Discharge lamp

Abstract

A discharge lamp includes a discharge vessel. A xenon gas is sealed within the discharge vessel so as to serve as a light emitting gas, the discharge vessel is made from quartz glass, a pair of electrodes are arranged so as to face each other in the discharge vessel, and the discharge vessel has a chip portion. The chip portion is made from a glass member that has a composition different from that of the discharge vessel, and the glass member has a transmittance of 50% or more over a wavelength range from 170 nm to 300 nm.

Claims

1. A discharge lamp for use with a projector or a general illumination device, the discharge lamp comprising a discharge vessel such that a xenon gas is sealed within the discharge vessel so as to serve as a light emitting gas, the discharge vessel being made from quartz glass, a pair of electrodes being arranged so as to face each other in the discharge vessel, and the discharge vessel having a chip portion and a light emitting part, the chip portion being disposed on an outer peripheral surface of the light emitting part of the discharge vessel, and made from a glass member that has a composition different from the discharge vessel, and the glass member of the chip portion having a transmittance of 50% or more over an entire wavelength range from 170 nm to 300 nm.

2. The discharge lamp for use with a projector or a general illumination device according to claim 1, wherein the chip portion is made from quartz glass that contains metallic impurities 1 ppm or less.

3. The discharge lamp for use with a projector or a general illumination device according to claim 1, wherein a concentration of an OH group of the glass member that constitutes the chip portion is between 100 ppm and 400 ppm.

4. The discharge lamp for use with a projector or a general illumination device according to claim 2, wherein a concentration of an OH group of the glass member that constitutes the chip portion is between 100 ppm and 400 ppm.

5. The discharge lamp for use with a projector or a general illumination device according to claim 1, wherein the quartz glass of the discharge vessel has a greater capability of absorbing ultraviolet light than the glass member of the chip portion, and the glass member of the chip portion only has a transmittance of 50% or more over an entire wavelength range from 170 nm to 300 nm.

6. The discharge lamp for use with a projector or a general illumination device according to claim 5, wherein the discharge vessel is made from fused quartz glass, and the chip portion is made from synthetic quartz glass.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a cross-sectional view of a discharge lamp according to an embodiment of the present invention.

(2) FIG. 2 is a cross-sectional view of another embodiment of the present invention.

(3) FIG. 3 is a cross-sectional view of still another embodiment of the present invention.

(4) FIG. 4 is a graph showing correlation between the wavelength and transmittance of various materials.

(5) FIG. 5 is a graph showing correlation between the transmittance and relative stress intensity of various materials.

(6) FIG. 6 is an energy diagram of a xenon lamp.

(7) FIG. 7 is a table to show relationship between oxygen deficiency and absorbed wavelength in quartz glass.

DESCRIPTION OF EMBODIMENTS

(8) FIG. 1 shows a schematic view of a discharge lamp according to an embodiment of the present invention.

(9) The discharge lamp 1 includes a light emitting part 3, which serves as a discharge vessel 2 and is made from fused silica glass, and sealing parts 4 and 4 disposed at opposite ends of the light emitting part 3. In the light emitting part 3, arranged is a pair of an anode 5 and a cathode 6 that face each other.

(10) Core wires (conductors) 5a and 6a of the anode 5 and the cathode 6 are sealed by the sealing parts 4 and 4, respectively. A xenon gas, which is used as a light emitting gas, is sealed in the light emitting part 3. The xenon gas is excited upon discharging across the electrodes 5 and 6 such that the xenon gas (or the light emitting part) emits light that has a natural daylight spectrum.

(11) The discharge vessel 2 has a chip portion 8, which is a remaining portion of an evacuation pipe, at a certain position of the discharge vessel 2. In this embodiment, the chip portion 8 is formed on an outer peripheral surface of the light emitting part 3. The chip portion 8 is formed during the manufacturing process of the discharge lamp. The evacuation pipe (chip pipe) is provided to expel an impurity gas from the discharge vessel 2 and introduce the light emitting gas into the discharge vessel 2. The chip portion 8 is a remaining portion of the evacuation pipe that is left after the evacuation pipe is melted and removed while the sealing is maintained (i.e., that is left upon the completion of the manufacturing process).

