Abstract
The disclosure relates to a device for transmitting electrical signals between a first interface element, arranged at a first structure of a lithography system, and a second interface element, arranged at a second structure of the lithography system. An electrical conductor connects the first interface element and the second interface element. The device has a hollow body which surrounds at least sections of the electrical conductor and which is designed to electromagnetically shield the electrical conductor. A gap is provided in the hollow body or between the hollow body and one of the structures and allows a relative movement of the first structure and the second structure to mechanically decouple the first structure from the second structure.
Claims
1. A device, comprising: an electrical conductor electrically connecting a first interface element to a second interface element, the first interface element arranged at a first structure, and the second interface element arranged at a second structure; and a hollow body surrounding at least portions of the electrical conductor to electromagnetically shield the electrical conductor, wherein: one of the following holds: i) the hollow body has a gap; and ii) a gap is present between the hollow body and a structure selected from the group consisting of the first structure and the second structure; and the gap is configured to permit relative movement between the first and second structures to mechanically decouple the first structure from the second structure.
2. The device of claim 1, wherein the hollow body has a gap.
3. The device of claim 1, wherein a gap is present between the hollow body and a structure selected from the group consisting of the first structure and the second structure.
4. The device of claim 1, wherein at least sections of the electrical conductor comprise a flexible printed circuit board.
5. The device of claim 4, wherein: the flexible printed circuit board has a first edge section and a second edge section opposite the first edge section; and in a section of the flexible printed circuit board, the and second first edge sections define a helix shape.
6. The device of claim 4, wherein a section of the flexible printed circuit board is bent.
7. The device of claim 4, wherein a section of the flexible printed circuit board is rotated.
8. The device of claim 1, wherein: the hollow body contacts the first structure; the hollow body is electrically conductively connected to the first structure; the hollow body has an opening facing the second structure; the hollow body has an edge; and the edge and the second structure define the gap.
9. The device of claim 1, wherein: the hollow body comprises first and second partial hollow bodies; the first partial hollow body contacts the first structure; the first partial hollow body is electrically conductively connected to the first structure; the second partial hollow body contacts the second structure; the second partial hollow body is electrically conductively connected to the second structure; and the gap is in an overlap section between the first and second partial hollow bodies.
10. The device of claim 9, further comprising first and second printed circuit boards, wherein: the first printed circuit board is electrically connected to the first interface element; the first printed circuit board is in the first partial hollow body; the second printed circuit board is electrically connected to the second interface element; the second printed circuit board is in the second partial hollow body; and the electrical conductor electrically connects the first and second printed circuit boards.
11. The device of claim 10, wherein the electrical conductor comprises a flexible printed circuit board.
12. The device of claim 9, wherein: the gap defined by a first edge structure of the first partial body in the overlap section and a second edge structure of the second partial body; and the first and second edge structures comprise intermeshing structures.
13. The device of claim 1, wherein the gap is configured to permit relative movement between the first and second structures of at most 200 m.
14. The device of claim 1, wherein the electrical conductor has a mechanical coupling strength of at most 200 N/m.
15. The device of claim 1, wherein: the electrical conductor is a portion of a cable which connects the first and second interface elements; and the cable comprises at least one member selected from the group consisting of a number of singly shielded core pairs in a cable sheath and a number of voltage supply lines in a cable sheath.
16. The device of claim 1, wherein the gap is configured so that, when the device is in a low pressure atmosphere with elevated hydrogen content, the gap suppresses penetration of hydrogen into the hollow body.
17. The device of claim 1, wherein: a housing defines the first structure; a first side of the first structure is exposed to a first pressure; a second side of the first structure is exposed to a second pressure; the second pressure is greater than the first pressure; the first interface element is arranged on a printed circuit board on the first side of the first structure; and the printed circuit board has a further interface element on the second side of the first structure.
