ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS, AND METHODS OF MANUFACTURING ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS

Abstract

Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.

Claims

1. A method for making a multi-thickness electro-magnetic device comprising the steps of: providing a conductive material; forming the conductive material into a multi-thickness template by performing an extrusion process, a skiving process, or a flattening process; and forming the multi-thickness template into a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion comprising a third thickness; wherein the first thickness is different than the second thickness, and wherein the first thickness is different than the third thickness.

2. The method of claim 1, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness.

3. The method of claim 1, wherein the step of forming the multi-thickness template into a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion comprising a third thickness comprises stamping the multi-thickness template.

4. The method of claim 1, wherein the conductive element has a serpentine shape or a generally rectangular shape.

5. The method of claim 1, wherein the conductive element, first lead, and second lead are formed from a continuous, non-wound piece of conductive material.

6. The method of claim 1, wherein no portion of the conductive element crosses over or under another portion of the conductive element.

7. The method of claim 1, wherein the first lead portion has a thickness that is uniform along substantially an entire length of the first lead portion, and the second lead portion has a thickness that is uniform along substantially an entire length of the second lead portion.

8. The method of claim 1, wherein the first lead portion has a first width adjacent the conductive element and a second width at an end of the first lead portion, and wherein the second width is different than the first width.

9. The method of claim 1, wherein the second lead portion has a first width adjacent the conductive element and a second width at an end of the second lead portion, and wherein the second width is great than the first width.

10. A method for making an electro-magnetic device comprising the steps of: providing a conductive material; forming the conductive material into a multi-thickness template, the multi-thickness template comprising a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion comprising a third thickness, wherein the first thickness is different than the second thickness, and wherein the first thickness is different than the third thickness; and pressing a core material around the conductive element and at least a portion of the first lead and at least a portion of the second lead to form a body.

11. The method of claim 10, further comprising the steps of trimming the first lead and trimming the second lead.

12. The method of claim 11, further comprising the steps of positioning at least a portion of the first lead along an outer surface of the body and extending at least a portion of the first lead along a bottom surface of the body, and further comprising the steps of positioning at least a portion of the second lead along an outer surface of the body and extending at least a portion of the second lead along a bottom surface of the body.

13. The method of claim 10, wherein the step of forming the conductive material into a multi-thickness template comprises performing an extrusion process.

14. The method of claim 10, wherein the step of forming the conductive material into a multi-thickness template comprises forming the conductive material into a sheet, and further comprises performing a skiving process.

15. The method of claim 10, wherein the step of forming the conductive material into a multi-thickness template comprises forming the conductive material into a sheet, and further comprises performing a flattening process.

16. The method of claim 10, wherein the step of forming the conductive material into a multi-thickness template comprises forming the conductive material into a sheet, and further comprises stamping the sheet to form the conductive element, the first lead, and the second lead.

17. The method of claim 10, wherein the conductive element has a serpentine shape or a generally rectangular shape.

18. The method of claim 10, wherein the conductive element, first lead, and second lead are formed from a continuous, non-wound piece of conductive material.

19. The method of claim 10, wherein no portion of the conductive element crosses over or under another portion of the conductive element.

20. The method of claim 10, further comprising the steps of plating the sheet of conductive material with a layer of nickel or a layer of tin.

Description

BRIEF DESCRIPTION OF THE DRAWING(S)

[0030] The foregoing aspects and many of the accompanying advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description when taken in conjunction with the accompanying drawings, wherein:

[0031] FIG. 1A illustrates an isometric view of an electro-magnetic device in partial transparency according to an aspect of the invention;

[0032] FIG. 1B illustrates top view of an electro-magnetic device in partial transparency according to an aspect of the invention as shown in FIG. 1A;

[0033] FIG. 1C illustrates a side view of an electro-magnetic device in partial transparency according to an aspect of the invention as shown in FIG. 1A;

[0034] FIG. 2A illustrates an isometric view of an electro-magnetic device in partial transparency according to an aspect of the invention;

[0035] FIG. 2B illustrates top view of an electro-magnetic device in partial transparency according to an aspect of the invention as shown in FIG. 2A;

[0036] FIG. 2C illustrates a side view of an electro-magnetic device in partial transparency according to an aspect of the invention as shown in FIG. 2A;

[0037] FIG. 3 shows a flowchart illustrating a method of making a multi-thickness template and electro-magnetic device according to an aspect of the invention;

[0038] FIG. 4 illustrates a metal sheet formed from a conductive material according to aspects of the invention;

[0039] FIG. 5A illustrates a multi-thickness metal sheet according to an aspect of the invention;

[0040] FIG. 5B illustrates a side view of the multi-thickness metal sheet of FIG. 5A;

[0041] FIG. 6 illustrates a multi-thickness template according to an aspect of the invention;

[0042] FIG. 7 illustrates a multi-thickness template according to an aspect of the invention with a body formed around areas of the template;

[0043] FIG. 8 illustrates a multi-thickness template according to an aspect of the invention;

