SURFACE TREATMENT METHOD OF MAGNESIUM FOR THE ASSEMBLY OF POLYMER AND MAGNESIUM
20220403526 · 2022-12-22
Inventors
Cpc classification
Y02E60/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
C23C22/57
CHEMISTRY; METALLURGY
International classification
Abstract
A method to treat the magnesium surface to manufacture the metallic assembly with the polymer and magnesium to have excellent bonding strength is disclosed.
As a method to treat the magnesium surface for the bonded coupling of the mixture of the polymer and magnesium, this is a method including, (a) an etching step, wherein the magnesium surface is treated with an acidic solution; (b) a first surface treatment step, wherein the magnesium surface is treated with ultrasonic waves; (c) a second surface treatment step, wherein the magnesium surface is treated with an acidic solution; (d) a first silane coupling processing step, wherein the magnesium surface is treated with ultrasonic waves; (e) a surface activation treatment step, wherein the magnesium surface is treated with acidic solution; and (f) a second silane coupling processing step, wherein the magnesium surface is treated with ultrasonic waves.
Claims
1. A method to treat the magnesium surface for the bonded coupling of the mixture of the polymer and magnesium, comprising, (a) an etching step wherein the magnesium surface is treated by an acidic solution; (b) a first surface treatment step, wherein the magnesium surface is treated by ultrasonic waves; (c) a second surface treatment step, wherein the magnesium surface is treated by an acidic solution; (d) a first silane coupling processing step, wherein the magnesium surface is treated by ultrasonic waves; (e) a surface activation treatment step, wherein the magnesium surface is treated by acidic solution; (f) a second silane coupling processing step, wherein the magnesium surface is treated by ultrasonic waves; and the step (a), is performed in an acidic solution mixing sulfuric acid, phosphoric acid and trace amounts of nitric acid, at 30˜60° C. for 10˜180 seconds; the step (b), proceeds by ultrasonic treatment with the alkali cleaning agent, at 30˜60° C. at 24˜100 kHz and 400 W for 10˜180 seconds; the step (c), proceeds a secondary etching with an acidic solution mixing sulfuric acid, phosphoric acid and trace amounts of nitric acid, at 30˜60° C. for 10˜180 seconds; the step (d), proceeds with a mixed solution of 0.1˜20 wt. % C.sub.2K.sub.2O.sub.4, 0.1˜10 wt. % Na.sub.2O.sub.3Si, 0.01˜1 wt. % C.sub.3H.sub.8O.sub.3 and 0.001˜0.01 wt. % C.sub.2OH.sub.24O.sub.10S.sub.2 adding 0.1˜1 wt. % Silane Coupling agent, at 30˜70° C., with 24˜100 kHz and 400 W for 10˜300 seconds; the step (e), proceeds with a mixed acidic solution of sulfuric acid and hydrochloric acid at a 30˜70° C. for 10˜300 seconds; and the step (f), proceeds with a mixed solution of 0.1˜20 wt. % C.sub.2K.sub.2O.sub.4, 0.1˜10 wt. % Na.sub.2O.sub.3Si, 0.01˜1 wt. % C.sub.3H.sub.8O.sub.3 and 0.001˜0.01 wt. % C.sub.2OH.sub.24O.sub.10S.sub.2 adding 0.1˜1 wt. % Silane Coupling agent, at 30˜70° C., with 24˜100 kHz and 400 W for 10˜300 seconds.
2. The method of claim 1, in the (d) and (f) step, the Silane coupling agent as the additive is used one of (RO).sub.3Si—(CH.sub.2).sub.3—NH.sub.2, (RO).sub.3Si—(CH.sub.2).sub.2—Si(OC.sub.2H.sub.5).sub.3, (RO).sub.3Si—(CH.sub.2).sub.3—SH, (RO).sub.3Si—CH═CH.sub.2, (RO).sub.3Si—(CH.sub.3).sub.3—OOC(CH.sub.3)C═CH.sub.2, (RO).sub.3Si—(CH.sub.3).sub.3—O—CHCH.sub.2O and (RO).sub.3Si—(CH.sub.2).sub.15CH.sub.3.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
[0031] Referring the below schematics, this explains how to manufacture the bonding of the polymer and magnesium with this invention.
