Carrier for temporary bonded wafers

Abstract

Carrier onto which a wafer can be temporarily bonded. The carrier comprises a plate shaped laminate. The plate shaped laminate comprises a first layer. The first layer comprises a metal foil or a metal sheet. The plate shaped laminate comprises a second layer comprising a porous metal medium with three-dimensional open pores. The porous metal medium comprises metal fibers. The first layer is permanently bonded to the porous metal medium thereby closing the pores of the porous metal medium at the side where the first layer is located.

Claims

1. Carrier onto which a wafer can be temporarily bonded, wherein the carrier comprises a plate shaped laminate, the plate shaped laminate comprises: a first layer, wherein the first layer comprises a metal foil or a metal sheet; and a second layer comprising a porous metal medium with three-dimensional open pores; wherein the porous metal medium comprises metal fibers; wherein the first layer is permanently bonded to the porous metal medium thereby closing the pores of the porous metal medium at the side where the first layer is located.

2. Carrier as in claim 1, wherein the first layer comprises the same metal or alloy as the porous metal medium.

3. Carrier as in claim 1, wherein said porous metal medium comprises stainless steel, titanium, palladium or tungsten; or comprises alloy comprising for more than 50% by weight of titanium, palladium or tungsten.

4. Carrier as in claim 1, wherein the first layer is permanently bonded to the porous metal medium by means of metallic bonds.

5. Carrier as in claim 1, wherein the first layer is permanently bonded to the porous metal medium by means of an adhesive.

6. Carrier as claim 1, wherein the porosity of the porous metal medium is between 30 and 80%.

7. Carrier as in claim 1, wherein the equivalent diameter of the metal fibers is between 2 and 50 m.

8. Carrier as in claim 1, wherein the porous metal medium has a surface for being bonded onto a wafer, wherein this surface is parallel with the first layer; and wherein this surface is polished so that the carrier has a total thickness variation (TTV) less than 10 m.

9. Carrier as in claim 1, wherein the porous metal medium comprises a first porous layer and a second porous layer, wherein the first porous layer is provided between the first layer and the second porous layer; and wherein the porosity of the first porous layer is higher than the porosity of the second porous layer.

10. Carrier as in claim 1, wherein the second layer comprises a contact layer for being bonded onto a wafer, wherein the contact layer comprises a mixture of metal fibers and metal powder, wherein the metal fibers and the metal powder are permanently bonded to each other at their contacting points.

11. Carrier as in claim 1, wherein the side edges of the porous metal medium are permanently sealed so that no open pores are present at the side edges of the porous metal medium.

12. Assembly of a wafer and a carrier as in claim 1, wherein the wafer is bonded onto said second layer by means of an adhesive.

13. Method for the processing of wafers, comprising the steps of temporarily adhering a wafer to a carrier as in claim 1 by means of an adhesive, processing the wafer temporarily adhered to the carrier; debonding the wafer from the carrier, by means of a debonding liquid breaking up the temporary adhesive bond between the wafer and the carrier; wherein the debonding liquid penetrates into the porous metal medium from the side edges of the assembly of the wafer bonded by means of adhesive to the carrier.

Description

BRIEF DESCRIPTION OF FIGURES IN THE DRAWINGS

(1) FIG. 1 shows a top view of an exemplary carrier according to the invention.

(2) FIGS. 2-5 show cross sections of exemplary carriers according to the invention.

(3) FIG. 6 shows an example of an assembly of a wafer temporarily bonded to an inventive carrier.

MODE(S) FOR CARRYING OUT THE INVENTION

(4) FIG. 1 shows the top view of a carrier 100 according to the invention. The carrier 100 has the shape of a disk deviating from a circular circumference (with diameter D) by a linear side 102. The linear side 102 is present in order to match the shape of a wafer to be bonded to the work carrier.

(5) FIG. 2 shows a cross section of an exemplary carrier 200 according to the invention. The carrier 200 comprises a first layer 210, wherein the first layer is a metal foil or a metal sheet. The carrier 200 further comprises a nonwoven metal fiber web 220 (e.g. sintered or bonded by means of capacity discharge welding), comprising metal fibers 228. Preferably, the metal foil or metal sheet and the metal fibers are out of the same metal or alloy. The nonwoven metal fiber web 220 is permanently bonded to the first layer 210, e.g. by means of an adhesive (e.g. an epoxy adhesive) or by means of sintering or by means of welding (e.g. capacity discharge welding).

(6) FIG. 3 shows a cross section of an exemplary carrier 300 according to the invention. The carrier 300 comprises a first layer 310, wherein the first layer is a metal foil or a metal sheet. The carrier 300 further comprises a first porous layer, e.g. a sintered nonwoven metal fiber web 322; and a second porous layer, e.g. another sintered nonwoven metal fiber web 324. The porosity of the first porous layer is higher than the porosity of the second porous layer.

(7) Preferably, the metal foil or metal sheet and the metal fibers of both sintered nonwoven metal fiber webs are out of the same metal or alloy. The nonwoven metal fiber webs 322, 324 are permanently bonded to each other and to the first layer 310, e.g. by means of an adhesive (e.g. an epoxy adhesive); or by means of sintering or by means of welding (e.g. capacity discharge welding).

