Directional coupling communication apparatus
10348365 ยท 2019-07-09
Assignee
Inventors
Cpc classification
H04B5/266
ELECTRICITY
H01L2224/16225
ELECTRICITY
H05K1/0243
ELECTRICITY
H05K2201/042
ELECTRICITY
H01L2924/00014
ELECTRICITY
H05K2201/09045
ELECTRICITY
H04B5/28
ELECTRICITY
H01L2924/00014
ELECTRICITY
H05K1/147
ELECTRICITY
H05K1/141
ELECTRICITY
International classification
H04B5/00
ELECTRICITY
Abstract
The invention relates to a directional coupling communication apparatus where the coupling impedance can be easily matched to reduce reflections, and thus, the speed of communication channels is increased as compared to that with inductive coupling, and at the same time, the reliability of communication is improved by increasing the signal intensity. Modules having a coupler where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted into the input/output connection line connected to the above-described first end is inputted is connected are layered on top of each other so that the couplers are couplers to each other using capacitive coupling and inductive coupling.
Claims
1. A directional coupling communication apparatus, comprising: a first coupler in arc form provided on a first insulating substrate, where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted to the input/output connection line connected to said first end is inputted is connected; and a second coupler in arc form, where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted to the input/output connection line connected to said first end is inputted is connected, wherein the diameter of a coupler in said second coupler in smaller than the diameter of a coupler in said first coupler, and said second coupler is incorporated inside said first coupler so as to be freely rotatable around said first coupler in a concentric manner.
2. The directional coupling communication apparatus according to claim 1, wherein said first coupler and said second coupler are provided to a hinge portion of a housing that can be freely opened and closed.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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PREFERRED EMBODIMENTS OF THE INVENTION
(54) The directional coupling communication apparatus according to an embodiment of the present invention is described below in reference to
(55) The objects to which the present invention is applied is a field where the system is treated as a distributed constant circuit of which the assumption is that each coupler has a length longer than the signal wavelength, typically 1/10 of the signal wavelength or longer, and thus, the objects are totally different than coils that can be handled as a lumped constant circuit.
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(58) Though the input/output connection lines 13.sub.1, 14.sub.1 and the input/output connection lines 13.sub.2, 14.sub.2 are formed as signal lines to which a distributed constant circuit is applied, bonding wires may be used. In addition, though the connection portions between the input/output connection lines 13.sub.1, 14.sub.1 and the input/output connection lines 13.sub.2, 14.sub.2 run in the direction of the long axes of the first coupler 12.sub.1 and the second coupler 12.sub.2, the input/output connection lines 13.sub.1, 14.sub.1 and the input/output connection lines 13.sub.2, 14.sub.2 may respectively be connected to the ends of sides of the first coupler 12.sub.1 and the second coupler 12.sub.2 along the long axis.
(59) Furthermore, it is not necessary for the first coupler 12.sub.1 and the second coupler 12.sub.2 to have the same length, and they may have a length different from each other. Alternatively, the long axes of the first coupler 12.sub.1 and the second coupler 12.sub.2 may not be parallel to each other so that the margin for positioning at the time of layering can be increased. Moreover, it is not necessary for the first coupler 12.sub.1 and the second coupler 12.sub.2 to be rectangular, and for example, they may be in C shape where there are two bends. As another alternative, they may be in such a shape that the two ends of the C shape are bent so that the shape has four bends in total. Thus, the couplers have such a shape that the two ends are close to each other in such a manner that the connection portions between the coupler and the input/output connection lines are in close proximity, and therefore, the couplers having the same coupling length can be made compact.
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(61) In addition, surface layers 18.sub.1, 18.sub.2, 19.sub.1, and 19.sub.2 having a relative dielectric constant ?.sub.3 are formed on the front and rear of the first insulating substrate 11.sub.1 and the second insulating substrate 11.sub.2 for protection. The first module 10.sub.1 and the second module 10.sub.2 are layered on top of each other so as to face each other with a space or an insulating film of which the relative dielectric constant is ?.sub.1.
(62) Resins such as a polyimide resin, an epoxy resin, a phenol resin, and an acryl resin may be used as the material for the first insulating substrate 11.sub.1, the second insulating substrate 11.sub.2, the surface layers 18.sub.1, 18.sub.2, 19.sub.1, 19.sub.2, and the insulating film, where it is desirable for the setting to be ?.sub.1<?.sub.2<?.sub.3. In order to set the relative dielectric constant at any value, it may be adjusted by the selection of the type of base resin and additives. As for the substrates, flexible printed circuits (FPCs) having any of the above-described resins as a base are flexible and have a thickness as thin as approximately 75 ?m, and thus are easily mounted in a small apparatus such as a mobile phone. However, the substrates are not limited to FPCs, and printed circuit boards (PCBs), semiconductor substrates, and substrates within a package may be used.
(63) In the case where the dielectric constant between the coupler lines is lower than the dielectric constant of the material around the coupler lines, the crosstalk in the near ends becomes smaller and the crosstalk in the far ends becomes greater, and therefore, the reliability of communication can be secured by using the crosstalk between the far ends. As a result, a gap may be left between the two modules when they are provided in close proximity, for example, which has such an advantage that the connection of modules is easy and at a low cost. Alternatively, the selection of an insulating film at the time of close connection with an insulating film in between can be more varied.
(64) Next, the operational principle of the directional coupling communication apparatus according to the embodiment of the present invention is described in reference to
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(66) When the signal (+).sub.1 propagates from the terminal A.sub.1 of the first coupler 12.sub.1 towards the terminal B.sub.1, the current and the voltage change at the crest of a wave of the signal that propagates. Mutual capacitance C and mutual inductance M exist continuously between the first coupler 12.sub.1 and the second coupler 12.sub.2, and therefore, a capacitive coupling current and an inductive coupling current are induced in the second coupler 12.sub.2 so as to flow due to the coupling effects of i=C (dv/dt) and v=L (di/dt).