[0032] This invention is a method to treat the surface of magnesium in order to maximize the bonded coupling of the polymer mixture with
(a) an etching step wherein the magnesium surface is treated with an acidic solution,
(b) a first surface treatment step wherein the magnesium surface is treated with ultrasonic waves.
(c) a second surface treatment step wherein the magnesium surface is treated with an acidic solution;
(d) a first silane coupling processing step wherein the magnesium surface is treated with ultrasonic waves
(e) a surface activation treatment step wherein the magnesium surface is treated with acidic solution
(f) a second silane coupling processing step wherein the magnesium surface is treated with ultrasonic waves.
[0033] The etching step (a), proceeds with an acidic solution mixing sulfuric acid, phosphoric acid and trace amounts of nitric acid, at 30˜60° C. for 10˜180 seconds.
[0034] The etching creates irregular etching patterns on the surface of the magnesium and roughens the surface of the magnesium.
[0035] The step (b), proceeds by ultrasonic treatment with the alkali cleaning agent, at 30˜60° C. at 24˜100 kHz and 400 W for 10˜180 seconds,
[0036] The ultrasonic treatment produces microcracks on the etched magnesium surface.
[0037] The step (c), proceeds a secondary etching with an acidic solution mixing sulfuric acid, phosphoric acid and trace amounts of nitric acid, at 30˜60° C. for 10˜180 seconds.
[0038] Secondary etching forms irregular etch marks on the magnesium surface, further roughening the surface.
[0039] In the (c) step, the electrolyte to be used may be one of C.sub.2K.sub.2O.sub.4, NaHCO.sub.3, NaOH, Na.sub.2CO.sub.3, Na.sub.2SO.sub.4, K.sub.2SO.sub.3, Na.sub.2SO.sub.3, NaNO.sub.2, KNO.sub.2, NaNO.sub.3, NaClO.sub.4, CH.sub.3COONa, Na.sub.2B.sub.2O.sub.7, NaH.sub.2PO.sub.2, (NaPO.sub.3).sub.6, Na.sub.2MoO.sub.4, Na.sub.3SiO.sub.3, and Na.sub.2HPO.sub.3.
[0040] The step (d), proceeds with a mixed solution of 0.1˜20 wt. % C.sub.2K.sub.2O.sub.4, 0.1˜10 wt. % Na.sub.2O.sub.3Si, 0.01˜1 wt. % C.sub.3H.sub.8O.sub.3 and 0.001˜0.01 wt. % C.sub.2OH.sub.24O.sub.10S.sub.2 adding 0.1˜1 wt. % Silane Coupling agent, at 30˜70° C., with 24˜100 kHz and 400 W for 10˜300 seconds.
[0041] Microcracks are additionally formed on the etched magnesium surface, and a silane coupling agent is penetrated into the formed microcrack region.
[0042] In the (d) step, the electrolyte to be used may be one of C.sub.2K.sub.2O.sub.4, NaHCO.sub.3, NaOH, Na.sub.2CO.sub.3, Na.sub.2SO.sub.4, K.sub.2SO.sub.3, Na.sub.2SO.sub.3, NaNO.sub.2, KNO.sub.2, NaNO.sub.3, NaClO.sub.4, CH.sub.3COONa, Na.sub.2B.sub.2O.sub.7, NaH.sub.2PO.sub.2, (NaPO.sub.3).sub.6, Na.sub.2MoO.sub.4, Na.sub.3SiO.sub.3, and Na.sub.2HPO.sub.3.
