Production method for fibre-reinforced composite material, prepreg, particle-containing resin composition, and fibre-reinforced composite material

Abstract

A production method for a fiber-reinforced composite material comprises: a step of stacking a prepreg plurally to obtain a prepreg-stacked body; and a step of heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 m.

Claims

1. A production method for a fiber-reinforced composite material comprising: stacking a prepreg plurally to obtain a prepreg-stacked body; and heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which a space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 m, wherein the polyamide resin particles include (D1) first polyamide resin particles and (D2) second polyamide resin particles having a higher melting temperature measured in a composition constituting the surface layer than the melting temperature of the first polyamide resin particles wherein a melting temperature of the (D1) first polyamide resin particles measured in the composition constituting the surface layer is 120 to 170 C.; and a melting temperature of the (D2) second polyamide resin particles measured in the composition constituting the surface layer is 175 to 220 C.

2. The production method for a fiber-reinforced composite material according to claim 1, wherein, when it is assumed that the melting temperature of the (D1) first polyamide resin particles measured in the composition constituting the surface layer is M.sub.1 C. and the melting temperature of the (D2) second polyamide resin particles measured in the composition constituting the surface layer is M.sub.2 C., a value of (M.sub.2M.sub.1) is 5 or more.

3. The production method for a fiber-reinforced composite material according to claim 1, wherein the surface layer contains 65 to 78 parts by mass of the (A) component, 22 to 35 parts by mass of the (B) component, 5 to 20 parts by mass of the (C) component, and 15 to 45 parts by mass of the (D) component when it is assumed that a total amount of the (A) component and the (B) component is 100 parts by mass.

4. The production method for a fiber-reinforced composite material according to claim 1, wherein the (D1) first polyamide resin particles are polyamide 12 resin particles and the (D2) second polyamide resin particles are polyamide 1010 resin particles.

5. A prepreg comprising: a reinforcing fiber layer including reinforcing fibers and a resin composition with which a space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 m, wherein the polyamide resin particles include (D1) first polyamide resin particles and (D2) second polyamide resin particles having a higher melting temperature measured in a composition constituting the surface layer than the melting temperature of the first polyamide resin particles, wherein a melting temperature of the (D1) first polyamide resin particles measured in the composition constituting the surface layer is 120 to 170 C.; and a melting temperature of the (D2) second polyamide resin particles measured in the composition constituting the surface layer is 175 to 220 C.

6. The prepreg according to claim 5, wherein, when it is assumed that the melting temperature of the (D1) first polyamide resin particles measured in the composition constituting the surface layer is M.sub.1 C. and the melting temperature of the (D2) second polyamide resin particles measured in the composition constituting the surface layer is M.sub.2 C., a value of (M.sub.2M.sub.1) is 5 or more.

7. The prepreg according to claim 5, wherein the surface layer contains 65 to 78 parts by mass of the (A) component, 22 to 35 parts by mass of the (B) component, 5 to 20 parts by mass of the (C) component, and 15 to 45 parts by mass of the (D) component when it is assumed that a total amount of the (A) component and the (B) component is 100 parts by mass.

8. A fiber-reinforced composite material obtained by stacking the prepreg according to claim 5 plurally, forming a plurality of sequential reinforcing layers and surface layers, and performing heating under increased pressure.

9. The fiber-reinforced composite material according to claim 8, wherein the (D1) first polyamide resin particles are polyamide 12 resin particles and the (D2) second polyamide resin particles are polyamide 1010 resin particles.

10. The fiber-reinforced composite material according to claim 8, wherein the volume proportion {C.sub.1/(C.sub.1+C.sub.2)}100 is 70% by volume or more, wherein: (C.sub.1) is the volume of polyamide resin contained between sequential reinforcing layers, and (C2) is volume of polyamide resin contained in the reinforcing layers.

11. The fiber-reinforced composite material according to claim 8, wherein the mode I interlaminar fracture toughness value (G1c) measured in accordance with ASTM D5528 is 300 J/m.sup.2 or more.

12. The prepreg according to claim 5, wherein the (D1) first polyamide resin particles are polyamide 12 resin particles and the (D2) second polyamide resin particles are polyamide 1010 resin particles.

13. A resin composition containing particles, comprising: (A) a benzoxazine resin; (B) an epoxy resin; (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and (D) polyamide resin particles having an average particle size of 5 to 50 m, wherein the polyamide resin particles include polyamide 12 resin particles and polyamide 1010 resin particles.

14. The resin composition containing particles according to claim 13, wherein the resin composition contains 65 to 78 parts by mass of the (A) component, 22 to 35 parts by mass of the (B) component, 5 to 20 parts by mass of the (C) component, and 15 to 45 parts by mass of the (D) component when it is assumed that a total amount of the (A) component and the (B) component is 100 parts by mass.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is schematic cross-sectional views for describing prepregs.

(2) FIG. 2 is schematic cross-sectional views for describing a production method for a prepreg.

(3) FIG. 3 is schematic cross-sectional views for describing a production method for a prepreg.

(4) FIG. 4 is a schematic diagram illustrating an example of a curing profile in a production method for a fiber-reinforced composite material according to an embodiment of the present invention.

(5) FIG. 5 is a schematic cross-sectional view for describing a fiber-reinforced composite material.

(6) FIG. 6 is a DSC chart of a second resin composition of Example 1.

(7) FIG. 7 is a DSC chart of a second resin composition of Example 7.

(8) FIG. 8 is a DSC chart of a second resin composition of Example 13.

(9) FIG. 9 is a DSC chart of a second resin composition of Example 20.

DESCRIPTION OF EMBODIMENTS

(10) Suitable embodiments of the present invention will now be described in detail.

(11) The production method for a fiber-reinforced composite material according to the embodiment comprises: a step of stacking a prepreg plurally to obtain a prepreg-stacked body; and a step of heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 m, wherein the polyamide resin particles include (D1) a first polyamide resin particle and (D2) a second polyamide resin particle having a higher melting temperature measured in a composition constituting the surface layer than the first polyamide resin particle has.

(12) In the present specification, the melting point of the polyamide resin particles is defined as a value determined by increasing the polyamide resin particles in temperature at a rate of 10 C./minute from 25 C. using a differential scanning calorimeter (DSC), and measuring the temperature of the top of the resulting endothermic peak. The melting temperature of the polyamide resin particles measured in the composition constituting the surface layer refers to a temperature of the top of an endothermic peak obtained by increasing the composition constituting the surface layer containing the polyamide resin particles in temperature at a rate of 10 C./minute from 25 C. using a differential scanning calorimeter (DSC).

(13) In the embodiment, the step mentioned above may include a step of measuring the melting temperature of the polyamide resin particles in the composition constituting the surface layer and a step of stacking the prepreg mentioned above plurally and heating the prepregs to cure the resin, or heating to cure the resin may be performed on the basis of the melting temperature of the polyamide resin particles in the composition constituting the surface layer which has been measured in advance.

(14) FIG. 1 is schematic cross-sectional views for describing a prepreg used in the embodiment. A prepreg 10 shown in (a) of FIG. 1 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers 1 is impregnated; and a surface layer 6a provided on a surface of the reinforcing fiber layer 3 and containing first polyamide resin particles 4a, second polyamide resin particles 4b, and a resin composition 5. In the surface layer 6a of the prepreg 10, the first polyamide resin particles 4a and the second polyamide resin particles 4b are included in the layer of the resin composition 5. A prepreg 12 shown in (b) of FIG. 1 has the same configuration as the prepreg 10 except that it comprises, in place of the surface layer 6a in the prepreg 10, a surface layer 6b in which first polyamide resin particles 4a and second polyamide resin particles 4b are attached to the surface on the opposite side to the reinforcing fiber layer 3 of the layer of the resin composition 5.

(15) In the prepregs 10 and 12 according to the embodiment, the resin composition 2 contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; the surface layers 6a and 6b each contain (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 m; and the polyamide resin particles include (D1) a first polyamide resin particle and (D2) a second polyamide resin particle having a higher melting temperature measured in a composition constituting the surface layer, that is, the resin composition 5 than the first polyamide resin particle has.

(16) As (A) the benzoxazine resin used in the embodiment (hereinafter, occasionally referred to as an (A) component), a compound having a benzoxazine ring represented by the following formula (A-1) is given.

(17) ##STR00001##
In formula (A-1), R.sup.5 represents a linear alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, an aryl group having 6 to 14 carbon atoms, or an aryl group substituted with a linear alkyl group having 1 to 12 carbon atoms or a halogen. A hydrogen atom may be bonded to the bond.

(18) Examples of the linear alkyl group having 1 to 12 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, an isobutyl group, and a t-butyl group. Examples of the cyclic alkyl group having 3 to 8 carbon atoms include a cyclopentyl group and a cyclohexyl group. Examples of the aryl group having 6 to 14 carbon atoms include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a phenanthryl group, and a biphenyl group. Examples of the aryl group substituted with a linear alkyl group having 1 to 12 carbon atoms or a halogen include an o-tolyl group, a m-tolyl group, a p-tolyl group, a xylyl group, an o-ethylphenyl group, a m-ethylphenyl group, a p-ethylphenyl group, an o-t-butylphenyl group, a m-t-butylphenyl group, a p-t-butylphenyl group, an o-chlorophenyl group, and an o-bromophenyl group.

