Precise Alignment and Decal Bonding of a Pattern of Solder Preforms to a Surface

Abstract

A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination, placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a laser micromachining system, adjusting the working distance, laser-cutting an outline, peeling off the solder ribbon, allowing the desired solder shape to remain, creating indexing holes, providing a target surface on an alignment fixture with indexing pins, aligning the indexing holes, placing the semiconductor release tape with the desired solder shape on the target surface, pressing the desired solder shape onto the target surface, removing the release tape, and making a pattern of the desired solder shape with precise alignment and decal bonding on the target surface.

Claims

1. A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising: cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination; placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on an X-Y stage pair in a laser micromachining system; adjusting the working distance of the galvo from the solder ribbon of the solder ribbon and semiconductor release tape combination by focusing the optical image on camera; laser-cutting an outline or perimeter of a desired solder shape pattern of elements on the solder ribbon and semiconductor release tape combination; creating indexing holes through the release tape while maintaining the spatial alignment of the solder ribbon and semiconductor release tape combination; peeling off the solder ribbon from the semiconductor release tape; allowing the desired solder shape pattern of elements to remain on the semiconductor release tape; providing a target or receiving surface on an alignment fixture with indexing pins; aligning the indexing holes on the release tape with the indexing pins of the alignment fixture; placing the semiconductor release tape with the desired solder shape pattern of elements on a target surface; pressing the desired solder shape pattern of elements onto the target surface; removing the release tape; and making a pattern of the desired solder shape pattern of elements with precise alignment and decal bonding on the target surface.

2. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 wherein the step of laser-cutting an outline or perimeter of a desired solder shape is to a depth that maintains the integrity of the release tape.

3. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 wherein the step of laser-cutting an outline or perimeter of a desired solder shape is to a depth to the surface of the release tape.

4. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 3 wherein the creating indexing holes through the release tape is by laser cutting.

5. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 wherein the target surface has target surface indexing holes and further comprising the step of aligning the indexing holes with the target surface indexing holes.

6. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 further comprising the step of aligning the indexing holes with indexing pins on a reel.

7. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 further comprising the step of utilizing the method in a reel-to-reel system.

8. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 wherein the step of removing the release tape is by mechanical, thermal, or photonic means.

9. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 further comprising the steps of: placing a receiving sample with the bonding surface face up over the indexing pins on an alignment jig; aligning the indexing holes on the release tape with the indexing pins of the alignment jig; emplacing the release tape with the solder preforms facing the receiving sample; pressing the solder preforms onto the surface; and removing the release tape by mechanical, thermal, or photonic means.

10. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 further comprising the step of making solder bonds of an electronic circuit on a flexible substrate.

11. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 wherein the solder preforms are placed on a surface with less than 50 microns spatial accuracy.

12. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 further comprising the step of bonding electrical elements or structures originating from separate layers.

13. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 further comprising the step of bonding superconducting elements or structures originating from separate layers.

14. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 6 wherein an alignment jig aligns and assembles separate components on a 2-D planar or 3-D curved surface with precision.

15. The product of the process of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising the steps of: cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination; placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a laser micromachining system; adjusting the working distance of the galvo from the solder ribbon of the solder ribbon and semiconductor release tape combination by focusing the optical image on camera; laser-cutting an outline or perimeter of a desired solder shape pattern on the solder ribbon and semiconductor release tape combination; creating indexing holes through the release tape while maintaining the spatial alignment of the solder ribbon and semiconductor release tape combination; peeling off the solder ribbon from the semiconductor release tape; allowing the desired solder shape elements to remain on the semiconductor release tape; providing a target surface on an alignment fixture with indexing pins; aligning the indexing holes on the release tape with the indexing pins of the alignment fixture; placing the semiconductor release tape with the desired solder shape elements on the target surface; pressing the desired solder shape elements onto the target surface; removing the release tape; and making a pattern of the desired solder shape elements with precise alignment and decal bonding on the target surface.

16. The product of the process of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 15 further comprising the steps of: placing a receiving sample with the bonding surface face up over the indexing pins on an alignment jig; aligning the indexing holes on the release tape with the indexing pins of the alignment jig; emplacing the release tape with the solder preforms facing the receiving sample; pressing the solder preforms onto the surface; and removing the release tape by mechanical, thermal, or photonic means.

Description

DESCRIPTION OF THE DRAWINGS

[0027] The following description and drawings set forth certain illustrative implementations of the disclosure in detail, which are indicative of several exemplary ways in which the various principles of the disclosure may be carried out. The illustrated examples, however, are not exhaustive of the many possible embodiments of the disclosure. Other objects, advantages and novel features of the disclosure will be set forth in the following detailed description when considered in conjunction with the drawings.