(12) As described above, the quartz glass (silica glass), which constitutes the discharge vessel 2, experiences the ultraviolet-derived stress due to the ultraviolet light generated in the discharge vessel 2. The following passages will describe the ultraviolet-derived stress.

(13) The quartz glass is an amorphous material having a plurality of base units, i.e., SiO.sub.4 tetrahedrons, in which SiO.sub.4 tetrahedrons are coupled to each other such that SiOSi coupling overlaps, thereby making a net-like (mesh-like) three-dimensional structure. If defects are present in the quartz glass, the wavelength range of the light absorbed by the glass changes. The defects include, for example, oxygen deficient center which occurs when some oxygen becomes insufficient in the coupling of SiOSi, and peroxy linkage which occurs when oxygen is present excessively. Typical wavelength absorption caused by such defects is shown in Table 1 of FIG. 7.

(14) It is considered that the defects in the quartz glass are generated due to the presence of impurity substances in the glass and/or disconnection of the SiO coupling by light.

(15) The ultraviolet-derived stress in the quartz glass depends on the degree of absorption of the ultraviolet light by the glass (how much ultraviolet light is absorbed by the glass). As shown in Table 1, it is assumed that the light absorption primarily takes place in the wavelength range below 300 nm, inclusive, and such light absorption facilitates generation of the ultraviolet-derived stress.

(16) In this embodiment, the chip portion 8 is made from a glass member that has a transmittance equal to or greater than 50% between the wavelength of 170 nm and the wavelength of 300 nm. This advantageously suppresses the accumulation of the ultraviolet-derived stress because the light from the vacuum ultraviolet range to the ultraviolet range at the wavelength equal to or shorter than 300 nm, which triggers the ultraviolet-derived stress in the glass member, passes through the chip portion 8. As a result, it is possible to prevent the breakage of the discharge lamp.

(17) It should be noted that the lower limit of the wavelength range is 170 nm because the discharge lamp of this embodiment is a xenon lamp in which a xenon gas is sealed as the light emitting gas. More specifically, it is because the light in the vacuum ultraviolet range (light at the wavelength equal to or shorter than 200 nm) is hardly emitted, but the peak light emission takes place at the wavelength of 172 nm and therefore 170 nm is included as the indicator (index) for the light transmittance.

(18) It is preferred that the discharge vessel of this embodiment is made from fused quartz glass, and the material to be used for the chip portion is the quartz glass that has various metallic impurities in an amount equal to or less than 1 ppm. It is preferred that the fused quartz glass having such extremely high purity is used. When an amount of the contained metallic impurities is equal to or less than 1 ppm, it is possible to more effectively increase the transmittance in an entire wavelength from 170 nm to 300 nm. If the glass member contains the metallic impurities over 1 ppm, the metallic impurities increase the possibility that the glass member absorbs the light in the deep ultraviolet range. This may become a major factor of deterioration of the transmittance. It should be noted that synthetic quartz glass may be used.

(19) It should be noted that the light transmittance of the glass member is influenced by the concentration of the OH group contained in the glass member. When the concentration of the OH group is too high, it becomes a factor of deterioration of the transmittance at a wavelength equal to or shorter than 200 nm. Therefore, it is preferred that the concentration of the OH group of the glass member is restricted to or less than 400 ppm at maximum. On the other hand, the OH group in the glass member functions to repair the structural defects in the glass member and moderate the stress. Thus, if the concentration of OH group is too low, the stress is easy to accumulate. Accordingly, it is preferred that the concentration of OH group is equal to or greater than 100 ppm at minimum. For the above-described reasons, it is preferred that the glass member that makes up the chip portion has the OH group concentration in a range of 100 ppm-400 ppm.

