DEVICE AND METHOD FOR SEPARATING A BANDEROLE
20190184490 · 2019-06-20
Assignee
Inventors
Cpc classification
B23K26/037
PERFORMING OPERATIONS; TRANSPORTING
B65B57/16
PERFORMING OPERATIONS; TRANSPORTING
B23K26/08
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0838
PERFORMING OPERATIONS; TRANSPORTING
B65B69/0025
PERFORMING OPERATIONS; TRANSPORTING
B23K2103/42
PERFORMING OPERATIONS; TRANSPORTING
B23K26/03
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
An apparatus and a corresponding method for separating a band of a bundle of documents have a deformation device which is devised to deform the bundle, in particular to bulge the bundle, such that a portion of the band lifts from the bundle, and a separating device which is devised to at least partly cutting through the band in the region of the portion lifted from the bundle. A value-document processing system includes such an apparatus.
Claims
1.-12. (canceled)
13. An apparatus for separating a band of a bundle of documents, comprising a deformation device which is devised to deform the bundle such that a portion of the band lifts from the bundle, and a separating device which is devised to at least partly cut through the band in the region of the portion lifted from the bundle.
14. The apparatus according to claim 13, wherein the bundle has two principal surfaces which are formed by the two outermost value documents of the bundle, and the deformation device is devised to concavely bulge the bundle in the region of one of the principal surfaces, wherein the portion of the band running in the region of this principal surface lifts from this principal surface.
15. The apparatus according to claim 13, wherein the separating device is devised for generating a laser beam by which the band can be cut through at least partly.
16. The apparatus according to claim 15, wherein the laser beam is focused on the portion of the band lifted from the bundle.
17. The apparatus according to claim 13, having a baffle element substantially opaque to electromagnetic radiation which is devised to be incorporated between the portion of the band lifted from the bundle and the bundle.
18. The apparatus according to claim 17, wherein the baffle element is devised to absorb electromagnetic radiation at least partly.
19. The apparatus according to claim 13, wherein the deformation device has at least one support element which the bundle can lie on top of.
20. The apparatus according to claim 19, wherein the deformation device further has a stamp element which is devised to press on the bundle lying on the at least one support element, wherein the at least one support element and the stamp element are arranged and/or shaped such that the bundle is concavely bulged by the stamp element pressing on the bundle.
21. The apparatus according to claim 19, wherein the at least one support element has at least one opening by which air and/or the cut-through band can be sucked off.
22. The apparatus according to claim 21, wherein the support element has a cross section which tapers toward the opening of the support element, so that the bundle lying on the support element upon a sucking of air through the opening adapts itself at least partly to the tapering cross section of the support element and is in the process concavely bulged.
23. A value-document processing system having at least one apparatus for processing value documents and having an apparatus according to claim 13.
24. A method for separating a band of a bundle of documents, comprising: deforming the bundle is deformed such that a portion of the band lifts from the bundle, and cutting through the band at least partly in the region of the portion lifted from the bundle.
Description
[0019] Further advantages, features and application possibilities of the present invention will result from the subsequent description in connection with the figures. There are shown:
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
[0028] Further, a light source 15, in particular in the form of a laser, is provided which generates a light beam 16 directed at the portion A of the band 2 lifted from the bundle 1. Preferably, the light beam 16, as is indicated in the present example, is focused on the portion A of the band 2. This is attained by a corresponding embodiment of the light source 15 itself and/or additional optical elements (not represented) in the beam path.
[0029] By the focusing of the light beam 16 on the portion A of the band 2, the light intensity is the highest there, so that upon choosing a light source 15 having a correspondingly high intensity, the material of the band 2, for example paper and/or plastic, evaporates, whereby the band 2 is cut through. A cutting-through of the band 2, preferably over the entire band width, can be attained for example by the fact that the light beam 16 is focused in a line which extends over the width of the band 2. Alternatively or additionally, it is, however, also possible to move the light beam 16 and the bundle 1 furnished with the band 2 relative to each other.
[0030] A focusing of the light beam 16 on the portion A of the band 2 further has the advantage that the light of the light beam 16 striking the value document of the bundle 1 lying below the portion A of the band 2 at the distance d lies outside the focus region and with it has a lower energy density than in the focus region, so that the value document of the bundle 1 cannot be damaged by the light beam 16.