(19) As R.sup.5, of the examples mentioned above, a methyl group, an ethyl group, a propyl group, a phenyl group, and an o-methylphenyl group are preferable because of providing good handleability.

(20) Furthermore, as (A) the benzoxazine resin, a compound having benzoxazine rings represented by the following formula (A-2) is given.

(21) ##STR00002##
In formula (A-2), L represents an alkylene group or an arylene group.

(22) Preferred examples of the benzoxazine resin of the (A) component include the monomers represented by the following formulae, oligomers in which several molecules of the monomers are polymerized, and reaction products of at least one of the monomers represented by the following formulae and a compound having a benzoxazine ring having a structure different from these monomers.

(23) ##STR00003## ##STR00004## ##STR00005##

(24) The (A) component forms a skeleton similar to phenol resins by the benzoxazine ring polymerizing by ring-opening, and is therefore excellent in fire retardancy. Furthermore, excellent mechanical characteristics such as a low percentage of water absorption and a high elastic modulus are obtained because of its dense structure.

(25) The (A) component may be used singly or in combinations of two or more.

(26) (B) the epoxy resin (hereinafter, occasionally referred to as a (B) component) used in the embodiment controls the viscosity of the composition, and is blended as a component that enhances the curability of the composition. Preferred examples of the (B) component include epoxy resins produced using a compound such as amines, phenols, carboxylic acids, and compounds having a carbon-carbon double bond as a precursor.

(27) Examples of the epoxy resins produced using amines as a precursor include tetraglycidyldiaminodiphenylmethane, glycidyl compounds of xylenediamine, triglycidylaminophenol, and glycidylaniline, and regioisomers of each thereof and alkyl group- or halogen-substituted products thereof. Hereinafter, when commercially available products are given as examples, for liquid products, the complex viscoelastic modulus * at 25 C. obtained with a dynamic viscoelasticity measurement apparatus described later is written as the viscosity.

(28) Examples of the commercially available products of tetraglycidyldiaminodiphenylmethane include SUMI-EPDXY (registered trademark, the same applies hereinafter) ELM 434 (manufactured by Sumitomo Chemical Company, Limited), Araldite (registered trademark, the same applies hereinafter) MY 720, Araldite MY 721, Araldite MY 9512, Araldite MY 9612, Araldite MY 9634, and Araldite MY 9663 (all manufactured by Huntsman Advanced Materials), and jER (registered trademark, the same applies hereinafter) 604 (manufactured by Mitsubishi Chemical Corporation).

(29) Examples of the commercially available products of triglycidylaminophenol include jER 630 (viscosity: 750 mPa.Math.s) (manufactured by Mitsubishi Chemical Corporation), Araldite MY 0500 (viscosity: 3500 mPa.Math.s) and MY 0510 (viscosity: 600 mPa.Math.s) (both manufactured by Huntsman Advanced Materials), and ELM 100 (viscosity: 16000 mPa.Math.s) (manufactured by Sumitomo Chemical Company, Limited).

(30) Examples of the commercially available products of glycidylanilines include GAN (viscosity: 120 mPa.Math.s) and GOT (viscosity: 60 mPa.Math.s) (both manufactured by Nippon Kayaku Co., Ltd.).

(31) Examples of the glycidyl ether-type epoxy resins produced using phenols as a precursor include bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, epoxy resins having a biphenyl skeleton, phenol novolac-type epoxy resins, cresol novolac-type epoxy resins, resorcinol-type epoxy resins, epoxy resins having a naphthalene skeleton, trisphenylmethane-type epoxy resins, phenolaralkyl-type epoxy resins, dicyclopentadiene-type epoxy resins, and diphenylfluorene-type epoxy resins, and various isomers of each thereof and alkyl group- or halogen-substituted products thereof. Also epoxy resins obtained by modifying epoxy resins produced using phenols as a precursor with a urethane or an isocyanate are included in this type.

(32) Examples of the commercially available products of liquid bisphenol A-type epoxy resins include jER 825 (viscosity: 5000 mPa.Math.s), jER 826 (viscosity: 8000 mPa.Math.s), jER 827 (viscosity: 10000 mPa.Math.s), and jER 828 (viscosity: 13000 mPa.Math.s) (all manufactured by Mitsubishi Chemical Corporation), EPICLON (registered trademark, the same applies hereinafter) 850 (viscosity: 13000 mPa.Math.s) (manufactured by DIC Corporation), Epotohto (registered trademark, the same applies hereinafter) YD-128 (viscosity: 13000 mPa.Math.s) (manufactured by Nippon Steel Chemical Co., Ltd.), and DER-331 (viscosity: 13000 mPa.Math.s) and DER-332 (viscosity: 5000 mPa.Math.s) (manufactured by The Dow Chemical Company). Examples of the commercially available products of solid or semisolid bisphenol A-type epoxy resins include jER 834, jER 1001, jER 1002, jER 1003, jER 1004, jER 1004AF, jER 1007, and jER 1009 (all manufactured by Mitsubishi Chemical Corporation).

(33) Examples of the commercially available products of liquid bisphenol F-type epoxy resins include jER 806 (viscosity: 2000 mPa.Math.s), jER 807 (viscosity: 3500 mPa.Math.s), and jER 1750 (viscosity: 1300 mPa.Math.s) (all manufactured by Mitsubishi Chemical Corporation), EPICLON 830 (viscosity: 3500 mPa.Math.s) (manufactured by DIC Corporation), and Epotohto YD-170 (viscosity: 3500 mPa.Math.s) and Epotohto YD-175 (viscosity: 3500 mPa.Math.s) (both manufactured by Nippon Steel Chemical Co., Ltd.). Examples of the commercially available products of solid bisphenol F-type epoxy resins include 4004P, jER 4007P, and jER 4009P (all manufactured by Mitsubishi Chemical Corporation) and Epotohto YDF 2001 and Epotohto YDF 2004 (both manufactured by Nippon Steel Chemical Co., Ltd.).

(34) Examples of the commercially available products of bisphenol S-type epoxy resins include EXA-1515 (manufactured by DIC Corporation).

(35) Examples of the commercially available products of epoxy resins having a biphenyl skeleton include jER YX4000H, jER YX4000, and jER YL6616 (all manufactured by Mitsubishi Chemical Corporation) and NC-3000 (manufactured by Nippon Kayaku Co., Ltd.).

(36) Examples of the commercially available products of phenol novolac-type epoxy resins include jER 152 and jER 154 (both manufactured by Mitsubishi Chemical. Corporation) and EPICLON N-740, EPICLON N-770, and EPICLON N-775 (all manufactured by DIC Corporation).

(37) Examples of the commercially available products of cresol novolac-type epoxy resins include EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, and EPICLON N-695 (all manufactured by DIC Corporation) and EOCN-1020, EOCN-102S, and EOCN-104S (all manufactured by Nippon Kayaku Co., Ltd.).

(38) Examples of the commercially available products of resorcinol-type epoxy resins include Denacol (registered trademark, the same applies hereinafter) EX-201 (viscosity: 250 mPa.Math.s) (manufactured by Nagase ChemteX Corporation).

(39) Examples of the commercially available products of epoxy resins having a naphthalene skeleton include EPICLON HP 4032 (manufactured by DIC Corporation) and NC-7000 and NC-7300 (both manufactured by Nippon Kayaku Co., Ltd.).

(40) Examples of the commercially available products of trisphenylmethane-type epoxy resins include TMH-574 (manufactured by Sumitomo Chemical Company, Limited).

(41) Examples of the commercially available products of dicyclopentadiene-type epoxy resins include EPICLON HP 7200, EPICLON HP 7200L, and EPICLON HP 7200H (all manufactured by DIC Corporation), Tactix (registered trademark) 558 (manufactured by Huntsman Advanced Materials), and XD-1000-1L and XD-1000-2L (both manufactured by Nippon Kayaku Co., Ltd.).

(42) Examples of the commercially available products of urethane and isocyanate-modified epoxy resins include AER 4152 having an oxazolidone ring (manufactured by Asahi Kasei E-materials Corporation).

(43) Examples of the epoxy resins produced using a carboxylic acid as a precursor include glycidyl compounds of phthalic acid, glycidyl compounds of hexahydrophthalic acid and glycidyl compounds of dimer acids, and various isomers of each of them.

(44) Examples of the commercially available products of phthalic acid diglycidyl esters include EPOMIK (registered trademark, the same applies hereinafter) R508 (viscosity: 4000 mPa.Math.s) (manufactured by Mitsui Chemicals, Inc.) and Denacol EX-721 (viscosity: 980 mPa.Math.s) (manufactured by Nagase ChemteX Corporation).

(45) Examples of the commercially available products of hexahydrophthalic acid diglycidyl esters include EPOMIK R540 (viscosity: 350 mPa.Math.s) (manufactured by Mitsui Chemicals, Inc.) and AK-601 (viscosity: 300 mPa.Math.s) (manufactured by Nippon Kayaku Co., Ltd.).

(46) Examples of the commercially available products of dimer acid diglycidyl esters include jER 871 (viscosity: 650 mPa.Math.s) (manufactured by Mitsubishi Chemical Corporation) and Epotohto YD-171 (viscosity: 650 mPa.Math.s) (manufactured by Nippon Steel Chemical Co., Ltd.).

