COPPER ALLOY WIRE AND MANUFACTURING METHOD THEREOF

Abstract

A copper alloy wire and a manufacturing method thereof are provided. The copper alloy wire includes: by weight percentage of components, 0.3 to 0.45 of silver (Ag), 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities. The method for manufacturing the copper alloy wire is performing two-phase vacuum melting: first performing vacuum electric arc melting into a copper-titanium mother alloy, and then performing vacuum induction melting with remaining components into a copper alloy wire material by means of continuous casting; then drawing the copper alloy wire material into a copper alloy fine wire by a non-slip wire drawing device in a material even-flow wire drawing manner, and finally performing thermal treatment on the copper alloy fine wire by using argon as a protection gas, so as to complete a process of the copper alloy wire.

Claims

1. A method for manufacturing a copper alloy wire, comprising: performing a vacuum melting step: melting titanium, silver, and copper into a molten copper alloy; performing a continuous casting step: manufacturing the molten copper alloy into a copper alloy wire material; performing a wire drawing step: drawing the copper alloy wire material into a copper alloy fine wire; and performing a thermal treatment step: performing thermal treatment on the copper alloy fine wire under a condition that an annealing temperature is ranged from 580 C. to 700 C.

2. The method for manufacturing a copper alloy wire according to claim 1, wherein the copper alloy wire comprises: by weight percentage of the copper alloy wire, 0.3 to 0.45 of silver, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities.

3. The method for manufacturing a copper alloy wire according to claim 1, wherein in the vacuum melting step, two-phase melting is performed in a vacuum manner and comprises steps of: first melting a total share of titanium and a partial share of copper into a copper-titanium mother alloy by means of electric arc melting, and then melting the copper-titanium mother alloy with a total share of silver and a remaining share of copper together into the molten copper alloy by means of induction melting.

4. The method for manufacturing a copper alloy wire according to claim 3, wherein the partial share of copper uses copper with a purity greater than 4N.

5. The method for manufacturing a copper alloy wire according to claim 3, wherein the remaining share of copper uses copper with a purity greater than 4N.

6. The method for manufacturing a copper alloy wire according to claim 1, wherein a wire diameter of the copper alloy wire material ranges between 4 mm and 8 mm.

7. The method for manufacturing a copper alloy wire according to claim 1, wherein a wire diameter of the copper alloy fine wire ranges between 10 m and 20 m.

8. The method for manufacturing a copper alloy wire according to claim 1, wherein the copper alloy wire material is drawn into the copper alloy fine wire by a wire drawing device.

9. The method for manufacturing a copper alloy wire according to claim 8, wherein the wire drawing device comprises a non-slip wire drawing device.

10. The method for manufacturing a copper alloy wire according to claim 9, wherein in the wire drawing step, the non-slip wire drawing device comprises a tension control apparatus and an eye mold, and the tension control apparatus is configured to increase a back drawing force of the copper alloy wire material behind the eye mold.

11. The method for manufacturing a copper alloy wire according to claim 9, wherein the non-slip wire drawing device performs a wire drawing process on the copper alloy wire material at a speed of 100 to 1000 m/min at room temperature.

12. The method for manufacturing a copper alloy wire according to claim 8, wherein coarse drawing, medium drawing and fine drawing of the wire drawing device are performed on the copper alloy wire material into the copper alloy fine wire.

13. The method for manufacturing a copper alloy wire according to claim 1, wherein the thermal treatment for annealing time of greater than 0.1 second is performed on the copper alloy fine wire.

14. The method for manufacturing a copper alloy wire according to claim 1, wherein a protection gas is used in the thermal treatment process.

15. The method for manufacturing a copper alloy wire according to claim 14, wherein argon is used as the protection gas in the thermal treatment process.

16. The method for manufacturing a copper alloy wire according to claim 1, wherein the copper alloy wire, only consisting of the following elements: by weight percentage of components, 0.3 to 0.45 of silver, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities.

17. A method for manufacturing a copper alloy wire, comprising: melting titanium, silver, and copper under a vacuum manner into a molten copper alloy; manufacturing the molten copper alloy into a copper alloy wire material; drawing the copper alloy wire material into a copper alloy fine wire; and performing a thermal treatment on the copper alloy fine wire under an annealing temperature.

18. The method for manufacturing a copper alloy wire according to claim 17, wherein the annealing temperature is ranged from 580 C. to 700 C.

19. The method for manufacturing a copper alloy wire according to claim 17, wherein the step of melting titanium, silver, and copper comprises steps of: first melting a total share of titanium and a partial share of copper into a copper-titanium mother alloy by means of electric arc melting, and then melting the copper-titanium mother alloy with a total share of silver and a remaining share of copper together into the molten copper alloy by means of induction melting.

