USE OF PLACEABLE MARKER COMPONENTS FOR A STAGED PLACEMENT OF COMPONENTS ON A CARRIER

Abstract

A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.

Claims

1. A method for the placement of electronic components on a carrier by means of a placement machine, in particular for the placement of unhoused, electronic components on the carrier for the purposes of producing housed electronic components, the procedure comprising: positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; transferring of the carrier along a transport direction into a second spatial location within the placement machine, wherein the second spatial location is selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; second optical detection by means of the camera of the marker components placed in the overlap area; and equipping of the carrier with a multitude of components at predefined placement positions within the second section, wherein the spatial locations of the placement positions on the carrier depend at least on the result of the second optical detection of the placed marker components.

2. The method of claim 1, further comprising equipping of the carrier with a multitude of components at predefined placement positions within the first section, when the carrier is located in the first spatial location.

3. The method of claim 1, further comprising: first optical detection of the first positions of the placed marker components using a camera of the placement machine, wherein the spatial locations of the placement positions on the carrier are furthermore dependent on the result of the first optical detection of the placed marker components.

4. The method of claim 1, further comprising: temporary fixation of the carrier directly or indirectly to a chassis of the placement machine, when the carrier is positioned in the first spatial location; and/or temporary fixation of the carrier directly or indirectly to the chassis when the carrier is positioned in the second spatial location.

5. The method of claim 1, further comprising: repeated first optical detection of the first positions of the placed marker components using a camera; determination, for each marker component, of a first deviation of each between the first position detected in the repeated first optical detection and the first position recorded in the first optical detection; and calculation of a spatial warpage of the carrier based on the determined first deviations.

6. The method of claim 1, further comprising: repeated second optical detection of the second positions of the placed marker components using a camera; determination, for each marker component, of a second deviation of each between the second position detected in the repeated second optical detection and the second position recorded in the first optical detection; and calculation of a spatial warpage of the carrier based on the determined second deviations.

7. The method of claim 1, wherein: a target position when transferring the carrier, which defines the second spatial location, depends on the first positions of the placed marker components detected by the first optical detection and/or by the repeated first optical detection.

8. The method of claim 1, wherein: the overlap area of the carrier is located between the first section and the second section.

9. The method of claim 1, wherein: the overlap area of the carrier is located both in the first spatial location and in the second spatial location within a placement area of the placement machine, wherein the placement area is defined by the entirety of all possible placement positions and within a stationary coordinate system of the placement position.

10. The method of claim 9, wherein: the spatial extension of the carrier along the transport direction is greater than the spatial extension of the placement area along the transport direction.

11. The method of claim 1, further comprising: after the transferring of the carrier into the second spatial location, placement of a multitude of further marker components on the carrier in a further overlap area of the carrier; first optical detection of the first positions of the additional placed marker components; transferring of the carrier along a transport direction into a third spatial location within the placement machine, wherein the third spatial location is selected such that: (a) components in a third section of the carrier are placeable; and (b) the marker components placed in the overlap area are optically detectable; second optical detection of the additional placed marker components; and equipping of the carrier with a multitude of components at predefined placement positions within the third section, wherein the spatial locations of the placement positions on the carrier depend at least on the result of the third optical detection of the placed marker components.

12. The method of claim 1, wherein: the first spatial location is assigned to a first placement area of the placement machine, such that the first section of the carrier is equipped in the first placement area; and the second spatial location is assigned to a second placement area of the placement machine, such that the second section of the carrier is equipped in the second placement area.

13. The method of claim 1, wherein: the first section has two first sub-sections, which are spaced apart from each another along a direction perpendicular to the transport direction and to each of which a first partial placement content of components is assigned, at least one marker component is placed within a first gap between the two first sub-sections.

14. The method of claim 13, wherein: the second section has two second sub-sections, which are spaced apart from each another along a direction perpendicular to the transport direction and to each of which a second partial placement content of components is assigned, and at least one marker component is placed within a second gap between the two second sub-sections.

15. The method of claim 1, wherein: at least some of the marker components are produced from an optically transparent material and/or from a semiconductor material.