18. The device of claim 1, wherein a vacuum housing defines the first structure.
19. An apparatus, comprising: the device of claim 1, wherein the apparatus is a lithography apparatus.
20. The apparatus of claim 19, wherein: the apparatus comprises a vacuum housing and a projection system; the first interface element is arranged at the vacuum housing; and the second interface element is arranged at the projection system.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0069] In the text that follows, the disclosure is explained in more detail on the basis of preferred embodiments with reference to the accompanying figures, in which:
[0070] FIG. 1A shows a schematic view of an EUV lithography apparatus;
[0071] FIG. 1B shows a schematic view of a DUV lithography apparatus;
[0072] FIG. 2 shows a cross section of a first exemplary embodiment of the device for transmitting electrical signals;
[0073] FIG. 3 shows a cross section of a second exemplary embodiment of the device for transmitting electrical signals;
[0074] FIG. 4 shows a cross section of a third exemplary embodiment of the device for transmitting electrical signals;
[0075] FIG. 5 shows a cross section of a fourth exemplary embodiment of the device for transmitting electrical signals;
[0076] FIG. 6 shows a cross section of a fifth exemplary embodiment of the device for transmitting electrical signals;
[0077] FIG. 7 shows a cross section of one exemplary embodiment of a flexible printed circuit board;
[0078] FIG. 8A schematically shows an excerpt from a flexible printed circuit board rotated in one section to form a helix shape;
[0079] FIG. 8B shows a schematic view of one embodiment of a specific section of a flexible printed circuit board;
[0080] FIG. 8C shows a schematic view of a further embodiment of a specific section of a flexible printed circuit board;
[0081] FIG. 9 schematically shows one exemplary embodiment of a printed circuit board as a vacuum bushing; and
[0082] FIGS. 10A-10C show various exemplary embodiments of edge structures for forming a gap.
EXEMPLARY EMBODIMENTS OF THE DISCLOSURE
[0083] Identical elements or elements having an identical function have been provided with the same reference signs in the figures, unless indicated otherwise.
[0084] FIG. 1A shows a schematic view of an EUV lithography apparatus 100A, which comprises a beam shaping and illumination system 102 and a projection system 104. In this case, EUV stands for extreme ultraviolet (EUV) and denotes a wavelength of the working light (also called used radiation) of between 0.1 and 30 nm. The beam shaping and illumination system 102 and the projection system 104 are arranged in a vacuum housing 101. The vacuum housing 101 is evacuated with the aid of an evacuation device (not illustrated). The vacuum housing 101 is surrounded by a machine room (not illustrated) in which, for example, controllers for setting the optical elements are provided.
[0085] For transmitting the electrical signals, the lithography apparatus 100A comprises a device 1. The device 1 comprises a first interface 11, which is arranged at a first structure 10, which in the present case constitutes a housing part of the vacuum housing 101. Furthermore, the device 1 comprises a second interface 21, which is arranged at a second structure 20. In the present case, the second structure 20 is a part of the housing of the projection system 104. Furthermore, the device 1 comprises a hollow body 40 and an electrical conductor 30 extending in the hollow body 40 and connecting the first interface 10 to the second interface 20. In particular, the hollow body 40 is configured such that its interior constitutes a volume 42 which is substantially free of electromagnetic interference fields. Various exemplary embodiments of the device 1 are shown in FIG. 2-FIG. 6.
[0086] The EUV lithography apparatus 100A comprises an EUV light source 106A. A plasma source (or a synchrotron), which emits radiation 108A in the EUV range (extreme ultraviolet range), i.e., for example, in the wavelength range of 0.1 nm to 30 nm, may be provided, for example, as the EUV light source 106A. In the beam shaping and illumination system 102, the EUV radiation 108A is focused and the desired operating wavelength is filtered out from the EUV radiation 108A. The EUV radiation 108A generated by the EUV light source 106A has a relatively low transmissivity through air, for which reason the beam guiding spaces in the beam shaping and illumination system 102 and in the projection system 104 are evacuated.
[0087] The beam shaping and illumination system 102 illustrated in FIG. 1A has five mirrors 110, 112, 114, 116, 118. After passing through the beam shaping and illumination system 102, the EUV radiation 108A is directed onto the photomask (reticle) 120. The photomask 120 is formed for example as a reflective optical element and can be arranged outside the systems 102, 104. Furthermore, the EUV radiation 108A can be directed onto the photomask 120 via a mirror 122. The photomask 120 comprises structures which are imaged onto a wafer 124 or the like in a reduced manner via the projection system 104. In this case, the wafer 124 is arranged in the image plane of the projection system 104.
[0088] The projection system 104 (also referred to as projection lens) has six mirrors M1-M6 for imaging the photomask 120 onto the wafer 124. In this case, individual mirrors M1-M6 of the projection system 104 may be arranged symmetrically in relation to the optical axis 126 of the projection system 104. It should be noted that the number of mirrors of the EUV lithography apparatus 100A is not restricted to the number illustrated. A greater or lesser number of mirrors can also be provided. Furthermore, the mirrors, as a rule, are curved on their front side for beam shaping.