(67) After a displacement current flows from the first coupler 12.sub.1 to the second coupler 12.sub.2, the impedance of the second coupler 12.sub.2 is equal as viewed in the left and right directions from that point, and therefore, the capacitive coupling current branches equally to the left and right and flows to the two ends. That is to say, half of the capacitive coupling current returns back to the near end (terminal A.sub.2) and the other half proceeds to the far end (terminal B.sub.2). Either current generates a positive voltage signal in the terminal resistor located in the point to which the current flows. Here, there are terminal resistors for matching termination in the transmitter/receiver circuit 15.sub.1 and 15.sub.2 shown in
(68) The signal that returns back to the near end (terminal A.sub.2) has a waveform shown in
(69) That is to say, a signal that propagates through the first coupler 12.sub.1 completely enters into the first coupler 12.sub.1 after the amount of time RT for the wave to rise since the crest of the wave of the signal has entered into the terminal A.sub.1, and while the signal propagates towards the terminal B.sub.1, half of the displacement current that has emitted from the current signal source that progresses towards the terminal B.sub.1 returns back towards the terminal A.sub.2 at the same speed, and therefore, the terminal A.sub.z has a constant current value. When the time it takes for the signal (+).sub.1 to propagate from the terminal A.sub.1 to the terminal B.sub.2 is TD, at the point in time when the signal has reached the terminal B.sub.1, half of the displacement current that has moved to the second coupler 12.sub.2 returns to the terminal A.sub.2 of the second coupler 12.sub.2, taking additional time TD, and therefore, the coupling signal (+).sub.2 that appears at the terminal A.sub.2 becomes a pulse signal with a time width of 2TD as shown in
(70) In addition, the remaining half of the current that progresses towards the terminal B.sub.2 reaches the terminal B.sub.2 after TD while accumulating the amount of current together with the current signal source since it progresses towards the terminal B.sub.1, and thus, a waveform as shown in
(71) Meanwhile, the inductive coupling current is a current that flows due to the voltage supply that is induced in the second coupler 12.sub.2 through inductive coupling, and the direction thereof is opposite to the direction of the current loop in the first coupler 12.sub.1 and is directed from the terminal B.sub.2 to the terminal A.sub.2 macroscopically, and thus, a waveform as shown in
(72) Furthermore, the signal generated at the terminal B.sub.2 has the symbol opposite to that of the signal generated at the terminal B.sub.2 through capacitive coupling as shown in
(73) That is to say, the signal (+).sub.1 that has been inputted from the terminal A.sub.1 generates a coupling signal (+).sub.2 having the same polarity applied to the terminal A.sub.2 by means of the coupler, and at the same time generates the coupling signal (+).sub.2 having the opposite polarity at the terminal B.sub.2. Meanwhile, the signal (?).sub.1 that has been inputted from the terminal B.sub.1 generates a coupling signal (?).sub.2 having the opposite polarity at the terminal A.sub.2 by means of the coupler as shown in
(74) Accordingly, at the terminal A.sub.2, the coupling signal (+).sub.2 and the coupling signal (?).sub.2 both have the same polarity as the signal (+).sub.1 so as to strengthen each other and generate the signal in
(75) Here, when the signal (+).sub.1 that has been inputted from the terminal A.sub.1 generates a coupling signal (+).sub.2 having the same polarity at the terminal A.sub.2 by means of a coupler, this is referred to as crosstalk in the near ends, and when it generates a coupling signal (+).sub.2 having the opposite polarity at the terminal B.sub.2, this is referred to as crosstalk in the far ends. That is to say, when the signal (?).sub.1 that has been inputted from the terminal B.sub.1 generates a coupling signal (?).sub.2 having the opposite polarity at the terminal A.sub.2 by means of a coupler, this is referred to as crosstalk in the far ends, and when it generates a coupling signal (?).sub.2 having the same polarity at the terminal B.sub.2, this is referred to as crosstalk in the near ends.
(76) In conventional differential couplers, only crosstalk in the near ends is used for communication, and crosstalk in the far ends is consumed as heat through the terminal resistor, and thus cannot be used for communication. Meanwhile, in the directional coupling differential communication apparatus according to the embodiment of the present invention, crosstalk in the far ends between differential signals having a polarity opposite to each other is also used, and therefore, the received signal can be increased.
(77) Here, in the couplers, copper foil having a thickness of approximately 20 ?m formed on the two surfaces of a substrate and vias that penetrate through the substrate are created through a printing process so that transmission lines for the signal may be provided. The characteristic impedance of the transmission lines is generally 50? but may have other values.
(78) When the application for data communication between the display module and the motherboard in a portable phone is assumed, the communication distance (distance between couplers) is approximately 0.1 mm, but the same structure can be used in the case where the distance is from several mm to several cm.
(79) Though a typical example relates to the connection between two modules, the number of modules may be three or more. The present invention also includes a case of communication between three semiconductor chips of which two semiconductor chips are mounted on the two surfaces of a PCB as shown in the below-described Example 15, for example, so that the transmission lines that form a coupler provided on the PCB and the transmission lines on the two semiconductor chips are coupled to each other while the remaining semiconductor chip is connected to the transmission lines provided on the PCB. In this case, semiconductor chips may be combined in any form, and as an example, a semiconductor chip connected to the transmission lines provided on a PCB can be a microprocessor and the other semiconductor chips can be memory chips.
(80) Here, in order to increase the coupling efficiency between the first coupler and the second coupler, a dielectric body in plate form may be inserted between the first coupler and the second coupler, which makes electromagnetic field coupling possible even in the case where the first coupler and the second coupler have a gap that is relatively large.
(81) In the case where a third coupler is provided on the first insulating substrate so as to form a closed circuit, the first coupler and the third coupler are respectively formed of two couplers and a terminal resistor for linking the two couplers so that a standing wave attenuates and the flatness of the coupling degree can be maintained in the broadband, which makes it possible to remove signal distortion.
