Semiconductor device

Abstract

First and second p-type anode layers (2,3) are provided side by side on a drift layer (1). N-type cathode layer (5) and p-type cathode layer (6) are provided side by side below the drift layer (1). An n-type buffer layer (7) is provided between the drift layer (1) and the n-type cathode layer (5) and between the drift layer (1) and the p-type cathode layer (6). The first p-type anode layer (2,2a,2b) has a greater diffusion depth than a diffusion depth of the second p-type anode layer (3). The first p-type anode layer (2,2a,2b) has a greater impurity concentration than an impurity concentration of the second p-type anode layer (3). The n-type cathode layer (5) has a greater diffusion depth than a diffusion depth of the p-type cathode layer (6). The n-type cathode layer (5) has a greater impurity concentration than an impurity concentration of the p-type cathode layer (6).

Claims

1. A semiconductor device comprising: a drift layer; first and second p-type anode layers provided side by side on the drift layer; n-type cathode layer and p-type cathode layer provided side by side below the drift layer; and an n-type buffer layer provided between the drift layer and the n-type cathode layer and between the drift layer and the p-type cathode layer, wherein the first p-type anode layer has a greater diffusion depth than a diffusion depth of the second p-type anode layer, the first p-type anode layer has a greater impurity concentration than an impurity concentration of the second p-type anode layer, the n-type cathode layer has a greater diffusion depth than a diffusion depth of the p-type cathode layer, and the n-type cathode layer has a greater impurity concentration than an impurity concentration of the p-type cathode layer.

2. The semiconductor device according to claim 1, wherein the first p-type anode layer has a smaller pitch than a pitch of the n-type cathode layer.

3. The semiconductor device according to claim 1, wherein the first p-type anode layer above the n-type cathode layer has a smaller pitch than a pitch of the first p-type anode layer above the p-type cathode layer.

4. The semiconductor device according to claim 1, wherein a pitch of one cycle made by the first p-type anode layer and the second p-type anode layer is smaller than a pitch of one cycle made by the n-type cathode layer and the p-type cathode layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a cross-sectional view of a semiconductor device according to Embodiment 1 of the present invention.

(2) FIG. 2 is a cross-sectional view illustrating a semiconductor device according to Embodiment 2 of the present invention.

(3) FIG. 3 is a cross-sectional view illustrating a semiconductor device according to Embodiment 3 of the present invention.

(4) FIG. 4 is a cross-sectional view illustrating a semiconductor device according to Embodiment 4 of the present invention.

DESCRIPTION OF EMBODIMENTS

(5) A semiconductor device according to the embodiments of the present invention will be described with reference to the drawings. The same components will be denoted by the same symbols, and the repeated description thereof may be omitted.

Embodiment 1

(6) FIG. 1 is a cross-sectional view of a semiconductor device according to Embodiment 1 of the present invention. First and second p-type anode layers 2 and 3 are formed side by side on an n.sup.-type drift layer 1. An anode electrode 4 is connected in ohmic contact with the first and second p-type anode layers 2 and 3.

(7) N-type cathode layers 5 and p-type cathode layers 6 are formed side by side below the n.sup.-type drift layer 1. An n-type buffer layer 7 is formed between the n.sup.-type drift layer 1 and the n-type cathode layers 5 and between the n.sup.-type drift layer 1 and p-type cathode layers 6. A cathode electrode 8 is connected in ohmic contact with the n-type cathode layers 5 and p-type cathode layers 6. The n-type cathode layers 5 and p-type cathode layers 6 are short-circuited via the cathode electrode 8.

(8) In this embodiment, the first p-type anode layers 2 have a greater diffusion depth xp2 than the diffusion depth xp3 of the second p-type anode layers 3 (xp2>xp3). The first p-type anode layers 2 have a greater impurity concentration cp2 than the impurity concentration cp3 of the second p-type anode layers 3 (cp2>cp3). The n-type cathode layers 5 have a greater diffusion depth xn2 than the diffusion depth xp1 of the p-type cathode layers 6 (xn2>xp1). The n-type cathode layers 5 have a greater impurity concentration cn2 than the impurity concentration cp1 of the p-type cathode layers 6 (cn2>cp1).

(9) If the backside p/n pitch, which is the pitch of one cycle made by the n-type cathode layer 5 and p-type cathode layer 6, is made smaller, V.sub.F increases, while E.sub.REC decreases. Namely, the V.sub.F-E.sub.REC trade-off curve shifts to the high-speed side. Therefore, as a free-wheeling diode to be integrated in inverters adopted to various purposes, it is desirable that the V.sub.F-E.sub.REC trade-off characteristics be adjustable by changing the backside p/n pitch. However, if the backside p/n pitch is designed too small, the snap-off tolerance will decrease. Conversely, if the pitch is designed too large, the recovery tolerance will be lowered. The settings of the diffusion depth and impurity concentration of this embodiment allow such a trade-off to be avoided.

