THIN FILM DEPOSITION PREPARATION DEVICE AND METHOD

Abstract

The invention provides a thin film deposition system and a method, and relates to the field of thin film deposition. The deposition method comprises the following steps: 1) heating metal substrate; carrying out deposition. The method is characterized in the step 1) that a current is conducted into the metal substrate at one end of the growth zone by one electrode, and out of the metal substrate at the other end of the growth zone by the other electrode, so that the metal substrate is heated by the heat emitting of the resistant of the metal substrate itself. According to the method, the quality of the prepared thin film is improved, while the preparation cost of the thin film is reduced. In addition, the consistent double-sided thin films can be easily prepared on two surfaces of the metal substrate by employing the system and method.

Claims

1. A thin film deposition system, comprising a growth chamber, two substrate-rolling setups and a substrate-heating setup; wherein the substrate-heating setup comprises a first electrode configuration and a second electrode configuration, which are side by side installed between a first rotation shaft and a second rotation shaft in the growth chamber; and a space between the first electrode configuration and the second electrode configuration is a growth zone of the thin film; the first electrode configuration comprises a first interface to a current source, and at least two first substrate-contacting electrode strips, the two first substrate-contacting electrode strips are distributed along a first edge and a second edge of a substrate passage respectively and electrically connected with each other; the two first substrate-contacting electrode strips are disposed on a same plane of the substrate passage; the substrate passage is configured for a metal tape substrate disposed therein; wherein each second electrode unit comprises a second interface to the current source, two second substrate-contacting electrode strips fixed along the first side and the second side of the substrate passage; and the two second substrate-contacting electrode strips are disposed on the same plane of the substrate passage; and a plurality of currents are conduct into the first edge of the substrate passage and out of the second edge of the substrate passage through the first electrode configuration and the second electrode configuration when the metal tape substrate is disposed on the substrate passage.

2. The thin film deposition system according to claim 1, wherein the first electrode configuration comprises a first current-distributing circuit and at least two first electrode units, the two first electrode units are connected electrically with each other through the first current-distributing circuit; and the first current-distributing circuit is the serial connection of resistors; each first electrode unit is parallel connected to its adjacent first resistor; wherein the second electrode configuration comprises a second current-distributing circuit and at least two second electrode units; and the two second electrode units are connected electrically with each other through the second current-distributing circuit, and the second current-distributing circuit is the serial connection of resistors; each distributing electrode unit is parallel connected to its adjacent second resistor.

3. The thin film deposition system according to claim 2, wherein the first substrate-contacting electrode strips are perpendicular to the substrate passage.

4. The thin film deposition system according to claim 2, wherein the second substrate-contacting electrode strips are perpendicular to the substrate passage.

5. The thin film deposition system according to claim 2, wherein a deposition source is directly disposed above a first surface of the metal tape substrate in the growth zone or a deposition source is directly disposed above a first surface and a second surface of the metal tape substrate in the growth zone.

6. The thin film deposition system according to claim 1, wherein the first electrode configuration further comprises a first settlement configuration containing a first position-adjusting configuration, and the second electrode configuration further comprises a second settlement configuration containing a second position-adjusting configuration.

7. The thin film deposition system according to claim 6, wherein the first electrode settlement configuration comprises headless screws and two parallel and insulated plates; the insulated plates are installed in the vacuum chamber by the headless screws; the interspace between the two insulated plates is substrate passage; and the first position-adjusting configuration is connected to the insulated plates; the second electrode settlement configuration comprises headless screws and two parallel and insulated plates; the insulated plates are installed in the vacuum chamber by the headless screws; the interspace between the two insulated plates is substrate passage; and the second position-adjusting configuration is connected to the insulated plates.

8. The thin film deposition system according to claim 7, wherein each of the first position-adjusting configuration and the second position-adjusting configuration comprises at least three screws, screw nuts and springs; the screws pass through holes on the two insulated plates and make them face to face with each other; the coupling of the screws and the holes is a slip fit; the screw nuts are settled on the part of the screws outside the insulated plates, and the springs are settled between the outside faces of the insulated plates and the screw nuts; the substrate-contacting electrode strips are fixed on the inner faces of the insulated plates.

9. The thin film deposition system according to claim 7, wherein there are at least three uniformly-spaced substrate-contacting electrode strips disposed on each of the insulated plates.

