Circuit arrangement consisting of two interconnected high-frequency components

Abstract

A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.

Claims

1. A circuit arrangement comprising a first high-frequency component and a second high-frequency component interconnected with each other, wherein a connection for transferring high-frequency signals between the first high-frequency component and the second high-frequency component is arranged between the first high-frequency component and the high-frequency second component; wherein the connection comprises at least one inner conductor; wherein the inner conductor is at least partially enclosed by an outer conductor; wherein the inner conductor is connected to the first high-frequency component and to the second high-frequency component, in order to transfer high-frequency signals; wherein the second high-frequency component comprises a contact surface on a connecting surface; wherein the inner conductor is pressed using a pressure force onto the contact surface to establish a high-frequency connection between the first high-frequency component and the second high-frequency component, wherein the first high-frequency component comprises a housing; wherein the inner conductor and the outer conductor extend in an identical direction away from the housing and in the direction of the second high-frequency component; and wherein the outer conductor is galvanically connected to the housing.

2. The circuit arrangement according to claim 1, wherein the first high-frequency component comprises a first functional module; wherein the second high-frequency component comprises a second functional module; wherein the contact surface is a metallized surface on the connecting surface of the second high-frequency component; and wherein the contact surface is connected to the second functional module of the second high-frequency component, so that a transfer of signals from the first functional module of the first component to the second functional module of the second high-frequency component is enabled.

3. The circuit arrangement according to claim 1, wherein the outer conductor is galvanically connected at least at some points to a further contact surface on the connecting surface.

4. The circuit arrangement according to claim 1, further comprising a dielectric material arranged between the inner conductor and the outer conductor.

5. The circuit arrangement according to claim 1, wherein the end faces of inner conductor and outer conductor protruding from the housing have an equal distance from an outer surface of the housing.

6. The circuit arrangement according to claim 1, wherein the at least one inner conductor comprises a plurality of inner conductors associated with the first high-frequency component and the outer conductor comprises a plurality of outer conductors, wherein one of the plurality of outer conductors is arranged between each two adjacent inner conductors of the plurality of the inner conductors.

7. The circuit arrangement according to claim 6, wherein at least a part of the inner conductors of the plurality of inner conductors is embedded in a plastic block and held immovably in relation to one another.

8. The circuit arrangement according to claim 1, wherein a plurality of contact surfaces is arranged on an outer surface of the first high-frequency component facing toward and opposite to the connecting surface of the second high-frequency component; wherein a corresponding number of contact surfaces is arranged on the connecting surface; wherein alternately one inner conductor of the at least one inner conductor or one outer conductor of the outer conductor extends between opposing contact surfaces of the outer surface and the connecting surface; and wherein the one inner conductor and the one outer conductor are pressed onto the contact surfaces of outer surface and connecting surface using a pressure force.

9. The circuit arrangement according to claim 1, wherein at least two positioning elements are arranged on one of the first high-frequency component or the second high-frequency component; and wherein recesses are arranged on the other one of the first high-frequency component or the second high-frequency component, wherein the recesses are configured to correspondingly accommodate the at least two positioning elements and to bring the first high-frequency component into a predetermined position with respect to the second high-frequency component and hold the first high-frequency component in the predetermined position.

10. The circuit arrangement according to claim 1, further comprising at least one connecting element arranged to exert a pressure force on the first high-frequency component and/or the second high-frequency component, so that the first high-frequency component is pressed in a direction of the second high-frequency component and is held using a predetermined pressure force.

11. A circuit arrangement comprising a first high-frequency component and a second high-frequency component interconnected with each other, wherein a connection for transferring high-frequency signals between the first high-frequency component and the second high-frequency component is arranged between the first high-frequency component and the high-frequency second component; wherein the connection comprises at least one inner conductor; wherein the inner conductor is at least partially enclosed by an outer conductor; wherein the inner conductor is connected to the first high-frequency component and to the second high-frequency component, in order to transfer high-frequency signals; wherein the second high-frequency component comprises a contact surface on a connecting surface; wherein the inner conductor is pressed using a pressure force onto the contact surface to establish a high-frequency connection between the first high-frequency component and the second high-frequency component, wherein the outer conductor is configured as a grid structure or honeycomb structure and is arranged between the first high-frequency component and the second high-frequency component; wherein the outer conductor forms a plurality of chambers and each chamber is at least partially enclosed by a material of the outer conductor; and wherein an inner conductor of the at least one inner conductor is arranged in each chamber.

