EMC FILTER DEVICE HAVING A LAMINATED CONDUCTOR STRUCTURE; AND POWER ELECTRONICS MODULE

Abstract

An EMC filter device for power electronics of an electric machine includes an electric conductor structure, a capacitor coupled to the conductor structure, and an inductor that cooperates with the conductor structure. The conductor structure has at least two separate conducting layers that are insulated from one another.

Claims

1. An EMC filter device for power electronics of an electric machine, comprising: an electrical conductor structure, a capacitor coupled to the electrical conductor structure and an inductor interacting with the electrical conductor structure, the electrical conductor structure having two separate conducting layers insulated from one another.

2. The EMC filter device according to claim 1, wherein an insulating layer is arranged between the conducting layers.

3. The EMC filter device according to claim 1, wherein the electrical conductor structure is surrounded outwardly in its entirety by an insulating layer.

4. The EMC filter device according to claim 1, wherein the inductor has a core, and the electrical conductor structure is inserted through the core.

5. The EMC filter device according to claim 1, wherein the capacitor is connected to a terminal configured to connect to a power supply.

6. A power electronics module for an electric machine, comprising: a capacitor arrangement; and an EMC filter device electrically connected to the capacitor arrangement, the EMC filter device including: an electrical conductor structure, a capacitor coupled to the electrical conductor structure and an inductor interacting with the electrical conductor structure, the electrical conductor structure having two separate conducting layers insulated from one another.

7. The power electronics module according to claim 6, wherein the electrical conductor structure is mounted to a region fixed to a housing of an inverter unit.

8. The power electronics module according to claim 6, wherein a thermally conducting layer is provided between the electrical conductor structure and a region fixed to a housing of an inverter unit.

9. The power electronics module according to claim 6, wherein the electrical conductor structure lies flat directly on a region fixed to a housing of an inverter unit.

10. The power electronics module according to claim 6, wherein a current input of the power electronics module is formed directly by the electrical conductor structure, and a current output of the power electronics module is formed by the capacitor arrangement.

11. The EMC filter device according to claim 1, wherein the electrical conductor structure is configured to mount to a housing of an inverter unit.

12. The EMC filter device according to claim 1, wherein the electrical conductor structure is configured to lie flat directly on a housing of an inverter unit.

13. The power electronics module according to claim 6, wherein the conducting layers are insulated from each other between an insulating printed circuit board.

14. The power electronics module according to claim 6, wherein the electrical conductor structure includes: a first single-layer printed circuit board having one of the conducting layers and an insulating printed circuit board; a second single-layer printed circuit board having the other of the conducting layers and a further insulating printed circuit board; and a spacer arranged between the first single-layer printed circuit board and the second single layer-printed circuit board.

15. The power electronics module according to claim 6, wherein the electrical conductor structure includes: a first single-layer printed circuit board having one of the conducting layers and an insulating printed circuit board; a second single-layer printed circuit board having the other of the conducting layers and a further insulating printed circuit board; and an adhesive layer between the first single-layer printed circuit board and the second single layer-printed circuit board.

16. The power electronics module according to claim 6, wherein the electrical conductor structure includes two separate insulating layers, the two conducting layers and the two insulating layers being arranged alternatingly with each other.

17. The power electronics module according to claim 6, wherein an insulating layer is arranged between the conducting layers.

18. The power electronics module according to claim 6, wherein the electrical conductor structure is surrounded outwardly in its entirety by an insulating layer.

19. The power electronics module according to claim 6, wherein the inductor has a core, and the electrical conductor structure is inserted through the core.

20. The power electronics module according to claim 6, wherein the capacitor is connected to a terminal configured to connect to a power supply.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present disclosure will now be explained in more detail below with reference to figures.

