Superconducting wire material having laminated structure and manufacturing method therefor

Abstract

Disclosed is a method for manufacturing a superconducting wire material having a laminated structure. The present invention provides a method for manufacturing a laminated superconducting wire material, comprising the steps of: providing a deposition substrate having a predetermined width; sequentially forming, on the deposition substrate, a laminated structure including a buffer layer, a superconducting layer and a stabilization layer, thereby forming, on both sides of the deposition substrate, regions in which a metal substrate is exposed in the width direction; providing a lamination substrate, having a width corresponding to the deposition substrate, to the laminated structure; and providing solder to the regions, in which the metal substrate is exposed, to thereby bond the deposition substrate and the lamination substrate.

Claims

1. A superconducting wire material comprising: a deposition substrate having a first width; a laminated structure comprising a buffer layer, a superconducting layer and a stabilization layer sequentially disposed on the deposition substrate, the buffer layer being disposed directly on the deposition substrate, the laminated structure having a second width which is smaller than the first width and recessed spaces at both ends in a width direction; a lamination substrate having a third width that is substantially the same as the first width of the deposition substrate; and a solder filling the recessed spaces thereby soldering the deposition substrate with the lamination substrate, wherein the stabilization layer includes first and second layers, the first layer including any one of gold, silver, platinum, palladium, and a combination thereof, the second layer including any one of copper, aluminum, and a combination thereof.

2. The superconducting wire material of claim 1, wherein the lamination substrate comprises one material selected from the group consisting of stainless steel, a copper alloy and a nickel alloy.

3. The superconducting wire material of claim 1, wherein the solder comprises at least one metal selected from the group consisting of silver, lead, tin, bismuth, aluminum, zinc and indium, or an alloy thereof.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is an exemplary view illustrating a laminated structure of a conventional superconducting wire material;

(2) FIG. 2 is an exemplary view illustrating a laminated structure of a superconducting wire material according to an embodiment of the present invention;

(3) FIG. 3 is a view illustrating a cross section of a laminated structure of a superconducting wire material according to another embodiment of the present invention;

(4) FIGS. 4 to 7 are cross-sectional views sequentially illustrating a method for laminating a superconducting wire material according to an embodiment of the present invention;

(5) FIGS. 8 to 12 are cross-sectional views sequentially illustrating a method for laminating a superconducting wire material according to another embodiment of the present invention;

(6) FIG. 13 is a view illustrating a cross section of a laminated structure of a superconducting wire material according to another embodiment of the present invention; and

(7) FIGS. 14 to 16 are views illustrating modification examples of the embodiment of FIG. 13.

BEST MODE FOR CARRYING OUT THE INVENTION

(8) Hereinafter, the present invention will be described by explaining preferable embodiments of the present invention with reference to the drawings.

(9) FIG. 2 is an exemplary view illustrating a superconducting wire material having a laminated structure according to a preferable embodiment of the present invention.

(10) Referring to FIG. 2, a superconducting wire material 100 has a strip shape of a predetermined width extending in a longitudinal direction. The superconducting wire material includes a laminated structure of a deposition substrate 112, a buffer layer 114, a superconducting layer 116, a stabilization layer and a lamination substrate 120.

(11) A structure of the deposition substrate 112, the buffer layer 114, the superconducting layer 116 and the stabilization layer 118 forming the wire material 110 of the present invention and a method for manufacturing the same may be manufactured by a typical method which is obvious to a skilled person in the art to which the present invention pertains.

(12) A series of material layers 114, 116 and 118 including the superconducting layer 116 are deposited on the deposition substrate 112. The series of material layers 114, 116 and 118 of the present invention are formed such that part of the metal substrate is exposed by a predetermined distance () in the width direction for the deposition substrate. The exposure distance of the metal substrate may be properly selected by a skilled person in the art with reference to the present invention which will be described below. The distance in which the metal substrate is exposed may be properly design in consideration of a handling of solder, a width of substrate, a bonding strength of substrate, etc. For example, for the distance in which the metal substrate is exposed, less than several mm may be allowed, and at least several cm may be allowed.

(13) A base used for manufacturing a common superconducting wire material may be used as the deposition substrate 112. For example, the deposition substrate may be implemented as a metal substrate including nickel or a nickel alloy. A series of material layers 114, 116 and 118 including a superconducting layer are deposited on the deposition substrate 112. The material and thickness of the deposition substrate of the present invention may vary depending on the use of a superconducting product.