[0044] FIG. 9 shows a flowchart illustrating a method of making a multi-thickness template and electro-magnetic device according to an aspect of the invention;

[0045] FIG. 10 illustrated a blade performing a skiving process on a metal sheet to form a multi-thickness metal sheet;

[0046] FIG. 11 shows a flowchart illustrating a method of making a multi-thickness template and electro-magnetic device according to an aspect of the invention;

[0047] FIG. 12 illustrates a template according to an aspect of the invention;

[0048] FIG. 13 illustrates a detailed view of a multi-thickness template according to an aspect of the invention, having flattened lead portions;

[0049] FIG. 14 illustrates an isometric view of an electro-magnetic device according to an aspect of the invention;

[0050] FIG. 15 illustrates an isometric view of an electro-magnetic device or template according to an aspect of the invention; and

[0051] FIG. 16 illustrates a template according to an aspect of the invention.

DETAILED DESCRIPTION

[0052] Certain terminology is used in the following description for convenience only and is not limiting. The words “right,” “left,” “top,” and “bottom” designate directions in the drawings to which reference is made. The words “a” and “one,” as used in the claims and in the corresponding portions of the specification, are defined as including one or more of the referenced item unless specifically stated otherwise. This terminology includes the words above specifically mentioned, derivatives thereof, and words of similar import. The phrase “at least one” followed by a list of two or more items, such as “A, B, or C,” means any individual one of A, B or C as well as any combination thereof. It may be noted that some Figures are shown with partial transparency for the purpose of explanation, illustration and demonstration purposes only, and is not intended to indicate that an element itself would be transparent in its final manufactured form.

[0053] FIGS. 1A-1C show an example of an electro-magnetic device 100 that may be formed according to an aspect of the invention, including a conductive element 150 having a selected shape. The conductive element may also be referred to as a “coil” or “coil area.” In an embodiment shown in FIGS. 1A-1C, the conductive element 150 comprises a serpentine or meandering conductive element provided as an “S” conductive element, “S-shaped” conductive element, or “S-conductive element,” when viewed as oriented in FIGS. 1A and 1B, or as viewed from above or below. A first curved portion C1 has a first end 152 extending adjacent one of the leads 140a (also referred to as a “lead portion”), and a second end 153, the first curved portion C1 curving around the center of the conductive element 150. A second curved portion C2 has a first end 155 extending from the other of the leads 140b (also referred to as a “lead portion”), and a second end 154, the second curved portion curving around the center of the conductive element 150 in an opposite direction from the first curved portion C1. Each curved portion forms an arc encircling part of the center of the conductive element 150. The curved portions may each run along a circumferential path about a central area of the device. A similarly shaped configuration of an electro-magnetic device is shown and described in U.S. Pat. No. 10,854,367, the entire contents of which is incorporated by reference as if fully set forth herein. The conductive element 150 has a central portion 151 crossing generally diagonally and extending between and connecting the second end 153 to the second end 154, and may preferably pass through the central area of the conductive element. The central portion 151 is generally straight.

[0054] An S-conductive element or “S” shape is illustrative of an aspect of the invention. Other configurations are also contemplated, including arcs, Z-shaped conductive element configurations or N-shaped conductive element configurations. Curved or straight conductive elements are also contemplated and within the scope of the invention. A conductive element configuration that extends along a meandering path between leads, with a portion of the conductive element crossing the mid-line or central portion of the conductive element or an electro-magnetic body, would be considered to be a “serpentine” conductive element. For example, and without limitation, an S-shaped conductive element, Z-shaped conductive element, N-shaped conductive element, and other shaped conductive elements having meandering paths traced from one lead to the other lead are considered to be “serpentine” conductive elements. The shape of the conductive element 150 may be designed to optimize the path length to fit the space available within the electro-magnetic while minimizing resistance and maximizing inductance. The shape may be designed to increase the ratio of the space used compared to the space available in the electro-magnetic body. In an embodiment of the invention, conductive element 150 has a top or upper surface that is preferably flat and oriented essentially in a plane. The serpentine conductive element may be considered a coil or coil area, but is distinguished from a “wound” conductive element formed from a wire or piece of conductive material that is wound about and encircles a central portion or axis of an electro-magnetic core.

[0055] As shown in FIGS. 1A-1C, the illustrated electro-magnetic device 100 has a length L1 running along the X1-X2 axis or direction, with X1 directed in a first direction and X2 being a second direction opposite the first direction, a length L2 running along the Y1-Y2 axis or direction, with Y1 directed in a third direction and Y2 directed in a fourth direction opposite the third direction, and a first thickness H1 (or height when viewed from the side as in FIG. 1C) running along the Z1-Z2 axis or direction, with Z1 directed in a fifth direction and Z2 directed in a sixth direction opposite the fifth direction. For ease of references, the Z1-Z2 axis is referred to as the “thickness.” For ease of reference, the area or areas of the conductive element having an increased thickness or height may be referred to as an “increased thickness area.”