[0019] In these:

[0020] FIG. 1 shows a plan view of an exemplary embodiment of an EMC filter device according to the present disclosure as part of a power electronics module configured as an inverter unit,

[0021] FIG. 2 shows a cross-sectional representation of the EMC filter device according to FIG. 1, such that a heat-conducting material arranged between a conductor structure and a region fixed to the housing can be clearly seen,

[0022] FIG. 3 shows a further cross-sectional view of the EMC filter device, wherein further components are visible compared to FIG. 2, including a current sensor and two side walls used for shielding,

[0023] FIG. 4 shows an alternative embodiment of the conductor structure,

[0024] FIG. 5 shows a further alternative embodiment of the conductor structure,

[0025] FIG. 6 shows a further alternative embodiment of the conductor structure,

[0026] FIG. 7 shows a further alternative embodiment of the conductor structure,

[0027] FIG. 8 shows a further alternative embodiment of the conductor structure, and

[0028] FIGS. 9a to 9c show a further alternative embodiment of the conductor structure.

[0029] The figures are merely schematic in nature and serve solely for understanding the present disclosure. The same elements are provided with the same reference symbols.

DETAILED DESCRIPTION

[0030] FIG. 1 clearly shows an EMC filter device 1 according to the present disclosure. In this embodiment, the EMC filter device 1 is implemented as an independent module, but in further embodiments according to the present disclosure it is also directly embodied as a component of a power electronics module 20/inverter unit 11. The inverter unit 11 then in turn forms a component of the power electronics module 20 indicated generally in FIG. 1/power electronics for an electric machine. The EMC filter device 1 is thus used in the power electronics of an electric machine, preferably configured as a drive unit, of a motor vehicle.

[0031] The EMC filter device 1, as can also be seen in more detail in FIGS. 2 and 3, has a laminated conductor structure 2 which is implemented here as a laminated busbar 5. In further embodiments, the conductor structure 2 is also implemented as a printed circuit board, namely as a high-current circuit board. The conductor structure 2, which is alternatively also referred to as a(n electrical) busbar, has a plurality of conducting layers 6a, 6b, which are indicated in FIG. 2 and in FIG. 3 and are insulated from one another. The conducting layers 6a, 6b lie flat/coplanar on one another and form as a whole the conductor structure 2/busbar 5. Between the conducting layers 6a, 6b, as also indicated in FIGS. 2 and 3, an insulating film/foil 7 is interposed which is used directly to insulate the two conducting layers 6a, 6b relative to one another. The conductor structure 2, i.e., the entirety of conducting layers 6a, 6b, is also sealed from the outside thereof by such an insulating film/foil 7. In further embodiments, the conductor structure 2 also consists of more than two, for example three or four, conducting layers 6a, 6b.

[0032] The conductor structure 2 has a substantially plate-shaped structure. According to the configuration as an EMC filter device 1, the conductor structure 2 has two inductors 4a, 4b. A first inductor 4a has a first core 8a, and a second inductor 4b has a second core 8b. Each core 8a, 8b is embodied as a toroidal core/is ring-shaped. One portion of the conductor structure 2 extends centrally through these cores 8a, 8b arranged next to one another.

[0033] Two terminals 10a, 10b are implemented on the conductor structure 2 on the same side of the two inductors 4a, 4b and form a current input during operation. The two terminals 10a, 10b are connected to a power supply 9, preferably a high-voltage battery, during operation, as also indicated. The two terminals 10a, 10b form not only a current input of the EMC filter device 1, but also a current input 16 of the inverter unit 11 and the power electronics module 20.

[0034] Furthermore, two capacitors 3a, 3b are placed on/applied to the conductor structure 2. The two capacitors 3a, 3b thus form two first electronic components 21 which are accommodated/mounted on the conductor structure 2.

[0035] A further, second electronic component 22, which is accommodated/mounted on the conductor structure 2, takes the form of a current sensor 24 and is therefore used to detect an electric current (FIGS. 1 and 3). The current sensor 24 is attached to the conductor structure 2 via a weld point 36.

[0036] Furthermore, a third electronic component 23 in the form of a discharge resistor 25 is accommodated/mounted on the conductor structure 2 (FIG. 1).

