FABRICATION OF FLOW REACTOR MODULES AND MODULES PRODUCED
20220401952 · 2022-12-22
Inventors
- George Edward Berkey (Pine City, NY, US)
- Alexander Lee Cuno (Sayre, PA, US)
- John Walter Grunden (Lawrenceville, PA, US)
- Kyler Robert Hurlburt (Horseheads, NY, US)
- Yanxia Ann Lu (Sunnyvale, CA, US)
- James Scott Sutherland (Painted Post, NY, US)
- Oscar Walter Wheeler (Avon, NY, US)
Cpc classification
B01J19/0093
PERFORMING OPERATIONS; TRANSPORTING
B01L2200/12
PERFORMING OPERATIONS; TRANSPORTING
C04B2235/96
CHEMISTRY; METALLURGY
C04B2235/604
CHEMISTRY; METALLURGY
B01L3/502707
PERFORMING OPERATIONS; TRANSPORTING
B01J2219/00792
PERFORMING OPERATIONS; TRANSPORTING
C04B2235/6026
CHEMISTRY; METALLURGY
F28D2021/0022
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01L2300/12
PERFORMING OPERATIONS; TRANSPORTING
F28F7/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
C04B2235/945
CHEMISTRY; METALLURGY
C04B2235/602
CHEMISTRY; METALLURGY
C04B2235/963
CHEMISTRY; METALLURGY
International classification
Abstract
A module and a process for forming a monolithic substantially closed-porosity silicon carbide fluidic module having a tortuous fluid passage extending through the module, the tortuous fluid passage having an interior surface, the interior surface having a surface roughness in the range of from 0.1 to 10 μm Ra. The process includes positioning a positive fluid passage mold within a volume of silicon carbide powder, the powder coated with a binder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body.
Claims
1. A silicon carbide flow reactor fluidic module, the module comprising: a monolithic closed-porosity silicon carbide body; and a tortuous fluid passage extending through the silicon carbide body, the tortuous fluid passage having an interior surface; the interior surface having a surface roughness of less than 10 μm Ra.
2. The fluidic module of claim 1 wherein the surface roughness is in the range of from 0.1 to 5 μm Ra.
3. The fluidic module of claim 1 wherein the surface roughness is in the range of from 0.1 to 1 μm Ra.
4. The fluidic module of claim 1 wherein the silicon carbide of the silicon carbide body has a density of at least 95% of a theoretical maximum density of silicon carbide.
5. (canceled)
6. The fluidic module of claim 4 wherein the silicon carbide of the silicon carbide body has a density of at least 97% of the theoretical maximum density of silicon carbide.
7. (canceled)
8. (canceled)
9. The fluidic module of claim 4 wherein the fluidic module has an open porosity of less than 1%.
10. (canceled)
11. (canceled)
12. The fluidic module of claim 1 wherein an internal pressure resistance of the fluidic module under pressurized water testing is at least 50 bar.
13. (canceled)
14. The fluidic module of claim 1 wherein an internal pressure resistance of the fluidic module under pressurized water testing is at least 150 bar.
15. The fluidic module of claim 1 wherein the interior surface of tortuous fluid passage comprises a floor and a ceiling separated by a height h and two opposing sidewalls joining the floor and the ceiling, the sidewalls separated by a width w measured perpendicular to the height h and at a position corresponding to one-half of the height h wherein the height h of the tortuous fluid passage is in the range of from 0.1 to 20 mm.
16. (canceled)
17. (canceled)
18. The fluidic module of claim 15 wherein the interior surface where the sidewalls meet the floor has a radius of curvature in the range of 0.1 to 3 mm.
19. (canceled)
20. (canceled)
21. A process for forming a silicon carbide fluidic module for a flow reactor, the process comprising: positioning a positive fluid passage mold of a passage having a tortuous shape within a volume of powder-coated silicon carbide powder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body to form a monolithic silicon carbide fluidic module having a tortuous fluid passage extending therethrough.
22. The process according to claim 21 wherein pressing the volume of silicon carbide powder with the mold inside to form a pressed body comprises uniaxial pressing.
23. The process according to claim 21 wherein pressing the volume of silicon carbide powder with the mold inside to form a pressed body comprises isostatic pressing in an isostatic press.
24. The process according to claim 23 wherein heating the pressed body to remove the mold comprises pressing the pressed body while heating the pressed body.