(20) An evaluation experiment was carried out with four kinds of material to know the influence of ultraviolet-derived stress in the quartz glass. FIG. 4 shows the relationship between the wavelength and the transmittance of each of the materials. The materials were selected to have different transmittances at the wavelength around 172 nm, and the relative stress intensity of the materials was measured, respectively. In this experiment, the material A was F310 (Shin-Etsu Quartz Products Co., Ltd), the material B was HX-LA (Shin-Etsu Quartz Products Co., Ltd), the material C was GE02AL (General Electric Company), the material D was GE214 (General Electric Company), and the material E was a high-purity fused quartz glass that had metallic impurities equal to or less than 1 ppm (Tosoh Corporation).

(21) In this experiment, the wavelength of 172 nm was selected as the indicator for the transmittance. Because the light having a wavelength longer than 172 nm shows a tendency that the light is easier to pass through the material, the inventor observed the transmittance at the wavelength of 172 nm to know the relationship between the transmittance of the ultraviolet light and the ultraviolet-derived stress accumulated in the glass.

(22) Among the observed materials, the materials A and B had the transmittance equal to or over 50% at the wavelength of 172 nm, and the materials C and D had the very low transmittance, i.e., no greater than 10%.

(23) FIG. 5 shows the correlation diagram, with the vertical axis indicating the relative stress intensity (arb. unit) and the horizontal axis indicating the transmittance (indicator being a wavelength of 172 nm).

(24) The experiment conditions: An excimer lamp was used, materials A to D were irradiated with light at a wavelength of 172 nm for 400 hours. Changes in stress were measured. In FIG. 5, the vertical axis indicates a ratio of the stress before the ultraviolet light irradiation to the stress after the ultraviolet light irradiation (hereinafter, referred to as relative stress intensity). As depicted in the drawing, those substances (materials A and B) which had transmittance of 50% or more at the wavelength of 172 nm showed an extremely low relative stress intensity. No accumulation of the ultraviolet-derived stress was observed. On the other hand, it was observed that those substances (materials C and D) which had transmittance of less than 50% at the wavelength of 172 nm showed a large amount of accumulation of the ultraviolet-derived stress as the transmittance was deteriorating. It should be noted that all the glass members made from the materials A-D showed the tendency that the light having a wavelength longer than 172 nm were more transmitted through the glass members. Thus, when the transmittance at the wavelength of 172 nm is 50% or more, it is natural that the transmittance of the light having a longer wavelength than 172 nm is never smaller than 50%.

(25) From the above-described results, it is understood that the accumulation of the ultraviolet-derived stress at the chip portion is extremely small when the glass material of the chip portion is a glass member that has a different composition from the discharge vessel, and the glass member has a transmittance equal to or greater than 50% in an entire wavelength range from 170 nm to 300 nm. Thus, it is also understood that obtained is the discharge lamp that has no possibility of cracking and breakage from the chip portion.

(26) FIG. 2 shows another embodiment of the present invention. In this embodiment, the chip portion 8 is formed on the sealing part 4 of the discharge vessel 2.

(27) FIG. 3 shows still another embodiment of the present invention. This embodiment is directed a long arc type discharge lamp whereas the embodiments shown in FIGS. 1 and 2 are generally directed to a short arc type discharge lamp.

(28) The long arc type discharge lamp 10 includes an elongated discharge vessel 11, and a pair of electrodes 12 and 12 in the discharge vessel 11 such that the electrodes 12 and 12 face each other. A chip portion 13 is formed on the discharge vessel 11.

REFERENCE NUMERALS AND SYMBOLS

(29) 1: (Short arc type) discharge lamp 2: Discharge vessel 3: Light emitting part 4: Sealing part 5: Anode 5a: Anode core wire 6: Cathode 6a: Cathode core wire 8: Chip portion 10: (Long arc type) discharge lamp 11: Discharge vessel 12: Electrode 13: Chip portion