[0037] FIG. 1 also shows that the conductor structure 2 is connected to a capacitor arrangement 12 of the inverter unit 11. A corresponding connection takes place, for example, in the region of a dividing line 33. In a further exemplary embodiment, however, the conductor structure 2 is also formed in one piece with a bar 35 of the capacitor arrangement 12, such that a plurality of capacitors 26 of the capacitor arrangement 12 are also arranged on the conductor structure 2. The EMC filter device 1 is then a direct component of an inverter unit 11 having the capacitor arrangement 12. The capacitors 26 are implemented as discrete capacitors 26 and are arranged in two parallel rows, for example.

[0038] The inverter unit 11 has a housing 13, which is also referred to as the inverter housing. This housing 13 encloses both the capacitor arrangement 12 and the EMC filter device 1 with the conductor structure 2. However, it should again be pointed out that in further embodiments, the EMC filter device 1 has its own housing, which is then mounted fixedly to the housing 13 and can therefore be referred to as a region 14, fixed to the housing, of the housing 13.

[0039] In this respect, it can be seen in FIG. 2 that the conductor structure 2 with its electronic components 21, 22, 23 and the inductors 4a, 4b is placed on the region 14, fixed to the housing, of the housing 13. The region 14 fixed to the housing is implemented here directly as a plate-shaped region of the housing 13. In further embodiments, the region 14 fixed to the housing is also configured in a different way as a heat sink, which is further connected to the housing 13.

[0040] It can also be seen from FIGS. 2 and 3 that a cover 29 is provided which, together with the region 14 fixed to the housing, accommodates the EMC filter device 1. When viewed in the plane of the drawing, the conductor structure 2 rests with its underside 19 (here indirectly) on the region 14 fixed to the housing. The electronic components 21, 22, 23 are attached to the upper side 18 thereof.

[0041] Furthermore, the two cores 8a, 8b are connected to the region 14 fixed to the housing via an adhesive connection 34. It can also be seen here that the two terminals 10a, 10b take the form of pins and project at least through the cover 29.

[0042] It should also be pointed out that in a further exemplary embodiment, a covering 27 which forms a shield is also formed by the cover 29. The covering 27 is formed by the cover 29 and a side wall 30 fastened to the cover 29. The cover 29 and side wall 30 thus form a shielding hood which is placed on the conductor structure 2 and is supported on the latter via the side walls 30.

[0043] In this regard, it can also be seen in FIG. 3 that an EMC seal 28 is interposed between an end face 31 of the side walls 30 and the conductor structure 2/the upper side 18 of the conductor structure 2. This EMC seal 28 has a sealing strip 32 or is implemented as such a sealing strip 32. The EMC seal 28 extends over the entire circumference of the side wall 30 and thus seals off an interior of the covering 27 from the environment. This shielding prevents interference signals from being coupled in.

[0044] The side walls 30 are formed separately from the cover 29 and are attached/mounted thereto. For example, the side wall 30 is welded to the cover 29 or attached in a non-positive manner, for example, via fastening means. In further embodiments, however, the side walls 30 are also configured as a component in one piece with the cover 29.

[0045] It can also be seen in FIGS. 2 and 3 that a thermally conducting layer 15, which is implemented as a gap pad in one exemplary embodiment, is inserted between the conductor structure 2 and the region 14 fixed to the housing. The layer 15 thus configured as a mat thus serves to dissipate waste heat from the conductor structure 2 in the direction of the region 14 fixed to the housing. The layer 15 is resiliently deformable and inserted in a compressed manner between the conductor structure 2 and the region 14 fixed to the housing. The layer 15 consists of a given thermally conductive material, such as a thermally conductive filled composite material. In further embodiments, the layer 15 is alternatively implemented as a gel layer or as a casting compound.