25. The process according to claim 24 wherein pressing the pressed body is performed in the isostatic press.
26. The process according to claim 21, further comprising, before sintering the pressed body, debinding the pressed body.
27. The process according to claim 21 further comprising forming a positive passage mold of a passage having a tortuous shape by molding the passage mold.
28. The process according to claim 21 further comprising forming a positive passage mold of a passage having a tortuous shape by 3-D printing the passage mold.
29. The process according to claim 21 further comprising forming a positive passage mold having an outer layer of lower melting material, the lower melting material having a melting point lower than a melting point of a remainder of the positive passage mold.
30. The process according to claim 29 wherein the melting point of the lower melting material is lower than the melting point of the remainder of the positive passage mold by at least 5° C.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The following is a description of the figures in the accompanying drawings. The figures are not necessarily to scale, and certain features and certain views of the figures may be shown exaggerated in scale or in schematic in the interest of clarity and conciseness.
[0018] In the drawings:
[0019]
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
[0028]
[0029]
[0030]
[0031]
[0032]
[0033]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0034] Additional features and advantages will be set forth in the detailed description which follows and will be apparent to those skilled in the art from the description or recognized by practicing the embodiments as described in the following description, together with the claims and appended drawings.
[0035] As used herein, the term “and/or,” when used in a list of two or more items, means that any one of the listed items can be employed by itself, or any combination of two or more of the listed items can be employed. For example, if a composition is described as containing components A, B, and/or C, the composition can contain A alone; B alone; C alone; A and B in combination; A and C in combination; B and C in combination; or A, B, and C in combination.
[0036] In this document, relational terms, such as first and second, top and bottom, and the like, are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions.
[0037] Modifications of the disclosure will occur to those skilled in the art and to those who make or use the disclosure. Therefore, it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the disclosure, which is defined by the following claims, as interpreted according to the principles of patent law, including the doctrine of equivalents.
[0038] For purposes of this disclosure, the term “coupled” (in all of its forms: couple, coupling, coupled, etc.) generally means the joining of two components directly or indirectly to one another. Such joining may be stationary in nature or movable in nature. Such joining may be achieved with the two components and any additional intermediate members being integrally formed as a single unitary body with one another or with the two components. Such joining may be permanent in nature, or may be removable or releasable in nature, unless otherwise stated.
[0039] As used herein, the term “about” means that amounts, sizes, formulations, parameters, and other quantities and characteristics are not and need not be exact, but may be approximate and/or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art. When the term “about” is used in describing a value or an end-point of a range, the disclosure should be understood to include the specific value or end-point referred to. Whether or not a numerical value or end-point of a range in the specification recites “about,” the numerical value or end-point of a range is intended to include two embodiments: one modified by “about,” and one not modified by “about.” It will be further understood that the end-points of each of the ranges are significant both in relation to the other end-point, and independently of the other end-point.
[0040] The terms “substantial,” “substantially,” and variations thereof as used herein are intended to note that a described feature is equal or approximately equal to a value or description. For example, a “substantially planar” surface is intended to denote a surface that is planar or approximately planar. Moreover, “substantially” is intended to denote that two values are equal or approximately equal. In some embodiments, “substantially” may denote values within about 10% of each other, such as within about 5% of each other, or within about 2% of each other.
[0041] Directional terms as used herein—for example up, down, right, left, front, back, top, bottom, above, below, and the like—are made only with reference to the figures as drawn and are not intended to imply absolute orientation.
[0042] As used herein the terms “the,” “a,” or “an,” mean “at least one,” and should not be limited to “only one” unless explicitly indicated to the contrary. Thus, for example, reference to “a component” includes embodiments having two or more such components unless the context clearly indicates otherwise.
[0043] As used herein, a “tortuous” passage refers to a passage having no line of sight directly through the passage and with a path of the passage having at least two differing radii of curvature, the path of the passage being defined mathematically and geometrically as a curve formed by successive geometric centers, along the passage, of successive minimum-area planar cross sections of the passage (that is, the angle of a given planar cross section is the angle which produces a minimum area of the planar cross section at the particular location along the passage) taken at arbitrarily closely spaced successive positions along the passage. Typical machining-based forming techniques are generally inadequate to form such a tortuous passage. Such passages may include a division or divisions of a passage into subpassages (with corresponding subpaths) and a recombination or recombinations of subpassages (and corresponding subpaths).