(47) Examples of the epoxy resins produced using compounds having a carbon-carbon double bond as a precursor include alicyclic epoxy resins. Examples of the alicyclic epoxy resins include (3,4-epoxycyclohexane)methyl-3,4-epoxycyclohexanecarboxylate, (3,4-epoxycyclohexane)octyl-3,4-epoxycyclohexanecarboxylate, and 1-methyl-4-(2-methyloxiranyl)-7-oxabicyclo[4.1.0]heptane.

(48) Examples of the commercially available products of (3,4-epoxycyclohexane)methyl-3,4-epoxycyclohexanecarboxylate include CELLOXIDE (registered trademark, the same applies hereinafter) 2021P (viscosity: 250 mPa.Math.s) (manufactured by Daicel Chemical Industries, Ltd.) and CY 179 (viscosity: 400 mPa.Math.s) (manufactured by Huntsman Advanced Materials); examples of the commercially available products of (3,4-epoxycyclohexane)octyl-3,4-epoxycyclohexanecarboxylate include CELLOXIDE 2081 (viscosity: 100 mPa.Math.s) (manufactured by Daicel Chemical Industries, Ltd.); and examples of the commercially available products of 1-methyl-4-(2-methyloxiranyl)-7-oxabicyclo[4.1.0]heptane include CELLOXIDE 3000 (viscosity: 20 mPa.Math.s) (manufactured by Daicel Chemical Industries, Ltd.).

(49) In the embodiment, an epoxy resin that is in a liquid form at 25 C. may be blended from the viewpoints of tackiness and draping properties. It is preferable that the viscosity at 25 C. of the epoxy resin that is in a liquid form at 25 C. be as low as possible from the viewpoints of tackiness and draping properties. Specifically, 5 mPa.Math.s or more, which is the lower limit obtained with commercially available products of epoxy resins, and 20000 mPa.Math.s or less are preferable, and 5 mPa.Math.s or more and 15000 mPa.Math.s or less are more preferable. If the viscosity at 25 C. is more than 20000 mPa.Math.s, tackiness or draping properties may be reduced.

(50) On the other hand, an epoxy resin that is in a solid form at 25 C. may be blended from the viewpoint of heat resistance. As the epoxy resin that is in a solid form at 25 C., epoxy resins having a high aromatic content are preferable; and examples include epoxy resins having a biphenyl skeleton, epoxy resins having a naphthalene skeleton, and phenolaralkyl-type epoxy resins.

(51) The (B) component may be used singly or in combinations of two or more.

(52) As (C) the curing agent having 2 or more phenolic hydroxy groups in a molecule (hereinafter, occasionally referred to as a (C) component) used in the embodiment, polyfunctional phenols such as bisphenols are given; and examples include bisphenol A, bisphenol F, bisphenol S, thiodiphenol, and bisphenols represented by the following formula (C-1).

(53) ##STR00006##
In formula (C-1), R.sup.1, R.sup.2, R.sup.3, and R.sup.4 represent a hydrogen atom or a hydrocarbon group; when R.sup.1, R.sup.2, R.sup.3, or R.sup.4 is a hydrocarbon group, they are a linear or branched alkyl group having 1 to 4 carbon atoms, or adjacent R.sup.1 and R.sup.2 or adjacent R.sup.3 and R.sup.4 bind to form a substituted or unsubstituted aromatic ring having 6 to 10 carbon atoms or a substituted or unsubstituted alicyclic structure having 6 to 10 carbon atoms; and x represents 0 or 1.

(54) Examples of the curing agent represented by the above formula (C-1) include the compounds represented by the following formulae.

(55) ##STR00007##

(56) In the embodiment, from the viewpoint of sufficiently increasing the glass transition temperature of the resin cured substance, bisphenol A, bisphenol F, thiobisphenol (hereinafter, occasionally referred to as TDP), 9,9-bis(4-hydroxyphenyl)fluorene (hereinafter, occasionally referred to as BPF), and 1,1-bis(4-hydroxyphenyl)cyclohexane (hereinafter, occasionally referred to as BPC) are preferable.

(57) The (C) component may be used singly or in combinations of two or more.

(58) In the embodiment, a curing agent other than the (C) component mentioned above may be used in combination. Examples of the curing agent that can be used in combination include tertiary aromatic amines typified by N,N-dimethylaniline, tertiary aliphatic amines such as triethylamine, imidazole derivatives, and pyridine derivatives. These may be used singly or in combinations of two or more.

(59) Examples of (D) the polyamide resin particles having an average particle size of 5 to 50 m (hereinafter, occasionally referred to as a (D) component) used in the embodiment include polymers or copolymers having an amide bond obtained by using an aliphatic amino acid, aliphatic lactam, or aliphatic diamine and an aliphatic carboxylic acid as starting raw materials.

(60) Examples of the amino acid include 6-aminocaproic acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid.

(61) Examples of the lactams include caprolactam, laurolactam, octalactam, and undecanelactam.

(62) Examples of the diamine include tetramethylenediamine, hexamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, 2,4-dimethyloctamethylenediamine, m-xylylenediamine, p-xylylenediamine, 1,3-bis(aminomethyl)cyclohexane, 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane, 3,8-bis(aminomethyl)tricyclodecane, bis(4-aminocyclohexyl)methane, bis(3-methyl-4-aminocyclohexyl)methane, 2,2-bis(4-aminocyclohexyl)propane, and bis(aminopropyl)piperazine.

(63) Examples of the dicarboxylic acid include adipic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedioic acid.

(64) As the polyamide resin particle used in the embodiment, polymers of caprolactam, polymers of laurolactam, copolymers of caprolactam and laurolactam, polyhexamethylene sebacamide (nylon 6/12), polydecamethylene sebacamide (nylon 10/10), polydecamethylene dodecamide (nylon 10/12), polyundecamethylene adipamide (nylon 11/6), polyundecanamide (nylon 11), polydodecanamide (nylon 12), polybis(4-aminocyclohexyl)methanedodecamide (nylon PACM 12), polybis(3-methyl-4-aminocyclohexyl)methanedodecamide (nylon dimethyl PACM 12), and copolymers thereof may be used, for example.

(65) As the average particle size of the polyamide resin particles, 5 to 50 m are preferable and 10 to 30 m are more preferable from the viewpoint of controlling the thickness of the surface layer. Here, the average particle size refers to the average value of the measured lengths of the major axes of 100 particles selected arbitrarily from particles that are magnified 200 to 500 times with a scanning electron microscope (SEM).

(66) The (D) component used in the embodiment include (D1) a first polyamide resin particle (hereinafter, occasionally referred to as a (D1) component) and (D2) a second polyamide resin particle (hereinafter, occasionally referred to as a (D2) component) having a higher melting temperature measured in a composition constituting the surface layer than the first polyamide resin particle has. As the (D1) component and the (D2) component used in the embodiment, the same substances as those included in examples of the polyamide resin particle of the (D) component may be used, for example.

(67) As the average particle size of the (D1) component and the (D2) component used in the embodiment, 5 to 50 m are preferable and 10 to 30 m are more preferable for both components from the viewpoint of controlling the thickness of the surface layer.

(68) For the melting temperature M.sub.1 of the (D1) component used in the embodiment measured in the resin composition 5, it is preferable to be 120 to 170 C., it is more preferable to be 130 to 170 C., and it is still more preferable to be 135 to 170 C. from the viewpoint of melting the (D1) component moderately during the preparation of a fiber-reinforced composite.

(69) For the melting temperature M.sub.2 of the (D2) component used in the embodiment measured in the resin composition 5, it is preferable to be 175 to 220 C., it is more preferable to be 175 to 210 C., and it is still more preferable to be 175 to 200 C. from the viewpoint of moderately suppressing the (D2) component melting and entering the reinforcing fiber layer during the preparation of a fiber-reinforced composite material.

(70) For the melting temperature M.sub.2 of the (D2) component used in the embodiment in the resin composition 5, it is desirable to be higher than the melting temperature M.sub.1 of the (D1) component in the resin composition 5 from the viewpoint of melting the (D1) component moderately and moderately suppressing the (D2) component melting and entering the reinforcing fiber layer during the preparation of a fiber-reinforced composite. For the difference between the melting temperatures M.sub.2 and M.sub.1 mentioned above, it is preferable to be 5 C. or more, it is more preferable to be 10 to 100 C., and it is still more preferable to be 15 to 70 C. from the viewpoint of melting the (D1) component moderately and moderately suppressing the (D2) component melting and entering the reinforcing fiber layer during the preparation of a fiber-reinforced composite.

(71) As the (D1) component and the (D2) component used in the embodiment, polyamide 12 resin particles, polyamide resin particles made of a copolymer in which caprolactam and laurolactam are copolymerized, and polyamide 1010 resin particles may be used, for example.

(72) In the present specification, the polyamide 12 resin refers to a polyamide resin in which laurolactam is polymerized by ring-opening.

(73) As the polyamide 12 resin particles used in the embodiment, commercially available products, may be used; examples include VESTOSINT 1111, VESTOSINT 2070, VESTOSINT 2157, VESTOSINT 2158, and VESTOSINT 2159 (registered trade mark, all manufactured by Daicel-Evonik Ltd.); and Orgasol 2002 D, Orgasol 2002 EXD, and Orgasol 2002 ES3 (registered trade mark, all manufactured by ARKEMA K.K.). It is preferable that the polyamide 12 resin particles be spherical particles, from the viewpoint of preventing the flow characteristics of the resin composition in which the particles are blended from being lowered, but may be non-spherical particles.

