Bond pattern for substrate
D0973200 ยท 2022-12-20
Assignee
Inventors
- Ray Dennis DRIA (Mason, OH, US)
- Michael Joseph PAGE (Cincinnati, OH, US)
- Joseph Leslie GROLMES (Madeira, OH, US)
- Scott Alan KING (Liberty Township, OH, US)
- Matthew Steven RITTER (Liberty Township, OH, US)
- Christopher Colin ARP (Mason, OH, US)
Cpc classification
A61F13/515
HUMAN NECESSITIES
A61F13/15756
HUMAN NECESSITIES
A61F13/15699
HUMAN NECESSITIES
A61F13/514
HUMAN NECESSITIES
A61F13/511
HUMAN NECESSITIES
A61F13/55115
HUMAN NECESSITIES
International classification
Abstract
Claims
The ornamental design for the bond pattern for a substrate, as shown and described above.
Description
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(8) The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.