SYSTEM AND METHOD FOR MANUFACTURING ASSEMBLY UNITS AS WELL AS USE OF THE SYSTEM

Abstract

A system for manufacturing assembly units. The system includes a component platform that is movably situated in a conveying direction, at least one layering unit for applying a layer, and at least one irradiation unit, which is situated downstream from the layering unit in the conveying direction of the component platform for selectively irradiating the layer for generatively assembling the layer.

Claims

1-13. (canceled)

14. A system for manufacturing assembly units, comprising: a component platform that is movably situated in a conveying direction; at least one layering unit configured to apply a layer; and at least one irradiation unit, situated downstream from the layering unit in the conveying direction of the component platform, configured to selectively irradiate the layer for a generative assembly of the layer; and several assembly unit carriers situated on the component platform, each of the assembly unit carriers being configured to accommodate at least one base component of an assembly unit to be produced, on whose surface the generative assembly of the at least one layer of the assembly unit takes place.

15. The system as recited in claim 14, wherein the assembly unit carriers are situated on the component platform in the conveying direction one after another and/or perpendicularly to the conveying direction.

16. The system as recited in claim 14, wherein the system is an in-line system including a placement device configured to place the assembly unit carriers on the component platform and a removing device configured to take the assembly unit carriers off the component platform.

17. The system as recited in claim 14, wherein the system is a carousel-type system, wherein the component platform is rotatable about an axis, and the system includes a placement device configured to place the assembly unit carriers on the component platform and a removing device configured to take the assembly unit carriers off the component platform.

18. The system as recited in claim 14, wherein the assembly unit carriers are situated on the component platform so that they may pivot about an axis of the assembly unit carriers.

19. The system as recited in claim 14, wherein in addition to the at least one layering unit and the at least one irradiation unit, at least one further processing station is situated along a conveyance path of the assembly unit carriers.

20. The system as recited in claim 19, wherein the at least one further processing station is an application device, or surface processing device, or cleaning device, or placement device.

21. The system as recited in claim 14, wherein at least the at least one layering unit and the at least one irradiation unit form a module-like constructional unit.

22. The system as recited in claim 14, wherein the system includes multiple layering units situated in the conveying direction of the assembly unit carriers at different levels with regard to one another.

23. A method for manufacturing assembly units using a system, each of the assembly units having at least one layer and generatively manufactured, the method comprising: generating at least one layer on a base component as an integral part of the assembly unit, the base component being situated on an assembly unit carrier of a plurality of assembly unit carriers that is conveyed using a component platform of the system that is movable in a conveying direction.

24. The method as recited in claim 23, wherein the manufacturing of the assembly units includes at least one further processing procedure that is carried out using at least one processing station.

25. The method as recited in claim 23, wherein the assembly unit carriers are continuously moved within the system in the conveying direction.

26. The system as recited in claim 13, wherein the system is configured to manufacture circuit configurations or cooling devices as the assembly unit.

27. The method as recited in claim 23, wherein the system includes: the component platform; at least one layering unit configured to apply the layer; and at least one irradiation unit, situated downstream from the layering unit in the conveying direction of the component platform, configured to selectively irradiate the layer for the generative assembly of the layer; and the plurality of assembly unit carriers situated on the component platform, each of the assembly unit carriers being configured to accommodate at least one base component of the assembly unit to be produced, on whose surface the generative assembly of the at least one layer of the assembly unit takes place.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG. 1 shows in a perspective illustration a sequence of processing steps for generating an assembly unit that has a circuit carrier equipped with a chip.

[0018] FIG. 2 shows in a perspective illustration a carrier unit equipped with a plurality of circuit carriers.

[0019] FIG. 3 shows a schematic longitudinal section of a first system for generating components in the form of an in-line system.

[0020] FIG. 4 shows a system in a schematic top view that is modified with regard to FIG. 3 and is designed as a carousel-type system.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0021] Identical elements or elements having identical functions are provided with identical reference numerals in the figures.

[0022] FIG. 1 shows, as an example only, various consecutive production or processing steps for generating an assembly unit 1. Assembly unit 1 includes a base component 2 in the form of a circuit board, a substrate, or the like, on which in a generative manufacturing process at least one layer 3a, 3b is applied and selectively irradiated, so that at least one layer 3a, 3b is generated in the generative manufacturing process. Furthermore, assembly unit 1 includes an electronic component part 5 in the form of a chip that is situated on the side of base component 2 facing away from at least one layer 3a, 3b, by way of example.

[0023] To generate an assembly unit 1 of this type, corresponding base component 2 is provided in a first step 101. In a second step 102, the top side of base component 2 is (fully) coated with a gold layer, by way of example. In a third step 103, an aluminum layer is subsequently applied to the previously applied gold layer. In steps 104 and 105, two layers 3a, 3b are applied on the aluminum layer in the generative manufacturing process, by way of example. In a central area 6 of base component 2, no material of layer 3a, 3b is provided, so that a cylindrical recess 7 is generated there by way of example. In steps 106 through 108, a rotation of base component 2 together with the layers applied thereto subsequently takes place about a longitudinal axis 8 of base component 2 by 180°. This makes it possible for the back side of base component 2 to be subsequently subjected to further processing steps. In a step 109, the placing or providing of a contact layer 9 initially takes place on the back side of base component 2. In a step 110, the applying or placing of structural element 5 or the chip on the back side of base component 2 finally takes place to complete assembly unit 1.