[0056] According to an aspect of the invention, and as shown in FIG. 1C, the conductive element 150 has an increased thickness area 159, having an increased first thickness T1 along the Z1-Z2 axis as shown in FIG. 1C, as compared to the thicknesses second thickness T2 and third thickness T3 of the portions of the conductive material such as the leads 140a, 140b, and including the lead portions 156, 157, which are positioned adjacent the outer sides ends 174, 175 of the conductive element 150. In this configuration, essentially the entirety of the conductive element 150 having the “S”-shape comprises the increased thickness area 159. It is appreciated that a portion of the conductive element having an increased thickness area can also be less than the entirety of the conductive element having the “S”-shape. For example, a conductive element could be formed having thicker portions and thinner portions, with each of the thicker portions comprising an increased thickness area. In this configuration, the lead 140a has a thickness T2 along substantially the entire length of the lead 140a, and the lead 140b has a thickness T3 along substantially the entire length of the lead.

[0057] As shown in FIGS. 1A-1C, in an aspect of the invention, a finished electro-magnetic device such as an inductor 100 may include a body 133, also referred to as a core body, shown in partial transparency formed about, pressed over or otherwise housing or surrounding the conductive element and at least parts of the leads. The body may be formed as a first body portion 110 and a second body portion 120. The first body portion 110 and a second body portion 120 sandwich, are pressed around or otherwise house or surround the conductive element 150 and parts of the leads 140a, 140b to form the finished inductor 100. When compressed around the conductive element and portions of the leads, the first body portion 110 and a second body portion 120 may comprise and be considered as a single, unitary compressed body, and may be referred to simply as the “body” or alternately as a “core body.”

[0058] The body 133 may be formed of a magnetic material comprising a ferrous material and may be formed having an upper or top surface 134 and an opposite lower or bottom surface 135, a first side 136 and an opposite second side 137, and a first lateral side lateral side 170 adjacent the first lead 140a and an opposite second lateral side 172 adjacent the second lead 140b. The body may comprise, for example, iron, metal alloys, and/or ferrite, combinations of those, or other materials known in the art of electro-magnetic devices and used to form such bodies. First body 110 and second body portion 120 may comprise a powdered iron or similar materials. Other acceptable materials as are known in the art of electro-magnetic devices may be used to form the body or body portions, such as known magnetic materials. For example, a magnetic molding material may be used for the body, comprising a powdered iron, a filler, a resin, and a lubricant, such as described in U.S. Pat. No. 6,198,375 (“Electro-magnetic conductive element structure”) and U.S. Pat. No. 6,204,744 (“High current, low profile inductor”), the entire contents of which are incorporated by reference as if fully set forth herein. The body 133 may be formed of a magnetic material powder comprising one or more of the following materials: of iron, iron alloys, and/or ferrite, and/or combinations thereof. The body 133 may comprise, for example, iron, metal alloys, or ferrite, combinations of those, or other materials known in the art of inductors and used to form such bodies. Each of the materials listed or referenced in U.S. Pat. Nos. 6,198,375 and 6,204,744, including any combinations thereof, and any equivalents as are known in the relevant art, are generally referred to as the “core material” or “core materials.” While it is contemplated that first body portion 110 and second body portion 120 are formed in similar fashion and of the same core material, first body portion 110 and second body portion 120 may be formed using different processes and from distinct core materials, as are known in the art.

[0059] The area of conductive material located between the increased thickness area T1 and the outer lateral sides 170, 172 of the body 133 may be considered either the beginning portions or parts of the leads 140a and 140b, or a transitional portion of the conductive element 150 that has a lesser thickness or height that extends between the increased thickness area to each of the lateral sides 170, 172. For ease of reference, this area is referred to as the first inner lead portion 156 and the second inner lead portion 157, and these portions will be contained within or otherwise surrounded by the body 133 as described further.

[0060] The first body portion 110 and second body portion 120 surround the conductive element and parts of the leads, and may be pressed or over-molded around the conductive element 150, initially leaving exposed parts of the leads 140a, 140b until they are folded underneath first body portion 110 as shown in their final state in the partially transparent examples of FIGS. 1 and 2. In a finished electro-magnetic device or “part,” each lead 140a, 140b may have a portion running or otherwise extending along sides or side surfaces of the first body portion 110 as shown in FIGS. 1A-1C. The first lead 140a may terminate in a surface mount contact portion 130a, and the second lead 140b may terminate in a surface mount contact portion 130b, each bent underneath the lower surface 135 of the body 133, which may be the first body portion 110, as shown in FIGS. 1A-1C.