(14) The buffer layer 114 is interposed between the superconducting layer 116 and the deposition substrate 112 and acts as a layer for providing a crystallographic orientation in order for the superconducting layer 116 following to show superconductivity properties. The buffer layer 114 may be formed of at least one material selected from the group consisting of MgO, LMO, STO, ZrO.sub.2, CeO.sub.2, YSZ, Y.sub.2O.sub.3 and HfO.sub.2. The buffer layer 114 may be formed as a single layer or plural layers depending on the use of the superconducting product and a manufacturing method therefor.

(15) Additionally, the superconducting layer 116 may be composed of a superconducting material including yttrium or a rare earth (RE) element. For example, an Y123 superconducting material represented by YBa.sub.2Cu.sub.3O.sub.7 or an RE123 superconducting material may be used. Also, a Bi-based superconducting material may be used as the superconducting layer 116.

(16) The stabilization layer 118 is provided for electrical stabilization of the superconducting wire material, such as for protecting the superconducting layer from an overcurrent, providing stability against quench, etc. The stabilization layer 118 of the present invention may include at least two layers. For example, the stabilization layer 118 may include a first conductive metal layer formed on the superconducting layer 116 and a second conductive metal layer formed on the first conductive metal layer. In this case, the first and second metal layers may be formed of any conductive metal layers. For example, the first metal layer may be composed of at least one metal selected from the jewelry group consisting of gold, silver, platinum, palladium, etc., or an alloy thereof, and the second metal layer may be composed of a conductive metal such as copper or aluminum, or an alloy thereof.

(17) The stabilization layer 118 may be formed by common techniques such as common physical vapor deposition, sputtering and electroplating.

(18) A lamination substrate 120 is provided on the stabilization layer 118. The lamination substrate 120 may be formed of a metal material having rigidity. For example, a copper alloy or a nickel alloy such as stainless steel or brass may be used as the lamination substrate 120.

(19) The lamination substrate 120 is opposite to the deposition substrate 112, and is bonded to the deposition substrate 112 by welding. For this, the lamination substrate 120 may have a proper width. In the present invention, the lamination substrate 120 may be designed to have substantially the same width as the deposition substrate 112, and may be designed to have a greater or a smaller width than the deposition substrate 112.

(20) A solder 130 is formed in regions in which a metal substrate between the deposition substrate 112 and the lamination substrate 120 is exposed. The solder 130 may be made of at least one metal selected from the group consisting of silver, lead, tin, bismuth, aluminum, zinc and indium, or an alloy thereof. The solder 130 bonds the deposition substrate 112 and the lamination substrate 120 to finally provide rigidity to the superconducting wire material.

(21) As described above, the present invention may reduce the total cross sectional area of the superconducting wire material by using the deposition substrate used for depositing the superconducting wire material as the laminated substrate. Accordingly, the present invention may provide a superconducting wire material with no decrease in current density Je while providing rigidity necessary for winding or handling the superconducting wire material.

MODE FOR CARRYING OUT THE INVENTION

(22) Meanwhile, the superconducting wire material of the present invention may use an additional rigid substrate below the deposition substrate according to necessity.

(23) s

(24) FIG. 3 is a view illustrating a cross section of a structure in which an additional lower lamination substrate 140 is used below the deposition substrate.

(25) In the present embodiment, as illustrated in FIG. 3, the solder 130 is provided between the deposition substrate 112 and the upper lamination substrate 120. In the present embodiment, the bonding of the lower lamination substrate 140 may be performed by additional soldering. Or, of course, a simultaneous bonding may be performed by providing an additional solder around an interface between the deposition substrate 112 and the lower lamination substrate 140 during a soldering process of the deposition substrate 112 and the upper lamination substrate 120.

(26) Hereinafter, a method for manufacturing a superconducting wire material of the present invention will be explained, and another embodiment of a superconducting wire material regarding this will be described.

(27) FIGS. 4 to 7 are cross-sectional views sequentially illustrating a method for laminating a superconducting wire material according to a preferable embodiment of the present invention.

(28) Referring to FIG. 4, a laminated structure including, on the entire surface of the deposition substrate 112, a buffer layer 114, a superconducting layer 116 and a stabilization layer 118 is sequentially formed. The buffer layer 114, the superconducting layer 116 and the stabilization layer 118 may be formed by common techniques which are well known to a skilled person in the art of the present invention. An explanation thereon is omitted.