10. The thin film deposition system according to claim 1, wherein the two substrate-rolling setups comprises a first substrate-rolling setup and a second substrate-rolling setup, and the first substrate-rolling setup comprises a first roll and the first rotation shaft for rotating the first roll, and the second substrate-rolling setup comprises a second roll and the second rotation shaft for rotating the second roll.

11. The thin film deposition system according to claim 10, wherein the first substrate-rolling setups further comprises a first supporting roller between the first roll and the adjacent first electrode configuration, and the second substrate-rolling setups further comprises a second supporting roller between the second roll and the adjacent second electrode configuration.

12. The thin film deposition system according to claim 11, wherein a substrate passage is the plane determined by the top edges of the first supporting roller and the second supporting roller.

13. The thin film deposition system according to claim 10, wherein a precursor-coating zone is formed between the second electrode configuration and the second roll.

14. The thin film deposition system according to claim 1, wherein one or more extra electrode configuration can be placed between the first electrode configuration and the second electrode configuration; the extra electrode configuration comprises at least two third substrate-contacting electrode strips distributed along two sides of the substrate passage and a third interface to current source; the extra electrode configuration is settled in the growth chamber through its settlement configuration; the thin film deposition zone locates between the adjacent electrode configurations.

15. The thin film deposition system according to claim 14, wherein the growth zone comprises a first growth zone and a second growth zone, the first growth zone is formed between the first electrode configuration and the extra electrode configuration, and the second growth zone is formed between the extra electrode configuration and the second electrode configuration.

16. The thin film deposition system according to claim 1, wherein a precursor-processing zone is formed between the first electrode configuration and the second electrode configuration.

17. The thin film deposition system according to claim 1, wherein there are positioning setups at the entrances and exits of the first electrode configuration and the second electrode configuration;

18. The thin film deposition system according to claim 17, wherein each of the positioning setups comprises two face-to-face positioning plates, a concavity to determine a substrate position is disposed on each of positioning plates; and a first edge and a second edge of a metal tape substrate are disposed in the concavity accordingly.

19. A method for fabricating thin film by using the thin film deposition system according to claim 1, comprising the following steps: 1) heating a metal tape substrate and 2) depositing thin films, wherein in the step 1) a current is conducted into the metal tape substrate at a first end of the growth zone by one electrode, and out of the metal tape substrate at a second end of the growth zone by the other electrode, so that the metal tape substrate is heated by the heat emitting of the resistant of the metal tape substrate itself.

20. The method for fabricating thin films according to claim 19, wherein the current is conducted into and out of the metal tape substrate through its edges.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The invention herein will be better understood when read in conjunction with the following appended drawings, in which same numeral indicates same configuration. It should be noted that these drawings are only used to illustrate the principle of the invention, thus the inventive concepts should not be limited to the precise arrangements and setups depicted in the drawings.

[0020] FIG. 1A illustrates the 3D structure and circuit of the embodiment 1 of the invention herein.

[0021] FIG. 1B illustrates the position variation of the substrate passage with the metal tape remnant in the roll.

[0022] FIG. 1C illustrates that the position of the substrate passage is constant under the effect of the supporting rollers.

[0023] FIG. 1D illustrates the current-distributing circuit of the electrode configuration referred in the invention herein.

[0024] FIG. 2 illustrates the 3D structure and circuit of the embodiment 2 of the invention herein.

[0025] FIG. 3 illustrates the 3D structure and circuit of the embodiment 3 of the invention herein.

[0026] FIG. 4 illustrates the 3D structure and circuit of the embodiment 4 of the invention herein.

[0027] FIG. 5 illustrates the 3D structure of the electrode configuration referred in the invention herein.

[0028] FIG. 6 is the top down view of the electrode configuration shown in FIG. 5.

[0029] FIG. 7 is right elevation view of the electrode configuration shown in FIG. 5.

[0030] FIG. 8 is the top down view of the positioning setup referred in the invention herein.

[0031] FIG. 9 is the right elevation view of the positioning setup referred in the invention herein.

[0032] FIG. 10 shows the X-ray 2theta scans of YBa.sub.2Cu.sub.3O.sub.7-x (YBCO) films deposited on three different positions (beginning, middle and end) of the metal tape substrate. It's revealed that the YBCO films at three positions are all c-axis oriented and highly crystallized, demonstrated by the sharp (00l) peaks rather than (h00) peaks, and are also uniform because of the similar intensity of their (00l) peaks.