(82) Furthermore, the above-described first coupler and second coupler are couplers in arc form having the same radius of curvature so that lead transmission lines of the first module and the second module can be led out at a free angle.
(83) In this case, the center of the second coupler in the second module matches with the center of the first coupler of the first module, and the second module is provided so as to be rotatable relative to the first module, thereby making communication possible between the operational members through electromagnetic field coupling.
(84) In the case of couplers in arc form, the length of the arc of the second coupler may be shorter than the length of the arc of the first coupler, and thus, an excellent degree of coupling can be maintained even in the case where the length of the arc of each coupler is not the same.
(85) A third module having a third coupler, where an input/output connection line is connected to a first end provided on a third insulating substrate and either a ground line or an input/output connection line to which an inverse signal of the signal inputted through the input/output connection line connected to the above-described first end is inputted is connected to a second end, may further be provided, and the first to third modules can be layered on top of each other so that the first coupler, the second coupler, and the third coupler at least partially overlap as viewed in the direction in which the modules are layered on top of each other, and signal coupling is generated between the first coupler, the second coupler, and the third coupler using capacitive coupling and inductive coupling.
(86) The three modules are layered on top of each other in this manner so that the couplers overlap in the direction in which the modules are layered on top of each other, and thus, a multi-drop bus can be formed using any one module as a bus. As a result, simultaneous communication becomes possible between the module that works as a bus and the other two modules.
(87) In the case where a third coupler is provided on the rear surface of the first insulating substrate, a third module with a third coupler may be layered in such a manner that the longitudinal direction of the first coupler crosses the longitudinal direction of the third coupler at right angles so that electromagnetic interference between the first coupler and the third coupler can be prevented.
(88) A second coupler in arc form, where an input/output connection line is connected to a first end and either a ground line or an input/output connection line to which an inverse signal of the signal inputted through the input/output connection line connected to the above-described first end is inputted is connected to a second end, may be built inside a first coupler in arc form, where an input/output connection line is connected to a first end provided on a first insulating substrate and either a ground line or an input/output connection line to which an inverse signal of the signal inputted through the input/output connection line connected to the above-described first end is inputted is connected to a second end, so as to be rotatable around the first coupler in a concentric manner, and thus, the couplers can work as an electromagnetic field connector in the rotatable portion.
(89) In this case, the first coupler and the second coupler typically form a connector in the hinge of a housing that can be opened and closed as a electromagnetic field connector in the rotatable portion.
(90) In summary, the directional coupling communication apparatus according to the embodiment of the present invention can provide the following working effects:
(91) 1) A coupler where four signal lines and two terminal resistors are necessary according to the prior art can be formed of two signal lines.
(92) 2) Since the number of lines for capacitive and inductive coupling is two, it is relatively easy to match the coupling impedance as compared to a conventional case where four signal lines are capacitively and inductively coupled to each other.
(93) 3) Signal reflection does not occur because matching termination can be achieved using a variable resistor provided in the transmitter/receiver circuit.
(94) 4) The signal is intensified through the crosstalk in the far ends, and therefore, the reliability of communication increases.
(95) 5) Since (+) and (?) signals are always applied to the two ends of a coupler, the common signal does not change, making unnecessary radiation (noise) smaller.
Example 1
(96) Next, the directional coupling differential communication apparatus according to Example 1 of the present invention is described in reference to
(97) The coupler components 41.sub.1, 41.sub.2, 51.sub.1, and 51.sub.2 are respectively provided with couplers 43.sub.1, 43.sub.2, 53.sub.1, and 53.sub.2, which are respectively connected to transmitter/receiver circuits 46 and 56 via lead transmission lines 44.sub.1, 44.sub.2, 45.sub.1, 45.sub.2, 54.sub.1, 54.sub.2, 55.sub.1, and 55.sub.2. Here, terrace members 61.sub.1 and 61.sub.2 provided on the main substrate 40 are used so that the couplers 43.sub.1 and 43.sub.2 provided on the coupler components 41.sub.1 and 41.sub.2 are installed in the proximity of the couplers 53.sub.1 and 53.sub.2 provided in the coupler components 51.sub.1 and 51.sub.2 in the structure. The main substrate 40 and the child substrate 50 are layered on top of each other using a support member 62. In the following examples, including this example, the setting allows the coupling impedance Z.sub.0-coupled to be matched in the electromagnetic field coupling between couplers that face each other.
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(99) The dimensions of the coupler 43 are different between the cases where the substrate is an FPC or a PCB and vary in accordance with the communication distance and the communication speed. An example can be cited where the length is 5 mm and the width is 0.5 mm. In an example of the dimensions of the lead transmission lines 44 and 45, the width is 0.3 mm, and close coupling can be achieved in places where two lead transmission lines 44 and 45 are provided in close proximity with a distance that is three times or less greater than the width.
(100) A differential signal is inputted to the two ends of the coupler on the transmitter side while a differential signal is outputted from the two ends of the coupler on the receiver side. It is desirable for the lead transmission lines for connecting the transmitter to the coupler and the lead transmission lines for connecting the coupler to the receiver to have an equal length so that the delay of the signal is the same. When the lead transmission lines 44 and 45 go out from the two ends of the coupler 43 and are bent so as to return to the center of the coupler 43, the coupler 43 and the lead transmission lines 44 and 45 are sufficiently spaced away from each other, such as by approximately three times the width, in order to prevent capacitive and inductive coupling. In the case where the width of the coupler 43 is 0.5 mm and the width of the lead transmission lines 44 and 45 is 0.3 mm, for example, it is desirable for them to be spaced away from each other by 1 mm to 1.5 mm or more.
(101) In contrast, when the coupler 43 and the lead transmission lines 44 and 45 are spaced away too far from each other, they are in coil form having an inductance component which resonates with the parasitic capacitance. In the case where the band that can be used for communication is broadened by making the resonant frequency sufficiently high, it is effective to reduce the area surrounded by the coupler 43 and the lead transmission lines 44 and 45 so that the inductance component becomes smaller. In the case where the coil is quadrangular, the inductance is determined by the shorter sides, and therefore, it is effective to narrow down the distance between the coupler 43 and the lead transmission lines 44 and 45.