[0061] It is contemplated that an electro-magnetic device according to aspects of the invention may be formed without a core body, such as with leads that are bent to form surface mount terminations. An example is shown in FIG. 14. A similar device without a core body with leads that are straight or not bent, and extend straight outwards from the conductive element, or extend at an angle, is shown in FIG. 15. FIGS. 14 and 15, thus, show examples of finished electro-magnetic devices that may comprise a multi-thickness conductive element and lead portions as described, without any core materials or core body surrounding those elements. The electro-magnetic device 100′ may comprise a conductive element 150′ having a serpentine shape. A first curved portion C1′ has a first end 152′ extending adjacent one of the leads 140a′ (also referred to as a “lead portion”), and a second end 153′, the first curved portion C1′ curving around the center of the conductive element 150′. A second curved portion C2′ has a first end 155′ extending from the other of the leads 140b′ (also referred to as a “lead portion”), and a second end 154′, the second curved portion curving around the center of the conductive element 150′ in an opposite direction from the first curved portion Each curved portion forms an arc encircling part of the center of the conductive element 150′. The curved portions may each run along a circumferential path about a central area of the device. The conductive element 150′ has a central portion 151′ crossing generally diagonally and extending between and connecting the second end 153′ to the second end 154′, and may preferably pass through the central area of the conductive element. The central portion 151′ is generally straight. A first inner lead portion 156′ is positioned adjacent the first end 152′. A second inner lead portion 157′ is positioned adjacent the second end 155′. The conductive element 150′ has an increased thickness area 159′. In FIG. 15, the leads 140a′, 140b′, are shown extending straight and outwardly from the conductive element 150′. In FIG. 14, the leads 140a′, 140b′ are bent to form surface mount lead portions 130a′, 130b′.

[0062] The leads 140a, 140b may each have the same uniform thickness, or substantially the same uniform thickness, along the entire length of each of the leads.

[0063] In another aspect of the invention, FIGS. 2A-2C show an example of an electro-magnetic device 200 that may be formed according to an aspect of the invention, including a shaped conductive element 250. In the illustrative device shown in FIGS. 2A-2C, the conductive element 250 comprises an essentially straight conductive element provided as an “I” or “H” shaped conductive element, or one having a “barbell” shape, when viewed from the top as in FIG. 2B. Such a conductive element may further be considered or referred to as a coil. In such an arrangement, a central portion 252 of the conductive element 250 has a width W1 along the Y1-Y2 axis or direction as viewed in FIGS. 2A-2C, a first side portion 253 has an outer width W2 along the Y1-Y2 axis or direction as viewed in FIGS. 2A-2C that is greater than the width W1, and a second side portion 254, on an opposite side of the device 200 than the first side portion 253, that has an outer width W3 along the Y1 -Y2 axis or direction as viewed in FIG. 3 that is greater than the width W1, and may be the same as the width W2. The conductive element 250 may have a generally rectangular shape between the first side portion 253 and second side portion 254.

[0064] As shown in FIGS. 2A-2C, according to an aspect of the invention, the conductive element 250 has an increased thickness area 259 having an increased first thickness T1′ along the Z1-Z2 axis or direction as shown in FIG. 2C, as compared to the second thickness T2′ and the third thickness T3′ of other portions of the conductive material such as the lead portions, including first inner lead portion 255 and second inner lead portion 257, adjacent the outer sides ends 274, 275 of the conductive element 250. In this configuration, substantially the entirety of the conductive element having the “barbell”-shape may have an increased first thickness T1′. It is appreciated that a portion of the conductive element having an increased thickness area can also be less than the entirety of the conductive element having the “barbell”-shape. It is noted that the conductive element 250 is not wound around an axis.

[0065] While a finished electro-magnetic device according to the invention may be formed without a core body, as shown in FIGS. 2A-2C, in an aspect of the invention, a finished electro-magnetic device 200 such as an inductor may include a body 233, or core body, shown in partial transparency formed about, pressed over or otherwise housing or surrounding the conductive element 250 and at least parts of the leads 240a, 240b. The body 233 and may be formed having an upper or top surface 234 and an opposite lower or bottom surface 235, a first side 236 and an opposite second side 237, and a first lateral side lateral side 270 adjacent the first lead 240a (or “lead portion”) and an opposite second lateral side 272 adjacent the second lead 240b (or “lead portion”). The body may be formed as a first body portion 210 and a second body portion 220. The first body portion 210 and a second body portion 220 sandwich, are pressed around or otherwise house the conductive element 150 and parts of the leads 240a and 240b to form the finished inductor 200. When compressed around the conductive element and portions of the leads, the first body portion 210 and a second body portion 220 may be considered as a single, unitary compressed body form from a core material or core materials.

[0066] The first body portion 210 and second body portion 220 surround the conductive element and parts of the leads and may be pressed or over-molded around the conductive element 250, initially leaving exposed parts of the leads 240a and 240b until they are folded underneath first body portion 210 as shown in their final state in the partially transparent examples of FIGS. 2A-2C. In a finished electro-magnetic device or “part,” each lead 240a and 240b may run along sides 270, 272 of the first body portion 210 as shown in FIGS. 2A-2C. The first lead lead 240a may terminate with a first contact portion 230a, and the second lead 240b may terminate with a second contact portion 230b, each contact portion bent underneath the lower surface 235 of the body 233, such as the first body portion 210, as shown in FIGS. 2A-2C.