(8) Instead of one or both of the nonwoven metal fiber webs, sintered porous powder layers and/or metal foam layers can be used for the first porous layer and/or for the second porous layer.

(9) FIG. 4 shows a cross section of an exemplary carrier 400 according to the invention. The carrier 400 comprises a first layer 410, wherein the first layer is a metal foil or a metal sheet. The carrier 400 further comprises a porous metal medium 423, e.g. as discussed in the previous examples. The side edges 450 of the porous metal medium are permanently sealed so that no open pores are present at the side edges 450 of the porous metal medium 423. The side edges can be sealed by means of a welding or laser cutting operation on the edges of the porous metal medium 423, or by means of a welding or laser cutting operation on the combination of the first layer and the second layer after bonding the first layer to the second layer.

(10) An alternative method for creating the sealing edges is by machining a plate so that the upstanding edges are created. The porous metal medium is then inserted in the cup that is created by the machining. Subsequently, bonding of the porous metal medium onto the first layer is performed. When a temporary bonded wafer is to be debonded from this carrier, initially no wicking of the debonding liquid occurs in the porous metal medium and initial debonding happens on the thin layer of adhesive between the carrier and the wafer. When this thin adhesive layer is broken down, the debonding speed increases by having an increased wicking of the debonding liquid in the porous metal medium through the openings created by dissolving the glue layer at the edge.

(11) FIG. 5 shows a cross section of an exemplary carrier 500 according to the invention. The carrier 500 comprises a first layer 510, wherein the first layer is a metal foil or a metal sheet. The carrier 500 further comprises an additional porous layer 526, e.g. a sintered nonwoven metal fiber web. The carrier comprises a contact layer 560 consisting out of a mixture of metal powder particles and metal fibers, sintered to each other at contacting points.

(12) Preferably, the metal foil or metal sheet, the metal fibers and the metal powder are out of the same metal or alloy.

(13) The different layers are permanently bonded to each other by means of sintering or by means of welding (e.g. capacity discharge welding). Instead of the nonwoven metal fiber web as additional layer, sintered porous powder layers and/or metal foam layers can be used.

(14) FIG. 6 shows an example of an assembly or stack 601 of a wafer temporarily bonded to a carrier, e.g. the carrier 200 of the example of FIG. 2. Same reference numbers as in FIG. 2 have the same meaning as described for FIG. 2. A temporary adhesive layer 670 is applied onto the porous metal medium of the carrier 200, and a wafer is 680 is temporarily bonded to the carrier 200 via this adhesive layer 670.

(15) As an example of the invention, a carrier has been made. The carrier comprises a 100 m thick titanium foil and a porous nonwoven titanium fiber medium of 600 m thickness. The carrier has a total thickness of 700 m. The nonwoven titanium fiber medium was sintered directly onto the titanium foil; and is a fiber sheet of 22 m diameter fibers with a density 1000 g/m.sup.2, meaning 56% porosity.

(16) As an example of the invention, a carrier has been made. The carrier comprises a 100 m thick titanium foil and a porous nonwoven titanium fiber medium of 600 m thickness. The porous metal medium comprises a first porous layer and a second porous layer. The first porous layer comprises titanium fibers of 22 m equivalent diameter and has 74 m thickness. The second porous layer comprises titanium fibers of 14 m equivalent diameter and has 526 m thickness.

(17) As an example of the invention, a carrier has been made having a first layer out of a 150 m thick titanium foil. A nonwoven titanium fiber medium of 500 g/m.sup.2 consisting out of titanium fibers of 22 m equivalent diameter and 14 mm fiber length was sintered onto the titanium foil, thereby establishing sinter bonds between contacting titanium fibers on the one hand; and between the titanium fibers and the titanium foil on the other hand, resulting in a total thickness 400 m of the structure. The porosity of the porous layer was 56%. The surface of the carrier to be bonded onto a wafer can be polished below a total thickness variation (TTV) of the carrier of 10 m.

(18) A150 mm by 150 mm square sized carrier has been temporarily glued using a standard available silicon based adhesive to a glass substrate of the same size. The glass substrate simulates a wafer. Immersing the solution in a debonding liquid (Daeclean 300a commercially available solvent system for removal of cured siliconewas used) showed proper debonding by wicking of the debonding liquid inside the titanium medium from the side edges of the carrier. The wicking could be followed by visual observation through the glass plate. The debonding liquid fully wicked inside the porous metal medium in a short time period of 2 minutes 40 seconds, resulting in fully debonding the carrier from the glass plate. It will be clear to the skilled person that in the same way as a metal fiber nonwoven web, a sintered metal powder layer or metal foam can be used as porous metal medium. However, metal fiber nonwovens are preferred because, due to the elongated shape of the fibers, a different pore size is obtained which is believed to optimize wicking.

(19) Preferably, the carrier is provided such that when applying a pressure of 4 bar onto it, the permanent deformation of the carrier is less than 5% of its original thickness before applying the pressure. This can be tested by measuring the thickness of the carrier before and after applying a pressure of 4 bar during a time period of 20 seconds. A carrier according to this embodiment can be made by prepressing the carrier or the porous metal layer or porous metal layers in it so that future permanent deformation is limited. Such embodiments surprisingly synergistically improve the properties of the wafer after its processing (e.g. thinning) while being temporarily adhered to the carrier.