20. The method for manufacturing a copper alloy wire according to claim 17, wherein the copper alloy wire material is drawn into the copper alloy fine wire by a wire drawing device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the disclosure, and wherein:

[0019] FIG. 1A is a schematic diagram of main components and first-phase melting of the present disclosure;

[0020] FIG. 1B is a schematic diagram of main components and second-phase melting of the present disclosure;

[0021] FIG. 2A is a flowchart of steps of a manufacturing method of the present disclosure;

[0022] FIG. 2B is a flowchart of a vacuum melting step of the present disclosure;

[0023] FIG. 2C is a flowchart of a wire drawing step of the present disclosure;

[0024] FIG. 2D is a flowchart of a thermal treatment step of the present disclosure; and

[0025] FIG. 3 is a schematic diagram of a non-slip wire drawing device of the present disclosure.

DETAILED DESCRIPTION

[0026] First, referring to FIG. 1A and FIG. 1B at the same time, FIG. 1A and FIG. 1B are components and a melting manner of a copper alloy wire of the present disclosure, and the copper alloy wire of the present disclosure is manufactured in a vacuum melting manner using the following weight percentage of components: copper, silver (Ag), and titanium: 0.3 to 0.45 of silver (Ag), 0.01 to 0.02 of titanium, and a remaining part of copper.

[0027] Because a melting point of titanium metal is 1668 C., which is higher than a melting point of 1085 C. of copper and a melting point of 961.8 C. of silver (Ag) by almost 600 to 700 C., to prevent titanium metal from being unevenly distributed in the molten copper alloy for casting owing to incomplete melting. Two-phase melting is used in a vacuum melting phase: first, as shown in FIG. 1A, a total share of titanium A and a partial share of copper B1 are melted to a copper-titanium mother alloy 100 having a low melting point by means of vacuum electric arc melting; and then as shown in FIG. 1B, the copper-titanium mother alloy 100, a total share of silver (Ag) C and a remaining share of copper B2 are melted together to a molten copper alloy 100 by means of induction melting. The foregoing partial share of copper B1 and the remaining share of copper B2 both use copper with a purity greater than 4N.

[0028] However, the copper alloy wire of the present disclosure is manufactured in the following steps: manufacturing a copper alloy wire material by means of continuous casting in a vacuum melting manner shown in FIG. 2A, and then performing drawing on the copper alloy wire material by a wire drawing device into a copper alloy fine wire, and finally performing thermal treatment to complete a process of the copper alloy wire, and the steps are as follows:

[0029] step S10: perform two-phase melting in vacuum state (e.g., melting titanium, silver, and copper under a vacuum manner into a molten copper alloy);

[0030] step S20: manufacture the molten copper alloy into a copper alloy wire material by means of continuous casting;

[0031] step S30: perform drawing the copper alloy wire material to obtain a copper alloy fine wire by a wire drawing device; and

[0032] step S40: perform thermal treatment on the copper alloy fine wire under an annealing temperature (e.g., the annealing time is greater than 0.1 second, and the annealing temperature is ranged from 580 to 700 C.

[0033] According to FIG. 2B, it can be further known that two-phase melting mentioned in step S10 is divided into step S11 in a first phase and step S11 in a second phase, and description is stated as follows.

[0034] Step S11: melt a total share of titanium and a partial share of copper into a copper-titanium mother alloy having a low melting point by means of vacuum electric arc melting. In detail, when titanium having a melting point of 1668 C. is put into a copper metal liquid having a melting point of 1085 C., the copper metal liquid cannot make titanium metal completely melted therein, and therefore in step S11, titanium to be melted and partial copper are first placed in a crucible, which is vacuumized, so that a pollution source in air is reduced in a melting process. Then, titanium and copper in the crucible are directly heated and melted by electric arcs generated by a stun rod, so that copper and titanium are first melted into a copper-titanium mother alloy having a melting point closer to that of copper. An objective of this step lies in preventing titanium metal having a high melting point from being melted into a copper alloy wire with remaining components in state of incomplete melting or uneven melting, and consequently, distribution of titanium metal in the copper alloy is uneven, resulting in a case in which inoxidizability of the copper alloy is unsatisfactory.

[0035] Step S12: melt the copper-titanium mother alloy with a total share of silver (Ag) and a remaining share of copper together into a molten copper alloy by means of induction melting.