[0028] FIG. 1 illustrates a photograph of blue low-tack dicing/release tape with solder preforms.

[0029] FIG. 2 illustrates step-by-step diagram of the general DIBS process.

DETAILED DESCRIPTION OF THE INVENTION

[0030] This disclosure teaches precise alignment and decal bonding of a pattern of solder preforms to a surface.

[0031] This invention fabricates arbitrarily-shaped solder elements in an arbitrary pattern onto a release tape layer and then places all of them with microscopic precision onto a surface at the same time.

Example 1

Decal Imprinting and Bonding of Solder (DIBS)

[0032] This invention, which can be termed Decal Imprinting and Bonding of Solder (DIBS) consists of three stepsthe fabrication of the solder preforms (shape and spacing) on the release (layer or) tape, the alignment and placement of the release tape over a target surface, and release of the individual solder preforms from the release tape onto the target surface and their subsequent bonding to the target surface.

[0033] The solder preforms can be detached from the release tape and bonded to the target surface by mechanical, thermal or photonic means.

Example 2

[0034] To fabricate the solder release tape, a strip of semiconductor dicing tape, such as low-tack blue is used as the support structure for the solder preforms. Components attached to low tack blue' dicing tape can be removed mechanically. Other types of dicing tape can use heat (Nitto Revalpha) or UV light (DU-300) to lower its adhesion properties in order to release its attached components.

[0035] A strip of dicing or release tape about the same size and shape as the target surface is secured to a stable surface, for example a vacuum chuck.

[0036] Next, a ribbon of solder of fixed thickness (e.g. Indium Bismuth eutectic) is pressed onto the release tape.

[0037] A UV (=355 nm) laser is then focused onto the solder and perforates the perimeter or outline of the desired solder preforms without damaging the underlying release tape.

[0038] To ensure precise alignment of the release tape (and the solder preforms) to the target surface, the same laser is used to drill indexing holes into the release tape outside the solder bonding area. The laser drilling of the index holes and the laser perforation of the solder preforms can be done in the same setup without physically disturbing the release tape.

[0039] Afterwards, the solder ribbon can be carefully peeled off the release tape, leaving behind the pattern of the desired solder preforms. Note that the size, shape and location of indexing holes of the release tape can be adapted for use in a reel-to-reel system (e.g. regularly-spaced holes along both edges of the tape to match index pins on a reel).

Example 3

[0040] This solder preform tape can now be guided over the corresponding indexing pins of an alignment jig, which holds the receiving surface, and the solder side placed over and pressed onto receiving surface.

[0041] Solder preforms such as In.sub.2Bi, can be mechanically released from the dicing tape and pressure and thermally treated to bond to a compatible surface in a single step.

[0042] The release tape can then be removed leaving behind a precisely spaced pattern of solder preforms on the target surface. Note that additional layers or tapes with the same pattern of indexing holes can now be precisely aligned and placed over this first layer of solder preforms. FIG. 1 shows a finished blue low tack release tape with a set of solder preforms ready for use.

[0043] This invention enables multiple solder preforms of arbitrary size and shape to be fabricated at precise locations on a release tape. This prescribed pattern of solder preforms matches the location of the corresponding bond pads and makes the solder process highly parallel in nature.

[0044] Current solder technology allows only preforms that are all the same size and shape on a tape reel. They are then placed onto pad locations by a pick-and-place machine in a serial manner.

[0045] The current invention overcomes these limitations by increasing flexibility in design and increasing the processing speed.

[0046] In addition, the thin dimensions of the release tape and the indexing feature of this invention are easily adaptable to a reel-to-reel or sheet-to-sheet environment.

[0047] The adhesion of the release tape can be thermally or UV light de-activated as stated earlier. Therefore heat or a UV light source (lamp or laser) could be used carefully to release the solder preforms from the release tape onto a receiving surface. Other solder material besides Indium Bismuth can be used and may require additional heat treatment to bond to the receiving surface before the release tape can be removed.

Example 4

[0048] The materials used in this invention consist of a solder ribbon, for example In.sub.2Bi that is 2 mil thick, but can be any other consistent composition or thickness that will work with the DIBS process.

[0049] A semiconductor (release) tape with low tackiness or adhesion and leaves no or minimal residue is required for holding the solder ribbon or elements.

[0050] A receiving sample or surface of interest with pre-machined indexing or registration holes is required to receive the solder elements.

[0051] An alignment jig or fixture with indexing pins is required to align and receive the sample and release tape.