(102) In addition, the plane 47 provided on the surface on the opposite side has a missing portion 48 only in the portion that faces the coupler 43. As a result, the degree of coupling by the coupler 43 can be increased. In the case of a PCB, the substrate is thick, and this makes the effects from the plane sufficiently small when the two couplers are placed sufficiently close to each other, and therefore, it is not necessary to cut out the plane on the side opposite to the couplers.
(103) As shown in
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Example 2
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(107) Meanwhile, the lead transmission lines 54 and 55 of the coupler component 51 on the child substrate side are in the same state as in
Example 3
(108) Next, the directional coupling differential communication apparatus according to Example 3 of the present invention is described in reference to
(109) In Example 3, as shown in
(110) Meanwhile, the place through which a current flows in close proximity to the connection point between the coupler 43 or 53 and the lead transmission lines 44, 45, 54, or 55 is different between the coupler 43 and the coupler 53, and therefore, there is a possibility that the impedance is not equal between an end and the center of the coupler 43 or 53. Conversely, the effective width of the crossing portion is wider at the center of the crossing portion and narrower on the two sides, and therefore, it is possible to make the band broader.
Example 4
(111) Next, the directional coupling differential communication apparatus according to Example 4 of the present invention is described in reference to
(112) Thus, the coupler 43.sub.3 can be bent so as to reduce the area occupied by the coupler 43.sub.3. In the case where the total length of the coupler 43.sub.3 is 5 mm, for example, the length L can be shortened to approximately 2.5 mm by bending. Here, it is desirable for the distance S between the bent portions of the coupler 43.sub.3 to be three times or more greater than the width W of the coupler 43.sub.3 in order to prevent capacitive coupling and inductive coupling in the facing portions of the coupler 43.sub.3. In the case when W=0.5 mm, for example, S=1.5 mm, and therefore, the length of the center portion of the coupler 43.sub.3 is 2.0 mm (=1.5 mm+0.5 mm?2), taking the length of the center line into consideration, and the length L of the side portions is 1.5 mm [=(5 mm?2 mm)/2]. Though the coupler on the parent substrate side is described above, the coupler provided on the child substrate side has the same structure, and thus, the substrates are layered on top of each other so that the couplers overlap completely.
(113) In Example 4, it is easier to connect the lead transmission lines 44 and 45, which are differential signal lines, to the coupler 43.sub.3. That is to say, when the lead transmission lines 44 and 45 that approach from the bottom in
Example 5
(114) Next, the directional coupling differential communication apparatus according to Example 5 of the present invention is described in reference to
(115) As shown in
(116) Thus, one coupler 43 is longer so that the other coupler 53 can be placed anywhere in the range of this length, which reduces the restriction for positioning. Alternatively, the module can be moved when communication is achieved or communication can be achieved while the module is moving. Here, the relationship of the difference between the lengths of the couplers may be opposite to each other. Likewise, the width of one coupler is greater so that the freedom for positioning can be increased in the direction of the width.
Example 6
(117) Next, the directional coupling differential communication apparatus according to Example 6 of the present invention is described in reference to
(118) In Example 6, as shown in
(119) Thus, the couplers 43 and 53 are provided so as to cross each other diagonally in Example 6 of the present invention, and therefore, a broadband wireless communication path can be realized. In addition, there are such features that the properties of the communication path do not change even in the case where the location of the coupler component 41 or the coupler component 51 is shifted relative to the other.
Example 7
(120) Next, the directional coupling differential communication apparatus according to Example 7 of the present invention is described in reference to
(121) In this case, the electromagnetic fields are generated in the orthogonal direction along the coupler lines, and therefore, the couplers 43.sub.1, 43.sub.2, 53.sub.1, 53.sub.2 are arranged in the longitudinal direction of the couplers, that is to say, in the direction of the line length. This arrangement makes interference between the couplers smaller, which increases reliability, and makes arrangement in close proximity possible as shown in
Example 8
(122) Next, the directional coupling differential communication apparatus according to Example 8 of the present invention is described in reference to FIGS. 17A to 17C.
(123) In Example 8, semiconductor integrated circuit apparatuses 65 and 66 having a transmitter/receiver circuit are connected to couplers 43 and 53 using short bonding wires 63.sub.1, 63.sub.2, 64.sub.1, and 64.sub.2 instead of lead transmission lines.
Example 9
(124) Next, the directional coupling differential communication apparatus according to Example 9 of the present invention is described in reference to
(125) Here, the relative dielectric constant ?.sub.1 of the gap between the couplers (in the case where the gap is a space, the relative dielectric constant is ?.sub.0=1) is smaller than the dielectric constant ?.sub.2 of the other parts around the coupler lines. For example, the relative dielectric constant of polyimide, which is the base resin of FPCs, is 3.2, while the relative dielectric constant of the surface layer where additives are added to polyimide is 3.4. Meanwhile, the relative dielectric constant of air is 1.0 and the dielectric constant of PET is 3.0. Accordingly, the gap between the two couplers 43 and 53 may be a space or an intervening insulating film made of a material such as PET of which the relative dielectric constant is smaller than 3.2.
(126) Thus, when the dielectric constant between the coupler lines is smaller than the dielectric constant of the other parts surrounding the coupler lines, the crosstalk in the near ends becomes smaller and the crosstalk in the far ends becomes greater. The reason for this, as shown as
(127) In Example 9, as in the other examples, crosstalk in the far ends is also used, and therefore, the reliability for communication can be secured. As a result, it is possible to leave a gap between two modules, for example, that are arranged in close proximity, and thus, there is such an advantage that the connection between modules can be easily achieved at a low cost. Alternatively, the selection of an insulating film can be made wider when the modules are connected in close proximity with the insulating film in between.