[0089] FIG. 1b shows a schematic view of a DUV lithography apparatus 100B, which comprises a beam shaping and illumination system 102 and a projection system 104. In this case, DUV stands for deep ultraviolet (DUV) and denotes the wavelength of the working light (also called used radiation) of between 30 and 250 nm. The beam shaping and illumination system 102 and the projection system 104as already described with reference to FIG. 1Acan be arranged in a vacuum housing and/or be surrounded by a machine room having corresponding control devices. FIG. 1b only shows a vacuum housing 101 comprising the projection system 104, the photomask 120 and a device 1. The device 1as likewise described with reference to FIG. 1Ais configured for electrical signal transmission to the projection system 104. Various exemplary embodiments of the device 1 are shown in FIG. 2-FIG. 6.
[0090] The DUV lithography apparatus 100B has a DUV light source 106B. By way of example, an ArF excimer laser that emits radiation 108B in the DUV range at 193 nm, for example, can be provided as the DUV light source 106B.
[0091] The beam shaping and illumination system 102 illustrated in FIG. 1B guides the DUV radiation 108B onto a photomask 120. The photomask 120 is embodied as a transmissive optical element and can be arranged outside the systems 102, 104. The photomask 120 comprises structures which are imaged onto a wafer 124 or the like in a reduced manner via the projection system 104. In this case, the wafer 124 is arranged in the image plane of the projection system 104.
[0092] The projection system 104 has a plurality of lens elements 128 and/or mirrors 130 for imaging the photomask 120 onto the wafer 124. In this case, individual lens elements 128 and/or mirrors 130 of the projection system 104 can be arranged symmetrically in relation to the optical axis 126 of the projection system 104. It should be noted that the number of lens elements and mirrors of the DUV lithography apparatus 100B is not restricted to the number illustrated. A greater or lesser number of lens elements and/or mirrors can also be provided. Furthermore, the mirrors are generally curved on their front face for beam shaping.
[0093] An air gap between the last lens element 128 and the wafer 124 can be replaced by a liquid medium 132 which has a refractive index of >1. The liquid medium can be high-purity water, for example. Such a construction is also referred to as immersion lithography and has an increased photolithographic resolution.
[0094] The exemplary embodiments of the device 1 as shown in FIG. 2-FIG. 6 are in each case suitable for example for information, power or data transmission in one of the lithography apparatuses 100A, 100B shown in FIG. 1A and FIG. 1b.
[0095] FIG. 2 shows a cross section of a first exemplary embodiment of the device 1 for transmitting electrical signals between a first structure 10 and a second structure 20. In the first exemplary embodiment, the hollow body 40 is formed as an integral hollow body 40, which is arranged at the first structure 10 and is conductively connected thereto. It has an edge 41 forming an opening toward the second structure 20. A gap 43 is formed between the edge 41 and the second structure 20. The hollow body 40 encloses a volume 42, which is shown with a dotted background in FIG. 2 and which constitutes a volume 42 substantially free of interference fields. A first interface element 11 is arranged at the first structure 10 and is connected to a second interface element 21, which is arranged at the second structure 20, via an electrical conductor 30 formed as a flexible cable 30 and extending in the volume 42. On account of the gap 43, the second structure 20 and the hollow body 40 can move independently of one another provided that a movement amplitude is not larger than the gap 43. The first structure 10 and the second structure 20 and also the hollow body 40 are connected to a ground potential (not illustrated) in the exemplary embodiment.
[0096] FIG. 3 shows a cross section of a second exemplary embodiment of the device 1 for transmitting electrical signals between a first structure 10 and a second structure 20. In this exemplary embodiment, the hollow body 40 comprises two partial bodies 44 and 45, which overlap in an overlap section 46. The gap 43 is formed in the overlap section 46. The first partial body 44 is arranged at the first structure 10 and is conductively connected thereto. The second partial body 45 is arranged at the second structure 20 and is conductively connected thereto. The further features correspond to those of the first exemplary embodiment in FIG. 2.