(10) If the backside p/n short-circuit ratio, which is the ratio of the p-type cathode layers 6 relative to the backside p/n pitch, is made smaller, V.sub.F increases, while E.sub.REC decreases. Namely, the V.sub.F-E.sub.REC trade-off curve shifts to the high-speed side. Therefore, as a free-wheeling diode to be integrated in inverters adopted to various purposes, it is desirable that the V.sub.F-E.sub.REC trade-off characteristics be adjustable by changing the backside p/n short-circuit ratio. However, if the backside p/n short-circuit ratio is designed too small, the snap-off tolerance will decrease while the cross point will increase. Conversely, if the ratio is designed too large, the recovery tolerance will be lowered. The anode structure design of this embodiment allows such a trade-off to be avoided.

(11) If the concentration of the p-type anode layers is reduced, V.sub.F increases, while E.sub.REC decreases. Namely, the V.sub.F-E.sub.REC trade-off curve shifts to the high-speed side. As a side effect, the carrier concentration on the ON-state anode side will decrease so that Irr of the recovery waveform is reduced, which relatively enhances the carrier concentration on the cathode side, whereby the snap-off tolerance can be improved. On the other hand, if the concentration of the p-type anode layers is reduced too much, the breakdown voltage will be lowered. The anode structure design of this embodiment allows such a trade-off to be avoided.

(12) By setting the diffusion depth and impurity concentration as in this embodiment, the V.sub.F-E.sub.REC trade-off characteristics can be adjusted over a wide range without having to rely on the conventional lifetime control. Thus the snap-off, which is a voltage surge toward the end of the turn-off operation, and oscillation triggered by the snap-off can be prevented. This way, cutoff performance such as controllable current density and tolerable cutoff speed during the turn-off operation can be improved.

Embodiment 2

(13) FIG. 2 is a cross-sectional view illustrating a semiconductor device according to Embodiment 2 of the present invention. The first p-type anode layers 2 have a smaller pitch than that of the n-type cathode layers 5.

(14) The maximum cutoff current density at recovery is lowered in diodes having a vertically parasitic bipolar transistor structure as compared to diodes without such a structure. By setting the pitch of the first p-type anode layers 2 as in this embodiment, the operation of the vertically parasitic bipolar transistor is inhibited, so that the maximum controllable current density at recovery can be prevented from decreasing. Similar effects as those of Embodiment 1 can also be achieved.

Embodiment 3

(15) FIG. 3 is a cross-sectional view illustrating a semiconductor device according to Embodiment 3 of the present invention. The first p-type anode layers 2a above the n-type cathode layers 5 have a smaller pitch than that of the first p-type anode layers 2b above the p-type cathode layers 6. This inhibits the operation of the vertically parasitic bipolar transistor, so that the maximum controllable current density at recovery can be prevented from decreasing. Similar effects as those of Embodiment 1 can also be achieved.

Embodiment 4

(16) FIG. 4 is a cross-sectional view illustrating a semiconductor device according to Embodiment 4 of the present invention. The pitch of one cycle made by the first p-type anode layer 2 and second p-type anode layer 3 is smaller than the pitch of one cycle made by the n-type cathode layer 5 and p-type cathode layer 6. This inhibits the operation of the vertically parasitic bipolar transistor, so that the maximum controllable current density at recovery can be prevented from decreasing. Similar effects as those of Embodiment 1 can also be achieved.

(17) While Embodiments 1 to 4 have, been described with respect to a diode that forms a high-breakdown-voltage power module (600 V) as one example, the present invention can be applied also to a range of diodes such as RC-IGBTs regardless of breakdown voltage class and semiconductor material, with the effects described above.

(18) The semiconductor device is not limited to a device formed of silicon, but instead may be formed of a wide-bandgap semiconductor having a bandgap wider than that of silicon. The wide-bandgap semiconductor is, for example, a silicon carbide, a gallium-nitride-based material, or diamond. A power semiconductor device formed of such a wide-bandgap semiconductor has a high voltage resistance and a high allowable current density, and thus can be miniaturized. The use of such a miniaturized semiconductor device enables the miniaturization and high integration of the semiconductor module in which the semiconductor device is incorporated. Further, since the semiconductor device has a high heat resistance, a radiation fin of a heatsink can be miniaturized and a water-cooled part can be air-cooled, which leads to further miniaturization of the semiconductor module. Further, since the semiconductor device has a low power loss and a high efficiency, a highly efficient semiconductor module can be achieved.

REFERENCE SIGNS LIST

(19) 1 n.sup.-type drift layer; 2,2a,2b first p-type anode layer; 3 second p-type anode layer; 5 n-type cathode layer; 6 p-type cathode layer; 7 n-type buffer layer