Example 10
(128) Next, the directional coupling differential communication apparatus according to Example 10 of the present invention is described in reference to
(129)
(130) Thus, an impedance matching circuit is provided on the transmitter/receiver circuit side so that the resistor members for termination connected to the couplers become unnecessary, and thus, the costs can be lowered and the volume of the mounted parts can be reduced. In addition, the resistance value can be adjusted by means of the circuit even in the case where the communication distance is inconsistent or the impedance of the couplers is inconsistent due to the positional shift, and therefore, signal reflection can be suppressed. In the above-described prior art inventions, a resistor member is required for termination and the impedance cannot be adjusted.
(131) In addition, the impedance adjusting circuit can be implemented as a digital circuit as shown in
Example 11
(132) Next, the directional coupling differential communication apparatus according to Example 11 of the present invention is described in reference to
(133) In this case, the first module 70 and the second module 80 have the same structure as the above-described child substrate, and thus are respectively provided with the couples 72 and 82, which are connected to semiconductor integrated circuit apparatuses 75 and 85 having a transmitter/receiver circuit through lead transmission lines 73, 74, 83, and 84.
(134) Meanwhile, the third module 90 has two couplers 92 and 93, where these two couplers 92 and 93 are connected through lead transmission lines 94 and 95. Here, the lead transmission line 94 and the lead transmission line 95 have the same length.
(135)
(136)
(137) The couplers 72 and 82 and the lead transmission lines 73, 74, 83, and 84 for forming the first module 70 and the second module 80 are formed using wires on the PCB or FPC or wires on a substrate or a semiconductor chip within a package.
(138) In this case, the first module 70 and the second module 80 achieve capacitive coupling and inductive coupling with the couplers 92 and 93 provided in the third module 90 so that data communication can be established between the first module 70 and the second module 80.
(139)
(140) As shown in
(141) Meanwhile, as shown in
Example 12
(142) Next, the directional coupling differential communication apparatus according to Example 12 of the present invention is described in reference to
Example 13
(143) Next, the directional coupling differential communication apparatus according to Example 13 of the present invention is described in reference to
(144) Example 13 corresponds to a case where the wires having the same length in Example 11 rearrange when the couplers 92 and 93 are shifted in the lateral direction. That is to say, no problem arises whenever wires are drawn out as long as the lead transmission line 94 and the lead transmission line 95 have the same length.
Example 14
(145) Next, the directional coupling differential communication apparatus according to Example 14 of the present invention is described in reference to
(146) Example 14 corresponds to Example 4 shown in
(147) Such a problem can be solved by bending the couplers 72 and 82 into a shape where the two ends approach each other as shown in
Example 15
(148) Next, the directional coupling differential communication apparatus according to Example 15 of the present invention is described in reference to FIGS. 27 and 28.
(149) In this case, in the first module 120 to the third module 140, respectively, the couplers 121, 131, and 141 and the semiconductor integrated circuit apparatuses 124, 134, and 144 are connected through lead transmission lines 122, 123, 132, 133, 142, and 143. Here, the semiconductor integrated circuit apparatus 124 is a microprocessor while the semiconductor integrated circuit apparatuses 134 and 144 are semiconductor memory apparatuses (memories).
(150)
(151) In the second module 130, the coupler 131 is layered on the front surface side so as to overlap the coupler 121 in the first module 120 in the direction in which the modules are layered on top of each other. Meanwhile, the third module 140 is layered on the rear surface side so that the coupler 141 overlaps the coupler 121 in the first module 120 in the direction in which the modules are layered on top of each other.
(152) In this case, in order for communication to be achieved with only one memory (134, 144), the other memory (144, 134) recognizes this and may ignore the contents of the communication. Meanwhile, each memory (134, 144) communicates with a microprocessor (124) individually in time division.
(153) In Example 15, the coupler 121 is on the front surface of the FR4 substrate 125, and therefore, the distance between the coupler 121 and 131 is shorter than the distance between the coupler 121 and the coupler 141, and thus, the degree of coupling between the coupler 121 and the coupler 131 is stronger than the degree of coupling between the coupler 121 and the coupler 141. However, the coupler 121 may be formed of wires inside the FR4 substrate 125 by using a multilayer wire substrate as the FR4 substrate 125 so that the distance between the coupler 121 and the coupler 131 is approximately equal to the distance between the coupler 121 and the coupler 141, and thus, the degree of coupling between the coupler 121 and the coupler 131 may be approximately equal to the degree of coupling between the coupler 121 and the coupler 141.
Example 16
(154) Next, the directional coupling differential communication apparatus according to Example 16 of the present invention is described in reference to
(155) In this case, in the first module 150, the two couplers 151.sub.1 and 151.sub.2 are connected in series through a connection transmission line 155 and are connected to the semiconductor integrated circuit apparatus 154 through lead transmission lines 152 and 153.
(156) In the second module 130 and the third module 140, as in Example 15, the couplers 131 and 141 and the semiconductor integrated circuit apparatuses 134 and 144 are respectively connected to each other through lead transmission lines 132, 133, 142, and 143. Here as well, the semiconductor integrated circuit apparatus 154 is a microprocessor while the semiconductor integrated circuit apparatuses 134 and 144 are semiconductor memory apparatuses (memories).
(157)
(158) The second module 130 is layered on the first module so that the coupler 131 overlaps the coupler 151.sub.1 in the first module 150 in the direction in which the two modules are layered on top of the other module. Meanwhile, the third module 140 is layered on the first module so that the coupler 141 overlaps the coupler 151.sub.2 in the first module 150 in the direction in which the two modules are layered on top of the other module.