[0044] As used herein a “monolithic” silicon carbide structure of course does not imply zero inhomogeneities in the ceramic structure at all scales. A “monolithic” silicon carbide structure or a “monolithic” silicon carbide fluidic module, as the term “monolithic” is defined herein, refers to a silicon carbide structure or fluidic module, with one or more tortuous passages extending therethrough, in which no (other than the passage(s)) inhomogeneities, openings, or interconnected porosities are present in the ceramic structure having a length greater than the average perpendicular depth d of the one or more passages P from the external surface of the structure or module 300, as shown in
[0045] With reference to
[0046] According to further embodiments, the silicon carbide body 200 of the fluidic module 300 has a density of at least 95% of a theoretical maximum density of silicon carbide, or even of at least 96, 97, 98, or 99% of theoretical maximum density.
[0047] According to further embodiments, the silicon carbide body 200 of the fluidic module 300 has an open porosity of less than 1%, or even of less than 0.5%, 0.4%, 0.2% or 0.1%.
[0048] According to still further embodiments, the silicon carbide body 200 of the module 300 has an internal pressure resistance under pressurized water testing of at least 50 bar, or even at least 100 bar, or 150 bar.
[0049] The tortuous fluid passage P, according to embodiments, comprises a floor 212 and a ceiling 214 separated by a height h and two opposing sidewalls 216 joining the floor 212 and the ceiling 214. The sidewalls are separated by a width w (
[0050] According to embodiments, the interior surface 210 of the fluidic passage P where the sidewalls 216 meet the floor 212 has a radius curvature (at reference 218) of greater than or equal to 0.1 mm, or greater than or equal to 0.3, or even greater than or equal to 0.6 mm, or 1 mm or 1 mm, 1 cm or 2 cm.
[0051] With reference to
[0052] The process further can include the step of (partially) filling a press enclosure (or die) 100, the press enclosure 100 being closed with a plug 110, with binder-coated SiC powder 120, as described in step 30 of
[0053] Next, the pressed body 150, now free from the press enclosure 100, is machined in selected locations, such as by drilling, to form holes or fluidic ports 160 extending from the outside of the pressed body 150 to the passage mold 130 (
[0054] Next, the pressed body 150 is heated, preferably at a relatively high rate, such that the passage mold 130 is melted and removed from the pressed body 150 by flowing out of the pressed body 150, and/or by being blown and/or sucked out in addition. (
[0055] Finally, the pressed body 150 is de-bound to remove SiC powder binder, and then fired (sintered) to densify and further solidify the pressed body into a monolithic silicon carbide body 200. (
[0056] As shown in the flowchart of
[0057] Sintering can be performed as specified or recommended by the supplier of the coated SiC powder. Such suppliers include, for example, Panadyne Inc. (Montgomeryville, Pa., USA), GNP Ceramics (Buffalo, N.Y., USA), H. C. Starck (Hermsdorf, Germany), and IKH (Industriekeramik Hochrhein GmbH) (Wutöschingen, Germany). One example of a debinding and firing cycles (performed in succession in one chamber or individually) can include three steps: (1) curing of the binder, such as at a temperature of 150+/−25° C., in air, to strengthen or stiffen the binder; (2) debinding at 600+/−25° C., in a non-oxygenating environment such as in N.sub.2; Sintering at 2100+/−50° C. in a non-oxygenating environment, such as in Ar. An example of a time, temperature, gas, and ramp rate table is given in the Table below:
TABLE-US-00001 TABLE Total Segment Target Heating time time temperature Rate Ambient (hr) (hr) (° C.) (° C./min) gas 0.0 0 25 Air 2.3 2.3 150 2 Air 5.3 3.0 150 3 Air 7.8 2.5 600 2 N2 10.8 3.0 600 3 N2 15.6 4.8 25 2 N2
[0058]
[0059]
[0060] As used for embodiments of the demolding step 60 in which pressure is applied to the pressed body 150 during demolding, the apparatus 400 is in the form of a press or optionally of an isostatic or quasi-isostatic press and comprises an openable and closeable frame 250, such as with a lid 252 or other means of opening and closing, and with an interior and exterior. One or more flexible membranes 262, 264, 266, 268 are positioned within the frame 250 and have a first surface facing the interior of the frame 250 and a second surface (directly) opposite the first surface, the second surface forming at least part of an enclosed volume having fluid lines, connections, ports, or the like, connected or to be connected to a supply of pressurized fluid F. The apparatus 400 also optionally includes a clearance or a pathway or a port or conduit 282, 284 or the like through which the material of a mold 130 can drain when melted from the from a green state powder pressed ceramic body 150 while a pressure is applied to the green state powder pressed ceramic body 150 by a fluid, through the one or more flexible membranes 262, 264, 266, 268. The fluid supplied by fluid source F can be, according to embodiments, a heated liquid which supplies energy to the mold material by heating the green state powder pressed ceramic body 150.
