METHOD FOR LASER BEAM PLASTIC WELDING, AND DEVICE

Abstract

The invention relates to a method for laser beam plastic welding, having the following steps: arranging a first mold part which substantially absorbs laser radiation on a receiving area, irradiating the first mold part using an electromagnetic radiation source, detecting the heat of the first mold part by means of a detector, generating an absorption profile of the first mold part, arranging a second mold part which is substantially transparent to laser radiation on the first mold part, and irradiating the two mold parts along the contour of a welding seam to be produced using a machining laser such that the energy input produced by the machining laser is controlled by a controller on the basis of the generated absorption profile of the first mold part.

Claims

1. A method for laser beam plastic welding, having the following steps: arranging a first mold part which substantially absorbs laser radiation on a receiving area, irradiating the first mold part using an electromagnetic radiation source, detecting the heat of the first mold part by means of a detector, generating an absorption profile of the first mold part, arranging a second mold part which is substantially transparent to laser radiation on the first mold part, and irradiating the two mold parts along the contour of a welding seam to be produced using a machining laser such that the energy input produced by the machining laser is controlled by a controller on the basis of the generated absorption profile of the first mold part.

2. The method according to claim 1, wherein the energy input in the event of irradiation with the machining laser is reduced by the controller at those points of the first mold part that have a higher absorption.

3. The method according to claim 1, wherein the energy input in the event of irradiation with the machining laser is increased by the controller at those points of the first mold part that have a lower absorption.

4. The method according to claim 1, wherein the first mold part is irradiated by means of the machining laser in order to produce the absorption profile.

5. The method according to claim 1, wherein in order to produce the absorption profile the first mold part is irradiated along a defined path, and the absorption profile is detected along the path.

6. The method according to claim 5, wherein the contour of the welding seam to be produced is used as defined path for producing the absorption profile.

7. The method according to claim 1, wherein a pyrometer or an infrared camera is used as detector.

8. The method according to claim 1, wherein a machining laser with a wavelength between 600 nm and 2500 nm is used.

9. The method according to claim 1, wherein a machining laser attached to a movement device is used, wherein the movement device is configured as an x-y axis system, as a robot, or as a galvanometer scanner.

10. The method according to claim 1, wherein a transmission profile of the transparent second mold part is produced and the energy input produced by the machining laser is also controlled on the basis of the produced transmission profile of the second mold part.

11. A device for laser beam plastic welding comprising a first receiving area for a first mold part, an electromagnetic radiation source with a movement device, a second receiving area for a second mold part placed on the first mold part, and a detector for detecting the heat of a mold part, wherein the device is configured to carry out the method according to claim 1.

12. The device according to claim 11, wherein the device comprises a controller which is connected to the electromagnetic radiation source and the detector and is configured to control the electromagnetic radiation source such that the first mold part is irradiated, the heat thereof is detected by means of the detector, and an absorption profile of the first mold part is produced, wherein, once the second mold part substantially transparent to laser radiation is arranged on the first mold part, both mold parts are irradiated along the contour of a welding seam to be produced using a machining laser, such that the energy input produced by the machining laser is controlled by the controller on the basis of the generated absorption profile of the first mold part.

13. The device according to claim 11, wherein it comprises a handling means for picking up and placing the second mold part on the first mold part.

14. The device according to claim 11, wherein the detector is arranged on the same side as the electromagnetic radiation source.

Description

[0027] Further advantages and details of the invention will be explained hereinafter on the basis of exemplary embodiments and with reference to the drawings. The drawings are schematic illustrations and show:

[0028] FIG. 1 a side view of an exemplary embodiment of a device according to the invention;

[0029] FIG. 2 an energy-time graph;

[0030] FIG. 3 a graph which shows the heat radiation over time;

[0031] FIG. 4 the device according to the invention according to FIG. 1 with two mold parts; and

[0032] FIG. 5 a plan view of a mold part and the path of the laser beam.

[0033] FIG. 1 shows a side view of an exemplary embodiment of a device 1. The device 1 comprises a receiving area 2 for a first mold part 3. The receiving area 2 is configured as a clamping device and cooperates with a holder 4, which together with the receiving area 2 forms the clamping device. The holder 4 has a recess 5, which is adapted to the size and shape of the first mold part 3. It can be seen in FIG. 1 that the first mold part 3 is received and held between the holder 4 and the receiving area 2. In this state the clamping device consisting of the receiving area 2 and the holder 4 exerts a compressive force, represented schematically by the two2 arrows 6, 7, on the mold part 3.