16. The method of claim 1, wherein: at least some of the marker components are selected components.

17. A placement machine for the placement of electronic components on a carrier, in particular for the placement of unhoused, electronic components on the carrier for the purposes of producing housed electronic components, the placement machine comprising: a chassis; a transport device for transferring the carrier along a transport direction from a first spatial location into a second spatial location, wherein a first section of the carrier is allocated to the first location for a first placement content and a second section of the carrier is allocated to the second spatial location for a second placement content; a gantry system with a stationary component, which is mounted in a stationary manner to the chassis, and with a moveable component, which can be positioned relative to the stationary component; a placement head, which is mounted on the moveable component and which is configured to pick up components and marker components and after a suitable positioning of the moveable component equip the carrier with the components at predefined placement positions and place the marker components on the carrier in an overlap area of the carrier; a camera for the first optical detection of first positions of the placed marker components, when the carrier is located in the first spatial location, and for the second optical detection of second positions of the placed marker components, when the carrier is located in the second spatial location; and a control unit for controlling at least the operation of the placement head, wherein the control unit is configured such that the spatial locations of the placement positions within the second section depend on the result at least of the second optical detection of the placed marker components.

18. The placement machine of claim 17, wherein: the camera is mounted to the placement head.

19. A computer program for the placement of electronic components on a carrier by means of a placement machine, in particular for the placement of unhoused, electronic components on the carrier for the purposes of producing housed electronic components, wherein the computer program, when it is executed by a control unit, is set up for undertaking the method according claim 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0063] FIGS. 1a and 1b show a two-stage clocking of a carrier through a placement area, wherein the carrier has two sections and one overlap area for marker components, wherein the overlap area is part of the second section.

[0064] FIGS. 2a and 2b show a two-stage clocking of a carrier through a placement area, wherein, compared with FIGS. 1a and 1b, the overlap area is both a part of the second section and a part of the first section.

[0065] FIG. 3 shows a carrier, whereby the two sections are separated perpendicular to a transport direction respectively into two sub-sections and whereby the marker components are placed in gaps between the sub-sections.

[0066] FIG. 4 shows a carrier, whereby in contrast to FIG. 3 the marker components are placed in marginal areas, facing towards each other, of the sub-sections.

[0067] FIGS. 5a and 5b show a two-stage clocking of a carrier with four sub-sections through a placement machine having two placement areas, to which two placement heads are respectively assigned, which work at a time offset to each other.

DETAILED DESCRIPTION

[0068] It is noted that in the following detailed description features or components of different embodiments, which are identical or at least functionally identical to the corresponding features or components of another embodiment, are furnished with the same reference numerals. To avoid unnecessary repetitions, features or components that have already been explained on the basis of a previously described embodiment are no longer explained in detail at subsequent points.

[0069] Furthermore, it is noted that the following described embodiments only represent a limited selection of possible variations of embodiments of the invention. In particular, it is possible to combine the features of individual embodiments in a suitable manner, such that a multitude of different embodiments can be viewed as obviously disclosed for the person skilled in the art with the embodiments explicitly described here.

[0070] FIGS. 1a and 1b show a two-stage clocking of a carrier 150 through a placement area 130 of a placement machine (not shown). The carrier 150 has two sections, a first section 160 and a second section 170. The first section 160 is provided for a first placement content 165, which is shown in FIG. 1a. The second section 170 is provided for a second placement content 175, which is shown in FIG. 1a and FIG. 1b. The placement contents 165 and 175 comprise respectively a multitude of unhoused electronic components 192.

[0071] The staged placement on the carrier 150 thereby begins in that the carrier 150 is positioned relative to the placement area 130 that is stationary in terms of the placement machine such that the first section 160 and an overlap area 180 can be equipped by means of a placement head of the placement machine. The corresponding position of the carrier 150 is also described as the first spatial location of the carrier 150 in this document. As is most clearly visible from FIG. 1a, the overlap area 180 is located in the exemplified embodiment shown here in a front marginal area of the second section 170. According to the exemplified embodiment shown here, the first placement area 160 is (exclusively) equipped with components 192 and the overlap area 180 is (exclusively) equipped with marker components 190.

[0072] After the placement of the marker components 190, these are (optionally) detected by a camera (not shown). As a result, the exact positions of the marker components 190 are determined (in the stationary coordinate system of the placement machine). As the accuracy of such an optical position determination is generally higher than the positional accuracy of the placement head, the accuracy of the subsequent placement of the second section 170 is thereby increased. The higher level of accuracy is thus particularly achieved by the use of a shared reference (in the form of the marker components 190).

[0073] After completion of the first placement content 165, the carrier 150 is then transferred along a transport direction 150a into a second spatial location. The carrier 150 in this second spatial location is shown in FIG. 1b. In this second spatial location, the second section 170 is accessible to the placement head. In addition, the overlap area 180 is detectable by a camera (not shown) of the placement machine. The overlap area 180 is preferably accessible to both the placement head and the camera in the two spatial locations.