(29) As illustrated in FIG. 5, part of a series of material layers forming the laminated structure on the deposition substrate 112 is removed to form laminated structure patterns 114, 116 and 118 in which a metal substrate is exposed in the width direction of the deposition substrate 112. In this case, the material layers can be removed by various ways. For example, laser ablation is a way suitable for selectively removing a material layer around an edge of the laminated structure to form a structure in which the metal substrate is exposed. Besides, a dry or a wet etching method applying common photolithography can be applied to the formation of structure in which the metal substrate is exposed.

(30) As illustrated in FIG. 6, the lamination substrate is arranged on the structure in which the metal substrate is exposed. The solder is provided in a space in which the metal substrate between the deposition substrate 112 and the lamination substrate 120 is exposed.

(31) As illustrated in FIG. 7, the solder is heated to bond the deposition substrate 112 and the lamination substrate 120, and thereby the laminated superconducting wire material is manufactured.

(32) FIGS. 8 to 12 are cross-sectional views sequentially illustrating a method for manufacturing a superconducting wire material according to another embodiment of the present invention.

(33) Referring to FIG. 8, the laminated structure of a buffer layer 114, a superconducting layer 116 and a stabilization layer 118 is formed on the entire surface of the deposition substrate 112.

(34) Referring to FIG. 9, a mask pattern 160 is formed on the buffer layer 114, the superconducting layer 116 and the stabilization layer 118.

(35) The mask pattern 160 may be implemented by a common photolithography process. That is, a photoresist is coated on the stabilization layer 118, photosensitization and etching techniques are applied to open part of an edge of the stabilization layer, and thereby the mask pattern 160 may be formed.

(36) Referring to FIG. 10, the open part of the superconducting layer, the buffer layer and the stabilization layer is etched with the mask pattern 160 as a mask. The etching may be performed by a drying etching such as a well-known plasma etching, etc., and/or a wet etching by an etching solution. In the case of the wet etching, different etching solutions may be used for removing the stabilization layer, the buffer layer and the superconducting layer.

(37) The laminated structure patterns 114, 116 and 118 including the superconducting layer, the buffer layer and the stabilization layer in which the metal substrate is exposed by the etching are obtained.

(38) As illustrated in FIG. 11, the mask pattern 160 is removed. The removal of the mask pattern may be performed by a common technique such as a strip process or an etching process, etc.

(39) Additionally, as illustrated in FIG. 12, the lamination substrate 120 is arranged on the deposition substrate 112 which went through the above process, and both substrates 112 and 120 are bonded by the solder 130, and thereby the superconducting wire material having the laminated structure may be manufactured.

(40) FIG. 13 is an exemplary view illustrating a laminated structure of a superconducting wire material according to another embodiment of the present invention.

(41) Referring to FIG. 13, a superconducting wire material 200 includes two laminated structures 110A and 110B which are opposing to each other.

(42) Each laminated structure 110A and 110B includes the deposition substrate 112, and the buffer layer 114, the superconducting layer 116 and the stabilization layer 118 sequentially laminated on the deposition substrate. With the same method as described above, each laminated structure 110A and 110B is formed such that the metal substrate is exposed in the width direction on both sides of the deposition substrate. The solder 230 fills a space formed by the regions in which the metal substrate is exposed. As such, the superconducting wire material can be laminated by bonding the laminated structures opposing to each other. In this case, there is an advantage that an additional lamination substrate for the lamination may not be used.

(43) FIG. 14 is a view illustrating a modification example of the superconducting wire material explained with reference to FIG. 13. An additional plating layer 210 is formed around the superconducting wire material 200. The plating layer may play a role of facilitating the soldering of an electrode.

(44) FIG. 15 is a view illustrating another modification example of the superconducting wire material explained with reference to FIG. 13. Unlike FIG. 13, lamination substrates 220A and 220B are used below and on the laminated structures 110A and 110B. This structure is applicable when rigidity of the deposition substrate needs to be reinforced. Of course, the lamination substrate 220 of the present invention may be applied to any one of on or below the laminated structures.

(45) FIG. 16 is a view illustrating a modification example of the superconducting wire material explained with reference to FIG. 15. Unlike FIG. 15, a substrate with a greater width extending and protruding in the width direction of the deposition substrate is used as lamination substrates 220A and 220B. By the use of the lamination substrate 220, the solder 230 may more firmly bond the deposition substrate 112 and the lamination substrates 220A and 220B.

(46) Although the exemplary embodiments of the present invention have been described, it is understood by a person ordinarily skilled in the art that the present invention should not be limited to these exemplary embodiments and that various changes and modifications can be made within the scope of the present invention as long as they do not depart from the technical spirit of the present invention.