Control module for an electric appliance

Abstract

The invention relates to a control module (13) for an electric appliance (10), comprising a printed circuit board (19) whereon electrical and electronic components (26) are mounted along with at least one power transistor (18) fixed to a first region (20) of the printed circuit board (19) and comprising a drain (D) connected to a first electrically conductive track (22) of said first region (20) and a source (S) connected to a second electroconductive track (23) of a second region (21) of the printed circuit board (19). At least one opening (27) forms a material discontinuity between the first and second regions (20, 21) of the printed circuit board (19), said opening (27) being arranged between the first and second conductive tracks (22, 23).

Claims

1. A control module for an electric appliance, comprising: a printed circuit board, on which are mounted electrical and electronic components and at least one power transistor, wherein the power transistor is fixed onto a first area of the printed circuit board and comprises: a first terminal called drain, linked to a first electrically conductive track of said first area; a second terminal called source, linked to a second electrically conductive track of a second area of the printed circuit board; and a third terminal called gate, and wherein the printed circuit board comprises at least one opening forming a discontinuity of material, at least partial, between the first and second areas of the printed circuit board, said opening being situated between the first and second conductive tracks.

2. The control module as claimed in claim 1, wherein the power transistor comprises a sole plate forming the drain, in electrical contact with the first track, and a pin forming the source, linked electrically to the second track.

3. The control module as claimed in claim 1, wherein the opening is a slit encircling, at least partially, the first area of the printed circuit board.

4. The control module as claimed in claim 3, wherein the slit is generally U- or L-shaped and comprises a base from which extends at least one branch.

5. A heating device for a motor vehicle, comprising a control module as claimed in claim 1.

6. The heating device as claimed in claim 5, further comprising at least one heating module comprising a first terminal linked electrically to a first terminal of a battery, a second terminal linked electrically to the drain of the power transistor, via a first electrical link member, a second terminal of the battery being linked electrically to the source of the power transistor, via a second electrical link member, the first terminal of the module being linked electrically to the first terminal of the battery via a third electrical link member, the three link members being linked mechanically to one another via an electrically insulating fitting.

Description

(1) The invention will be better understood and other details, features and advantages of the invention will become apparent on reading the following description given by way of non-limiting example with reference to the attached drawings in which:

(2) FIG. 1 is a schematic view illustrating the mounting of a MOSFET between the negative terminal of a heating element and the ground of a battery, in the case of normal operation of the MOSFET, in accordance with the prior art,

(3) FIG. 2 is a view corresponding to FIG. 1, illustrating a degraded state of the MOSFET, namely an impeding short-circuit state between the drain and the source,

(4) FIG. 3 is a view corresponding to FIG. 1, illustrating a completely open degraded state of the MOSFET and a degraded state of the printed circuit board,

(5) FIG. 4 is a plan view of a part of the printed circuit board, illustrating the case of FIG. 3,

(6) FIG. 5 is a front view of a heating device according to the invention,

(7) FIG. 6 is a plan view of a control module according to the invention, belonging to the heating device of FIG. 4,

(8) FIG. 7 is a bottom view of a printed circuit board belonging to the control module according to the invention,

(9) FIG. 8 is a plan view of the printed circuit board illustrating the different electrically conductive tracks,

(10) FIG. 9 is a schematic view of the power electrical wiring of the heating device.

(11) FIG. 1 illustrates a normal mode of operation of a power transistor 1 such as a field-effect transistor with metal-oxide gate, also called MOSFET, mounted on a printed circuit board. Such a transistor 1 conventionally comprises a first terminal D called drain, a second terminal S called source and a third terminal G called gate and making it possible to control the opening and the closing of the MOSFET.

(12) The drain D is for example linked electrically to the negative terminal of a heating module 2, notably via a first electrically conductive track 3 (FIG. 4), the positive terminal of the heating module 2 being linked to a potential formed for example by the positive terminal of a battery. The source S is for example linked to the negative terminal or ground of the battery, notably via a second electrically conductive track 4.

(13) Thus, in normal operation, when the MOSFET 1 is open, no current flows in the heating module 2. Conversely, when the MOSFET 1 is closed, a current passes into the heating module 2.

(14) When the MOSFET 1 is closed, that is to say when it is in the on state, it has a resistance Rdson with a value of, for example, the order of 4 m. Since the current passing into the MOSFET 1 is relatively great, a quantity of heat of, for example, between 2 W and 3 W is dissipated by the MOSFET 1 in normal operation.

(15) There is also a very low risk of the MOSFET 1 being damaged in operation. In most cases, this damage translates into an impeding short-circuit state between the drain D and the source S. Such a degraded state is illustrated in FIG. 2.

(16) In other words, the MOSFET 1 behaves as if an impedance 5 (internal to the MOSFET 1) were mounted in parallel between the drain D and the source S. This impedance 5 has, for example, a value of the order of 40 m. The heat then dissipated by the MOSFET 1 is, for example, of the order of 30 W.

(17) This heat can, ultimately, lead to a progressive degradation of the material of the printed circuit board (FIG. 4), this degradation transforming this usually insulating material into a relatively conductive material.

(18) If such a degradation extends between the drain D and the source S, more particularly between the conductive tracks 3, 4 to which the drain D and the source S are electrically linked, the degraded material 6 of the printed circuit board acts as a resistance (FIG. 5). In parallel, the MOSFET 1 ends up opening completely such that the negative terminal of the heating element 2 is linked to the negative terminal or ground of the battery via the resistor 7 formed by the degraded material 6 of the printed circuit board. In this case, this resistor 7 is, for example, of the order of 10. The heat dissipated by this resistor 7 is then of the order of 10 to 15 w.