[0074] According to the exemplified embodiment shown here, the camera is a camera that is movable by means of a gantry system, which is mounted in particular directly or indirectly to the placement head and is moved together with the placement head.

[0075] Before the start of the placement of the second section 170 with the second placement content 175, the marker components 190 are then detected by the camera and their exact positions are determined by means of a data processing unit downstream of the camera. As a result, the (not stationary) reference systems for the first section 160 and the second section 170 can be related to each other such that a (seamless) connecting placement of the second section 170 can be made on the already performed placement of the first section 160 with the first placement content 165.

[0076] FIGS. 2a and 2b show a two-stage clocking of a carrier 250 through a placement area 130, wherein, compared with FIGS. 1a and 1b, an overlap area 280 is both a part of the second section 170 and a part of the first section 160. Even if in doing so some placement surface on the carrier 250 is wasted for the placement with marker components 190, this embodiment can be advantageous due to the symmetry of the location of the overlap area 280 in relation to the two sections 160 and 170. In addition, it is noted that it is also possible that components are also placed in the overlap area 280 next to the marker components 190, such that the placement surface wastage is not so great. In addition, the marker components 190 in other exemplified embodiments are selected (unhoused) electronic components, the structures of which are easily detectable for the camera.

[0077] FIG. 3 shows a carrier 350, whereby the two sections are separated respectively into two sub-sections compared to the carrier 150 and 250. In tangible terms, according to the exemplified embodiment shown here, the first (front in relation to the transport direction 150a) section is separated perpendicular to the transport direction 150a into two first sub-sections 361 and 362. Between the two first sub-sections 361 and 362, there is a first gap 363. Accordingly, the second (rear) section is also separated perpendicular to the transport direction 150a into two second sub-sections 371 and 372. Between the two second sub-sections 371 and 372, there is a first gap 373. In addition, the first sub-sections 361 and 362 are spaced apart from the two second sub-sections 371 and 372 along the transport direction 150a by a third gap 367 or a fourth gap 377. Overall, the two first sub-sections 361 and 362 together with the two second sub-sections 371 and 372 form a four-sided arrangement consisting of a total of four sub-sections 361, 362, 371 and 372. Obviously, more than four and in principle any number of sub-sections can be used.

[0078] According to the exemplified embodiment shown, the marker components 190 are placed in the area of the third gap 367 and the fourth gap 377, which are positioned within the overlap area 280. As is visible from FIG. 3, a marker component 190 is located in the centre on the carrier 350 (in the intersection between the gaps 363 and 373 on one side and the gaps 367 and 377 on the other side).

[0079] Furthermore, in the exemplified embodiment shown here, two marker components 390 are placed at the marginal area of the carrier 350, displaced along the transport direction 150a (but still in the overlap area 280). This has the advantage that not all marker components along the transport direction 150a are placed at the same height or at the same coordinate. As a result, the pattern of marker components 190, 390 detected by the camera is a two-dimensional pattern, which improves the accuracy of the positional measurement. In addition, warpages of the carrier 350 along the transport direction, which are caused during transportation between the two spatial locations and/or by mechanical clampings of the carrier 350 in the two spatial locations, can be thereby determined and taken into consideration during the placement on the second section or the two second sub-sections 371 and 372.

[0080] FIG. 4 shows a carrier 450, whereby in contrast to the carrier 350, shown in FIG. 3, the marker components 190 are placed in marginal areas, facing towards each other, of the sub-sections 316, 362, 363 and 364. In this exemplified embodiment too, the marker components 190 form a two-dimensional patterns with the above described advantages. The marker components 190 can, as already previously mentioned, also be selected and optically easily detectable unhoused components.

[0081] FIGS. 5a and 5b show a two-stage clocking of a carrier 350 with four sub-sections by a placement machine 500. The carrier 350 in a first spatial location is shown in FIG. 5a. The carrier 350 in a second spatial location is shown in FIG. 5b.

[0082] The placement machine 500 has a stationary chassis. According to the exemplified embodiment shown here, stationary markers furnished with the reference numeral 504 are directly or indirectly mounted to the chassis in an unshown manner, on the basis of which the positional accuracy of a gantry system 510 is checked in the known manner by an optical reference measurement and the gantry system 510 can be (re)calibrated when necessary.

[0083] The gantry system has a stationary component 512, formed as a carrier rail, and a total (in this exemplified embodiment) of four moveable components 514a, 514b, 514c and 514d, formed as transverse carrier arms that are displaceable on the carrier rail 512 along a y-axis. The carrier arms 514a-d extend along an x-direction that is perpendicular to the y-direction. On each of the carrier arms 514a-d, a placement head 520a, 520b, 520c or 520d is attached, which is respectively illustrated by a component holding device formed as a suction gripper. The placement heads 520a-520d are displaceable along the x-direction, such that with each placement head 520a-520d respectively a placement area can be approached. The placement heads 520a-520d can be single placement heads and/or multiple placement heads with a plurality of component holding devices for the temporary removal of a component each.