[0097] FIG. 4 shows a cross section of a third exemplary embodiment of the device 1 for transmitting electrical signals between a first structure 10 and a second structure 20. In this exemplary embodiment, the hollow body 40, as in the second exemplary embodiment in FIG. 3, is constructed in a bipartite fashion. Furthermore, printed circuit boards 32, 33 are provided here, wherein a respective printed circuit board 32, 33 is arranged in one of the partial bodies 44, 45. The first interface element 11 comprises four individual interfaces, which are connected to corresponding contacts 11 on the first printed circuit board 32 via rigid lines 38. The interface element 21 also comprises four individual interfaces, which are connected to corresponding contacts 21 on the second printed circuit board 33 via rigid lines 38. The first printed circuit board 32 is connected to the second printed circuit board 33 via a flexible cable 30 having the desired number of individual cores. The further features of this exemplary embodiment correspond to those of the exemplary embodiment in FIG. 3.
[0098] FIG. 5 shows a cross section of a fourth exemplary embodiment of the device 1 for transmitting electrical signals between a first structure 10 and a second structure 20. The fourth exemplary embodiment shown differs from the third exemplary embodiment in FIG. 4 in that instead of the flexible cable 30 a flexible printed circuit board 31 connects the two printed circuit boards 32 and 33 arranged in the partial bodies 44, 45. The further features correspond to those of the third exemplary embodiment.
[0099] FIG. 6 shows a cross section of a fifth exemplary embodiment of the device 1 for transmitting electrical signals between a first structure 10 and a second structure 20. This exemplary embodiment differs from the fourth exemplary embodiment in FIG. 5 in that the second interface element 21 is formed as a printed circuit board 21, which is connected to the first printed circuit board 32 in the first partial body 44 via a flexible printed circuit board 31. It can also be stated that the second printed circuit board 33 (see FIG. 5) is arranged at the second structure 20. The further features correspond to those of the third or else the fourth embodiment.
[0100] Over and above the illustration it is possible, alternatively or additionally, for the first interface element 11 to be formed as a printed circuit board.
[0101] FIG. 7 shows a cross section of one exemplary embodiment of a flexible printed circuit board 31. The illustration is such that the flexible printed circuit board 31 enters the plane of the drawing or emerges from the plane of the drawing. The printed circuit board 31 illustrated comprises a total of five layers arranged one above another. In this case, conductor tracks 321, 322, 323 are respectively provided in a first, third and fifth layer. A second and fourth layer serve as a substrate for the flexible printed circuit board 31, which substrate mechanically stabilizes the latter, keeps the layers together and insulates conductor tracks 321, 322, 323 arranged one above another from one another. The substrate material 324 is polyimide, for example. In the third layer, in particular, a plurality of conductor tracks 321, 322, 323 are arranged alongside one another and are insulated from one another by the substrate material 324 arranged therebetween. In this exemplary embodiment, the conductor tracks 321 and 322 serve for signal transmission, wherein a differential signal transmission can be provided. In each case wide conductor tracks 323 are provided in the first and fifth layers. The conductor tracks 323 are connected to a ground potential. The arrangement shown thus has shielding properties for the centrally arranged conductor tracks 321 and 322. A flexible printed circuit board 31 constructed in accordance with this exemplary embodiment is suitable for example for use in the device 1 in accordance with any of the abovementioned exemplary embodiments of the device 1.
[0102] FIG. 8A schematically shows an excerpt from a flexible printed circuit board 31 rotated in one section to form a helix shape. The flexible printed circuit board 31 extends from left to right in this illustration. Furthermore, a top side and an underside of the printed circuit board 31 are identified by different hatchings in the illustration. The flexible printed circuit board 31 comprises a first edge section 35 and a second edge section 36 lying opposite. Coming from the left, the second edge section 36 is an upper edge section. In this orientation, the top side of the printed circuit board 31 points out of the plane of the drawing. Along the course of the printed circuit board 31 toward the right, the printed circuit board 31 comprises a section 37 in which the flexible printed circuit board 31 is rotated. The edge sections 35, 36 form a helix shape in the section 37. The degree of rotation in this exemplary embodiment is 180, for example. This has the effect that further toward the right, following the section 37, the edge sections are interchanged, such that now the first edge section 35 is an upper edge section. Furthermore, in this orientation, now the underside of the printed circuit board 31 points out of the plane of the drawing. Furthermore, two auxiliary lines (not designated) are depicted in FIG. 8A, the auxiliary lines illustrating the change of orientation. The embodiment illustrated has a flexibility in the plane of the drawing which, without a rotated section 37, would not be present or would be present only very slightly.