[0043] In the (d) step, the Silane coupling additive as the additive may be one of (RO).sub.3Si—(CH.sub.2).sub.3—NH.sub.2, (RO).sub.3Si—(CH.sub.2).sub.2—Si(OC.sub.2H.sub.5).sub.3, (RO).sub.3Si—(CH.sub.2).sub.3—SH, (RO).sub.3Si—CH═CH.sub.2, (RO).sub.3Si—(CH.sub.3).sub.3—OOC(CH.sub.3)C═CH.sub.2, (RO).sub.3Si—(CH.sub.3).sub.3—O—CHCH.sub.2O and (RO).sub.3Si—(CH.sub.2).sub.15CH.sub.3.
[0044] The step (e), proceeds with a mixed acidic solution of sulfuric acid and hydrochloric acid at a 30˜70° C. for 10˜300 seconds.
[0045] The surface is etched to make it rougher, and at the same time, about 60% of the magnesium surface containing a silane coupling agent penetrating into the microcrack is removed with etching.
[0046] The step (f), proceeds with a mixed solution of 0.1˜20 wt. % C.sub.2K.sub.2O.sub.4, 0.1˜10 wt. % Na.sub.2O.sub.3Si, 0.01˜1 wt. % C.sub.3H.sub.8O.sub.3 and 0.001˜0.01 wt. % C.sub.2OH.sub.24O.sub.10S.sub.2 adding 0.1˜1 wt. % Silane Coupling agent, at 30˜70° C., with 24˜100 kHz and 400 W for 10˜300 seconds.
[0047] Microcracks are additionally formed on the etched magnesium surface, and a silane coupling agent is penetrated into the formed microcrack region.
[0048] In the (f) step, the Silane coupling additive as the additive may be one of (RO).sub.3Si—(CH.sub.2).sub.3—NH.sub.2, (RO).sub.3Si—(CH.sub.2).sub.2—Si(OC.sub.2H.sub.5).sub.3, (RO).sub.3Si—(CH.sub.2).sub.3—SH, (RO).sub.3Si—CH═CH.sub.2, (RO).sub.3Si—(CH.sub.3).sub.3—OOC(CH.sub.3)C═CH.sub.2, (RO).sub.3Si—(CH.sub.3).sub.3—O—CHCH.sub.2O and (RO).sub.3Si—(CH.sub.2).sub.15CH.sub.3.
[0049] After the step (c), upon the magnesium with the second anodizing treatment, the ultrasonic treatment shall proceed with a solvent of H.sub.2SO.sub.4 of 0.001˜0.01 wt. % after adding an additive, C.sub.2H.sub.4(OH).sub.2 of 0.001˜0.01 wt. %, for 1 to 3 minutes at 400 W, 24˜100 kHz, at the temperature of 30 to 60° C.
[0050] By the first and second silane coupling treatment using ultrasonic waves, surface roughness is increased on the surface of magnesium, a large amount of fine micro-cracks are formed, such that the silane coupling agent penetrates into the formed micro-cracks, and is coupled to the polymer through a chemical reaction. There is an effect of maximizing the bonding force between the polymer and magnesium by such surface roughness and microcracks and silane coupling agents.
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[0053] After this, specific examples and figures will be explained.
Embodiment 1
[0054] The step (a), proceeds with an acidic solution mixing sulfuric acid, phosphoric acid and trace amounts of nitric acid, at 30˜60° C. for 10˜180 seconds.
[0055] The step (b), proceeds by ultrasonic treatment with the alkali cleaning agent, at 30˜60° C. at 24˜100 kHz and 400 W for 10˜180 seconds.
[0056] The step (c), proceeds a secondary etching with an acidic solution mixing sulfuric acid, phosphoric acid and trace amounts of nitric acid, at 30˜60° C. for 10˜180 seconds.
[0057] The specimens were made by conventional methods.