(159) In this case as well, as in Example 15, the microprocessor (154) can communicate with the two memories (134, 144) simultaneously, and each memory (134, 144) communicates with the microprocessor (154) in time division. Here, signals attenuate in the couplers and the signal length is different between the transmitter/receiver provided inside the semiconductor circuit apparatuses 154, 134, and 144 and the couplers 151.sub.1, 151.sub.2, 131, and 141, and therefore, the amplitude and the phase of the differential signal inputted into the two ends of each coupler 151.sub.1, 151.sub.2, 131, and 141 are shifted, and thus, the signal transmission performance is inferior to the case where there is only one coupler.
(160) Though in the figures the first module 150 is provided with two couplers 151.sub.1 and 151.sub.2, three or more couplers may be provided, and in this case, it is possible to couple modules of which the number corresponds to the number of couplers. Here, the greater the number of couplers is, the more the signal transmission performance deteriorates.
Example 17
(161) Next, the directional coupling differential communication apparatus according to Example 17 of the present invention is described in reference to FIGS. 31 and 32.
(162) In this case, the first module 160 has such a length as to be able to deal with two couplers 131 and 141 and is connected to the semiconductor integrated circuit apparatus 164 through lead transmission lines 162 and 163. In the second module 130 and the third module 140, as in Example 15, the couplers 131 and 141 and the semiconductor integrated circuit apparatuses 134 and 144 are respectively connected to each other through lead transmission lines 132, 133, 142, and 143. Here as well, the semiconductor integrated circuit apparatus 164 is a microprocessor while the semiconductor integrated circuit apparatuses 134 and 144 are semiconductor memory apparatuses (memories).
(163)
(164) The second module 130 is layered on the first module so that the coupler 131 overlaps a portion of the coupler 161 in the first module 160 in the direction in which the two modules are layered on top of the other module. Meanwhile, the third module 140 is layered on the first module so that the coupler 141 overlaps the other portion of the coupler 161 in the first module 160 in the direction in which the two modules are layered on top of the other module.
(165) In this case as well, as in Example 16, the microprocessor (164) can communicate with the two memories (134, 144) simultaneously, and each memory (134, 144) communicates with the microprocessor (164) in time division. Here, signals attenuate in the couplers 151.sub.1 and 151.sub.2 and the signal length is different between the transmitter/receiver provided inside the semiconductor circuit apparatuses 164, 134, and 144 and the couplers 161, 131, and 141, and therefore, the amplitude and the phase of the differential signal inputted into the two ends of each coupler 161, 131, and 141 are shifted, and thus, the signal transmission performance is inferior.
(166) Though in the figures the coupler 161 in the first module 160 has such a length as to deal with two couplers, it may have such a length as to deal with three or more couplers. In such a case, it is possible to couple modules of which the number corresponds to the length of the coupler. The greater the number of couplers is, the more the signal transmission performance deteriorates.
Example 18
(167) Next, the directional coupling differential communication apparatus according to Example 18 of the present invention is described in reference to
(168) As shown in
(169) Next, the operational principle of Example 18 according to the present invention is described in reference to
(170)
(171) When the (+).sub.1 signal propagates from the terminal A.sub.1 of the coupler 112.sub.1 toward the terminal B.sub.1, a capacitive coupling current and an inductive coupling current are induced and flow through the coupler 112.sub.2 due to the coupling effects of i=C(dv/dt) and v=L(di/dt) in exactly the same manner as the operational principle described in reference to
(172) Meanwhile, the inductive coupling current has the waveform shown in
(173) In addition, the signal that appears in the terminal B.sub.2 has a symbol opposite to that of the signal that appears in the terminal B.sub.2 due to the capacitive coupling as shown in
(174) Meanwhile, the wave reflected from the terminal B.sub.1 generates a coupling signal of the reflected wave having the opposite polarity as shown in
(175) Accordingly, the coupling signal shown in
(176) The coupling signal that has reached the terminal B.sub.2 as shown in
(177) Accordingly, the waveform shown in
(178) When the length of the couplers 112.sub.1 and 112.sub.2 in
Example 19
(179) Next, the directional coupling differential communication apparatus according to Example 19 of the present invention is described in reference to
(180) As in Example 1, coupler components 41.sub.1 and 41.sub.2 using an FPC 42.sub.1 or 42.sub.2 are installed on a main substrate 40, and each coupler component 41.sub.1 or 41.sub.2 is provided with a coupler 43.sub.1 or 43.sub.2, which is connected to a transmitter/receiver circuit 46 via lead transmission lines 44.sub.1 or 44.sub.2 and 45.sub.1 or 45.sub.2.
(181) Meanwhile, couplers 53.sub.1 and 53.sub.2 are directly provided on the surface of the display module (child substrate) 50 and are connected to a transmitter/receiver circuit 56 via lead transmission lines 54.sub.1, 54.sub.2, 55.sub.1, and 55.sub.2. Here, a terrace member 61.sub.1 or 61.sub.2 provided on the main substrate 40 is used so that the coupler 43.sub.1 or 43.sub.2 provided in the coupler component 41.sub.1 or 41.sub.2 is installed in close proximity to the coupler 53.sub.1 or 53.sub.2 provided on the child substrate 50 in the structure. The main substrate 40 and the child substrate 50 are layered on top of each other using a support member 62. Here as well, the setting allows the coupling impedance Z.sub.0-coupled to be matched in the electromagnetic field coupling between the couplers that face each other.
(182) Thus, in Example 19 of the present invention, wires on the child substrate can form couplers and lead transmission lines, which makes an FPC unnecessary and a reduction in the cost possible. Though it is necessary for the FPC to be bent with a small curvature radius in Example 1, no FPC is used in Example 19 where the manufacturing process can be simplified.
Example 20
(183) Next, the directional coupling differential communication apparatus according to Example 20 of the present invention is described in reference to
(184) Couplers 43.sub.1 and 43.sub.2 are directly provided on the surface of a main substrate 40 and are connected to a transmitter/receiver circuit 46 via lead transmission lines 44.sub.1, 44.sub.2, 45.sub.1, and 45.sub.2. Meanwhile, couplers 53.sub.1 and 53.sub.2 are directly provided on the surface of a display module (child substrate) 50 and are connected to a transmitter/receiver circuit 56 via lead transmission lines 54.sub.1, 54.sub.2, 55.sub.1, and 55.sub.2.