[0084] On each of the carrier arms 514a-d, a camera 524a, 524b, 524c or 524d is further mounted, which can also be displaced along the x-direction, such that at least the corresponding placement areas can be optically detected by the respective camera 524a-d. According to the exemplified embodiment shown here, the cameras 524a-d are displaceable together with the respective placement head 520a, 520b, 520c or 520d.

[0085] The clocked placement on the carrier 350 begins then with the carrier 350 being brought along the transport direction 195a in the first spatial location in relation to a first placement area 530a of the placement machine 500, which is located in front of the carrier rail 512 in relation to the transport direction 150a. The reference numeral 530a is only shown in FIG. 5b for reasons of clarity.

[0086] The two front sub-sections, relating to the transport direction 150a, of the carrier 350 are placed in the first spatial location. The front sub-sections are furnished with the reference numerals 361 and 362 in FIG. 4. With this placement, the two placement heads 520a and 520b work at a time offset to each other. This means that in a time window when a placement head 520a is mounting components on the carrier 350 (in the two front sub-sections), the other placement head 520b is removing components from a (not shown for reasons of clarity) component feeding device, which is located right of a transportation device 534 in relation to the transport direction 150a. With the unhoused components used here, such a feeding device is a system, which has received a semiconductor wafer, and which, for example using ejector tools, separates individual unhoused component or semiconductor chips from the wafer composite, such that they can be sequentially picked up by the placement head 520b. In a next time window, the placement head 520b places the previously received components and the placement head 520a removes (new) components from a component feeding device located on the left side of the transportation device 534.

[0087] Before and during a placement on the two front sub-sections with components, as shown in FIG. 3, marker components 190 are placed by the placement heads in an overlap area of the carrier 350 which is not shown in FIGS. 5a and 5b for reasons of clarity. The exact positions of these marker components 190 are then determined by the camera 524a or 524b.

[0088] Thereafter, the carrier 350, as is visible in FIG. 5b, is transferred along the transport direction 150a into a second placement area 530b, such that the carrier is located in a second spatial location in relation to the stationary chassis 502. The second placement area 530b is located behind the carrier rail 512 in relation to the transport direction 150a. The reference numeral 530b is only shown in FIG. 5b for reasons of clarity.

[0089] In the second spatial location, the exact positions of these marker components 190 are determined by the camera 524c or 524d. Thereafter, taking into consideration the detected positions, the placement of the two (in relation to the transport direction) rear sub-sections beings, which are furnished with the reference numerals 371 and 372 in FIG. 3. This placement occurs in the same way as the placement of the two front sub-sections (with a staggered operation of the two placement heads 520c and 520d).

[0090] The operation of the entire placement machine 500 is coordinated by a control unit 540, which is only shown schematically in FIGS. 5a and 5b and which is furnished with the reference numeral 540. In this control unit, an image evaluation can take place of the images detected by the cameras 524a-d of the marker components 190, in particular.

[0091] It is noted that the term have or comprising does not exclude other elements and that the word one or a does not exclude a plurality. Elements, which are described in connection with different exemplified embodiments, can also be combined. It should also be noted that reference numerals in the claims should not be construed as limiting the scope of the claims.

REFERENCE NUMERALS

[0092] 130 Placement area [0093] 150 Carrier [0094] 150a Transport direction [0095] 160 First section [0096] 165 First placement content [0097] 170 Second section [0098] 175 Second placement content [0099] 180 Overlap area [0100] 190 Marker components [0101] 192 (Unhoused) components/chips [0102] 250 Carrier [0103] 280 Overlap area [0104] 350 Carrier [0105] 361/362 First sub-section [0106] 363 First gap [0107] 371/372 Second sub-section [0108] 373 Second gap [0109] 367 Third gap [0110] 377 Fourth gap [0111] 390 Marker components [0112] 450 Carrier [0113] 500 Placement machine [0114] 502 Chassis [0115] 504 Stationary markers [0116] 510 Gantry system [0117] 512 Stationary component/carrier rail [0118] 514a/b/c/d Moveable components/carrier arm [0119] 520a/b/c/b Placement head [0120] 524a/b/c/d Camera [0121] 530a First placement area [0122] 530b Second placement area [0123] 534 Transport device [0124] 540 Control unit