(74) The copolymer mentioned above in which caprolactam and laurolactam are copolymerized is what is called polyamide 6/12 or the like. The copolymer mentioned above may be a random copolymer, or may be a block copolymer. As the polyamide 6/12 resin particle, commercially available products may be used; and examples include Orgasol 4000 EXD (registered trademark, manufactured by ARKEMA K.K.).

(75) In the present specification, the polyamide 1010 resin refers to a polyamide resin in which sebacic acid and decamethylenediamine are polycondensed.

(76) As the polyamide 1010 resin particles used in the embodiment, commercially available products may be used; examples include VESTAMID Terra DS (registered trade mark, manufactured by Daicel-Evonik Ltd.).

(77) It is preferable that the (D1) component used in the embodiment be polyamide 12 resin particles or polyamide resin particles made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 9:1 to 7:3, from the viewpoint of melting the (D1) component moderately during the preparation of a fiber-reinforced composite material.

(78) For the copolymerization ratio (molar ratio) of caprolactam and laurolactam in the copolymer mentioned above in the case of being used as the (D1) component, it is preferable to be in the range of 1:9 to 3:7, it is more preferable to be in the range of 1:9 to 25:75, and it is still more preferable to be in the range of 1:9 to 2:8. By setting the copolymerization ratio in the range mentioned above, the melting point of the polyamide resin particles and the melting temperature of the polyamide resin particles in the resin composition containing particles can be adjusted to a moderate range, and the interlaminar fracture toughness, the CAI, and the flexural modulus can be improved.

(79) For the melting point of the polyamide 6/12 resin particles in the case of being used as the (D1) component, it is preferable to be 120 to 185 C., it is more preferable to be 130 to 185 C., and it is still more preferable to be 140 to 185 C. from the viewpoint of melting the polyamide 6/12 resin particles moderately during the preparation of a fiber-reinforced composite. Here, the melting point refers to the melting point of the polyamide resin particles themselves.

(80) It is preferable that the (D2) component used in the embodiment be polyamide resin particles made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 9:1 to 7:3 or polyamide 1010 resin particles, from the viewpoint of moderately suppressing the (D2) component melting and entering the reinforcing fiber layer during the preparation of a fiber-reinforced composite material.

(81) For the copolymerization ratio (molar ratio) of caprolactam and laurolactam in the copolymer mentioned above in the case of being used as the (D2) component, it is preferable to be in the range of 9:1 to 7:3, it is more preferable to be in the range of 9:1 to 75:25, and it is still more preferable to be in the range of 9:1 to 8:2. By setting the copolymerization ratio in the range mentioned above, the melting point of the polyamide resin particles and the melting temperature of the polyamide resin particles in the resin composition containing particles can be adjusted to a moderate range, and the interlaminar fracture toughness, the CAI, and the flexural modulus can be improved.

(82) For the melting point of the polyamide 6/12 resin particles in the case of being used as the (D2) component, it is preferable to be 186 to 230 C., it is more preferable to be 188 to 220 C., and it is still more preferable to be 190 to 210 C. from the viewpoint of moderately suppressing the polyamide 6/12 resin particles melting and entering the reinforcing fiber layer during the preparation of a fiber-reinforced composite material. Here, the melting point refers to the melting point of the polyamide resin particles themselves.

(83) It is preferable that a combination of the (D1) component and the (D2) component used in the embodiment be a combination of polyamide 12 resin particles as the (D1) component and polyamide 1010 resin particles as the (D2) component, a combination of polyamide 12 resin particles as the (D1) component and polyamide resin particles made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 9:1 to 7:3 as the (D2) component, a combination of polyamide resin particles made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 1:9 to 3:7 as the (D1) component and polyamide resin particles made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 9:1 to 7:3 as the (D2) component, and a combination of polyamide resin particles made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 1:9 to 3:7 as the (D1) component and polyamide 1010 resin particles as the (D2) component from the viewpoint of melting the (D1) component moderately and moderately suppressing the (D2) component melting and entering the reinforcing fiber layer during the preparation of a fiber-reinforced composite material.

(84) In the embodiment, for the amounts of the (A) component and the (B) component contained in the resin composition 2, when it is assumed that the total amount of the (A) component and the (B) component is 100 parts by mass, it is preferable that the amount of the (A) component be 65 to 78 parts by mass and the amount of the (B) component be 22 to 35 parts by mass. When the proportion of the contained (A) component is less than 65 parts by mass, that is, when the proportion of the contained (B) component is more than 35 parts by mass, the elastic modulus and the water resistance of the resulting fiber-reinforced composite tend to be reduced and the glass transition temperature of the resin cured substance tends to be reduced.

(85) For the amount of the (C) component contained in the resin composition 2, when it is assumed that the total amount of the (A) component and the (B) component is 100 parts by mass, it is preferable to be 5 to 20 parts by mass and it is more preferable to be 7 to 15 parts by mass. If the amount of the contained (C) component is less than 5 parts by mass, it tends to be difficult to sufficiently increase the interlaminar fracture toughness, the CAI and the flexural modulus in the fiber-reinforced composite material; and in the case of more than 20 parts by mass, mechanical properties such as the glass transition temperature of the cured substance tend to be reduced.

(86) In the embodiment, for the amounts of the (A) component and the (B) component contained in the surface layers 6a and 6b, when it is assumed that the total amount of the (A) component and the (B) component is 100 parts by mass, it is preferable that the amount of the (A) component be 65 to 78 parts by mass and the amount of the (B) component be 22 to 35 parts by mass. If the proportion of the contained (A) component is less than 65 parts by mass, that is, if the proportion of the contained (B) component is more than 35 parts by mass, the elastic modulus and the water resistance of the resulting fiber-reinforced composite tend to be reduced and the glass transition temperature of the resin cured substance tends to be reduced.

(87) For the amount of the (C) component contained in the surface layers 6a and 6b, when it is assumed that the total amount of the (A) component and the (B) component is 100 parts by mass, it is preferable to be 5 to 20 parts by mass and it is more preferable to be 7 to 15 parts by mass. If the amount of the contained (C) component is less than 5 parts by mass, it tends to be difficult to sufficiently increase the CAI and the flexural modulus in the fiber-reinforced composite material; and in the case of more than 20 parts by mass, mechanical properties such as the glass transition temperature of the cured substance tend to be reduced.

(88) For the amount of the (D) component contained in the surface layers 6a and 6b, when it is assumed that the total amount of the (A) component and the (B) component is 100 parts by mass, it is preferable to be 15 to 45 parts by mass and it is more preferable to be 25 to 40 parts by mass. If the amount of the contained (D) component is less than 15 parts by mass, it tends to be difficult to sufficiently increase the interlaminar fracture toughness, the CAI and the flexural modulus in the fiber-reinforced composite material; and in the case of more than 45 parts by mass, the flexural modulus tends to be reduced. In the embodiment, it is preferable that the total amount of the (D1) component and the (D2) component contained be in the range mentioned above.

(89) Regarding the blending ratio of the (D1) component and the (D2) component, it is preferable that the amount of the (D2) component be 10 to 1000 parts by mass, it is more preferable that the above amount be 20 to 500 parts by mass, and it is still more preferable that the above amount be 30 to 300 parts by mass, with respect to 100 parts by mass of the (D1) component, from the viewpoint of sufficiently increasing the interlaminar fracture toughness.

(90) The surface layers 6a and 6b in the prepreg of the embodiment refer to between the prepreg surface and the reinforcing fibers of the reinforcing fiber layer, and the amount mentioned above of the (D) component contained in the surface layer can be calculated on the basis of, for example, the amounts of the (A) component, the (B) component, and the (C) component contained detected between the prepreg surface and the reinforcing fibers of the reinforcing fiber layer.

(91) In the prepreg of the embodiment, another component such as (E) a toughness improver may be blended to the surface layer and the reinforcing fiber layer to the extent that their physical properties are not impaired. Examples of (E) the toughness improver include phenoxy resins and polyethersulfone.

(92) As still another component, a nanocarbon, a fire retardant, a mold release agent, etc. may be blended. Examples of the nanocarbon include carbon nanotubes, fullerene, and derivatives of each of them. Examples of the fire retardant include red phosphorus, phosphoric acid esters such as triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, resorcinol bis(phenyl phosphate), and bisphenol A bis(diphenyl phosphate), and boric acid esters. Examples of the mold release agent include silicon oil, stearic acid esters, and carnauba wax.

(93) As the reinforcing fibers in the embodiment, glass fibers, carbon fibers, graphite fibers, aramid fibers, boron fibers, alumina fibers, silicon carbide fibers, and the like may be used. Two or more of these fibers may be mixed for use. It is preferable to use carbon fibers or graphite fibers and it is more preferable to use carbon fibers in order to obtain a molded product that is lighter in weight and higher in durability.

(94) As the carbon fibers used in the embodiment, either of PAN-based carbon fibers and pitch-based carbon fibers may be used.

(95) In the embodiment, any type of carbon fibers or graphite fibers may be used in accordance with the use. For the tensile elastic modulus in a strand tensile test of the carbon fibers or the graphite fibers, it is preferable to be 150 to 650 GPa, it is more preferable to be 200 to 550 GPa, and it is still more preferable to be 230 to 500 GPa because a composite material that is excellent in impact resistance and has high rigidity and mechanical strength can be obtained. The strand tensile test refers to a test performed on the basis of JIS R 7601 (1986) after carbon fibers or graphite fibers in a bundle form are impregnated with an epoxy resin and curing is performed at a temperature of 130 C. for 35 minutes.