[0033] FIG. 11 shows the X-ray scan and scan of YBCO film deposited on the middle of the metal tape substrate. The full width at half maximum (FWHM) of -scan curve and -scan curve is 1.5 and 2.2, respectively, indicating that the YBCO film is of excellent in-plane and out-of-plane textures, and is similar with the YBCO film deposited on single crystal substrate.

[0034] FIG. 12 shows the scanning electron microscope (SEM) image of YBCO film deposited on the middle of the metal tape substrate. It's shown that the film is smooth, dense and crack free with few a-axis oriented YBCO grains on its surface.

[0035] In the above figures, numerals indicate different objects or configurations: 1. ceramic plate, 2. conductive metal strip, 3. spring, 4. headless screw, 5. screw, 6. conductive wire, 7. current-distributing resistor, 8. metal tape substrate, 9-10. current source, 11. growth zone of thin film, 12. electrode configuration, 13. roll, 14. insulated cover of the roll, 15. rotation shaft of the roll, 16. positioning setup of the substrate, 17. stick to fix the positioning setup, 18. growth chamber, 19. supporting roller, 20. deposition source, 21. precursor-coating zone, 22. precursor-processing zone.

DETAILED DESCRIPTION

[0036] The invention herein proposes a method for preparing thin films, including the following steps: 1) metal substrate heating, 2) thin film deposition. The method is characterized in the step 1) that the current flows into the metal substrate through the electrode beside one end of the growth zone and flows out of the metal substrate through another electrode beside the other end of the growth zone, and the metal substrate is heated by the Joule effect because of the resistant of the metal itself. Especially, the current flows into and out of the metal substrate through its edges. And the current may be direct current or alternating current.

[0037] The invention herein also provides a system for thin film deposition, shown in FIG. 1-9.

[0038] The system is composed of a growth chamber 18, two substrate-rolling setups and substrate-heating setup. The substrate-heating setup herein consists of the first electrode configuration 12A and the second electrode configuration 12C, which are installed side by side between the rolls of 13A and 13B in the growth chamber 18; and the rolls of 13A and 13B are installed through two rotation shafts; the thin film growth zone is located between the two electrode configurations, 12A and 12C.

[0039] The first electrode configuration 12A consists of an interface to current source 10 (in FIG. 1) and at least two conductive metal strips 2, which are distributed along two sides of the substrate passage and electrically connected with each other as well as the current source 10.

[0040] The second electrode configuration 12C is same with the first electrode configuration 12A.

[0041] The above-mentioned substrate passage is the position or the moving path of the substrate at the working state. If there are no supporting rollers 19, the substrate passage is determined by the movement scope of the substrate due to the variation of the amount of the substrate in the roll, and is illustrated in FIGS. 1B and 7. However, the substrate edges always move in a plane due to the parallel installation of the rotation shafts 15, therefore the conductive metal strips 2 are fixed perpendicular to the substrate passage to keep them closely contact to the substrate edges. As an improvement showed in FIG. 1C, two extra supporting rollers 19 are added to determine the only substrate passage, which are the plane containing the top edges of the rollers 19.

[0042] The first electrode configuration 12A consists of current-distributing circuit and at least two electrode units, each of which includes two conductive metal strips settled along two sides of the substrate passage. And the electrode unit connects electrically with each other by the current-distributing circuit. The second electrode configuration 12C is same with that 12A.

[0043] The above-mentioned current-distributing circuit is composed of resistors 7 and conductive wires 6, showed in FIG. 1d. For example, the first electrode configuration 12A includes at least three electrode units and current-distributing circuit composed of serially connected resistors 7. Each electrode unit is in parallel connection to the adjacent resistor 7, and the current flowing into each electrode unit is determined by the resistant of those resistors 7.

And one resistor 7 is enough if there are only two electrode units in the first electrode configuration 12A.

[0044] The electrode configuration is installed through settlement configuration. Taking an example in FIG. 5-7, the first settlement configuration consists of headless screws and two parallel and insulated plates. The two insulated plates are settled in the growth chamber through the screws, and the space between the two plates is the substrate passage. In addition, a position-adjusting configuration is connected to the plates. And the position-adjusting configuration consists of at least three screws, screw nuts and springs. The screws pass through the holes on the two insulated plates and make them face to face with each other. The coupling of the screws and the holes is a slip fit. The screw nuts are settled on the part of the screws outside the insulated plates, and the springs are installed between the outside faces of the insulated plates and the screw nuts. The conductive metal strips are fixed on the inner faces of the insulated plates.