[0034] The device 1 is provided for laser beam plastic welding, wherein the first mold part 3 is connected to a second mold part (not shown in FIG. 1). In order to ensure that during the welding process exactly the amount of energy required for plasticizing or melting is supplied, the first mold part 3 is firstly irradiated with a radiation source configured as a machining laser 8. The machining laser 8 is controlled by controller 9 in such a way that a laser beam 10 is moved over the surface of the first mold part 3 along a defined contour. The defined contour is rectangular in this exemplary embodiment. Under the action of the laser beam 10, the irradiated surface of the first mold part 3 heats up depending on the absorption. This absorption is detected by means of a detector 11, which is arranged in the vicinity of the machining laser 8 and is directed towards a surface 12 of the first mold part 3. In this exemplary embodiment the detector 11 is configured as a pyrometer. The pyrometer makes it possible to detect the temperature at specific points of the surface 12 heated by the laser beam 10.

[0035] FIG. 2 is a graph that shows the energy input by the machining laser 8 over time. It can be seen in FIG. 2 that the irradiation energy generated by the machining laser 8 is constant over time.

[0036] FIG. 3 is a graph that shows the heat radiation, detected by the detector 11, of the surface 12 of the irradiated first mold part 3. The detector 11 configured as a pyrometer trails the machining laser 8 by the controller 9, such that the movement of the detector 11 is coupled to the movement of the machining laser 8 in that the detector 11 trails the machining laser 8. Since the detector 11 measures the temperature of the surface 12 of the first mold part 3 at different points at various moments in time, the graph shown in FIG. 3 also shows the detected heat radiation along the contour passed over by the machining laser 8. The graph shown in FIG. 3 therefore can be interpreted not only as a representation of the heat radiation over time, but also as a representation of the heat radiation in relation to the irradiated contour.

[0037] The curve 13 shown in FIG. 3 comprises a point 14 at which the heat radiation is relatively low. This is a relatively cold point. Thus, the absorption at this position is low. By contrast, the heat radiation at the point 15 is relatively high. This is thus a warm point on the surface 12 of the first mold part 3. A warm point means that the absorption of the first mold part 3 is high. Accordingly, the curve 13 indicates the absorption of the first mold part 3 along the contour passed over by the machining laser 8. The curve 13 thus represents the absorption profile of the first mold part 3.

[0038] FIG. 4 is an illustration similar to FIG. 1 and shows the device 1 with the receiving area 2, the first mold part 3, and the holder 4. The laser radiation is substantially absorbed on the first mold part 3 if a second mold part 16 is placed in position and is substantially transparent to laser radiation. The two mold parts 3, 16 are held in a clamped manner between the receiving area 2 and the holder 4. In this exemplary embodiment the holder 4 is used on the one hand to detect the absorption profile of the first mold part 3 and on the other hand to weld the first and the second mold part 3, 16. In other embodiments two different holders can also be used for the detection of the absorption profile and for the subsequent welding process.

[0039] The welding process is carried out in the braced or clamped state shown in FIG. 4 in that the first and the second mold part 3, 16 are acted on by a clamping force configured as compressive force. Energy is input by means of the machining laser 8 and passes through the second mold part 16, which is substantially transparent to laser radiation, and heats the surface 12 of the first mold part 3 arranged there-beneath until the plastic plasticizes. The machining laser 8 is in the meantime controlled by the controller 9 such that the laser beam 10 is guided along the defined contour. In so doing, the first mold part 3 melts locally. By heat conduction, the underside of the second mold part 16 is also heated to such an extent that the two mold parts 3, 16 bond to one another under the action of the clamping force. The energy input generated by the machining laser 8 is controlled during the welding process by the controller 9 on the basis of the absorption profile of the first mold part 3 shown in FIG. 3. The energy input in the event of irradiation using the machining laser 8 is reduced by the controller 9 at those points of the first mold part 3 that have a higher absorption, for example at the point 15. On the other hand, the energy input in the event of irradiation using the machining laser 8 is increased by the controller 9 at those points of the first mold part 3 that have a lower absorption. An example of this is the point 14, at which the absorption is lower.

[0040] The device 1 is intended for the series production of mold parts made of plastic welded to one another. The first mold part 3 and the second mold part 16 are picked up and placed in position by a handling means. The first mold part 3 is firstly placed on the receiving area 2 by means of the handling means, in order to produce the absorption profile. The second mold part 16 is then placed on the first mold part 3 by means of the handling means. Once the welding process has been carried out, the component formed from the two mold parts 3, 16 is removed from the receiving area 2 by means of the handling means.

[0041] FIG. 5 is a plan view and shows the holder 4, which has the recess 5 and the clamped second mold part 16. The arrows 17 and dashed lines show the path of the laser beam 10 and therefore the irradiated contour of the second mold part 16. It can be seen that the machining laser 8 travels over a rectangular path, whereby a rectangular welding seam is formed.

LIST OF REFERENCE SIGNS

[0042] 1 device [0043] 2 receiving area [0044] 3 first mold part [0045] 4 holder [0046] 5 recess [0047] 6 arrow [0048] 7 arrow [0049] 8 machining laser [0050] 9 controller [0051] 10 laser beam [0052] 11 detector [0053] 12 surface [0054] 13 curve [0055] 14 point [0056] 15 point [0057] 16 second mold part [0058] 17 arrow