Atmospheric pressure linear rf plasma source for surface modification and treatment
11533801 · 2022-12-20
Assignee
Inventors
Cpc classification
H05H1/46
ELECTRICITY
H01J37/321
ELECTRICITY
H05H1/2406
ELECTRICITY
H01J37/32174
ELECTRICITY
International classification
Abstract
An atmospheric pressure linear RF plasma source having an enclosure enclosing a chamber in the form of an extended slot having a width W, a length L, and a thickness T, with W≥20T, the enclosure having a top opening for receiving a flow of a working gas in the direction of the length L and a bottom opening for delivering a flow of plasma, with the bottom opening being open to atmospheric pressure. Then walls of the enclosure comprise a dielectric material. Two mutually opposing pancake coils are positioned on opposite sides of the enclosure and are capable of being driven by an RF power source in an opposing phase relationship. Alternatively, an elongated solenoid coil may surround the enclosure.
Claims
1. An atmospheric pressure linear RF plasma source comprising: an enclosure enclosing a chamber in the form of an extended slot, the slot having a width W, a length L, and a thickness T, with W≥20T, the enclosure having two opposing major walls enclosing the slot in a direction of the thickness of the slot, and two opposing minor walls enclosing the slot in a direction of the width of the slot, the enclosure having a top opening communicating with the slot for receiving a flow of a gas, the enclosure having a bottom opening communicating with the slot for delivering a flow of plasma, the bottom opening being open to atmospheric pressure, the enclosure having an interior surface comprising surfaces facing the slot of each of the major and minor walls and an exterior surface comprising surfaces facing away from the slot of each of the major and minor walls, the two major walls of the enclosure comprising a dielectric material; and two or more pairs of pancake coils connected to each other in a planar arrangement on the enclosure, each pair comprising a first and a second pancake coil positioned in an opposing relationship on opposite sides of the enclosure adjacent to the surfaces of the major walls corresponding to the exterior surface.
2. The source according to claim 1 further comprising an RF power source connected to each opposing first pancake coil and second pancake coil and structured and arranged so as to be able to drive each opposing first pancake coil and second pancake coil in an out-of-phase (opposing phase) relationship.
3. The source according to claim 1 further comprising an air knife connectable to a supply of working gas, the air knife having an air knife output slot positioned to deliver a flow of working gas into the enclosure through the top opening of the enclosure.
4. The source according to claim 1 wherein the first and second major walls comprise quartz.
5. The source according to claim 1 wherein W≥30T.
6. The source according to claim 1 wherein W≥40T.
7. The source according to claim 1 wherein W≥100T.
8. The source according to claim 1 wherein Tis selected so as to allow the source to be capable of providing a laminar flow of plasma from the lower opening of the enclosure.
9. The source according to claim 1 wherein T is selected so as to allow the source to be capable of providing a laminar flow of plasma extending from the lower opening of the enclosure a distance of in the range of from 1 to 3 cm.
10. The source according to claim 1 wherein Tis selected so as to allow the source to be capable of providing a laminar flow of plasma extending from the lower opening of the enclosure a distance of in the range of from 2 to 3 cm.
11. An atmospheric pressure linear RF plasma source comprising: an enclosure enclosing a chamber in the form of an extended slot, the slot having a width W, a length L, and a thickness T, with W≥20T, the enclosure having two opposing major walls enclosing the slot in a direction of the thickness of the slot, and two opposing minor walls enclosing the slot in a direction of the width of the slot, the enclosure having a top opening communicating with the slot for receiving a flow of a gas, the enclosure having a bottom opening communicating with the slot for delivering a flow of plasma, the bottom opening being open to atmospheric pressure, the enclosure having an interior surface comprising surfaces facing the slot of each of the major and minor walls and an exterior surface comprising surfaces facing away from the slot of each of the major and minor walls, the two major and the two minor walls of the enclosure comprising a dielectric material; and an elongated solenoid coil surrounding the outer surface of the enclosure.
12. The source according to claim 11 further comprising an RF power source connected to the elongated solenoid coil.
13. The source according to claim 11 further comprising an air knife connectable to a supply of working gas, the air knife having an air knife output slot positioned to deliver a flow of working gas into the enclosure through the top opening of the enclosure.