(96) The form of the reinforcing fibers in the prepreg and the fiber-reinforced composite material of the embodiment is not particularly limited; for example, long fibers uniformly extended in one direction, rattans, textiles, mats, knits, braids, short fibers chopped to a length of less than 10 mm, and the like may be used. Here, the long fiber(s) refers to a single fiber or a fiber bundle substantially continuous for 10 mm or more. The short fiber(s) refers to a fiber bundle cut to a length of less than 10 mm. For uses in which it is required for the specific strength and the specific elastic modulus to be high, an arrangement in which a reinforcing fiber bundle is uniformly extended in one direction like the prepreg of the embodiment is most suitable; but also an arrangement of a cloth (textile) form, which is easy to handle, can be used.

(97) In the prepreg of the embodiment, for the amount of reinforcing fibers per unit area, it is preferable to be 25 to 3000 g/m.sup.2. If the amount of reinforcing fibers is less than 25 g/m.sup.2, it is necessary to increase the number of stacked sheets in order to obtain a prescribed thickness during molding a fiber-reinforced composite material, and operation may be complicated. On the other hand, if the amount of reinforcing fibers is more than 3000 g/m.sup.2, the draping properties of the prepreg tend to be poor. When the prepreg is a flat surface or a simple curved surface, the amount of reinforcing fibers may be more than 3000 g/m.sup.2. The percentage of contained fibers in the prepreg is preferably 30 to 90 mass %, more preferably 35 to 85 mass %, and still more preferably 40 to 80 mass %. If the content percentage is less than 30 mass %, the amount of the resin is too large; and the advantage of a fiber-reinforced composite material excellent in specific strength and specific elastic modulus may not be obtained, or during the molding of a fiber-reinforced composite material, the amount of heat generated during curing may be too large. If the content percentage is more than 90 mass %, an impregnation defect of the resin occurs and the resulting composite material tends to include a large amount of voids.

(98) Next, production methods for prepregs according to the embodiment are described. FIG. 2 and FIG. 3 are schematic cross-sectional views for describing production methods for prepregs according to the embodiment. The method shown in FIG. 2 is an embodiment of the production method for the prepreg 10 according to the embodiment described above. In this method, a reinforcing fiber bundle 7 in which reinforcing fibers 1 are uniformly extended in one direction is prepared (a), the reinforcing fiber bundle 7 is impregnated with a first resin composition 2 containing the (A) to (C) components mentioned above to form the reinforcing fiber layer 3 (b), and both surfaces of the reinforcing fiber layer 3 are impregnated with a second resin composition containing the (A) to (C) components and the (D) component mentioned above to form the surface layers 6a and thus the prepreg 10 is obtained (c).

(99) In the method shown in FIG. 3, a reinforcing fiber bundle 7 in which reinforcing fibers 1 are uniformly extended in one direction is prepared (a), and both surfaces of the reinforcing fiber bundle 7 are impregnated with a resin composition containing the (A) to (D) components mentioned above once to form the surface layers 6a made of the resin composition 2 containing the (D) component 4a and 4b with which fibers have not been impregnated and the (A) to (C) components and thus a prepreg 11 is obtained (b).

(100) The prepreg 12 of FIG. 1(b) can be produced by, for example, impregnating a reinforcing fiber bundle with a resin composition containing the (A) to (C) components and then sprinkling the (D) component over the surfaces of the reinforcing fiber bundle impregnated with the resin composition.

(101) Each resin composition with which the reinforcing fiber bundle is impregnated can be prepared by kneading the (A) to (C) components mentioned above and, as necessary, other components, or the (A) to (D) components mentioned above and, as necessary, other components.

(102) The method for kneading a resin composition is not particularly limited; for example, a kneader, a planetary mixer, a biaxial extruder, etc. are used. It is preferable that, from the viewpoint of the dispersibility of the particle components of the (D) component etc., the particles be diffused into liquid resin components beforehand with a homomixer, three rolls, a ball mill, a bead mill, ultrasonic waves, and the like. Furthermore, during mixing with a matrix resin, during preliminary diffusion of particles, or in other cases, it is possible to perform heating or cooling, or pressurization or depressurization, as necessary. After kneading, immediate storage in a refrigerator or a freezer is preferable from the viewpoint of storage stability.

(103) As the viscosity of the resin composition, 10 to 20000 Pa.Math.s at 50 C. are preferable from the viewpoint of the production of a precursor film. 10 to 10000 Pa.Math.s are more preferable, and 50 to 6000 Pa.Math.s are most preferable. In the case of less than 10 Pa.Math.s, the tackiness of the resin composition may be increased, and coating may be difficult. In the case of more than 20000 Pa.Math.s, semisolidification occurs and coating is difficult.

(104) Examples of the method for impregnating fibers with a resin composition include the wet method in which a resin composition is dissolved in a solvent such as methyl ethyl ketone or methanol to be reduced in viscosity and impregnation therewith is performed and the hot melt method (dry method) in which the viscosity is reduced by heating and impregnation is performed.

(105) The wet method is a method in which reinforcing fibers are immersed in a solution of a resin composition and then pulled up and the solvent is vaporized using an oven or the like. The hot melt method is a method in which reinforcing fibers are directly impregnated with a resin composition that has been reduced in viscosity by heating or a method in which a resin composition is once applied onto a mold release paper sheet or the like in a coating manner to fabricate a film, subsequently the film is superposed from both sides or one side of reinforcing fibers, and heating and pressurization are performed to impregnate the reinforcing fibers with the resin. The hot melt method is preferable because there is substantially no solvent remaining in the prepreg.

(106) The prepreg according to the embodiment can be made into a fiber-reinforced composite material by a method in which, after stacking, the resin is cured by heating while pressure is applied to the stacked matter or other methods. Here, examples of the method for applying heat and pressure include the press molding method, the autoclave molding method, the bagging molding method, the wrapping tape method, and the internal pressure molding method. The wrapping tape method is a method in which a prepreg is wound around a cored bar such as a mandrel and a tubular body made of a fiber-reinforced composite material is molded, and is a method suitable in fabricating stick-like bodies such as golf shafts and fishing rods. More specifically, it is a method in which a prepreg is wound around a mandrel, a wrapping tape formed of a thermoplastic film is wound on the outside of the prepreg in order to fix and apply pressure to the prepreg, the resin is cured by heating in an oven, and then the cored bar is taken out to obtain a tubular body.

(107) The internal pressure molding method is a method in which a preform in which a prepreg is wound around an internal pressure applier such as a tube made of a thermoplastic resin is set in a mold, and subsequently a high pressure gas is introduced into the internal pressure applier to apply pressure and at the same time the mold is heated to perform molding. This method is preferably used in molding complicated shaped objects such as golf shafts, bats, and rackets for tennis, badminton, etc.

(108) A resin composition containing particles that contains the (A) to (D) components mentioned above and, as necessary, other components can be suitably used for the preparation of the prepreg described above. A resin composition containing particles in which the amount of the contained (D) component is 15 to 45 parts by mass and preferably 25 to 40 parts by mass when it is assumed that the total amount of the (A) component and the (B) component is 100 parts by mass can be suitably used as the material for forming the surface layer of the prepreg. For the resin composition containing particles, it is preferable that the glass transition temperature of its cured substance obtained by increasing the temperature at a temperature increase rate of 2.0 C./minute from room temperature to 185 C. and then performing curing under the conditions of the same temperature and 2 hours be 190 C. or more.

(109) FIG. 4 is a schematic diagram illustrating an example of a curing profile. In the figure, M.sub.1 denotes the melting temperature ( C.) of the (D1) component measured in a composition constituting the surface layer, and M.sub.2 denotes the melting temperature ( C.) of the (D2) component measured in a composition constituting the surface layer. In the curing profile shown in FIG. 4, a process is illustrated in which a stacked body obtained by stacking the prepreg described above plurally is increased in temperature to a predetermined curing point CP ( C.) at a predetermined temperature increase rate (line a in the figure), and the stacked body is retained at the predetermined curing point CP ( C.) for a predetermined time (T.sub.4T.sub.3) to cure the resin (line b in the figure), and thereafter the temperature is decreased.

(110) The curing point CP ( C.) mentioned above is appropriately set depending on the type of the (C) component, the blending ratio between the (A) component and the (B) component, or the like so that the resin composition 2 containing the (A) component to (C) component mentioned above is sufficiently cured.

(111) The curing point CP ( C.) can be set to a temperature between 140 and 200 C., for example, and it is preferable that the above curing point be set to a temperature between 160 and 195 C., from the viewpoint of productivity and controlling the melted state of the polyamide. Here, the curing point refers to the temperature of a prepreg.

(112) In the embodiment, for the CP, it is preferable to be a temperature higher than M.sub.1 C. by 1 to 100 C., it is more preferable to be a temperature higher than M.sub.1 C. by 5 to 70 C., and it is still more preferable to be a temperature higher than M.sub.1 C. by 10 to 50 C. from the viewpoint of melting the (D1) component moderately.

(113) In addition, it is more preferable that the CP be a temperature in the range of 20 to 10 C., and it is still more preferable that the CP be a temperature in the range of 10 to 10 C., with the upper limit being a temperature higher than M.sub.2 C. by 10 C., from the viewpoint of curing the resin sufficiently and moderately suppressing the (D2) component melting and entering the reinforcing fiber layer.