(19) Given the significant quantity of heat to be dissipated in this case, there is a risk of this heat causing a fire to start or smoke to be generated on the printed circuit board and/or surrounding elements.

(20) FIG. 5 represents an add-on electric heating device 10 according to the invention, intended to equip a motor vehicle. Such a heating device 10 is notably used in the first minutes of use of the motor vehicle, when the engine is not hot enough to ensure the supply of hot air into the vehicle interior.

(21) This device 10 comprises a parallelepipedal support frame 11 on which are mounted parallel heating modules 12 arranged so as to be passed through by the flow of air to be heated. The heating modules 12 are controlled using a control module 13 (FIG. 6), or driver, mounted in a case 14 fixed to the support frame 11.

(22) Each heating module 12 comprises two electrodes or terminals referenced + and in FIG. 9, between which are placed resistive elements 15 (FIG. 9) of positive temperature coefficient (PTC) type. Two opposing heat sinks 16 are fixed onto the electrodes, so as to increase the surface area of exchange with the flow of air to be heated. The heat sinks 16 are, for example, formed from pleated or corrugated metal strips.

(23) Each heating module 12 thus comprises a positive terminal linked electrically to the positive terminal of a battery 17, and a negative terminal linked electrically to the negative terminal of the battery 17 via a power transistor 18, such as a field-effect transistor with metal-oxide gate (MOSFET).

(24) The control module 13 comprises a printed circuit board 19 comprising first areas 20 on which the MOSFETs 18 are mounted and a second area 21 on which various electrical and electronic components are notably soldered or mounted (FIGS. 7 and 8).

(25) Each first area 20 is of generally rectangular form and comprises, on its top face, a first track 22 (FIG. 8) extending over most of the first area 20 and linked to the drain D of the corresponding MOSFET 18. More particularly, each MOSFET 18 comprises a sole plate forming the drain D, in electrical contact with the first track 22 and soldered onto the latter.

(26) The second area 21 of the electronic board 19 comprises a top face on which are formed, respectively, three second electrically conductive tracks 23 and three third electrically conductive tracks 24, situated globally facing the corresponding first tracks 22, and a fourth electrically conductive track 25 linked to the negative terminal or ground of the battery 17. The fourth track 25 extends over most of the second area and forms a ground plane, as is better described hereinbelow. Each second track 23 is linked to the ground plane 25 via a resistor or shunt 26 (FIG. 6) making it possible to perform an electrical current measurement. The value of this shunt is very low, of the order of a few milliohms.

(27) The printed circuit board 19 comprises three slits 27 situated respectively between each first area 20 and the second area 21 of the printed circuit board 19, each slit 27 forming a discontinuity of material, at least partial, between the first and second areas 20, 21 of the printed circuit board 19, said slit 27 being situated or inserted notably between the first and second conductive tracks 22, 23.

(28) This slit 27 is generally U-shaped (or L-shaped depending on the applications and on the position of the slit) and comprises a base from which two branches extend.

(29) As can be better seen in FIG. 7, the drain D of each MOSFET 18 is linked to the negative terminal of the corresponding heating module 12 via the corresponding first track 22 and a first conductor bar 28 comprising terminations soldered onto the first track 22.

(30) The source S is formed by a first pin 29 of the MOSFET 18 and is linked to the negative terminal or ground of the battery 17, via the second and fourth tracks 23, 25 of the printed circuit board 19, via the corresponding shunt 26 and via a second conductor bar 30 comprising terminations soldered onto the fourth track 25. Hereinafter in the description, the presence of the shunt 26 will be disregarded, for the purpose of simplifying the explanation.

(31) Finally, the gate G of the MOSFET 18 is formed by a pin 31 serving as input for a control signal making it possible to control the opening and the closing of the MOSFET 18, said pin 31 being soldered onto the corresponding third track 24 of the printed circuit board 19.

(32) The electrical link between the positive terminals of the battery 17 and of the heating modules 2 is provided by a third conductor bar 32.

(33) The different conductor bars 28, 30, 32 are linked mechanically to one another and electrically insulated from one another by a fitting 32 overmolded with synthetic material and acting as support in such a way that said conductor bars 28, 30, 32 and the fitting 33 form a unitary assembly. The fitting 33 is fixed onto the printed circuit board 19.

(34) As indicated previously, when a MOSFET 18 is open, no current flows through the corresponding resistive elements 15. Conversely, when the MOSFET 18 is closed, a current flows in the resistive elements 18 and thus causes the temperature of the corresponding heating module 12 to rise.

(35) Each MOSFET 18 can be opened and closed cyclically, the temperature reached by each heating module 12 then being a function of the opening and closure times of the MOSFET 18.

(36) The presence of the slits 27 makes it possible to avoid the case represented in FIG. 3, in which a degradation of the material 6 of the printed circuit board 19 can lead to a strong rise in temperature.

(37) This slit 27 prevents the degraded material 6 from acting like a resistor 7 placed between the potential of the drain D (first track 22) and that of the source S (second track 23 or fourth track 25). It will be recalled that, given the negligible influence of the shunt 26, the potential of the second and fourth tracks 23, 25 is substantially identical.