[0045] As an improvement, there are positioning setups 16 installed at the entrance and exit of the electrode configuration, showed in FIGS. 1A, 2-4, 8 and 9. The positioning setup herein consists of two face-to-face positioning plates, on each of which there is a concavity to determine the substrate position. Under the effect of the positioning setup, the up-and-down motion of the metal substrate is mitigated or eliminated, thereby the close contact between substrate and electrode configuration is achieved.

Embodiment 1

[0046] As what is shown in FIG. 1, the embodiment 1 comprises a growth chamber 18, two rotation shafts 15 of substrate rolls and substrate-heating setup. The substrate-heating setup herein consists of the first electrode configuration 12A and the second configuration 12C, which are settled side by side between the rolls 13A and 13B in the growth chamber 18; and the rolls 13A and 13B are installed by the two rotation shafts 15; the thin film growth zone 11 is located between the two electrode configurations, 12A and 12C.

[0047] The electrode configurations, 12A and 12C, are same with each other.

The first electrode configuration 12A consists of an interface to current source 10 and at least two conductive metal strips 2, which are distributed along two sides of the substrate passage and electrically connected with each other as well as the current source 10. The first electrode configuration 12A is installed in growth chamber 18 through the first settlement configuration.

[0048] The first settlement configuration herein consists of two face-to-face and parallel insulated ceramic plates 1, which are skewered by headless screws 4 located at the corners of the ceramic plates 1. The headless screws 4 can be fixed directly or through a holder to the wall of the growth chamber 18.

[0049] The ceramic plates 1 can slip along the headless screws 4. There are springs 3 between ceramic plates 1 and screw nuts. There are two or more equal-spaced and parallel conductive metal strips 2 fixed on the inner faces of the two ceramic plates 1 through the screws 5. And the two face-to-face metal strips 2 are connected by a conduction wire 6 to form a pair, which is closely and elastically contacted to metal tape 8 by adjusting the compression of the springs 3. Because of the resistant of the metal tape 8 several current-distributing resistors 7 are in parallel connection with the pairs of the metal strips 2 to uniformly allocate the current flowing into each pair of metal strips 2. The resistant of each resistor 7 is determined by the properties of metal tape 8, number of the metal strip pair, and interspace between two adjacent pairs of metal strip 2. The number of resistor 7 is determined by the number of metal strip pair.

[0050] In FIGS. 1, 8 and 9, there is one positioning setup 16 on each side of the electrode configuration. The positioning setup 16 herein is fixed in the growth chamber 18 by a stick 17 and also insulated to the growth chamber 18. The positioning setup 16 consists of two face-to-face positioning plates located at two sides of the metal tape 8, respectively. On each of the positioning plate there is a trapezoidal tank to position the metal tape 8 to prevent scraping its surface. The bottom width w of the trapezoidal tank is a little larger than the thickness of the metal tape 8. The interspace d between the bottoms of the two face-to-face trapezoidal tanks on the two positioning plates is adjustable and consistent with the width of metal tape 8.