(114) In the embodiment, the (D1) component and the (D2) component may be selected so as to satisfy the conditions mentioned above using the curing point CP ( C.) as a benchmark. Also in this case, it is preferable that the relation described above between the (D1) component and the (D2) component be satisfied. Alternatively, the melting temperatures M.sub.1 and M.sub.2 C. may be used as a benchmark to perform primary curing at a temperature satisfying M.sub.1<CP<M.sub.2 followed by additional secondary curing at a temperature higher than M.sub.2 to allow the curing to progress sufficiently.

(115) For the temperature increase rate to the curing point CP ( C.) mentioned above, it is preferable to be 0.1 to 5.0 C./minute and it is more preferable to be 0.3 to 3.0 C./minute. Although the temperature increase rate to a temperature less than M.sub.1 ( C.) may be different from the temperature increase rate from M.sub.1 ( C.) to CP ( C.), in the embodiment it is preferable that at least the temperature increase rate from M.sub.1 to CP be in the range mentioned above.

(116) In the case where the curing point CP ( C.) mentioned above is higher than M.sub.2 C., the temperature increase rate to a temperature less than M.sub.1 C., the temperature increase rate from M.sub.1 ( C.) to M.sub.2 ( C.), and the temperature increase rate from M.sub.2 ( C.) to CP ( C.) may be different.

(117) In the embodiment, for the temperature increase rate to a temperature less than M.sub.1 ( C.), it is preferable to be 0.1 to 10.0 C./minute, it is more preferable to be 0.1 to 5.0 C./minute, and it is still more preferable to be 0.3 to 3.0 C./minute. For the temperature increase rate from M.sub.1 ( C.) to M.sub.2 ( C.), it is preferable to be 0.1 to 5.0 C./minute and it is more preferable to be 0.3 to 3.0 C./minute. For the temperature increase rate from M.sub.2 ( C.) to CP ( C.), it is preferable to be 0.1 to 5.0 C./minute and it is more preferable to be 0.3 to 3.0 C./minute.

(118) It is preferable that the pressure in the heating be 0.2 to 1.0 MPa, and it is more preferable that the above pressure be 0.3 to 0.8 MPa.

(119) After heating, the temperature can be decreased at a rate of 0.3 to 3.0 C./minute.

(120) Thus, a fiber-reinforced composite material can be obtained.

(121) FIG. 5 is a schematic cross-sectional view for describing a fiber-reinforced composite material according to an embodiment of the present invention. A fiber-reinforced composite material 100 shown in FIG. 5 comprises reinforcing fibers 1, a resin cured substance 8, and polyamide resin particles 4a and 4b. The fiber-reinforced composite material 100 can be obtained by the production method of the embodiment described above, that is, by stacking any one of the prepregs 10, 11, and 12 plurally and performing heating under increased pressure. The polyamide resin particles, which are illustrated in FIG. 5 in the same way as ones in the surface layer of the prepreg, are melted by increasing pressure and heating to deform due to flowing and bonding between the particles.

(122) In the fiber-reinforced composite material, for the volume proportion of C.sub.1 in the total amount of the amount C.sub.1 of the polyamide resin contained in the resin cured substance between reinforcing fiber layers and the amount C.sub.2 of the polyamide resin contained in the reinforcing fiber layers, {C.sub.1/(C.sub.1+C.sub.2)}100, it is preferable to be 70 volume % or more and it is more preferable to be 80 volume % or more.

(123) The amount of the contained polyamide resin is found by analyzing, by microscopic observation, a cross section of the fiber-reinforced composite material taken along a plane orthogonal to the direction in which an arbitrary reinforcing fiber in the fiber-reinforced composite material extends and performing image analysis to observe the distribution of the polyamide resin.

(124) The fiber-reinforced composite material obtained by the method of the embodiment can be obtained also by directly impregnating a reinforcing fiber matrix with a resin composition and performing curing. For example, the production can be performed by a method in which a reinforcing fiber matrix is placed in a mold and then a resin composition containing the (A) to (D) components mentioned above is poured in followed by impregnation and curing, or a method in which a reinforcing fiber matrix and a film formed of a resin composition containing the (A) to (D) components mentioned above are stacked and the stacked body is heated and pressurized. The film mentioned above can be obtained by applying a prescribed amount of a resin composition with a uniform thickness onto a mold release paper sheet or a mold release film beforehand. Examples of the reinforcing fiber matrix include long fibers uniformly extended in one direction, bidirectional textiles, unwoven fabrics, mats, knits, and braids. The stacking herein includes not only the case where fiber matrices are simply superposed but also the case where preforming is performed by attachment to various molds or core materials. As the core materials, foam cores, honeycomb cores, and the like are preferably used. As the foam cores, urethanes and polyimides are preferably used. As the honeycomb cores, aluminum cores, glass cores, aramid cores, and the like are preferably used.

(125) In the fiber-reinforced composite material obtained by the method of the embodiment, for the compressive strength after impact (CAI) measured in accordance with ASTM D7136 and D7137, it is preferable to be 210 MPa or more and it is more preferable to be 220 MPa or more.

(126) In the fiber-reinforced composite material obtained by the method of the embodiment, for the mode I interlaminar fracture toughness value (G1c) measured in accordance with ASTM D5528, it is preferable to be 250 J/m.sup.2 or more and it is more preferable to be 300 J/m.sup.2 or more.

(127) In the fiber-reinforced composite material obtained by the method of the embodiment, for the mode II interlaminar fracture toughness value (G2c) measured in accordance with Composite Materials Handbook 17-1, it is preferable to be 1500 J/m.sup.2 or more and it is more preferable to be 1800 J/m.sup.2 or more.

(128) In the fiber-reinforced composite material obtained by the method of the embodiment, for the glass transition temperature of the resin cured substance, it is preferable to be 180 C. or more and it is more preferable to be 190 C. or more.

(129) The fiber-reinforced composite material obtained by the method of the embodiment having the physical properties mentioned above is suitably used for railroad vehicles, aircraft, building members, and other general industrial uses.

EXAMPLES

(130) The present invention will now be specifically described using Examples, but the present invention is not limited to them. The measurements of various physical properties are based on the following methods. The results are shown in Tables 1 to 4.

Examples 1 to 21 and Comparative Examples 1 to 6

(131) For Examples and Comparative Examples, the source materials were mixed with heating at the ratios shown in Tables 1 to 4, and a first resin composition containing no particles (the first composition in Table) and a second resin composition containing particles (the second composition in Table) were obtained. The source materials used here are as follows.

(132) The (A) component: a benzoxazine resin

(133) F-a: a bisphenol F-aniline type (F-a type benzoxazine, manufactured by SHIKOKU CHEMICALS CORPORATION)

(134) P-a: a phenol-aniline type (P-a type benzoxazine, manufactured by SHIKOKU CHEMICALS CORPORATION)

(135) The (B) component: an epoxy resin

(136) 2021P: CELLOXIDE (registered trademark) 2021P (manufactured by Daicel Chemical Industries, Ltd.)

(137) The (C) component: a curing agent

(138) TDP (bis(4-hydroxyphenyl)sulfide, manufactured by Tokyo Chemical Industry Co., Ltd.)

(139) BPF (9,9-bis(4-hydroxyphenyl)fluorene, manufactured by Osaka Gas Chemicals Co., Ltd.)

(140) The (D) component: polyamide resin particles

(141) The (D1) component

(142) PA 12 (1): polyamide 12 resin particles (VESTOSINT 2158, average particle size: 20 m, manufactured by Daicel-Evonik Ltd.)

(143) PA 12 (2): polyamide 12 resin particles (VESTOSINT 2159, average particle size: 10 m, manufactured by Daicel-Evonik Ltd.)

(144) PA 6/12 (20/80): particles made of a polyamide 6/12 copolymer (a random copolymer) in which caprolactam and laurolactam are copolymerized at a molar ratio of 20:80, (average particle size: 25 m)

(145) The (D2) component

(146) PA 6/12 (80/20): particles made of a polyamide 6/12 copolymer (a random copolymer) in which caprolactam and laurolactam are copolymerized at a molar ratio of 80:20, (average particle size: 20 m)

(147) PA 6/12 (75/25): particles made of a polyamide 6/12 copolymer (a random copolymer) in which caprolactam and laurolactam are copolymerized at a molar ratio of 75:25, (average particle size: 20 m)

(148) PA 6/12 (90/10): particles made of a polyamide 6/12 copolymer (a random copolymer) in which caprolactam and laurolactam are copolymerized at a molar ratio of 90:10, (average particle size: 20 m)

(149) PA 1010 (1): polyamide 12 resin particles (VESTOSINT 9158, average particle size: 20 m, manufactured by Daicel-Evonik Ltd.)

(150) PA 1010 (2): polyamide 12 resin particles (VESTOSINT 9159, average particle size: 10 m, manufactured by Daicel-Evonik Ltd.)

(151) The (E) component: a toughness improver

(152) YP 70: a phenoxy resin (YP-70, manufactured by NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.)

