HEAT DISSIPATION DEVICE

20190204019 ยท 2019-07-04

    Inventors

    Cpc classification

    International classification

    Abstract

    A heat dissipation device is disclosed. The heat dissipation device includes a main body and a tubular body. The main body has a chamber. A capillary structure is formed on an inner surface of the chamber by means of laser processing. A working fluid is contained in the chamber. One face of the main body is a condensation face, while the other face of the main body is a heat absorption face. The capillary structure is disposed corresponding to the heat absorption face. The heat absorption face of the main body is made of titanium material. The condensation face is made of titanium material or metal material. The tubular body is correspondingly inserted in the main body. The capillary structure is formed by means of laser processing. This not only solves the problem that the titanium material is difficult to process, but also can enhance the production efficiency.

    Claims

    1. A heat dissipation device comprising: a main body having a chamber, a capillary structure being formed on an inner surface of the chamber by means of laser processing, a working fluid being contained in the chamber, one face of the main body being a condensation face, while the other face of the main body being a heat absorption face, the capillary structure being disposed corresponding to the heat absorption face, the heat absorption face of the main body being made of titanium material, the condensation face being made of titanium material, metal material or ceramic material; and a tubular body correspondingly inserted in the main body.

    2. The heat dissipation device as claimed in claim 1, wherein the capillary structure is a micro-channeled structure or a structure composed of multiple raised bodies or recesses arranged at intervals.

    3. The heat dissipation device as claimed in claim 1, wherein the titanium material is commercial pure titanium or titanium alloy.

    4. The heat dissipation device as claimed in claim 1, wherein the metal material is selected from a group consisting of gold, silver, copper, aluminum and stainless steel.

    5. The heat dissipation device as claimed in claim 1, wherein the main body has an upper plate and a lower plate, the condensation face being positioned on one face of the upper plate, while the heat absorption face being positioned on one face of the lower plate, the upper and lower plate bodies being mated with each other to together define the chamber, the capillary structure being disposed on the other face of the lower plate opposite to the heat absorption face.

    Description

    BRIEF DESCRIPTION OF THE DRAWINGS

    [0010] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

    [0011] FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention; and

    [0012] FIG. 2 is a sectional assembled view of the first embodiment of the heat dissipation device of the present invention.

    DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

    [0013] Please refer to FIGS. 1 and 2. FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention. FIG. 2 is a sectional assembled view of the first embodiment of the heat dissipation device of the present invention. According to the first embodiment, the heat dissipation device 1 of the present invention includes a main body 11 and a tubular body 12.

    [0014] The main body 11 has a chamber 111. A capillary structure 112 is formed on an inner surface of the chamber 111 by means of laser processing. A working fluid 2 is contained in the chamber 111. One face of the main body 11 is a condensation face 113, while the other face of the main body 11 is a heat absorption face 114. The capillary structure 112 is disposed corresponding to the heat absorption face 114. The heat absorption face 114 of the main body 11 is made of titanium material. The titanium material is commercial pure titanium or titanium alloy. The condensation face 113 is made of titanium material, metal material or ceramic material. The metal material is selected from a group consisting of gold, silver, copper, aluminum and stainless steel. The tubular body 12 is correspondingly inserted in the main body 11 in communication with the internal chamber 111 of the main body 11.

    [0015] The main body 11 has an upper plate 11a and a lower plate 11. The condensation face 113 is positioned on one face of the upper plate 11a, while the heat absorption face 114 is positioned on one face of the lower plate 11b. The upper and lower plate bodies 11a, 11b are mated with each other to define the chamber 111 together with the tubular body 12. The capillary structure 112 is disposed on the other face of the lower plate 11b opposite to the heat absorption face 114. The capillary structure 112 is, but not limited to, a micro-channeled structure or a structure composed of multiple raised bodies or recesses arranged at intervals. In this embodiment, the capillary structure 112 is a micro-channeled structure for illustration purposes. The tubular body 12 is disposed between the upper and lower plate bodies 11a, 11b. After the upper and lower plate bodies 11a, 11b are overlapped and mated with each other, the periphery is sealed. At the same time, the tubular body 12 is connected with the upper and lower plate bodies 11a, 11b to keep the main body 11 airtight.

    [0016] In the heat dissipation device of the present invention, the capillary structure is mainly formed by means of laser processing. The vapor chamber is made of titanium material instead of other material so that the titanium material can be processed by laser to solve the problems that the titanium material is difficult to process and the oxide is produced at high temperature and is uneasy to reduce.

    [0017] The heat dissipation device of the present invention is not limited to the vapor chamber. Alternatively, the heat dissipation device of the present invention can be a flat-plate heat pipe or other heat dissipation device that employs titanium material as the material of the base seat and needs to be processed to form the capillary structure.

    [0018] The titanium material is selectively employed to eliminate the shortcomings of the conventional vapor chamber that the other material is employed and is easy to corrode and the structural strength is poor and the vapor chamber is too heavy.

    [0019] The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.