[0052] A laser micromachining system is also required to fabricate the solder preform tape and to fabricate the indexing holes. The system includes: [0053] a) A laserpreferably pulsed UV (355 nm wavelength, 30-70 ns pulsewidth, >10 kHz repetition rate), but can be other laser type that can cut solder ribbon without melting or deforming it. [0054] b) Beam control, optical, and motion control components consisting of a) fast-scanning galvanometric (galvo) mirrors, laser pulse amplitude and timing control, high-precision and accuracy X-Y translation stage pair, vacuum chuck, parfocal optical inspection camera, and stage, and mirror scanning software.

Example 5

[0055] A. Fabrication of the release tape: [0056] 1) Cut and place desired length of solder ribbon onto the semiconductor release tape. [0057] 2) Place on vacuum chuck on X-Y stage pair in laser micromachining system. [0058] 3) Adjust working distance of galvo from solder by focusing optical image on camera. [0059] 4) After optimizing laser energy and scan parameters on other surrogate tapes, laser-cut the outline (perimeter) of the desired solder shapes and pattern to a depth that does not damage the release tape. [0060] 5) Carefully peel the solder ribbon off the release tape while leaving behind the desired solder (preform) elements. [0061] 6) Laser cut indexing holes through the release tape that matches those on the receiving surface.

[0062] B) Application of solder preforms to sample: [0063] 1) Place receiving sample with the bonding surface face up over the indexing pins on an alignment jig. [0064] 2) Align the indexing holes on the release tape with the indexing pins of the alignment jig and emplace the release tape with the solder preforms facing the receiving sample. [0065] 3) Press the solder preforms onto the surface and remove the release tape by mechanical, thermal, or photonic means.

[0066] Solder preforms are now bonded to the sample surface and ready for further processing if needed.

[0067] Solder preforms deliver a precise amount and shape of solder for attaching electronic circuitry. Current methods to emplace the preforms are distinguished by low- or high-volume applications. Low-volume applications employ manual placement of solder preforms using a tweezer or suction tool. High-volume methods place the preforms (all of the same size) onto tape-and-reel packages or trays, which can be removed and placed elsewhere by an automated pick-and-place system. Manual placement is slow and pick-and-place systems cannot handle very small and fragile components. Although high-speed multiple-head pick-and-place machines exist, the increasing complexity and density of circuitry require ever decreasing solder preform size with wider variety, demands that go beyond the capabilities of current pick-and-place machines. Ultimately, both methods place the solder preforms in their final locations in a serial manner which limits their processing speeds.

[0068] This invention teaches a method to place a consistent volume and shape of solder in multiple precise locations simultaneously on a surface.

[0069] This invention provides a method for placing a pattern of solder preforms (or elements) of well-defined shape and size simultaneously at multiple locations on a surface and bonding them to a surface with high spatial resolution and accuracy.

[0070] It is an efficient and scalable method of solder bonding 2-D and 3-D features of an electronic circuit, especially on flexible samples.

[0071] The pattern of solder preforms is fabricated with a high-speed scanning laser beam on a release (layer or) tape and has indexed alignment holes at user-defined locations. This indexed tape design allows for placing solder preforms onto and simple integration into a reel-to-reel or sheet-to-sheet system.

[0072] This method is especially applicable to solder bonding the sets of filaments originating from separate high-temperature superconducting (HTS) tape or ribbon structures. This method can also be generalized to allow solder bonding of microscopic features at precise locations between any two adjacent surfaces in intimate contact.

[0073] This invention enables multiple solder preforms of arbitrary size and shape to be fabricated at precise locations on a release tape. This prescribed pattern of solder preforms matches the location of the corresponding bond pads and makes the solder process highly parallel in nature. Current solder technology allows only preforms that are all the same size and shape on a tape reel. They are then placed onto pad locations by a pick-and-place machine in a serial manner.

[0074] The current invention overcomes these limitations by increasing flexibility in design and increasing the processing speed.

[0075] In addition, the thin dimensions of the release tape and the indexing feature of this invention easily lends itself to a reel-to-reel environment and future commercial potential.

[0076] The adhesion of the release tape can be thermally or UV light de-activated. Therefore heat or a UV source, for example a lamp or a laser, can be used carefully to release the solder preforms onto a receiving surface. Other solder material besides InBi can be used and may require additional heat treatment to bond to the receiving surface before the release tape can be removed.

[0077] The above examples are merely illustrative of several possible embodiments of various aspects of the present disclosure, wherein equivalent alterations and/or modifications will occur to others skilled in the art upon reading and understanding this specification and the annexed drawings. In addition, although a particular feature of the disclosure may have been illustrated and/or described with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. Also, to the extent that the terms including, includes, having, has, with, or variants thereof are used in the detailed description and/or in the claims, such terms are intended to be inclusive in a manner similar to the term comprising.