[0024] It is additionally elucidated that the above-described production or processing steps for generating assembly unit 1 are described as an example only and must be adjusted to the particular application with regard to the number as well as the individual processing steps. This makes it possible for stations that are designed in the form of an application device, a surface processing device, a cleaning device, a placement device, or the like, to be provided in the individual processing steps. Assembly unit 1 is in particular, however not in a limiting manner, a circuit configuration or cooling device.

[0025] In FIG. 2, an assembly unit carrier 10 is illustrated, on which with regard to a conveying direction 12 of assembly unit carrier 10 within a system 100, 100a, described at a later point in time, three base components 2 are situated one behind the other in conveying direction 12 and three base components 2 are also situated in a transverse direction 14 situated perpendicularly to conveying direction 12. Assembly unit carrier 10 is thus used for accommodating or fastening and positioning a total of nine base components 2. To fasten base components 2, for example in the area of the receptacles, which are not illustrated in greater detail, of plate-shaped, rectangular assembly unit carrier 10, it may be provided that a plate-shaped blank holder 16 is used that has rectangular openings 18 for each base component 2, by way of example, and that is clamped against the top side of assembly unit carrier 10 with the aid of elements (not illustrated), to fasten base components 2 in the area of assembly unit carrier 10.

[0026] FIG. 3 schematically shows a heavily simplified illustration of a first system 100 for manufacturing assembly unit 1 with the aid of assembly unit carriers 10. System 100 includes a machine housing 20 designed as a closed machine housing 20 with the exception of two transport areas 21, to be able to carry out individual production or processing steps within machine housing 20 under an inert gas atmosphere (under low overpressure with regard to the surrounding atmosphere).

[0027] System 100 is designed as an in-line system having a schematically indicated placement device 22 and a removing device 24 that are situated at the input or output of machine housing 20 or close to transport areas 21, by way of example. Assembly unit carriers 10 equipped with base components 2 are situated on a component platform 25 with the aid of placement device 22. Component platform 25 is designed as an endless circumferential conveyor belt 26, by way of example, on the surface of the side of conveyor belt 26, receptacles 27, 28, which are situated at uniform distances from one another and between each of which an assembly unit carrier 10 is situated, being provided by way of example. The placing of assembly unit carriers 10 between receptacles 27, 28 with the aid of placement device 22 preferably takes place fully automatically, for example by handling robots (not illustrated) or the like.

[0028] With the aid of removing device 24, assembly units 1 produced within machine housing 20 are removed from component platform 25. Aids (not illustrated either) that preferably work fully automatically, such as assembly robots or the like, are also used for this purpose. These are designed to remove assembly unit carriers 10 equipped with assembly units 1 from receptacles 27, 28 of conveyor belt 26.

[0029] Within machine housing 20, a plurality of processing stations 30.1 through 30.n is situated. Processing stations 30.1 through 30.n are used to carry out processing and production steps for generating assembly units 1, as elucidated within the scope of the description of FIG. 1 by way of example. At least one of processing stations 30.1 through 30.n is designed as processing station 30.1 through 30.n that is used to generatively manufacture or apply a layer 3 on base component 2.

[0030] Processing station 30.2 used in the exemplary embodiment to generatively generate layer 3 includes a layering unit 32 and an irradiation unit 34, which together form a module for designing constructional unit 35. With the aid of layering unit 32, as is conventional in the related art, a layer 3 of metal powder is applied on base component 2. With the aid of irradiation unit 34, layer 3 is selectively irradiated or heated to above the melting temperature of the material, so that corresponding (solid) layer 3 is formed after the subsequent solidification. This process may be repeated any number of times to generate the required number of layers 3 on top of one another, consecutive constructional units 35 then being situated at a height offset with regard to one another, which corresponds to the layer thickness of lastly applied layer 3, in conveying direction 12 of assembly unit carriers 10. Furthermore, at least one of processing stations 30.1 through 30.n is designed to remove the non-solidified, powdery material of at least one layer 3 after generating layer 3 on base component 2. This processing station 30.1 through 30.n may also be designed as an integral part of constructional unit 35.

[0031] FIG. 4 shows a system 100a which is modified with regard to FIG. 3. System 100a is designed as a carousel-type system including a disc-shaped component platform 25a, which is situated rotatably about a vertically situated axis 36 and on which assembly unit carriers 10 are situated. Component platform 25a is rotated clockwise in conveying direction 12.

[0032] System 100 as well as system 100a or corresponding component platform 25, 25a is preferably driven or rotated continuously.