[0067] Methods of making the electro-magnetic devices as illustrated, by way of example, in FIGS. 1A-2C, or FIG. 14-16, or similar electro-magnetic devices having multi-thickness elements, or multi-thickness templates that may be used in forming the electro-magnetic devices illustrated in FIGS. 1A-2C, in FIGS. 1A-2C, or FIGS. 14-16, or similar electro-magnetic devices, will now be described. In some aspects, the templates may be formed as lead frames.

[0068] In an aspect of the invention, a method of making an electro-magnetic device is illustrated via a flowchart provided in FIG. 3.

[0069] At step 1010, a conductive material is provided. The conductive material may be heated to form a molten conductive material to be shaped as described herein. Examples of conductive material that may be used include, but are not limited to, copper, steel, aluminum, zinc, bronze, or combinations or alloys of those. Examples of conductive material that may be used further include conductive materials provided in wire form, such as copper wire, aluminum wire, and platinum wire.

[0070] At step 1012, the conductive material is extruded via a metal extrusion process to form a multi-thickness sheet, such as extruding the heated or molten conductive material through an opening of a selected shape. An extrusion process may comprise forcing a near-molten or heated conductive material, such as a metal, through a die having a desired profile or shape. FIGS. 5A and 5B illustrate a multi-thickness sheet 310, having a central area 312 having an increased thickness area 314 having an increased first thickness TH1, a first outer side portion 316 adjacent a first side 318 of the increased thickness area 314 having a second thickness TH2 that is less than the thickness TH1, and a second outer side portion 320 adjacent a second side 322 of the increased thickness area 314 having a third thickness TH3 that is less than the thickness TH1. As shown the first outer side portion 316 and second outer side portion 320 may be on opposite sides of the increased thickness area 314. The multi-thickness sheet 310 is used to form a template, as further described.

[0071] At step 1014, the multi-thickness sheet 310 may be plated, using an electro- plating or similar process, with nickel as a first layer, and tin applied on top of the nickel as a second layer. Known plating methods may be used to apply the nickel and tin layers. These layers provide for increased solderability.

[0072] At step 1016, the multi-thickness sheet 310 is stamped or otherwise machined or shaped to form a multi-thickness template 322 for use in an electro-magnetic device, such as shown in FIGS. 1A-1C. FIG. 6 illustrates a multi-thickness template 322 having a conductive element 150 according to the arrangements as illustrated in FIGS. 1A-1C, although it is appreciated that conductive elements of various shapes can be formed without departing from the teachings herein. When stamped or otherwise machined, the template 322 comprises an increased thickness area associated with the increased thickness area 314 having an increased thickness TH1 of the multi-thickness sheet 310 used to form the template 322. The conductive element 150 may be located in a central or inner area of the template.

[0073] While more than one conductive element is shown by way of example in FIG. 6, a template may be provided where only a single conductive element is provided. In addition, more than two, or any number, of conductive elements may be provided by a template.

[0074] It is noted that steps 1014 and 1016 may be performed in any order. For example, the multi-thickness sheet 310 may be formed multi-thickness template 322 according to step 1016, and them plated according to step 1014.

[0075] As shown in FIG. 6, the template 322 includes leads 140a, 140b connected to the conductive element 150, with the areas forming the leads 140a, 140b associated with the first outer side portion 316 having a thickness TH2, and the second outer side portion 320 a having a third thickness TH3. Therefore, the leads 140a and 140b each have a thickness that is less than the increased thickness TH1 of the conductive element 150. The first inner lead portion 156 and the second inner lead portion 157 adjacent the conductive element 150 allow for ease in forming the leads, such as by bending. As the leads are of a decreased thickness, those areas are easier to bend and form surface mount leads without cracking or breaking. As shown in FIGS. 1B and 6, the leads 140a, 140b may have a width along the Y1-Y2 axis or direction that is less than a width of the conductive element 150.

[0076] As shown for example in FIGS. 1A-1C and FIG. 6, the first inner lead portion 156 of the first lead 140a, and the second inner portion 157 of the second lead 140b may have a width (along the Y1-Y2 axis or direction) that is narrower or less than the width of the other portions of the leads 140a, 140b, such as the first surface mount contact portion 130a and the second surface mount contact portion 130b.

[0077] The upper surface of the conductive element 150 may be formed so as to lie essentially in or along a plane. The lower surface of the conductive element 150 may be formed so as to lie essentially in or along a plane. The upper or lower surfaces of the conductive element may be generally flat.

[0078] The leads 140a, 140a may be formed so as to have upper or lower surfaces that lie essentially in or along a plane. The upper or lower surfaces of the leads 140a, 140b may be generally flat.

[0079] As shown in FIG. 6, the template 322 may be formed as a lead frame, and may comprise at least first and second carrier strips 324, 326 at opposite outer portions of the lead fame 322. The carrier strips 324, 326 may have progressive holes 328 used for alignment in connection with manufacturing equipment. The carrier strips 324, 326 may therefore be considered optional.