12. The circuit arrangement according to claim 11, wherein a dielectric material, which at least partially encloses the inner conductor in the chambers, is arranged in at least a part of the chambers.

13. The circuit arrangement according to claim 11, wherein the at least one inner conductor is arranged spaced apart from the outer conductor in a chamber or is galvanically coupled to the outer conductor at a lateral surface of a chamber.

14. A satellite having a circuit arrangement according to claim 1, wherein the circuit arrangement is coupled to a signal processing unit of the satellite and to a functional module of the satellite.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The exemplary embodiments of the invention will be described in greater detail hereafter with the aid of the appended drawings. The illustrations are schematic and are not true to scale. Identical reference signs relate to identical or similar elements. In the figures:

(2) FIG. 1 shows a schematic illustration of two interconnected high-frequency components.

(3) FIG. 2 shows a schematic illustration of a circuit arrangement according to one exemplary embodiment in a lateral sectional view.

(4) FIG. 3 shows a schematic illustration of inner conductors in a dielectric material.

(5) FIG. 4 shows a schematic sectional illustration of a circuit arrangement according to one exemplary embodiment.

(6) FIG. 5 shows a schematic top view of a partially assembled circuit arrangement according to one exemplary embodiment.

(7) FIG. 6 shows a schematic illustration of inner conductors and one outer conductor.

(8) FIG. 7 shows a schematic illustration of a satellite having a circuit arrangement according to one exemplary embodiment.

(9) FIG. 8 shows a schematic illustration of a circuit arrangement according to one exemplary embodiment.

DETAILED DESCRIPTION

(10) FIG. 1 shows by way of example an electronic module having a first component 110 and a second component 150. The two components 110, 150 are each arranged on a circuit board, wherein the circuit board of the first component 110 extends from left to right and into the plane of the drawing and the circuit board of the second component 150 extends perpendicularly thereto.

(11) The first component 110 comprises processing modules 112. The processing modules receive (or transmit, depending on the direction of the signal processing path) signals via a signal interface 114. The first component 110 is connected via a connection 160 to the second component 150.

(12) A functional module 156 is arranged on the second component 150. The functional module can independently execute signal processing functionality or solely relay the signals to a processing unit. In any case, a signal is fed from the first component 110 via the connection 160 to the second component 150 (or vice versa).

(13) FIG. 2 schematically shows a circuit arrangement 100 according to one exemplary embodiment. The circuit arrangement 100 comprises a first component 110 and a second component 150, which are interconnected via a connection 116.

(14) The first component 110 comprises a housing 111 (shaded). Processing modules 112 (one or more, two are shown) are contained in the housing. Openings are arranged in a side wall of the housing 111 to conduct signals from the processing modules 112 outward via an inner conductor 120. In the present case, the inner conductors 120 are connected via a microstrip line (bonding). The inner conductor 120 is enclosed by a dielectric material 118 in the opening of the housing and protrudes outward from the outer surface 126. Each inner conductor 120 is enclosed by an outer conductor 122. The outer conductor protrudes from the outer surface 126 of the housing in the same direction as the inner conductor 120.

(15) The first component 110 is aligned with respect to a second component, of which only a connecting surface 152 is shown in FIG. 2, so that the inner conductor 120 and the outer conductor 122 touch provided contact surfaces 154 and establish a connection thereto when the first component 110 and the second component 150 are pressed against one another, thus when the connecting surface 152 and the outer surface 126 are moved toward one another.

(16) The circuit arrangement contains and connects two HF modules (first and second components 110, 150), wherein in some variants both HF and also DC signals can be transferred. The HF modules can be arranged perpendicularly in relation to one another in this case (for example, to connect a backplane and an amplifier module for active antennas). The connection is established by an inner conductor inserted into plastic (for example, Teflon or PEEK, the dielectric material 118). This inner conductor can either be embedded in the plastic or pressed in or inserted later. Either a single inner conductor embedded in plastic or a block of inner conductors (having metallic partition surfaces between the individual inner conductors, which can also be embedded) can be used. This structure is schematically shown in FIG. 2.

