METHOD AND DEVICE FOR SEALING CONTACT POINTS AT ELECTRICAL LINE CONNECTIONS
20190221981 ยท 2019-07-18
Inventors
Cpc classification
H02G15/046
ELECTRICITY
H01R43/005
ELECTRICITY
H01R43/0242
ELECTRICITY
H01R4/723
ELECTRICITY
International classification
H01R43/00
ELECTRICITY
Abstract
The invention relates to a method for sealing a contact point region comprising at least one contact point at an electrical line connection, wherein the line connection comprises at least one electrical line and at least one conductive element electrically connected thereto. The method starts by arranging a shrink tube on the outer circumference of the contact point region, in a first region extending over the contact point region on both sides in the longitudinal direction. This is followed by heating the shrink tube to shrinking temperature. During the heating of the shrink tube, an inductive heating of the electrical conductor is additionally performed, at least in the contact point region, and so hotmelt adhesive arranged inside the shrink tube and/or on the outer circumference of the contact point region is heated to its melting temperature. The invention also relates to a device for sealing a contact point region and to a sealing at such a region.
Claims
1. A method for sealing a contact point area, having at least one contact point, at an electrical line connection, the line connection including at least one electrical line and at least one electrical conductive element connected thereto, the electrical line having at least one electrical conductor with conductor insulation, which, however, is removed in the contact point area, comprising the following steps: arranging a heat shrink tube on the outer circumference of the contact point area in a first area that extends in the longitudinal direction beyond the contact point area on both sides; heating the heat shrink tube to the shrinkage temperature from the outside via a heat source; and during the heating of the heat shrink tube, generation of a magnetic field for inductive heating of the electrical conductor additionally takes place, at least in the contact point area, so that hot-melt adhesive situated inside the heat shrink tube and/or on the outer circumference of the contact point area is heated to its melting temperature.
2. The method according to claim 1, wherein the electrical conductor is inductively heated in the contact point area in such a way that the temperature on its outer circumference and also in its core is greater than or equal to the melting temperature of the hot-melt adhesive.
3. The method according to claim 1, wherein the heating of the heat shrink tube to the shrinkage temperature takes place via externally applied hot air and/or irradiated infrared radiation.
4. The method according to claim 1, wherein during the heating of the heat shrink tube, inductive heating of the electrical conductor also takes place in a second area adjoining the contact point area, so that the conductor insulation in this area is heated to its melting temperature.
5. The method according to claim 1, wherein hot-melt adhesive is applied at least in the contact point area before the heat shrink tube is arranged.
6. The method according to claim 1, wherein a heat shrink tube having an inner coating of hot-melt adhesive is situated at the contact point area.
7. The method according to claim 1, wherein hot-melt adhesive having a melting temperature that is in the melting temperature range of the conductor insulation is applied, at least in the contact point area, and/or is guided over the heat shrink tube at the contact point area.
8. The method according to claim 1, wherein an outer border area of the heat shrink tube is cooled while the heat shrink tube and the electrical conductor are being heated.
9. The method according to claim 1, wherein the heat shrink tube is situated at the contact point area of a line connection which has at least one electrical line and an electrically conductive element that is designed as an electrical connector or electrical terminal contact.
10. A device for sealing a contact point area, having at least one contact point, at an electrical line connection, the line connection including at least one electrical line that has at least one electrical conductor with conductor insulation, and at least one electrically conductive element that is connected to the electrical line, wherein the electrical conductor of the electrical line has no conductor insulation in the contact point area, wherein the device includes a heat source for heating the heat shrink tube to the shrinkage temperature from the outside, and additionally includes an induction unit for inductively heating the electrical conductor, at least in the contact point area, to the melting temperature of the hot-melt adhesive.
11. The device according to claim 10, wherein it also has a cooling device for cooling the outer border areas of the heat shrink tube.
12. The device according to claim 10, wherein the heat source for heating the heat shrink tube to the shrinkage temperature from the outside provides hot air and/or infrared radiation.
13. The device according to claim 11, wherein the heat source for heating the heat shrink tube to the shrinkage temperature from the outside provides hot air and/or infrared radiation.
14. The method according to claim 3 wherein during the heating of the heat shrink tube, inductive heating of the electrical conductor also takes place in a second area adjoining the contact point area-, so that the conductor insulation in this area is heated to its melting temperature.
15. The method according to claim 2 wherein an outer border area of the heat shrink tube is cooled while the heat shrink tube and the electrical conductor are being heated.
16. The method according to claim 3 wherein an outer border area of the heat shrink tube is cooled while the heat shrink tube and the electrical conductor are being heated.
17. The method according to claim 4 wherein an outer border area of the heat shrink tube is cooled while the heat shrink tube and the electrical conductor are being heated.