[0051] As what is shown in FIG. 1, at working state the embodiment 1 herein is installed in growth chamber 18. The first electrode configuration 12A and the second electrode configuration 12C is connected to anode (or cathode) and cathode (or anode) of the current source 10, respectively. The thin film growth zone 11 is located between the two electrode configurations. There is deposition source 20 directly above the surface of the metal tape 8 in the growth zone 11. The deposition source 20 can originate from coating techniques such as sputtering, pulsed-laser deposition, evaporation, chemical vapor deposition, and so on. The positioning setup 16 is fixed in the growth chamber 18 by the sticks 17 and insulated with the growth chamber 18. The rolls 13 are installed on the rotation shafts 15 driven by an electric motor. An insulated cover 14 is inserted between the roll 13 and rotation shaft 15 to keep the roll 13 insulated with the growth chamber 18. The metal tape 8 is fed by the roll 13B, and passes through the positioning setup 16 on the right side of the second electrode configuration 12C, and is limited into the trapezoidal tanks, which are adjusted to parallel and be level with each other, and the interspace between which is adjusted to be consistent with the width of the metal tape 8. Then, the metal tape 8 successively passes through the second electrode configuration 12C and the positioning setup 16 on the left side of the second electrode configuration 12C, and is limited into the trapezoidal tanks. Next, the metal tape 8 goes through the growth zone 11, then successively passes through the positioning setup 16 on the right side of the first electrode configuration 12A, the first electrode configuration 12A, and the positioning setup 16 on the left side of the first electrode configuration 12A in a same way, and is finally taken up by the roll 13A. When the metal tape 8 is going through the electrode configuration, the metal strips 2 on the inner faces of the two ceramic plates 1 clamp two edges of the metal tape 8 with the surfaces of metal strips perpendicular to the metal tape 8 surfaces. The pressure of the ceramic plates clamping the metal tape 8 is controlled by adjusting the compression of the springs 3 to ensure that the metal strips 2 have excellent electrical contacts with the edges of the metal tape 8. Meanwhile, the positioning effect of the positioning setups 16 that keeps the metal strips 2 always orthogonally contact to the metal tape 8 further ensures the heating reliability. The heating current I.sub.1 flows from the anode of the current source 10 to the first electrode configuration 12A, then is uniformly allocated into every pair of the metal strips 2 by the current-distributing resistors 7. The allocated current is then converged through the edges of metal tape 8 into the metal tape 8. Because the metal tape 8 is insulated with the deposition system, the converged current hI will transmit only in the part of the metal tape 8 located in the growth zone 11, then flows back to the cathode of current source 10 through the second electrode configuration 12C in a same way. The part of the metal tape 8 in the growth zone 11 is heated under the effect of the current I.sub.1, and the required surface temperature can be achieved by adjusting the current or voltage of the current source 10. Afterward, the thin film can be formed on the heated metal tape 8 under the effect of the deposition source 20. At the same time, the rotation shaft 15 will drive the roll to rotate, thereby brings the movement of the metal tape 8 between two electrode configurations 12 to realize the continuous and reel-to-reel deposition of single-sided thin film on metal tape 8.

Embodiment 2

[0052] As what is shown in FIG. 2, at wording state the substrate-heating setups and metal tape 8 are settled by referring to the embodiment 1. However, there is difference that there are deposition sources over both faces of the metal tape 8 in the growth zone 11 in the embodiment 2, therefore simultaneous deposition of double-sided thin films on both faces of metal tape 8 can be achieved. With the assistance of the movement of metal tape 8, the continuous and reel-to-reel deposition of double-sided thin films on metal tape 8 can be realized.

Embodiment 3

[0053] As what is shown in FIG. 3, at wording state the substrate-heating setups and metal tape 8 are settled by referring to the embodiment 1. However, the difference between embodiment 1 and 3 is that one extra electrode configuration 12B is installed between the two electrode configurations, 12A and 12C, therefore there are two growth zones, 11A and 11B, in which there are four deposition sources 20A, 20B, 20C and 20D over both faces of the metal tape 8. The first electrode configuration 12A is connected to the anodes (or cathodes) of the current source 9 and 10, and the extra electrode configuration 12B and the second electrode configuration 12C are connected to the cathodes (or anodes) of current source 9 and 10, respectively. The heating current I.sub.1 and I.sub.2 flow from the anodes of current sources 9 and 10 to the first electrode configuration 12A, and then converged into metal tape 8. The converged I.sub.1+I.sub.2 will transmit only in the part of metal tape 8 located in the growth zone 11A, then the I.sub.2 flows back to the cathode of current source 9 through the extra electrode configuration 12B, while I.sub.1 will transmit in the part of the metal tape 8 in the growth zone 11B and then flows back to the cathode of current source 10 through the second electrode configuration 12C. The part of the metal tape 8 in the growth zone 11 is heated under the effect of the current, and the required surface temperature can be achieved by adjusting the current or voltage of the current source 9 and 10. The surface temperature of the metal tape 8 in deposition zone 11A will be higher than that of the metal tape 8 in deposition zone 11B because the current transmitted in the metal tape 8 in the growth zone 11A is I.sub.1+I.sub.2, larger than that I.sub.1 in the metal tape 8 in the deposition zone 11B, meaning that the sectional heating of the metal tape 8 is achieved. The temperature gradient between the deposition zone 11A and 11B can be adjusted by the current I.sub.2 of current source 9. At the same time, the rotation shaft 15 will drive the roll 13 to rotate, thereby brings the movement of the metal tape 8 among the three electrode configurations 12 to realize the continuous and reel-to-reel deposition of multilayer thin films on both faces of the metal tape 8.

