Bond pattern for substrate

D0973200 ยท 2022-12-20

Assignee

Inventors

Cpc classification

International classification

Abstract

Claims

The ornamental design for the bond pattern for a substrate, as shown and described above.

Description

(1) FIG. 1 is a perspective view of a bond pattern for a substrate;

(2) FIG. 2 is a view of the front side of the bond pattern for a substrate of FIG. 1;

(3) FIG. 3 is a view of the right side of the bond pattern for a substrate of FIG. 1;

(4) FIG. 4 is a view of the back side of the bond pattern for a substrate of FIG. 1;

(5) FIG. 5 is a view of the left side of the bond pattern for a substrate of FIG. 1;

(6) FIG. 6 is a view of the top side of the bond pattern for a substrate of FIG. 1; and,

(7) FIG. 7 is a view of the bottom side of the bond pattern for a substrate of FIG. 1.

(8) The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.