[0046] While the terminals 10a, 10b, as already mentioned, form the entire current input 16 of the inverter unit 11/power electronics module 20, an output of the capacitor arrangement 12 typically forms a current output 17 of the inverter unit 11/power electronics module 20, as indicated schematically in FIG. 1.

[0047] In other words, according to the present disclosure an EMC filter 1 is constructed on the basis of a laminated electrical busbar (busbar 5).

[0048] The laminated electrical busbar 5 consists of at least two electrically conducting layers (conducting layers 6a, 6b, made of copper for example), which are (electrically) insulated from one another by an insulating film/foil 7. The outer surfaces are in each case insulated by an insulating film/foil 7. Thus, the laminated electrical busbar 5 is made of two or more coplanar conductive plates (e.g., copper plates: also referred to as conducting layers 6a, 6b) laminated with insulating films/foils 7 in between and on the outside thereof.

[0049] The laminated electrical busbar 5 is inserted through the cores 8a, 8b (inductors). The passive components (e.g., capacitors) can be soldered directly onto the laminated electrical busbar 5. Current sensor 24 (DC side) and discharge resistor 25 can be connected directly to the laminated electrical busbar 5 (e.g., by means of laser welding). In one variant embodiment, a DC link capacitor can be connected as a parallel connection of discrete capacitors (capacitors 3a, 3b) via the laminated electrical busbar 5.

[0050] Capacitors (capacitors 3a, 3b) are fitted on the laminated electrical busbar 5 and connected to the DC(+) and DC(?) contacts (terminals 10a, 10b). The laminated electrical busbar 5 is connected to the HV battery via the DC(+) and DC(?) terminals (terminals 10a, 10b).

[0051] In one alternative embodiment, the electrical busbar 5 can be mounted tightly to the inverter housing 13 or to a cooling surface and thermally connected to the inverter housing 13 via heat-conducting materials (e.g., gap pad). The cores 8a, 8b are placed in the inverter housing 13 and fixed with an adhesive (for example, epoxy adhesive) or with an encapsulant and thermally connected to the inverter housing 13.

[0052] An EMC shielding wall (side wall 30) is integrated into the inverter covering (covering 27) and provided with an EMC seal 28. Once the cover 29 has been closed, the EMC filter 1 and the DC input connector are protected from electromagnetic radiation in-coupling.

[0053] Various conductor structures 200 to 205 which can be used as alternatives to the above-described conductor structure 2 are described below.

[0054] FIG. 4 shows an alternative embodiment of the conductor structure 200.

[0055] The conductor structure 200 is a multi-layer, high-current circuit board or PCB 200. In this conductor structure 200, a plurality of thick conductor layers 600a, 600b, two of which are shown by way of example in FIG. 4, are embedded insulated from one another between an insulating printed circuit board material 700. These conductor layers 600a, 600b can include copper. Preferably, thin conductor layers 800 can be arranged on outer surfaces of the printed circuit board material 700 in addition to the conductor layers 600a, 600b arranged or embedded on the inside thereof. These thin conductor layers 800 can include copper.

[0056] FIG. 5 shows a further alternative embodiment of the conductor structure 201.

[0057] The conductor structure 201 has two or more single-layer printed circuit boards. In this conductor structure 201, a distance is provided between single-layer printed circuit boards which respectively have a conductor layer 601a and an insulating printed circuit board material 701a and a conductor layer 601b and an insulating printed circuit board material 701b, to maintain an air gap. The distance is ensured by a spacer 803. The printed circuit boards 601a, 601b are fastened to one another, for example by means of a screw 801, which is electrically insulated from at least one of the conductor layers 601a, 601b by means of insulation 802.

[0058] FIG. 6 shows a further alternative embodiment of the conductor structure 202.

[0059] The conductor structure 202 has two or more single-layer printed circuit boards. To attach the circuit boards to one another, in this conductor structure 202 an adhesive layer 901 is arranged between single-layer circuit boards, which respectively have a conductor layer 602a and an insulating circuit board material 702a and a conductor layer 602b and an insulating circuit board material 702b.