[0080] It is noted that the conductive element 150 and leads 140a, 140b, as well as the carrier strips 324, 326 if present, are all formed from the same piece of conductive material, that has been pre-shaped to provide for a conductive element 150 having an increased thickness as compared to the thickness of leads 140a, 140b. The conductive element 150 is formed in a preselected shape without the need for winding or turning a metal strip or wire. No portion of the conductive element 150 crosses over or under another portion of the conductive element 150. The inductance of electro-magnetic devices according to the teachings herein can be adjusted by, for example: changing the thickness, width, shape, or other dimensions, of the conductive elements; changing the core materials; increasing or decreasing the thickness of the core material; changing the density of the core material such as by hot or cold pression; and/or the positioning of the conductive element within the core body.

[0081] It is further noted that FIG. 15 may also be considered as showing a template for an electro-magnetic device, that may be further formed, such as by trimming or bending the leads 140a′, 140b′. In this instance, the template would be formed by stamping a multi-thickness conductive material into the shape shown in FIG. 15.

[0082] At step 1018, where the device is to have a core body, one or more core materials, and preferably a core material comprising an iron and/or ferrite powder, are pressed around the conductive element 150 and portions of the leads 140a, 140b, including the first inner lead portion 156 and the second inner lead portion 157, to form the body 133. To form the body 133, the plated template 322 may be inserted into a compacting press where one or more core materials are pressed around the coil portion of the leadframe in a desired shape, such as, for example, a generally rectangular shape, although as shown, the shape may include rounded corners or edges. FIG. 7 illustrates the template 322 with an illustration of the body 133 shown in partial transparency, and showing the body formed around the conductive element 150 and portions of the leads 140a, 140b. It is note that step 1018 may be optional if an electro-magnetic device is to be formed without a core body.

[0083] At step 1020, portions of the template adjacent the leads are trimmed to selected sizes and positioned around the body 133 to form surface mount leads, which are desirable for modern circuit board assembly processes. At least portions of each of the leads 140a, 140b are positioned along side surfaces of the body 133, and at least the end portions 130 of the leads 140a, 140b are bent under and positioned along portions of the bottom surface 135 of the body 133. An example of a finished electro-magnetic device 100 is shown in FIG. 1A, as previously described.

[0084] FIG. 8 illustrates a template 330 which may be formed according to the steps illustrated in FIG. 3 and associated with the electro-magnetic device having a conductive element 250 as shown in FIGS. 2A-2C. As shown in FIG. 8, the template 330 includes a conductive element 250 comprising a straight conductive element provided as an “I” or “H” shaped conductive element, or one having a “barbell” shape, when viewed from the top. The template may be formed following the steps previously outlined in FIG. 3 and described above. At step 1016, the selected shape of the conductive element 250 is that as shown in FIGS. 2A-2C.

[0085] As shown in FIG. 8, the template 330 includes the conductive element 250, as well as leads 240a, 240b. If the template 330 is formed as a lead frame, for example, carrier strips 332, 334 may be provided. The conductive element 250 and leads 240a, 240b, are all formed from the same single piece of conductive material. The carrier strips 332, 334 may have progressive holes 336 used for alignment in connection with manufacturing equipment. The conductive element 250 may be formed having an increased thickness area 280 with a thickness TH1a. The first lead 240a has a thickness TH2a, and the second lead 240b has a third thickness TH3a. Therefore, the leads 240a, 240b each have a thickness that is less than the increased thickness TH1a of the conductive element 150. The first inner lead portion 255 and the second inner lead portion 257 adjacent the conductive element 150 have a decreased thickness allowing for ease in forming the leads, such as by bending. As the leads are of a decreased thickness, those areas are easier to bend and form surface mount leads without cracking or breaking. As shown for example in FIGS. 2B and 8, the first inner lead portion 255 and the second inner lead portion 257 may have widths (along the Y1-Y2 axis or direction) that are narrower or less than the widths of the other portions of the leads 240a, 240b, such as the first surface mount contact portion 230a, or the second surface mount contact portion 230b.

[0086] A skiving or cutting process may also be used to make an electro-magnetic device according to aspects of the invention. A skiving process uses a cutting blade to skim away material.

[0087] In an aspect of the invention, a method of making an electro-magnetic device is illustrated via a flowchart provided in FIG. 9. At step 2010, a sheet of conductive material is provided as the starting material, which may be formed from a conductive material such as through a rolling or press process. FIG. 4 illustrates an exemplary sheet 300 of conductive material. The term “sheet” is used to also capture the concept of a sheet or plate or strip of piece of conductive material to be used as a starting material for forming a template of the invention. Preferably, the sheet 300 of conductive material comprises a metal such as copper. Examples of conductive material that may be used to form the sheet 300 include, but are not limited to, copper, steel, aluminum, zinc, bronze, or combinations or alloys of those. The thickness of the metal sheet may be selected such that the thickness is that of the increased thickness area of the conductive element to be formed from the sheet. It is further contemplated that the conductive material can be formed or provided as, or may start as, a rod, wire, or other arrangement or shaped that can be processed or formed according to teachings herein without departing from aspects of the invention. Thus, while a sheet is used as an example, other conductive materials having other shapes can be used to form the electro-magnetic devices as shown and described.