(153) TABLE-US-00001 TABLE 1 Example 1 Example 2 Example 3 Example 4 Example 5 Component Abbreviation First Second First Second First Second First Second First Second (A) Benzoxazine F-a 70 70 55 55 50 50 70 70 70 70 resin P-a 5 5 20 20 25 25 5 5 5 5 (B) Epoxy resin 2021P 25 25 25 25 25 25 25 25 25 25 (C) Curing agent TDP BPF 10 10 10 10 10 10 10 10 10 10 (D) Polyamide PA12 (1) 8 resin particles PA12 (2) 14.5 14.5 14.5 8 PA1010 14.5 14.5 14.5 21 21 (E) Toughness YP70 5 5 5 5 5 5 5 5 5 5 improver Melting temperature of 167 167 167 167 167 polyamide resin particles ( C.) 183 183 183 183 183 (in second resin composition) Curing point ( C.) 185 185 185 185 185 Glass transition temperature 194 190 192 194 194 ( C.) Flexural modulus (MPa) 4020 4020 3950 4060 4060 CAI (MPa) 316 319 314 283 270 G1c (J/m.sup.2) 482 366 478 338 318 G2c (J/m.sup.2) 2284 2179 2282 1989 1910 Abundance ratio (volume %) of 85 80 78 83 88 polyamide resin between carbon fiber layers Comparative Comparative Example 6 Example 1 Example 2 Component Abbreviation First Second First Second First Second (A) Benzoxazine F-a 70 70 70 70 70 70 resin P-a 5 5 5 5 5 5 (B) Epoxy resin 2021P 25 25 25 25 25 25 (C) Curing agent TDP 10 10 10 10 BPF 10 10 (D) Polyamide PA12 (1) 29 resin particles PA12 (2) 14.5 PA1010 14.5 29 (E) Toughness YP70 5 5 5 5 5 5 improver Melting temperature of 159 156 183 polyamide resin particles ( C.) 176 (in second resin composition) Curing point ( C.) 185 185 185 Glass transition temperature 194 194 194 ( C.) Flexural modulus (MPa) 4330 3920 4280 CAI (MPa) 271 200 227 G1c (J/m.sup.2) 272 245 250 G2c (J/m.sup.2) 2438 1873 1835 Abundance ratio (volume %) of 82 30 83 polyamide resin between carbon fiber layers

(154) TABLE-US-00002 TABLE 2 Comparative Comparative Example 7 Example 8 Example 9 Example 10 Example 11 Example 3 Example 4 Component Abbreviation First Second First Second First Second First Second First Second First Second First Second (A) Benzoxazine F-a 70 70 70 70 70 70 70 70 70 70 70 70 70 70 resin P-a 5 5 5 5 5 5 5 5 5 5 5 5 5 5 (B) Epoxy resin 2021P 25 25 25 25 25 25 25 25 25 25 25 25 25 25 (C) Curing agent BPF 10 10 10 10 10 10 10 10 10 10 10 10 10 10 (D) Polyamide PA6/12 14.5 10 19 14.5 19 29 resin particles (20180) PA1010 (1) 14.5 19 10 29 PA1010 (2) 14.5 10 (E) Toughness YP70 5 5 5 5 5 5 5 5 5 5 5 5 5 5 improver Melting temperature of 141 142 141 141 141 183 141 polyamide resin particles 184 183 184 181 184 ( C.) (in second resin composition) Curing point ( C.) 185 185 185 185 185 185 185 Glass transition 190 190 190 190 190 190 187 temperature ( C.) Flexural modulus (MPa) 4320 4380 4110 4290 4240 4280 4020 CAI (MPa) 220 210 235 229 255 227 175 G1c (J/m.sup.2) 244 241 285 244 251 250 140 G2c (J/m.sup.2) 2088 2006 2132 1980 2273 1835 1651 Abundance ratio (volume %) of 75 85 78 80 81 81 55 polyamide resin between carbon fiber layers

(155) TABLE-US-00003 TABLE 3 Comparative Comparative Example 12 Example 13 Example 14 Example 15 Example 16 Example 5 Example 6 Component Abbreviation First Second First Second First Second First Second First Second First Second First Second (A) Benzoxazine F-a 70 70 70 70 70 70 70 70 70 70 70 70 70 70 resin P-a 5 5 5 5 5 5 5 5 5 5 5 5 5 5 (B) Epoxy resin 2021P 25 25 25 25 25 25 25 25 25 25 25 25 25 25 (C) Curing agent BPF 10 10 10 10 10 10 10 10 10 10 10 10 10 10 (D) Polyamide PA12 (1) 10 19 19 29 resin particles PA12 (2) 14.5 19 PA6/12 19 14.5 10 29 (80/20) PA6/12 10 (75/25) PA6/12 10 (90/10) (E) Toughness YP70 5 5 5 5 5 5 5 5 5 5 5 5 5 5 improver Melting temperature of 162 162 162 161 161 180 156 polyamide resin particles ( C.) 180 179 181 177 184 (in second resin composition) Curing point ( C.) 185 185 185 185 185 185 185 Glass transition temperature 190 191 191 190 192 190 190 ( C.) Flexural modulus (MPa) 4330 4220 4190 4080 4390 4210 3920 CAI (MPa) 289 285 295 281 288 282 200 G1c (J/m.sup.2) 270 265 258 254 254 217 245 G2c (J/m.sup.2) 2003 2189 2211 2397 2400 2262 1873 Abundance ratio (volume %) of 83 80 75 75 81 92 42 polyamide resin between carbon fiber layers

(156) TABLE-US-00004 TABLE 4 Comparative Comparative Example 17 Example 18 Example 19 Example 20 Example 21 Example 5 Example 4 Component Abbreviation First Second First Second First Second First Second First Second First Second First Second (A) Benzoxazine F-a 70 70 70 70 70 70 70 70 70 70 70 70 70 70 resin P-a 5 5 5 5 5 5 5 5 5 5 5 5 5 5 (B) Epoxy resin 2021P 25 25 25 25 25 25 25 25 25 25 25 25 25 25 (C) Curing agent BPF 10 10 10 10 10 10 10 10 10 10 10 10 10 10 (D) Polyamide PA6/12 10 10 10 14.5 19 29 resin particles (20/80) PA6/12 19 14.5 29 (80/20) PA6/12 19 (75/25) PA6/12 19 10 (90/10) (E) Toughness YP70 5 5 5 5 5 5 5 5 5 5 5 5 5 5 improver Melting temperature of 140 142 141 141 141 180 141 polyamide resin particles ( C.) 178 179 184 181 184 (in second resin composition) Curing point ( C.) 185 185 185 185 185 185 185 Glass transition temperature 190 190 190 190 190 191 190 ( C.) Flexural modulus (MPa) 4600 4530 4610 4380 4240 4210 4020 CAI (MPa) 291 289 289 296 281 282 175 G1c (J/m.sup.2) 232 227 221 207 219 217 140 G2c (J/m.sup.2) 2300 2264 2195 2290 2285 2262 1651 Abundance ratio (volume %) of 85 83 81 82 86 92 55 polyamide resin between carbon fiber layers

(157) <Production of a Prepreg>

(158) The first and second resin compositions obtained were each applied onto a mold release paper sheet at 70 to 100 C. to obtain a first resin film with 18 g/m.sup.2 and a second resin film with 25 g/m.sup.2. The first resin film obtained was supplied from the upper and lower sides of carbon fibers uniformly extended in one direction and the space between fibers was impregnated therewith to form a carbon fiber layer. Subsequently, the second resin film was laminated from the upper and lower sides of the carbon fiber layer to form surface layers; thus, a prepreg was prepared. The amount of carbon fibers per unit area of the prepreg was 150 g/m.sup.2, and the total amount of the resin composition in the carbon fiber layer and the surface layers (amount of matrix resin) was 86 g/m.sup.2.

(159) <Measurement of the Melting Point of the Polyamide Resin Particles>

(160) The first polyamide resin particles that are the (D1) component mentioned above and the second polyamide resin particles that are the (D2) component mentioned above were increased in temperature at a rate of 10 C./minute from 25 C. using a differential scanning calorimeter (DSC), and the temperature of the top of the resulting endothermic peak was taken as the melting point of the polyamide resin particles. The melting point of the polyamide 12 resin particles was 184 C., the melting point of the polyamide 6/12 resin particles (20/80) was 164 C., the melting point of the polyamide 6/12 (80/20) resin particles was 194 C., the melting point of the polyamide 6/12 (75/25) resin particles was 187 C., the melting point of the polyamide 6/12 (90/10) resin particles was 200 C., and the melting point of the polyamide 1010 resin particles was 205 C.

(161) <Measurement of the Melting Temperature of the Polyamide Resin Particles in the Second Resin Composition>

(162) The second resin composition obtained was increased in temperature at a rate of 10 C./minute from 25 C. using a differential scanning calorimeter (DSC), and the temperature of the top of the resulting endothermic peak was taken as the melting temperature of the polyamide resin particles in the second resin composition. The results are shown in Tables 1 to 4. In an example in which two melting temperatures are listed in the column of melting temperature in Tables 1 to 4, the value in the upper side is the melting temperature of the (D1) component and the value in the lower side is the melting temperature of the (D2) component. As an example, a DSC chart of the second resin composition of Example 1 is shown in FIG. 6, a DSC chart of the second resin composition of Example 7 is shown in FIG. 7, a DSC chart of the second resin composition of Example 13 is shown in FIG. 8, and a DSC chart of the second resin composition of Example 20 is shown in FIG. 9.