[0061] In alternative embodiments, the fluid source F may supplied gas under pressure such as compressed air or nitrogen, and the apparatus 400 can also include one or more flexible heating pads 272, 274, 276, 278 positioned on the first surface of the one or more flexible membranes 262, 264, 266, 268. A flexible heating pad of the apparatus can comprise (1) multiple zones in which input energy can be individually controlled and/or (2) multiple individually energizeable smaller heating pads, not shown, to which energy can be supplied by a source E of electrical energy.
[0062] In operation for demolding, in the apparatus of
[0063] According to additional alternative aspects of the present invention, the press apparatus 400 of
[0064] According to additional embodiments of the present invention, the flexible membrane through which pressure is applied for demolding or both pressing and demolding may take the form of a fluid-tight bag enclosing the green state powder pressed ceramic body—as is more typical of isostatic pressing practice—rather two or more multiple membranes arranged around the powder and resulting pressed body 150 as in
[0065] Process steps for one embodiment of demolding green pressed fluidic modules according to this aspect are shown in the flow chart of
[0066] Further in
[0067] As mentioned, the passage mold can be a wax-based material. As the green state powder pressed ceramic body 150 is heated by the warm fluid, the passage mold(s) 130 are also heated, and the mold material begins expanding, softening, and melting. The expansion produces an outward force on the interior walls of the passages within the body 150. The outward force is counteracted and/or balanced, at least in part, by the isostatic pressing force, represented by the arrows 330, applied to the exterior surface of the body 150 through the bag 320.
[0068] The melted mold material can move into optional ports such as ports IP1, IP2, IP, OP shown in
[0069] After the time period of step 516 is ended, the pressure inside the chamber 350 is reduced to atmospheric pressure in step 518, the chamber is opened and the bag 320 and body 150 are removed in step 522, and the bag 320 is removed from the body 150 in step 524. During steps 522 and 524, the body is preferably kept sufficiently warm (for example, at 50° C. or greater) to prevent re-solidification of the mold material, until any remaining mold material is completely removed, such as by heating the body 150 in an oven (for example, at 175° C., in air), in step 526. While heating, the body can be oriented to allow the mold material to drain out through one or more ports IP1, IP2, IP, OP.
[0070] Prior to heating the body 150 in an oven in step 526, the body and the mold material may be in a state general depicted in the cross section of
[0071] According to another and alternative aspect of the present disclosure shown in the cross section of
[0072] As discussed above with respect to the embodiment of
[0073] As also discussed with respect to the embodiment of
[0074] The cross section of
[0075] In another additional or alternative aspect, as an alternative to the one or more ports or vents 386
[0076] According to yet another alternative embodiment representable by
[0077] According to still another alternative embodiment representable by
[0078] In yet another additional or alternative aspect shown in the cross section of
[0079] In still another additional or alternative aspect shown in the cross section of
Mold Materials and Mold Formation
[0080] As mentioned above, the passage mold can be obtained by molding, machining, 3D printing, or other suitable forming techniques or combinations thereof. The material of the passage mold can be an organic material such as an organic thermoplastic. The mold material may include organic or inorganic particles suspended or otherwise distributed within the material as one way of decreasing expansion during heating/melting. As mentioned, the material of the passage mold is desirably a relatively incompressible material—specifically a material with low rebound after compression relative to the rebound of the pressed SiC powder after compression, as explained above in connection with
[0081] As the mold is heated to be melted and removed, the mold material can potentially expand more than is desirable before sufficiently low viscosity is reached for the mold material to flow away and relieve the pressure of expansion. If the pressure generated during mold removal is excessive, the passage being formed may be damaged. As an additional alternative embodiment addressing this potential issue, a mold may be used which has an outer layer of lower melting material having a melting point than the rest or inner portion of the mold. By selecting a lower melting material having a sufficiently lower melting point then the remainder of the mold, when the mold is heated to remove the mold, the outer layer can transition to low viscosity before the mold as a whole has expanded significantly, and the outer layer can then flow away as the remainder of the mold is further heated and expands then melts, relieving pressure that may otherwise be undesirably high. Melting point separation between the low melting material melting point and the melting of the remainder of the mold is desirably at least 5° C., or even 20° C. or even 40° C. but generally not more than 80° C. The outer layer can be formed by a second molding or by dipping or the like.