[0103] FIG. 8B shows a schematic view of one embodiment of a specific section of a flexible printed circuit board 31. The flexible printed circuit board 31 in FIG. 8B extends from left to right in this illustration. The specific section of the flexible printed circuit board 31 in FIG. 8B is bent. In other words, the longitudinal axis of the section of the flexible printed circuit board 31 does not form a straight path, but rather an arc. The normal vectors n to the longitudinal axis of the flexible printed circuit board 31 in FIG. 8B have different directions and lie in a plane.
[0104] FIG. 8C shows a schematic view of a further embodiment of a specific section of a flexible printed circuit board 31. The specific section of the flexible printed circuit board 31 in accordance with FIG. 8C is rotated. Rotated here means that the normal vectors n to the longitudinal axis of the specific section of the flexible printed circuit board 31 have different directions in the specific section and each group of three of the normal vectors n are linearly independent with respect to one another. The latter property can also be described by each group of three of the normal vectors n in FIG. 8C always spanning a three-dimensional space.
[0105] FIG. 9 schematically shows one exemplary embodiment of a printed circuit board 32 used as a vacuum bushing. For this purpose, the printed circuit board 32 is incorporated into the first structure 10. A first pressure prevails on a first side 12 of the first structure 10 and a second pressure, which is increased by comparison with the first pressure, prevails on a second side 13 of the first structure 10. The first interface element 11 is formed on the printed circuit board 32 on the first side 12 and a further interface element 14 is formed on the printed circuit board 32 on the second side 13. The arrangement shown can analogously also be applied to the second structure 20 (see any of FIGS. 1-6).
[0106] FIG. 10A-FIG. 10C show various exemplary embodiments of edge structures 47, 48 for forming a gap 43. The exemplary embodiments shown are based on a hollow body 40 formed in a bipartite fashion, for example in accordance with the second, third, fourth or fifth exemplary embodiment of the device 1. In this case, the edge structure 47 is assigned to the partial body 44 and the edge structure 48 is assigned to the partial body 45. The edge structure 47 forms for example a piece and the edge structure 48 forms a counterpiece. The two edge structures 47, 48 overlap in the overlap section 46. The gap 43 formed between the edge structures 47, 48 extends in each case in a serpentine fashion in FIGS. 10A-10C. This can also be referred to as a zigzag shape or a meandering shape. Such a gap shape can improve a shielding. Furthermore, such a gap shape can constitute an improved penetration barrier or diffusion barrier.
[0107] Besides the illustration with two partial bodies 44, 45, it is possible for one of the edge sections 47, 48 to be arranged directly at one of the structures 10, 20. In that case the hollow body 40 can also be formed in an integral fashion, for example as is shown in the first embodiment of the device 1.
[0108] Although the present disclosure has been described on the basis of exemplary embodiments, it is modifiable in diverse ways.
LIST OF REFERENCE SIGNS
[0109] 1 Device [0110] 10 First structure [0111] 11 First interface element [0112] 11 Contact [0113] 12 First side of the first structure [0114] 13 Second side of the first structure [0115] 14 Further interface element [0116] 20 Second structure [0117] 21 Second interface element [0118] 21 Contact [0119] 30 Electrical conductor [0120] 31 Flexible printed circuit board [0121] 32 First printed circuit board [0122] 33 Second printed circuit board [0123] 35 First edge section [0124] 36 Second edge section [0125] 37 Section [0126] 38 Lines [0127] 40 Hollow body [0128] 41 Edge [0129] 42 Electromagnetically shielded volume [0130] 43 Gap [0131] 44 First partial body [0132] 45 Second partial body [0133] 46 Overlap section [0134] 47 Edge structure [0135] 48 Edge structure [0136] 100 Lithography apparatus [0137] 100A EUV lithography apparatus [0138] 100B DUV lithography apparatus [0139] 101 Vacuum housing [0140] 102 Beam shaping and illumination system [0141] 104 Projection system [0142] 106A EUV light source [0143] 106B DUV light source [0144] 108A EUV radiation [0145] 108B DUV radiation [0146] 110-118 Mirrors [0147] 120 Photomask [0148] 122 Mirror [0149] 124 Wafer [0150] 126 Optical axis [0151] 128 Lens element [0152] 130 Mirror [0153] 132 Immersion liquid [0154] 321 Conductor track [0155] 322 Conductor track [0156] 323 Conductor track [0157] 324 Substrate material [0158] M1-M6 Mirrors [0159] n Normal vector