(17) The first component 110 consists of a group of electronic modules 112, of which one or more (for example, four) are installed in a housing 111 (for example, produced from aluminium). The housing 111 has feedthroughs, which are designed so that they represent the connection to the backplane for the outer conductor (in the figure, the housing part 122 connected to the backplane). The inner conductor 120 embedded in dielectric material 118 is inserted into this feedthrough. Inner conductor and dielectric material are designed so that a displacement of the inner conductor under pressure load from right to left (in relation to the illustration in FIG. 2, i.e., into the housing 111) is prevented. The inner conductor is connected to the electronic assembly 112 (for example, bonding, soldering, gap welding). The connection to the backplane 150 is produced with the aid of contact surfaces, these are, for example, electrically conductive polymers or silicones (e.g., Nolato, Invisipin). The housing, in which the backplane is installed, is aligned with the housing 111 for this purpose (for example, using register pins, see FIG. 8) and then permanently connected (e.g., screwed on, clamped, or adhesively bonded). The backplane is installed as a whole from the right in FIG. 2.

(18) A connection via contact surfaces enables a flexible connection which ensures the electrical conductivity over a large temperature range. Mechanical decoupling is also achieved. The force required for the contacting is low, only a certain pre-tension has to be ensured to achieve a secure contact (during the installation of the backplane 150 on the housing 111 of the first component 110).

(19) FIG. 3 shows a schematic illustration of a plurality of inner conductors 120, which are fitted or embedded in a plastic block 118, which functions as a dielectric material. The entire structure shown in FIG. 3 can thus be arranged between the first component 110 and the second component 150. In addition, measures are also to be taken to be able to attach the outer conductors. For this purpose, recesses or depressions can be provided in the plastic block 118, so that the outer conductors find space therein.

(20) The inner conductors 120 can be arranged in the plastic block 118 at provided distances, so that the inner conductors touch the provided contact surfaces exactly upon placement of the arrangement from FIG. 3.

(21) FIG. 4 shows by way of example how a first component 110 and a second component 150 can be interconnected according to the connection technology provided here. Inner conductors 120, outer conductors 122, and dielectric material 118 are arranged between the components 110, 150 (which are each designed as a circuit board in this case). Each inner conductor is enclosed by two outer conductors, and/or one outer conductor is located between each two adjacent inner conductors. The intermediate spaces are filled using dielectric material. The upper circuit board 110 and the lower circuit board 150 are pressed against one another by connecting elements 170 in the form of a screw connection (left) and a clamp connection (right), so that the inner conductors and outer conductors touch the contact surfaces 154 on the upper circuit board and the lower circuit board and thus establish a high-frequency signal connection.

(22) FIG. 4 thus shows that the connection technology described herein can also be used to directly interconnect two circuit boards. However, a circuit board can also be connected using an output to an antenna, which is located above the circuit board.

(23) FIG. 5 shows the connection of FIG. 4 in a partially assembled state. This is a top view of the arrangement of FIG. 4, wherein the upper circuit board 110 is not yet installed. The dielectric material 118 and the structure of the outer conductor 122 and also the position of the inner conductor 120 with respect to the outer conductor 122 can be seen.

(24) The outer conductor 122 is provided in the form of a grid structure or honeycomb structure. The outer conductor thus forms a plurality of chambers 124, which are partially or entirely enclosed by the material of the outer conductor forming the grid structure. At the top left in FIG. 5, the chamber is completely enclosed by the outer conductor, while in contrast the other three chambers shown are open at least in sections on a side wall. The openings are preferably at those positions from which electromagnetic disturbances or interference do not threaten the respective inner conductor.

(25) The inner conductors 120 are arranged horizontally and vertically in the middle in the chambers (the direction specifications relate to the directions in FIG. 5). However, it is also conceivable that the inner conductors are offset in one or both directions from the middle.

(26) In any case, the inner conductors are arranged in relation to the outer conductor so that they contact correspondingly arranged contact surfaces on the circuit boards 110, 150. For this purpose, the assembly made up of outer conductor 122, dielectric material 118, and inner conductor 120 from FIG. 5 is firstly positioned on the lower circuit board 150 (and if necessary fixed against lateral displacement, possibly using register pins, cf. FIG. 8), the upper circuit board 110 is then placed on the assembly made of outer conductor 122, dielectric material 118, and inner conductor 120 and also positioned, so that inner conductor and outer conductor contact the associated contact surfaces of the upper circuit board.

(27) Finally, a pressure force is applied to the circuit boards using connecting elements or retaining elements 170.