14. The source according to claim 11 wherein the first and second major walls comprise quartz.
15. The source according to claim 11 wherein W≥30T.
16. The source according to claim 11 wherein W≥40T.
17. The source according to claim 11 wherein W≥100T.
18. The source according to claim 11 wherein Tis selected so as to allow the source to be capable of providing a laminar flow of plasma from the lower opening of the enclosure.
19. The source according to claim 11 wherein Tis selected so as to allow the source to be capable of providing a laminar flow of plasma extending from the lower opening of the enclosure a distance of in the range of from 1 to 3 cm.
20. The source according to claim 11 wherein T is selected so as to allow the source to be capable of providing a laminar flow of plasma extending from the lower opening of the enclosure a distance of in the range of from 2 to 3 cm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiment(s), and together with the Detailed Description serve to explain principles and operation of the various embodiments. As such, the disclosure will become more fully understood from the following Detailed Description, taken in conjunction with the accompanying Figures, in which:
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DETAILED DESCRIPTION
(8) Reference is now made in detail to various embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same or like reference numbers and symbols are used throughout the drawings to refer to the same or like parts. The drawings are not necessarily to scale, and one skilled in the art will recognize where the drawings have been simplified to illustrate the key aspects of the disclosure.
(9) The claims as set forth below are incorporated into and constitute part of this Detailed Description.
(10) References to directions such as up, down, front, back, left, and right and/or to directional features such as top, bottom, front, back, left side, and right side are for relative reference within the drawings as drawn only, or for relative reference within the described or claimed feature or apparatus, and are not to be understood as limiting the orientation of the described features, but only the relative positioning of such features within an arbitrary frame of reference.
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(13) With reference to
(14) In an example embodiment, the quartz plates are 175 mm in width×102 mm in length×2 mm in thickness each, and the quartz rod spacers are 102 mm×4 mm×4 mm, thus forming an enclosure enclosing an extended slot of width W of 167 mm, a length L of 102 mm and a thickness T of 4 mm. The directions of the width W, the length L, and the thickness T of the quartz plates 601, 604, the spacers 602, 603, and the extended slot are indicated generally with reference to the front quartz plate 601 shown in
(15) Instead of compressed air as in a typical air knife, a working gas such as argon is used to produce plasma. Working gasses such as argon, helium, nitrogen or oxygen and/or various combinations thereof may be used. The quartz plates 602, 603 act as dielectric separators keeping the plasma away from the RF induction coils and by virtue of their spatial structure, confine the plasma to a specific shape and volume.
(16) The plasma may transition from an E-mode, which is electric field dominant, to an H-mode or magnetic field dominant by means of increasing the RF power applied to the inductor, and as a consequence the plasma will transition from a non-thermal to thermal plasma. Experiment has shown that >600 W power will increase the plasma temperature to the point where thermal shock of the quartz plates is very likely. Therefore, additional water cooling of the quartz plates can be required to prevent the occurrence of thermal shock. Deionized coolant water with resistivity maintained in the 1018 Ohm range needs is used to prevent RF power coupling into the coolant water and unnecessarily heating it, resulting in a power drain from the plasma.
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(18) The atmospheric pressure line plasma in the example 150 mm line plasma source may be initiated by flowing a plasma working gas such as argon at a flow rate of 5 slpm to 45 slpm, turning on the RF source which can be from 500 kHz to 40 MHz and tuning the matching network connected to the RF inductor to 500 W forward power and 0 watts reflected power. A spark from a piezoelectric source or a Tesla spark coil is then introduced into the plasma working gas that is flowing in the RF electromagnetic field. The spark starts the electron neutral atom cascade (electron avalanche) ionization process. The plasma is then self-sustaining at that point as long as the RF power and the plasma gas flow rate are maintained. Both RF power and plasma gas flow may be adjusted to optimize the plasma characteristics for the required process. Plasma characteristics can be measured either through optical emission spectroscopy or by means of a platinum tipped Langmuir probe. A substrate to be processed is then passed through the line plasma at constant velocity which may be anywhere from 1 mm/s to 1000 mm/s. The processing may involve multiple passes or may be single pass, as may be required by the application for effective treatment.
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(20) Shown in the 3D renderings of
(21) As a further alternative embodiment shown in a side view drawing in
(22) It will be apparent to those skilled in the art that various modifications to the preferred embodiments of the disclosure as described herein can be made without departing from the spirit or scope of the disclosure as defined in the appended claims. Thus, the disclosure covers the modifications and variations provided they come within the scope of the appended claims and the equivalents thereto.