(185) Here, a dielectric body 69.sub.1 or 69.sub.2, such as dielectric ceramics made of a material of which the relative dielectric constant is higher than 1, for example, BaOR.sub.2O.sub.2TiO.sub.2, is provided between the coupler 43.sub.1 or 43.sub.2 and the coupler 53.sub.1 or 53.sub.2 so as to strengthen the electromagnetic field coupling between the coupler 43.sub.1 or 43.sub.2 and the coupler 53.sub.1 or 53.sub.2. The main substrate 40 and the child substrate 50 are layered on top of each other using a support member 62. Here as well, the setting allows the coupling impedance Z.sub.0-coupled to be matched in the electromagnetic field coupling between the couplers that face each other.
(186) Thus, in Example 20 of the present invention, wires on the parent substrate and the child substrate can form couplers and lead transmission lines, which makes a terrace member and an FPC unnecessary as well as a reduction in the cost possible. Though it is necessary for the FPC to be bent with a small curvature radius in Example 1, no FPC is used in Example 20 where the manufacturing process can be simplified.
Example 21
(187) Next, the directional coupling differential communication apparatus according to Example 21 of the present invention is described in reference to
(188)
(189)
(190) In Example 21, as shown in
(191) Here, the first module 70 and the second module 80 are the same as in Example 11 and are provided with couplers 72 and 82, respectively, and are connected to a semiconductor integrated circuit apparatus having a transmitter/receiver circuit through lead transmission lines 73, 74, 83, and 84.
(192) Thus, in Example 21 of the present invention, a terminal resistor is inserted into a closed circuit so as to terminate the signal for matching so that the stationary wave attenuates, making it possible to remove signal distortion.
Example 22
(193) Next, the directional coupling differential communication apparatus according to Example 22 of the present invention is described in reference to
(194)
(195) In Example 22, as shown in
(196) Here, the first module 70 and the second module 80 are the same as in Example 13 and are provided with couplers 72 and 82, respectively, and are connected to a semiconductor integrated circuit apparatus having a transmitter/receiver circuit through lead transmission lines 73, 74, 83, and 84.
(197) Thus, in Example 22 of the present invention as well, a terminal resistor is inserted into a closed circuit so as to terminate the signal for matching so that the stationary wave attenuates, making it possible to remove signal distortion.
Example 23
(198) Next, the directional coupling differential communication apparatus according to Example 23 of the present invention is described in reference to
(199)
(200) In Example 23, as shown in
(201) Here, the first module 70 and the second module 80 are the same as in Example 14 and are provided with couplers 72 and 82, respectively, and are connected to transmitter/receiver circuits 67 and 68, respectively, through lead transmission lines 73, 74, 83, and 84.
(202) Thus, in Example 23 of the present invention, couplers provided in a closed circuit are formed of two couplers and a terminal resistor for linking the two couplers, and therefore, the properties of the degree of coupling can be flattened in the same manner as in Example 21 or Example 22, and as a result, signal distortion can be removed.
Example 24
(203) Next, the directional coupling differential communication apparatus according to Example 24 of the present invention is described in reference to
(204)
(205) In the case where the first module and the second module are formed of a package 170.sub.1 or 170.sub.2 as shown in
(206) In Example 24 of the present invention, a coupler can be made of wires of a package, and therefore, first and second modules can be provided closer to a coupler end of the third module than in the case where a coupler is made of wires on a semiconductor chip, and thus, the degree of coupling can be strengthened. Though the couplers are formed of wires on the substrates 171.sub.1 and 171.sub.2 on the side where the semiconductor chips are mounted in the figure, the couplers may be formed of wires on the substrates 171.sub.1 and 171.sub.2 on the rear side.
Example 25
(207) Next, the directional coupling differential communication apparatus according to Example 25 of the present invention is described in reference to
(208)
(209) In addition, the two surfaces, front and rear, of the FPCs 181.sub.1, 181.sub.2, or 181.sub.3 are provided with surface layers 187.sub.1 and 188.sub.1, 187.sub.2 and 188.sub.2, or 187.sub.3 and 188.sub.3 for protection, and the FPCs face each other with a gap in between. The distance of the gaps is 0 mm to several cm. Instead of the gaps, insulating films made of a material of the surface layers of the FPCs, such as polyethylene terephthalate (PET), is sandwiched between the FPCs, which are thus pasted together with an adhesive so that the couplers 182.sub.1, 182.sub.2, and 182.sub.3 overlap in the direction in which the FPCs are layered on top of each other. In addition, there are no restrictions to the FPCs, but rather printed circuit boards (PCBs), semiconductor substrates, or substrates within a package may be used.
(210)
(211) In Example 25 of the present invention, the three couplers are layered on top of each other in the direction in which the coupler components are layered on top of each other, and therefore, a multi-drop bus can be formed using the middle coupler component 180.sub.2 as the bus so that the coupler 182.sub.2 can communicate with the coupler 182.sub.1 and the coupler 182.sub.3 simultaneously. It is also possible to form a multi-drop bus using the lower coupler component 180.sub.1 as the bus so that the coupler 182.sub.1 can communicate with the coupler 182.sub.2 and the coupler 182.sub.3 simultaneously.
Example 26
(212) Next, the directional coupling differential communication apparatus according to Example 26 of the present invention is described in reference to
(213) Accordingly, the coupler 191.sub.1 and the coupler in the first module can be coupled, and the coupler 191.sub.2 and the coupler in the second module can be coupled without causing coupling between the first module and the second module, and therefore, no crosstalk occurs.
