuation tube t1 Thickness of first pane