[0036] In step S20 (as shown in FIG. 2A), the molten copper alloy is casted from the even molten copper alloy into a copper alloy wire material with a wire diameter ranging between 8 mm and 4 mm by means of continuous casting; in this step of melting into a wire material, based on physical characteristics, casting costs and convenience of the wire material, a continuous casting process that directly pours the copper alloy molten liquid into a constantly vibrated and cooled casting die body to generate continuous wire materials is used.

[0037] Next, in step S30, coarse drawing, medium drawing, and fine drawing are performed on the copper alloy wire material with the wire diameter ranging between 8 mm and 4 mm by the wire drawing device at a speed of 100 to 1000 m/min at room temperature into a copper alloy fine wire with a wire diameter ranging between 10 m and 20 m.

[0038] In an embodiment, the non-slip wire drawing device in step S31 shown in FIG. 2C can be used to perform wire drawing on the copper alloy wire material. For example, referring to FIG. 3, in the wire drawing step, the non-slip wire drawing device 300 includes a tension control apparatus 301 and an eye mold 302, and the tension control apparatus 301 (for example, a tension rod) is configured to increase a back drawing force of the copper alloy wire 303 behind the eye mold 302, so that flowing uniformity of a wire central material is improved to a better mechanical property, and common broken wire problems derived from sector defects in general wire drawing are reduced.

[0039] In step S40: after wire drawing, thermal treatment at an annealing temperature of 580 to 700 C. for annealing time of greater than 0.1 second is performed on the copper alloy fine wire, so as to complete a process of the copper alloy wire. Grains on a surface of the copper alloy fine wire drawn by the non-slip wire drawing device can still maintain arrangement with both even sizes and even distribution, and therefore, flowing uniformity in the wire after thermal treatment is good, and mechanical properties of the wire may be optimized to make the wire have better ductility to facilitate encapsulation welding work. Upon measurement verification, a breaking level (B.L.) and an elongation level of the copper alloy wire of the present disclosure can be increased. In an embodiment, a problem that a copper alloy wire is easily oxidized can be improved by using argon in place of common nitrogen as a protection gas in thermal treatment in step S41 shown in FIG. 2D.

[0040] Referring to table I, table I lists examples 1 to 4 with different ratios of components of the present disclosure, and components by weight percentage are as follows:

TABLE-US-00001 TABLE I Silver (Ag) Titanium (Ti) Copper (Cu) Example 1 0.45 0.02 Remaining part Example 2 0.45 0.01 Remaining part Example 3 0.3 0.01 Remaining part Example 4 0.3 0.02 Remaining part

[0041] The present disclosure adds titanium in components, so as to improve an antioxidant capacity of the copper alloy wire, thereby improving easy oxidization in use, which leads to lack of wire attributes, of the copper wire. The present disclosure adds silver (Ag) in components, so as to improve weldability of a pure copper wire. The conventional pure copper wire into which silver (Ag) is not added has cases in which ballability is poor and a copper ball easily detaches, but the claimed copper alloy wire into which silver (Ag) metal is added can form an intermetallic compound (IMC) layer having high welding strength in welding, and has performances better than the conventional pure copper wire in the breaking level (B.L.) and the elongation level (E.L.).

[0042] Referring to table II, table II is a table of differences between examples 1 to 4 of the present disclosure and a 6N pure copper wire in the breaking level (B.L.) and the elongation level (E.L.), and the differences are listed below:

TABLE-US-00002 TABLE II Presentation data of a 6N pure copper wire in the breaking level (B.L.) and the elongation level (E.L.) Breaking level (B.L.) Elongation level (E.L.) 4.34 g 9.87% 4.23 g 8.69% 4.14 g 9.08% 4.24 g 9.21% Presentation data of the present disclosure in the breaking level (B.L.) and the elongation level (E.L.) Breaking level (B.L.) Elongation level (E.L.) Example 1 6.07 g 11.76% Example 2 5.60 g 12.18% Example 3 5.82 g 12.02% Example 4 5.83 g 12.01%

[0043] Based on the above, the present disclosure can achieve the following effects:

[0044] 1. Adding silver (Ag) and titanium in trace elements, so as to improve weldability and an antioxidant capacity of a copper wire;

[0045] 2. Performing vacuum continuous casting on a manufacturing device, and making a wire have good quality and high cleanness in combination with a wire drawing process of a non-slip wire drawing device; and

[0046] 3. Optimizing mechanical properties of the copper wire itself under thermal treatment conditions at a specific temperature for specific time.

[0047] The foregoing implementation manners or examples of the technical means used in the present disclosure are not intended to limit the implementation scope of the present patent for invention. Equal variations and modifications that accord with literary content of the patent application scope of the present disclosure or that are made according to the scope of the present disclosure patent are covered by the scope of the present disclosure patent.