Example 27
(214) Next, the directional coupling differential communication apparatus according to Example 27 of the present invention is described in reference to
(215) In Example 27, as shown in
(216)
(217) Accordingly, lead transmission lines 44, 45, 54, and 55 in the first module and in the second module can be led out at a free angle, which can increase the freedom in design. Here, the lead transmission lines can be installed so as to be freely rotatable relative to the first module and the second module so as to be used as an electromagnetic field coupling connector in a rotatable portion.
Example 28
(218) Next, the directional coupling differential communication apparatus according to Example 28 of the present invention is described in reference to
(219) In Example 28, as shown in
(220) As shown in
Example 29
(221) Next, the directional coupling differential communication apparatus according to Example 29 of the present invention is described in reference to
(222) As shown in
(223) As shown in
(224) Alternatively, as shown in
(225) Thus, an electromagnetic field coupling connector is provided in a hinge portion in Example 29 of the present invention, and therefore, it is not necessary to connect the PC main body 201 and the PC display 202 with wires.
EXPLANATION OF SYMBOLS
(226) 10.sub.1 First module 10.sub.2 Second module 11.sub.1 First insulating substrate 11.sub.2 Second insulating substrate 12.sub.1 First coupler 12.sub.2 Second coupler 13.sub.1, 13.sub.2, 14.sub.1, 14.sub.2 Input/output connection lines 15.sub.1, 15.sub.2, Transmitter/receiver circuits 16.sub.1, 16.sub.2 Electromagnetic shield layers 17.sub.1, 17.sub.2 Missing portions 18.sub.1, 18.sub.2, 19.sub.1, 19.sub.2 Surface layers 40 Main substrate 41, 41.sub.1, 41.sub.2, 51, 51.sub.1, 51.sub.2 Coupler components 42, 42.sub.1, 42.sub.2, 52, 52.sub.1, 52.sub.2 FPCs 43, 43.sub.1, 43.sub.2, 43.sub.3, 53, 53.sub.1, 53.sub.2 Couplers 44, 44.sub.1, 44.sub.2, 45, 45.sub.1, 45.sub.2, 55, 54.sub.1, 54.sub.2, 55.sub.1, 55.sub.2 Lead transmission lines 46, 56 Transmitter/receiver circuits 47, 47.sub.1, 47.sub.2, 57, 57.sub.1, 57.sub.2 Planes 48, 48.sub.1, 48.sub.2, 58, 58.sub.1, 58.sub.2 Missing portions 49.sub.1, 49.sub.2, 59.sub.1, 59.sub.2 Surface layers 50 Child substrate 61, 61.sub.1, 61.sub.2 Terrace members 62 Support member 63.sub.1, 63.sub.2, 64.sub.1, 64.sub.2 Bonding wires 65, 66 Semiconductor integrated circuit apparatuses 67, 68 Transmitter/receiver circuits 69.sub.1, 69.sub.2 Dielectric bodies 70 First module 71, 81, 91 FPCs 72, 82, 92, 92.sub.1, 92.sub.2, 93, 93.sub.1, 93.sub.2 Couplers 73, 74, 83, 84, 94, 95 Lead transmission lines 75, 85 Semiconductor integrated circuit apparatuses 76, 86, 96 Planes 77, 87 Semiconductor chips 78, 88 Bumps 79, 89 Bonding wires 80 Second module 90 Third module 92.sub.3, 93.sub.3 Terminal resistors 97, 98 Surface layers 99 FR4 substrate 100 PCB 101 FR4 substrate 102 Plane 103, 104 Surface layers 110.sub.1, 110.sub.2 Modules 111.sub.1, 111.sub.2 FPCs 112.sub.1, 112.sub.2 Couplers 113.sub.1, 113.sub.2 Lead transmission lines 114.sub.1, 114.sub.2 Termination lines 115.sub.1, 115.sub.2 Planes 116.sub.1, 116.sub.2 Missing portions 120, 150, 160 First modules 121, 131, 141, 151.sub.1, 151.sub.2, 161 Couplers 122, 123, 132, 133, 142, 143 Lead transmission lines 124, 134, 144, 154, 164 Semiconductor integrated circuit apparatuses 125, 156, 165 RF4 substrates 126, 158, 159, 167, 168 Surface layers 130 Second module 140 Third module 152, 153, 162, 163 Lead signal lines 155 Connection transmission line 170.sub.1, 170.sub.2 Packages 171.sub.1, 171.sub.2 Substrates 172.sub.1, 172.sub.2 Couplers 173.sub.1, 173.sub.2 Caps 174.sub.1, 174.sub.2 Bumps 180.sub.1, 180.sub.2, 180.sub.3 Coupler components 181.sub.1, 181.sub.2, 181.sub.3 FPCs 182.sub.1, 182.sub.2, 182.sub.3 Couplers 183.sub.1, 183.sub.2, 183.sub.3, 184.sub.1, 184.sub.2, 184.sub.3 Lead transmission lines 185.sub.1, 185.sub.2, 185.sub.3 Planes 186.sub.1, 186.sub.2, 186.sub.3 Missing portions 187.sub.1, 187.sub.2, 187.sub.3, 188.sub.1, 188.sub.2, 188.sub.3 Surface layers 190 Insulating substrate 191.sub.1, 191.sub.2 Couplers 192.sub.1, 192.sub.2, 193.sub.1, 193.sub.2 Lead transmission lines 194.sub.1, 194.sub.2 Planes 195.sub.1, 195.sub.2 Missing portions 201 PC main body 202 PC display 203 Hinge 204.sub.1, 204.sub.2 Couplers in arc form 205.sub.1, 205.sub.2, 206.sub.1, 206.sub.2 Lead transmission lines 210.sub.1, 210.sub.2 Modules 211.sub.1, 211.sub.2 Substrates 212.sub.1, 212.sub.2 Signal lines 214.sub.1, 214.sub.2 Resistors 215.sub.1, 215.sub.2 Semiconductor integrated circuit apparatuses 224.sub.1, 224.sub.2 Feedback lines 225.sub.1, 225.sub.2, 226.sub.1, 226.sub.2 Transmission lines