(163) <Measurement of the Glass Transition Temperature>

(164) The second resin composition obtained was increased in temperature at a temperature increase rate of 2.0 C./minute from room temperature to 185 C. in an oven and cured for 2 hours at the same temperature to obtain a resin cured substance. For the cured substance obtained, the middle point temperature found on the basis of JIS K 7121 (1987) using a differential scanning calorimeter (DSC) was measured as the glass transition temperature. The results are shown in Tables 1 to 4.

(165) <Measurement of the Flexural Modulus>

(166) The second resin composition obtained was increased in temperature at a temperature increase rate of 2.0 C./minute from room temperature to 185 C. in an oven and cured for 2 hours at the same temperature to obtain a resin cured substance having a thickness of 2 mm. For the resin cured substance, the flexural modulus was measured in accordance with JIS J 7171. The results are shown in Tables 1 to 4.

(167) <Measurement of the CAI>

(168) Prepregs obtained were stacked 32 plies (layers) pseudo-isotropically with a configuration of [+45/0/45/90].sub.4s, were increased in temperature in an autoclave at 2.0 C./minute from room temperature to 185 C. at a pressure of 0.6 MPa, and were then cured by heating for 2 hours at the same temperature; thus, a fiber-reinforced composite material was obtained. From the fiber-reinforced composite material, a sample of 150 mm long100 mm broad was cut out in accordance with ASTM D7136 and D7137, and a falling weight impact of 6.7 J/mm was applied to a central portion of the sample; thus, the compressive strength after impact (CAI) was found. The results are shown in Tables 1 to 4.

(169) <Mode I Interlaminar Fracture Toughness Test (G1c)>

(170) Prepregs obtained were stacked 26 plies with each carbon fiber arranged so as to extend in the same direction, and a Kapton film (1 mil) (manufactured by DU PONT-TORAY CO., LTD.) was interposed in a partial region of the central interlayer (between the 13th layer and 14th layer) so as to introduce a precrack on the side surface of the stacked body perpendicular to the direction of the carbon fibers. Here, 1 mil means 1/1000 inches or 25.3995 m. This was increased in temperature in an autoclave at a temperature increase rate of 2.0 C./minute from room temperature to 185 C. at a pressure of 0.6 MPa, and was then cured by heating for 2 hours at the same temperature; thus, a fiber-reinforced composite material was obtained. From the fiber-reinforced composite material, a sample of 264.0 mm long (fiber direction)25.4 mm broad was cut out, and a hinge was bonded to each edge portion to obtain a test piece. This test piece was subjected to a double cantilever beam test at a loading speed of 1.0 mm/min in accordance with ASTM D5528 to find the mode I interlaminar fracture toughness value (G1c). The results are shown in Tables 1 to 4.

(171) <Mode II Interlaminar Fracture Toughness Test (G2c)>

(172) Prepregs obtained were stacked 26 plies with each carbon fiber arranged so as to extend in the same direction, and a Kapton film (1 mil) (manufactured by DU PONT-TORAY CO., LTD.) was interposed in a partial region of the central interlayer (between the 13th layer and 14th layer) so as to introduce a precrack on the side surface of the stacked body perpendicular to the direction of the carbon fibers. Here, 1 mil means 1/1000 inches or 25.3995 m. This was increased in temperature in an autoclave at a temperature increase rate of 2.0 C./minute from room temperature to 185 C. at a pressure of 0.6 MPa, and was then cured by heating for 2 hours at the same temperature; thus, a fiber-reinforced composite material was obtained. From the fiber-reinforced composite material, a sample of 264.0 mm long (fiber direction)25.4 mm broad was cut out to obtain a test piece. This test piece was subjected to an end-notched flexure test at a loading speed of 1.0 mm/min in accordance with Composite Materials Handbook 17-1 to find the mode II interlaminar fracture toughness value (G2c). The results are shown in Tables 1 to 4.

(173) <The Abundance Ratio (volume %) of the Polyamide Resin Between Carbon Fiber Layers>

(174) A cross section of the fiber-reinforced composite material taken along a plane orthogonal to the direction in which an arbitrary carbon fiber in the fiber-reinforced composite material obtained in the measurement of CAI extends was analyzed by microscopic observation (500 times), and image analysis was performed for a range of 500 m100 m to observe the distribution of polyamide particles; thereby, the amount C.sub.1 of the polyamide resin contained in one piece of the resin cured substance between carbon fiber layers and the amount C.sub.2 of the polyamide resin contained in one carbon fiber layer were calculated. This measurement was performed on arbitrary 5 places that are combinations of different carbon fiber layers and different pieces of the resin cured substance, and the average value of the 5 places of C.sub.1 and C.sub.2 was used to find the volume proportion of C.sub.1, {C.sub.1/(C.sub.1+C.sub.2)}100, per prepreg. The results are shown in Tables 1 to 4.

(175) <Evaluation at Various Temperature Increase Rates>

(176) For CAI, G1c, and G2c, evaluation was further performed in the same way as described above except that the temperature increase rate was changed to 0.3 C./minute. The results are shown in Tables 5 to 8 in combination with the evaluation results in the case of 2.0 C./minute.

(177) TABLE-US-00005 TABLE 5 Evaluation CAI (MPa) G1c (J/m.sup.2) G2c (J/m.sup.2) Temperature increase rate ( C./minute) 0.3 2.0 0.3 2.0 0.3 2.0 Example 1 306 316 394 482 2209 2284 Example 2 296 319 404 366 2296 2179 Example 3 307 314 378 478 2157 2282 Example 4 268 283 306 338 1900 1989 Example 5 253 270 314 318 1826 1910 Example 6 298 271 371 272 1663 2438 Comparative 250 200 271 245 1650 1873 Example 1 Comparative 215 227 193 250 1560 1835 Example 2

(178) TABLE-US-00006 TABLE 6 Evaluation CAI (MPa) G1c (J/m.sup.2) G2c (J/m.sup.2) Temperature increase rate ( C./minute) 0.3 2.0 0.3 2.0 0.3 2.0 Example 7 278 220 281 244 2300 2088 Example 8 265 210 275 241 2288 2006 Example 9 298 235 311 285 2258 2132 Example 10 288 229 288 244 2265 1980 Example 11 294 255 309 251 2401 2273 Comparative 215 227 193 250 1560 1835 Example 3 Comparative 280 175 211 140 2100 1651 Example 4

(179) TABLE-US-00007 TABLE 7 Evaluation CAI (MPa) G1c (J/m.sup.2) G2c (J/m.sup.2) Temperature increase rate ( C./minute) 0.3 2.0 0.3 2.0 0.3 2.0 Example 12 296 289 369 270 2998 2003 Example 13 301 285 356 265 2885 2189 Example 14 310 295 335 258 2777 2211 Example 15 306 281 321 254 2668 2397 Example 16 266 288 298 254 2581 2400 Comparative 303 282 254 217 2363 2262 Example 5 Comparative 250 200 271 245 1650 1873 Example 6

(180) TABLE-US-00008 TABLE 8 Evaluation CAI (MPa) G1c (J/m.sup.2) G2c (J/m.sup.2) Temperature increase rate ( C./minute) 0.3 2.0 0.3 2.0 0.3 2.0 Example 17 306 291 246 232 2816 2300 Example 18 300 289 271 227 2555 2264 Example 19 300 289 266 221 2561 2195 Example 20 310 296 243 207 2710 2290 Example 21 317 281 255 219 2688 2285 Comparative 303 282 254 217 2363 2262 Example 5 Comparative 280 175 211 140 2100 1651 Example 4

(181) As shown in Tables 1 to 4, it has been found that, in Examples 1 to 21 in which two types of the specific polyamide resin particles were used, G1c, G2c, CM, and flexural modulus can be achieved at a high level at the same time, and also the glass transition temperature of the resin material can be kept high.

(182) Further as shown in Tables 5 to 8, in Examples 1 to 21 in which two types of the specific polyamide resin particles were used, CAI, G1c, and G2c can be obtained at a high level stably even in the case of different temperature increase conditions in heating a stacked body of prepregs. As a result of observation of cross-sectional photographs of the fiber composite materials of Examples 1 to 21 obtained under the respective conditions listed in Tables 5 to 8, a resin cured layer containing a polyamide resin between the fiber layers was confirmed to be formed in a sufficient thickness under any of the conditions. This suggests that the prepregs according to the present invention can provide a fiber-reinforced composite material which can deal with a wide range of production conditions and at the same time can achieve CAI, G1c, and G2c at a high level stably by the method according to the present invention.

INDUSTRIAL APPLICABILITY

(183) As described above, according to the present invention, a production method for a fiber-reinforced composite material that makes it possible to obtain a fiber-reinforced composite material that, while using a benzoxazine resin having excellent moisture resistance and heat resistance, can achieve interlaminar fracture toughness, CAI, and flexural modulus at high level at the same time and can also keep the glass transition temperature of the resin material high, a prepreg and a resin composition containing particles which can be used for it, and a fiber-reinforced composite material can be provided. The fiber-reinforced composite material mentioned above can be used for aircraft uses, vessel uses, automobile uses, sports uses, and other general industrial uses.

REFERENCE SIGNS LIST

(184) 1 . . . reinforcing fibers, 2 . . . resin composition, 3 . . . reinforcing fiber layer, 4a . . . first polyamide resin particles, 4b . . . second polyamide resin particles, 5 . . . resin composition, 6a, 6b . . . surface layer, 7 . . . reinforcing fiber bundle, 8 . . . resin cured substance, 10, 11 . . . prepreg, 100 . . . fiber-reinforced composite material