(28) FIG. 6 shows an alternative design of the arrangement from FIG. 5. In the example of FIG. 5, the inner conductors 120 are arranged spaced apart from the walls of the chambers 124 of the outer conductors 122 (grid structure) in the chambers. In the example of FIG. 6, in contrast, the inner conductors 122 press against a wall of a chamber. In this case, the inner conductors 120 are galvanically connected at at least one position to the outer conductor 122. Moreover, a gap can be provided between inner conductor and outer conductor, in which a high-frequency wave propagates and is thus transferred.

(29) A chamber can optionally be filled using dielectric material 118, as shown in the chamber at the bottom right in FIG. 6. The other three chambers are not filled using dielectric material.

(30) The inner conductors can be arranged on the walls of the chambers so that one inner conductor is not arranged in each case on the same wall on different sides of the wall. This can keep the mutual influence of signals on one another low. As shown in FIG. 6, the two inner conductors on the right side are each arranged on the upper wall of the chamber thereof. The inner conductor on the top left is arranged on the upper wall of its chamber and the inner conductor on the bottom left is arranged on the right wall of its chamber. In any case, many constellations are conceivable for the attachment of the inner conductors to the walls of the chambers, to avoid two inner conductors being arranged on opposing sides of the same chamber wall. To illustrate the state which one seeks to avoid if possible: if the inner conductor in the chamber on the bottom right is arranged on the left inner wall of its chamber, then the inner conductors in the two lower chambers are arranged on opposing sides of the same chamber wall and are very close to one another, so that interference possibly occurs.

(31) FIG. 7 schematically shows a satellite 10, which contains a circuit arrangement 100 according to one of the examples described herein. The circuit arrangement 100 receives signals from the signal processing unit 12 and transfers them further to a functional module 14, which is designed in the example 14 as an antenna.

(32) The circuit arrangement 100 enables a plurality of channels to be transferred via a mechanically and thermo-mechanically decoupled connection, as described in detail above.

(33) FIG. 8 shows by way of example how the first component 110 and the second component 150 can be brought into a predetermined or desired position in relation to one another and can be retained so that the inner conductors and outer conductors contact the associated contact surfaces (and only these and no other contact surfaces).

(34) Multiple positioning elements 128 in the form of register pins in the design as truncated cones, which taper in the direction of the second component 150, are provided on a surface of a component which faces toward the other component and which is used as a connecting surface (in the example of FIG. 8, this is the lower side of the first component 110). The positioning elements 128 can assume diverse shapes and the number thereof can be two or more.

(35) Recesses 158 in the form of depressions or holes, which correspond in the shape and number thereof to the positioning elements, are provided in the opposing surface of the other component (in FIG. 8, this is the second component 150).

(36) If the two components 110, 150 are now moved toward one another, as the two arrows indicate, the positioning elements 128 are accommodated in the depressions 158 and aligned in relation to one another, so that the inner conductors and outer conductors between the two components contact the respective provided contact surfaces and enable high-frequency signals to be transferred.

(37) In addition, it is to be noted that “comprising” does not preclude other elements or steps and “a” or “one” does not preclude a plurality. Furthermore, it is to be noted that features or steps which have been described with reference to one of the above exemplary embodiments can also be used in combination with other features or steps of other above-described exemplary embodiments. Reference signs in the claims are not to be understood as a restriction.

(38) While at least one exemplary embodiment of the present invention(s) is disclosed herein, it should be understood that modifications, substitutions and alternatives may be apparent to one of ordinary skill in the art and can be made without departing from the scope of this disclosure. This disclosure is intended to cover any adaptations or variations of the exemplary embodiment(s). In addition, in this disclosure, the terms “comprise” or “comprising” do not exclude other elements or steps, the terms “a” or “one” do not exclude a plural number, and the term “or” means either or both. Furthermore, characteristics or steps which have been described may also be used in combination with other characteristics or steps and in any order unless the disclosure or context suggests otherwise. This disclosure hereby incorporates by reference the complete disclosure of any patent or application from which it claims benefit or priority.

LIST OF REFERENCE SIGNS

(39) 10 satellite 12 signal processing unit 14 functional module, antenna 100 circuit arrangement 110 first component 111 housing 112 processing module 114 interface 116 connection 118 dielectric material 120 inner conductor 122 partition surface, outer conductor 124 chamber 126 outer surface 128 positioning element, register pin 150 second component 152 connecting surface 154 contact surface 158 depression, recess 156 functional module 160 connection 170 connecting element, retaining element