Embodiment 4

[0054] As what is shown in FIG. 4, at working state the substrate-heating setup is installed in the system, and the first and second electrode configurations, 12A and 12C are connected to the anode (or cathode) and cathode (or anode) of the current source 10, respectively. The metal tape 8, positioning setups 16 are installed by referring to the embodiment 1. The difference is that there is precursor-coating zone 21 between the second electrode configuration 12C and the roll 13B, and precursor-processing zone 22 between the first electrode configuration 12A and the second electrode configuration 12C. In the precursor-coating zone 21, the precursor to form thin film is coated on the metal tape 8C by the technique of metal organic deposition, solution planarization deposition, and so on. The precursor-processing zone 22 may be vacuumed or in the atmosphere. Similarly, one or more kinds of gas like O.sub.2, Ar, H.sub.2, H.sub.2O, N.sub.2 and so on, can also be introduced into the zone 22. When the precursor-coated metal tape 8B has gone into the preheated precursor-processing zone 22, the precursor forms the thin film after different kinds of chemical and/or physical changes. With referring to embodiment 3, one or more extra electrode configurations 12 can also be inserted to form multiple precursor-processing zones, thereby to achieve the sectional processing of the precursor-coated metal tape 8 with different temperatures or enclosures. Moreover, the rotation shaft 15 will drive the roll 13 to rotate, thereby brings the movement of the metal tape 8 among the precursor-coating zone 21, the electrode configurations 12 and the precursor-processing zone 22 to realize the continuous and reel-to-reel deposition of thin films on the metal tape 8.

Embodiment 5

[0055] The system shown in FIG. 1 can be employed to deposit the 2.sup.nd generation high-temperature superconducting YBa.sub.2Cu.sub.3O.sub.7-x (YBCO) coated conductors. A 1 cm-width oxide-buffered hastelloy metal tape (LaMnO.sub.3/homo-epi MgO/IBAD-MgO/SDP-Y.sub.2O.sub.3/Hastelloy) with its length longer than that of the growth zone was prepared, and the oxides on its edges were also sanded off. Then, this treated metal tape was welded end-to-end to a stainless steel tape. With referring to embodiment 1, the prepared metal tape was settled properly and the circuit was connected. Next, the growth chamber was vacuumed below 1 Pa, and the metal-organic solids of Y(TMHD).sub.3, Ba(TMHD).sub.2 and Cu(TMHD).sub.2 (TMHD: 2,2,6,6-tetramethyl-3,5-heptanedionate) with its weight of 120 mg, 230 mg and 210 mg, respectively, were dissolved together into 3 mL tetrahydrofuran solvent by ultrasonic vibration to form homogeneous and clear precursor solution. Then, the current source 9 was turned on to supply 26 A electricity (corresponding to voltage of 11.4 V) to heat the metal tape, and the temperature was monitored by a thermocouple. Then, the metal tape was dragged to the growth zone by the electric motor. After the temperature had been stable, the precursor solution was pumped by a peristaltic pump into an evaporator with temperature of 300 C. and transformed to gas. The gas was \then delivered by the carrier gas of 70 Pa argon to be mixed with 70 Pa oxygen and 20 Pa N.sub.2O. Then, the mixed gas passed through a 320 C. pipe and was sprayed by a showerhead to the metal tape surface in the growth zone to form YBCO film. The thickness of the deposited YBCO film was around 1.5 m.

[0056] Then, the deposited YBCO film was placed into a tube furnace filled with 1 atm. O.sub.2 and annealed at 500 C. for 30 minutes. The annealed YBCO film was characterized, and the corresponding texture and microstructure results were shown in FIG. 10-12. It was shown that the prepared YBCO films crystallized well and were of excellent texture, smooth and dense surface, and were crack free. The critical current density (J.sub.c) at 77 K and self-field of the YBCO films at the beginning, middle and end of the sample is 1.2 MA/cm.sup.2, 1.07 MA/cm.sup.2 and 1.07 MA/cm.sup.2, respectively, corresponding to the critical current of 180 A/cm, 160 A/cm and 160 A/cm. The above results indicated that the method and the system in the invention herein could achieve the fabrication of homogeneous and high-performance YBCO films on metal tapes.