[0082] The devices disclosed and/or produced by the methods disclosed herein are generally useful in performing any process that involves mixing, separation including reactive separation, extraction, crystallization, precipitation, or otherwise processing fluids or mixtures of fluids, including multiphase mixtures of fluids—and including fluids or mixtures of fluids including multiphase mixtures of fluids that also contain solids—within a microstructure. The processing may include a physical process, a chemical reaction defined as a process that results in the interconversion of organic, inorganic, or both organic and inorganic species, a biochemical process, or any other form of processing. The following non-limiting list of reactions may be performed with the disclosed methods and/or devices: oxidation; reduction; substitution; elimination; addition; ligand exchange; metal exchange; and ion exchange. More specifically, reactions of any of the following non-limiting list may be performed with the disclosed methods and/or devices: polymerisation; alkylation; dealkylation; nitration; peroxidation; sulfoxidation; epoxidation; ammoxidation; hydrogenation; dehydrogenation; organometallic reactions; precious metal chemistry/homogeneous catalyst reactions; carbonylation; thiocarbonylation; alkoxylation; halogenation; dehydrohalogenation; dehalogenation; hydroformylation; carboxylation; decarboxylation; amination; arylation; peptide coupling; aldol condensation; cyclocondensation; dehydrocyclization; esterification; amidation; heterocyclic synthesis; dehydration; alcoholysis; hydrolysis; ammonolysis; etherification; enzymatic synthesis; ketalization; saponification; isomerisation; quaternization; formylation; phase transfer reactions; silylations; nitrile synthesis; phosphorylation; ozonolysis; azide chemistry; metathesis; hydrosilylation; coupling reactions; and enzymatic reactions.
[0083] The process disclosed and the structures producible can be extended to additional fields of application, in that a silicon carbide structure can be provided, the structure comprising a monolithic closed-porosity silicon carbide body; and a tortuous fluid passage extending within the silicon carbide body, the tortuous fluid passage having an interior surface, with the interior surface having a surface roughness of less than 10 μm Ra, or in the range of from 0.1 to 5 μm Ra, or in the range of from 0.1 to 1 μm Ra.
[0084] The silicon carbide of the structure has a density of at least 95, 96, 97, 98 or even 99% of officially published US government standard theoretical maximum density (or the average of any such, in the case of multiple) for silicon carbide. The has an open porosity of less than 1%, less than 0.5%, or less than 0.1%.
[0085] An internal pressure resistance of the structure under pressurized water testing can be at least 50 bar, or at least 100 bar, or at least 150 bar.
[0086] The silicon carbide structure can have an interior surface of tortuous fluid passage comprising a floor and a ceiling separated by a height h and two opposing sidewalls joining the floor and the ceiling, with the sidewalls separated by a width w measured perpendicular to the height h and at a position corresponding to one-half of the height h wherein the height h of the tortuous fluid passage is in the range of from 0.1 to 20 mm. The height h of the tortuous fluid passage can be in the range of from 0.2 to 15 mm, or in the range of from 0.3 to 12 mm.
[0087] The process for forming a silicon carbide structure with an internal passage can comprise positioning a positive fluid passage mold of a passage having a tortuous shape within a volume of powder-coated silicon carbide powder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body to form a monolithic silicon carbide structure having a tortuous fluid passage within. Pressing the volume of silicon carbide powder with the mold inside can comprise uniaxial pressing or isostatic pressing. Heating the pressed body to remove the mold can comprise pressing the pressed body while heating the pressed body. The process can further comprise debinding the pressed body before sintering the pressed body. The process can further comprise forming a positive passage mold of a passage having a tortuous shape by molding and/or 3-D printing the passage mold.
[0088] The process can further comprise forming a positive passage mold having an outer layer of lower melting material, the lower melting material having a melting point lower than a melting point of a remainder of the positive passage mold. The melting point of the lower melting material can be lower than the melting point of the remainder of the positive passage mold by at least 5° C.
[0089] While exemplary embodiments and examples have been set forth for the purpose of illustration, the foregoing description is not intended in any way to limit the scope of disclosure and appended claims. Accordingly, variations and modifications may be made to the above-described embodiments and examples without departing substantially from the spirit and various principles of the disclosure. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.