[0031] In the second example of the apparatus shown in
[0032]
[0033] Preferably the air intake is controlled by the opening 17 and/or the channels 18 and/or 19 such that the band 2 cut through in the portion A is sucked off through the opening 17 or one of the channels 18 or 19. For example, the cut-through band 2 can be sucked off through the channel 18, after the negative pressure at the opening 17 and at the channel 19 is switched off. Alternatively, it is also possible to draw the band through the opening 17, by switching off the negative pressure in the channels 18 and 19.
[0034]
[0035] In a first step a), the substantially cuboid bundle 1 is positioned on a support means, which in the shown example is formed by support elements 12 and 13, below a stamp element 14.
[0036] In a second step b), the bundle 1 is pressed onto the support means by introducing the stamp element 14 and is in the process concavely bulged, so that an upper portion A of the band 2 lifts from the upper side of the bundle 1.
[0037] In a third step c), the upper portion A of the band 2 is cut through by a light beam 16 focused on the portion A.
[0038] In a fourth step d), the stamp element 14 moves back from the bundle 1, so that this can again assume the original cuboid shape.
[0039] In a fifth step e), the cut-through band 2 is sucked off through opening 17 by creating a negative pressure at said opening, so that the debanded bundle 1 can finally be transported off from the support means in a step f) and be fed to a further processing.
[0040]
[0041] The laser beam 16 is preferably generated by a so-called marking or inscription laser which has an internal mirror deflection by which the beam 16 can be guided over the portion A of the band 2 and in the process cuts through this. The cut-through band 2 is then removed from the bundle 1, for example by sucking off in the direction R.
[0042] Preferably, an image-capturing device 25 is provided which can capture the position of the bundle 1 and/or the band 2. In a control device (not represented) the feed and/or the positioning of the bundle 1 or the band 2 can then be controlled based on the captured position of the bundle 1 or the band 2. On the basis of the captured images of the bundle 1 or the band 2, a distance measuring can optionally also be performed in the control device to perform, for example, a targeted focusing of the light beam 16 onto the portion A of the band 2. The images recorded by means of image capture can also be archived to be able to retrace, if necessary, the individual process steps upon separating the bundle 1. Alternatively or additionally, is can also be checked on the basis of the recorded images whether the band 2 was removed correctly. Alternatively or additionally, it is also possible to configure the image capturing device 25 such that this uses an internal positioning aid of the light source 15, in particular of the marking or inscription laser. Alternatively or additionally, it is also possible to configure the image capturing device 25 such that this captures information items present on the band 2 which can be employed upon a subsequent processing in a value-document processing apparatus 30.
[0043] Alternatively or additionally, a device 26 can also be provided for distance measuring by means of which the height of the focus of the light beam 16 is adapted to the current position, in particular height, of the portion A of the band 2.
[0044] After the cutting-open of the bundle 1 and removing of the band 2, the value documents of the debanded bundle 1 can be fed to a further processing in the value-document processing apparatus 30, which is indicated only schematically.
[0045]
[0046]
[0047] According to an alternative or additional aspect of the invention, the apparatus can be configured such that packages can be separated or opened with the light beam 16 in which several bundles of value documents are packaged, in particular furnished with bands. Such packages can be e.g. packages from foils, in particular shrink films, and/or vacuum packages. Preferably, the packaged bundles are lined up adjacently such that the bands of the individual bundles lie in a line and have at least a certain overlap.
[0048] In the process, the apparatus preferably has a device by which a package is rotated under the light beam 16 by 360 and/or is displaced relative to the light beam 16. Preferably the device is configured to continually change the distance of the rotation axis to the focus point during the rotation in such a way that the surface of the package always lies in the focus of the light beam 16.
[0049] During the relative motion of package and light beam 16, this successively cuts through the packaging foil lying tightly against the combined bundles along their circumference, whereas excess energy of the light beam 16 is absorbed by the bands lying under the cut line of the bundles. In general the excess energy is lower than the energy required for separating the band material, so that the value documents located in the respective bundles are reliably protected by the bands from damage. The bands can possibly have light scorch marks, which does no matter if these are thereupon removed from the bundles, in particular in the hereinabove described manner.
[0050] Besides the hitherto described light source as a separating device 15 for the cutting of the band 2, other means can be employed for the cutting through of the band 2, for example knifes or blades.