[0088] At step 2012, a skiving process is performed whereby the sheet is cut with a blade to form a multi-thickness sheet 410.

[0089] FIG. 10 illustrates a cutting blade 437 having a raised central cutting portion 439 shown in the process of cutting a sheet of conductive material to form a multi- thickness sheet 410. The resultant multi-thickness sheet 410 has a central area 412 provided as an increased thickness area having an increased thickness, a first outer side portion 416 adjacent a first side 418 of the increased thickness area 414 having a second thickness that is less than the thickness of the central area 412, and a second outer side portion 420 adjacent a second side 422 of the increased thickness area 414 having a third thickness that is less than the thickness of the central area but may be equal to the thickness of the first outer side portion 416. As shown the first outer side portion 416 and second outer side portion 420 may be on opposite sides of the increased thickness area 414. The multi-thickness sheet 410 is used to form a template, as further described.

[0090] At step 2014, the multi-thickness sheet may be plated, using an electro-plating or similar process, with nickel as a first layer, and then tin on top of the nickel as a second layer.

[0091] At step 2016, the multi-thickness sheet 410 is stamped or otherwise machined to form a multi-thickness template for use in an electro-magnetic device, such as shown in FIGS. 1A-1C. A this stage, the process provides for a FIG. a multi-thickness template such as shown in FIG. 6.

[0092] At step 2018, one or more core materials, and preferably a core material comprising an iron and/or ferrite powder, are pressed around the conductive element and portions of the leads including the first inner lead portion and the second inner lead portion, to form the body. At this stage, FIG. 7, discussed previously, illustrated the body 133 formed around portions of the template. Step 2018 may be optional if a core body is not desired.

[0093] At step 2020, portions of the template adjacent the leads are trimmed to selected sizes and positioned around the body to form surface mount leads, which are desirable for modern circuit board assembly processes. At least portions of each of the leads are positioned along side surfaces of the body, and at least the end portions of the leads are bent under and positioned along portions of the bottom surface of the body. An illustrative final electro-magnetic device 100 is shown in FIG. 1A, as previously described.

[0094] The skiving process described may also be used to form an electromagnetic design having the arrangement as illustrated in FIGS. 2A-2C. The skiving process described may also be used to form conductive elements having various shapes, sized, orientations, and/or arrangements.

[0095] A swaging and/or pressing and/or flattening process may also be used to form an electro-magnetic device according to aspects of the invention.

[0096] In an aspect of the invention, a method of making an electro-magnetic device is illustrated via a flowchart provided in FIG. 11. At step 3010, a sheet of conductive material is provided as the starting material. The sheet 300 shown in FIG. 4 illustrates such an exemplary sheet of conductive material.

[0097] At step 3012, the sheet may be plated, using an electro-plating or similar process, with nickel as a first layer, and then tin on top of the nickel as a second layer. In this aspect, the sheet is of a uniform thickness at this stage of the process. The thickness represents an increased thickness of the conductive element, as discussed further.

[0098] At step 3014, a stamping or other machining process is performed in order to form a template of a uniform thickness.

[0099] FIG. 12 illustrates a template 500 in the process of formation, including a shaped conductive element 520, a first lead 530a, a second lead 530b, all formed from the same single piece of conductive material forming the sheet. If the template 500 is formed as a lead frame, carrier strips 540, 542 may be provided. The carrier strips 540, 542, may have progressive holes 544 used for alignment in connection with manufacturing equipment.

[0100] To obtain a multi-thickness template, in step 3016, the first lead 530a and the second lead 530b, or portions of each of those, are flattened, such as by swaging or pressing.

[0101] FIG. 13 illustrates a detailed view of a portion of the template 500, with the first lead 530a and the second lead 530b flattened or compressed, thereby providing the leads with a decreased thickness as compared to the thickness of the conductive element 520. Different processes could be used for producing the decreased thickness portions, such as, for example, stamping, coining, roll forming, or milling.

[0102] Upon flattening the first lead 530a and the second lead 530b, the template 500 with the conductive element 520 having a central area 512 formed as an increased thickness area 514 having a thickness of the original sheet, the first lead 530a having a decreased thickness that is less than the thickness of the central area 512, and the second lead 530b having a decreased thickness that is less than the thickness central area 512, but may be the same thickness as the first lead 530a. The carrier strips 540, 542 may have the same thickness as the conductive element 520 if those areas are not also flattened.

[0103] At step 3018, one or more core materials, and preferably a core material comprising an iron and/or ferrite powder, are pressed around the conductive element 520 and portions of the leads 530a, 530b to form the body 546. To form the body 546, the plated template 520 may be inserted into a compacting press where the one or more core materials are pressed around the coil portion of the leadframe in a desired shape, such as, for example, a generally rectangular shape, although as shown, the shape may include rounded corners or edges. At this stage, the lead body and frame are arranged similarly to FIG. 7 described previously. Step 3018 may be optional if no core body is desired.