Embodiment 2
[0058] After step (a), the step (b) and the step (c),
[0059] The step (d), proceeds with a mixed solution of 0.1˜20 wt. % C.sub.2K.sub.2O.sub.4, 0.1˜10 wt. % Na.sub.2O.sub.3Si, 0.01˜1 wt. % C.sub.3H.sub.8O.sub.3 and 0.001˜0.01 wt. % C.sub.2OH.sub.24O.sub.10S.sub.2 adding 0.1˜1 wt. % Silane Coupling agent, at 30˜70° C., with 24˜100 kHz and 400 W for 10˜300 seconds.
[0060] The specimens were made by above methods.
Embodiment 3
[0061] After step (a), the step (b), the step (c) and (d)
[0062] The step (e), proceeds with a mixed acidic solution of sulfuric acid and hydrochloric acid at a 30˜70° C. for 10˜300 seconds.
[0063] The specimens were made by above methods.
Embodiment 4
[0064] After step (a), the step (b), the step (c), the step (d) and the step (e)
[0065] The step (f), proceeds with a mixed solution of 0.1˜20 wt. % C.sub.2K.sub.2O.sub.4, 0.1˜10 wt. % Na.sub.2O.sub.3Si, 0.01˜1 wt. % C.sub.3H.sub.8O.sub.3 and 0.001˜0.01 wt. % C.sub.2OH.sub.24O.sub.10S.sub.2 adding 0.11 wt. % Silane Coupling agent, at 30˜70° C., with 24˜100 kHz and 400 W for 10˜300 seconds.
[0066] The specimens were made by above methods.
[0067] With the specimens from embodiments 1 to 4, tests were conducted to measure the bonding strength and sealing quality by the resistance test, T-Bend test, tensile strength test, and rest time test. The followings are the results thereof.
[Test 1]
[0068] By using the specimens from embodiment 1 to 4, to measure the bonding strength, after 1,000 hours of the temperature and humidity test, the T-bend test was conducted and the results thereof are marked in Table 1.
TABLE-US-00001 TABLE 1 embodiment embodiment embodiment embodiment test piece 1 2 3 4 T-bend test No Good No Good No Good Good
[0069] As shown in Table 1, it may be seen that only the samples of embodiment 4 is additionally performed, have best bonding strength between polymer and magnesium rather than the samples of embodiment 1, 2, and 3.
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[Test 2]
[0073] By using the specimens from embodiments 1 to 4, to measure the bonding strength, after 1,000 hours of the temperature and humidity test, the tensile strength test was conducted and the results show in
[0074]
[0075]
[0076] Just as a graph in
[0077] Also, rather than the specimen from embodiment 2, the specimen from embodiment 3 shows excellent tensile strength before and after the temperature and humidity test.
[0078] Finally, rather than the specimen from embodiment 3, the specimen from embodiment 4 shows excellent tensile strength before and after the temperature and humidity test.
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[0084] The graph in
[0085] Likewise, the decrease in tensile force over pass time is greater the specimen of embodiment 2 than in the specimen of embodiment 1.
[0086] Also, the decrease in tensile force over pass time is superior the specimen of embodiment 3 than in the specimen of embodiment 2.
[0087] Finally, the decrease in tensile force over pass time is better the specimen of embodiment 4 than in the specimen of embodiment 3.
[Test 3]
[0088] By using the specimens from embodiments 1 to 4, to measure the sealing condition between the magnesium and polymer, the temperature and humidity test was conducted and the results thereof are shown in
[0089] Just as a graph in
[0090] Also, rather than the specimen from embodiment 2, the specimen from embodiment 3 shows better sealing quality.
[0091] Finally, rather than the specimen from embodiment 3, the specimen from embodiment 4 shows the best sealing quality.
[0092]
FEASIBILITY TO BE USED IN INDUSTRIES
[0093] This invention is a method to manufacture the assembly of the polymer and magnesium by reinforcing the bonding strength of the polymer and magnesium with treatments on the magnesium surface, enhancing the sealing quality of components, making them lighter, and saving money for those components.