18. The method according to claim 5 wherein an outer border area of the heat shrink tube is cooled while the heat shrink tube and the electrical conductor are being heated.
19. The method according to claim 6 wherein an outer border area of the heat shrink tube is cooled while the heat shrink tube and the electrical conductor are being heated.
20. The method according to claim 7 wherein an outer border area of the heat shrink tube is cooled while the heat shrink tube and the electrical conductor are being heated.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Preferred applications of the method according to the invention are explained in greater detail below with reference to the appended drawings. Also described in greater detail are the individual method steps that are carried out to provide these preferred applications. The drawings show the following:
[0029]
[0030]
[0031]
[0032]
[0033]
[0034]
[0035]
DETAILED DESCRIPTION
[0036] The line connections 02 shown in the figures each include at least one electrical line 03 and an electrically conductive element that is connected to the electrical line 03. The electrically conductive element may be designed as an electrical conductor 04, an electrical connector 12, or an electrical terminal contact 14, for example.
[0037]
[0038] For clarification, it is pointed out that the type of electrical conductor and the type of connection are not important for implementing the invention. In the simplest case, the electrical line may also be a one-piece continuous line whose insulation in one section has been removed or damaged, so that there is an exposed contact point area at which a seal according to the invention is to be produced.
[0039] A heat shrink tube 07 that extends on the outer circumference of the contact point area 01 in a first area 08 that runs in the longitudinal direction of the contact point area 01 is used for sealing the contact point area 01 of the line connection 02. The first area 08 extends beyond the contact point area 01 on both sides.
[0040] The seal on the contact point area 01 is produced via the method according to the invention, as described below. The heat shrink tube 07 is arranged on the outer circumference of the contact point area 01 in a first step. The length of the heat shrink tube is selected so that the heat shrink tube 07 extends beyond the contact point area 01 on both sides. The heat shrink tube 07 preferably has an inner coating of hot-melt adhesive. Additionally or alternatively, prior to arranging the heat shrink tube 07, hot-melt adhesive may be applied directly to the contact point area 01 or positioned on the contact point area 01 in the form of a hot-melt adhesive molding. The hot-melt adhesive preferably has a processing temperature in the melting range of the conductor insulation 05.
[0041] The heat shrink tube -07 is subsequently heated to the shrinkage temperature, preferably by hot air or infrared radiation. During the heating of the heat shrink tube 05 [sic; 07], the electrical conductors 04 at the same time are inductively heated, at least in the contact point area 01. The hot-melt adhesive present in the contact point area 01 is thereby heated to its processing temperature, and the hot-melt adhesive meets the preheated conductor material, so that the flowability of the adhesive is maintained and the adhesive is thus able to penetrate into all cavities and provide a good sealing effect.
[0042] While carrying out the method according to the invention, in the contact point area 01 the conductor material may be heated to temperatures in the range of 210 to 300 C., for example. In the second area 09, the temperature of the conductor 04 should still be high enough that melting of the conductor insulation 05 is possible in the second area 09. In contrast, in the outer border area 10, the aim is for the temperature to be low enough that no damage results to the conductor insulation 05 in this area. For this purpose, the temperature in the outer border area 10 should preferably be below the melting range of the conductor insulation 05. The outer border area 10 may be additionally cooled, for example with cold air, in order to control the temperature at the border area to an appropriately low level. Cooling may be dispensed with when, due to the temperature gradient, the temperature in the outer border area 10 is already below the melting range of the conductor insulation 05.
[0043]
[0044]
[0045] For producing the sealed contact point area 01 illustrated in
[0046]
[0047]
[0048] In the border area 10, the temperature during the process is instead selected so that no change in the mechanical and optical properties of the insulation occurs. Neither curing of the insulation nor melting or crack formation is desired in this section. This temperature control is achieved by the inductor supplying little or no energy in the border area 10, and if necessary, cooling by supplying cooling air.
[0049]
[0050] The diagram illustrated in
LIST OF REFERENCE NUMERALS
[0051] 01contact point area [0052] 02line connection [0053] 03electrical line [0054] 04electrical conductor [0055] 05conductor insulation [0056] 06- [0057] 07heat shrink tube [0058] 08first area [0059] 09second area [0060] 10outer border area [0061] 11- [0062] 12electrical connector [0063] 13extension of the heat shrink tube [0064] 14terminal contact [0065] 20hot air feed duct [0066] 21heated air [0067] 22cooling air duct [0068] 23cool air [0069] 24inductor [0070] 30insertion of the line connection [0071] 31clamping of the line connection [0072] 32shrinkage and sealing process [0073] 33optional preheating [0074] 34induction heating [0075] 35heating of the heat shrink tube and hot-melt adhesive [0076] 36thorough heating of the heat shrink tube [0077] 37optional cooling [0078] 38cooling [0079] 39removal of the line connection