[0104] At step 3020, portions of the template adjacent the leads are trimmed to selected sizes and positioned around the body 546 to form surface mount leads, which are desirable for modern circuit board assembly processes. At least portions of each of the leads 530a, 530b are positioned along the side surfaces of the body 133, and at least the end portions of the leads 530a, 530b are bent under and positioned along portions of the bottom surface of the body 546.

[0105] It is contemplated that the steps used in FIG. 11 may be employed to form a template including a conductive element comprising a straight conductive element provided as an “I” or “H” shaped conductive element, or one having a “barbell” shape, when viewed from the top, such as in FIGS. 2A-2C.

[0106] Further, a conductive element having an increased thickness area could be formed by starting with a generally uniform thickness template such as shown in FIG. 12, and building up the conductive element 520 by plating. For example, copper plating could be plated over or on top of the conductive element 520 until a certain thickness is achieved. This “build up” process could be accomplished by, for example, 3D printing a plating material, or by otherwise depositing metal using methods known to the metal working industry (e.g., sputtering, etc.) onto the conductive element 520.

[0107] The methods described herein can also be used to form an electro- magnetic device having a shaped conductive element that has a reduced thickness as compared to the thicknesses of one or more of the leads. For example, referring to FIG. 3, as step 1012, the extrusion process may form a multi-thickness sheet, where the central portion of the sheet has a decreased thickness, and the outer sides of the sheet have a thickness greater than the central portion. By way of further example, referring to 9, at step 2012, the skiving process may form a multi-thickness sheet, where the central portion of the sheet has a decreased thickness, and the outer sides of the sheet have a thickness greater than the central portion. By way of further example, referring to FIG. 11, at step 3016, the flattening process may flatten the conductive element rather than the leads, creating a conductive element of a decreased thickness as compared to the leads.

[0108] Thus, as illustrated by way of example in FIG. 16, a template 700 has been stamped from a uniform thickness piece of conductive material, such as a sheet as shown in FIG. 4. The stamping or other forming process forms a conductive element 750, which may be a serpentine conductive element, a first lead 740a, and a second lead 740a, all formed from the same piece of conductive material. In this aspect, the conductive element 750 is stamped, pressed, swaged, or skived, to produce an electro-magnetic device having a conductive element of a decreased thickness, as compared to the leads 740a, 740b. The conductive element 750 may be serpentine, barbell shaped, or another selected shape, and may be generally flat, with one or more surfaces lying along or in a plane. The leads 740a, 740b may be bent or trimmed as known in the art or as described herein. A core body may be molded around the conductive element 750 and portions of the leads.

[0109] The conductive material or sheet of conductive material may be formed such that the area to be used for forming a conductive element may have a different hardness than the area to be used for forming the first lead portion or the second lead portion. For example, a first portion of the conductive material may have a first hardness (e.g., half hard) and a second portion of the conductive material may have a second hardness (e.g., annealed soft). Alternately, a first portion of the conductive material may have a first hardness (e.g., Hardness Vickers 100 HV10) and a second portion of the conductive material may have a second hardness (e.g., Hardness Vickers 30 HV10).

[0110] It is appreciated that the surfaces of the conductive elements and/or leads described herein may be somewhat or slightly rounded, bowed or curved based on the process used to form the conductive element, and the side edges may be rounded or curved or bowed. Acceptable metals used for forming the conductive element and leads may be copper, aluminum, platinum, or other metals for use as electro-magnetic conductive elements as are known in the art. As used herein, “flat” means “generally flat,” i.e., within normal manufacturing tolerances. It is appreciated that the flat surfaces of the conductive element and/or leads may be somewhat or slightly rounded, bowed, curved or wavy based on the process used to form the conductive element, and the side edges may be somewhat or slightly rounded, bowed, curved or wavy, while still being considered to be “flat.”

[0111] The increased thickness portions or areas of the conductive elements described herein act to decrease the direct current resistance (DCR) of an electro-magnetic device such as an inductor comprising such conductive elements.

[0112] The templates described herein provide for multiple thicknesses, in a single unitary piece. The templates described herein may also be formed by 3D printing techniques.

[0113] The decreased thickness areas of the leads or lead portions of the templates allow for ease in forming the leads, such as by shaping and/or bending. In addition, the thinner yet wide lead portions provide for improved heat transfer when mounted to a circuit board, and further provide for improved mounting strength with resistance from shock and vibration due to the width of the surface mount leads or terminations.

[0114] It will be appreciated that the foregoing is presented by way of illustration only and not by way of any limitation. It is contemplated that various alternatives and modifications may be made to the described embodiments without departing from the spirit and scope of the invention. Having thus described the present invention in detail, it is to be appreciated and will be apparent to those skilled in the art that many physical changes, only a few of which are exemplified in the detailed description of the invention, could be made without altering the inventive concepts and principles embodied therein. It is also to be appreciated that numerous embodiments incorporating only part of the preferred embodiment are possible which do not alter, with respect to those parts, the inventive concepts and principles embodied therein. The present embodiment and optional configurations are therefore to be considered in all respects as exemplary and/or illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all alternate embodiments and changes to this embodiment which come within the meaning and range of equivalency of said claims are therefore to be embraced therein.