[0060] FIG. 7 shows a further alternative embodiment of the conductor structure 203.

[0061] The conductor structure 203 has a plurality of conductor layers 603a, 603b and insulating layers 703a, 703b, 703c stacked one on top of the other. The stacking is such that one of the conductor layers 603a, 603b and one of the insulating layers 703a, 703b, 703c alternate in each case. The number of conductor layers 603a, 603b and insulating layers 703a, 703b, 703c is not limited to the number shown in FIG. 7. The conductor layers 603a, 603b and insulating layers 703a, 703b, 703c which are stacked one on top of the other are not laminated to each other and are not firmly bonded to each other.

[0062] FIG. 8 shows a further alternative embodiment of the conductor structure 204.

[0063] The conductor structure 204 has a plurality of conductor layers 604a, 604b and insulating layers 704a, 704b, 704c stacked one on top of the other. The stacking is such that one of the conductor layers 604a, 604b and one of the insulating layers 704a, 704b, 704c alternate in each case. The number of conductor layers 604a, 604b and insulating layers 704a, 704b, 704c is not limited to the number shown in FIG. 8. The stacked conductor layers 604a, 604b and insulating layers 704a, 704b, 704c are bonded together by respective adhesive layers 904 between respective mutually adjacent layers.

[0064] FIGS. 9a to 9c show a further alternative configuration of the conductor structure 205. More precisely, FIG. 9a and FIG. 9b show method steps for producing the conductor structure 205 shown in FIG. 9c.

[0065] As shown in FIG. 9a, multiple conductor layers 605a, 605b and at least one insulating layer 705 are stacked one on top of the other. The stacking is such that one of the conductor layers 605a, 605b and the at least one insulating layer 705 alternate in each case. The number of conductor layers 605a, 605b and insulating layer 705 is not limited to the number shown in FIGS. 9a to 9c. The conductor layers 605a, 605b and insulating layer 705 stacked one on top of the other are arranged in a molding form 1000.

[0066] As shown in FIG. 9b, the molding form is closed with a closure or cover. A molding material is introduced into the molding form 1000. After the molding material has hardened, the conductor structure 205 is removed from the molding form.

[0067] As shown in FIG. 9c, the result is the conductor structure 205 surrounded by the molding material 1100, such as an epoxy material.

LIST OF REFERENCE SIGNS

[0068] 1 EMC filter device [0069] 2 Conductor structure [0070] 3a First capacitor [0071] 3b Second capacitor [0072] 4a First inductor [0073] 4b Second inductor [0074] 5 Busbar [0075] 6a First conducting layer [0076] 6b Second conducting layer [0077] 7 Insulating film/foil [0078] 8a First core [0079] 8b Second core [0080] 9 Power supply [0081] 10a First terminal [0082] 10b Second terminal [0083] 11 Inverter unit [0084] 12 Capacitor arrangement [0085] 13 Housing [0086] 14 Region fixed to the housing [0087] 15 Layer [0088] 16 Current input [0089] 17 Current output [0090] 18 Upper side [0091] 19 Underside [0092] 20 Power electronics module [0093] 21 First electronic component [0094] 22 Second electronic component [0095] 23 Third electronic component [0096] 24 Current sensor [0097] 25 Discharge resistor [0098] 26 Capacitor [0099] 27 Covering [0100] 28 EMC seal [0101] 29 Cover [0102] 30 Side panel [0103] 31 End face [0104] 32 Sealing strip [0105] 33 Dividing line [0106] 34 Adhesive connection [0107] 35 Bar [0108] 36 Weld point [0109] 200 Conductor structure [0110] 600a Conductor layer [0111] 600b Conductor layer [0112] 700 Circuit board material [0113] 800 Thin conductor layer [0114] 201 Conductor structure [0115] 601a Conductor layer [0116] 601b Conductor layer [0117] 701a Circuit board material [0118] 701b Circuit board material [0119] 801 Screw [0120] 802 Insulation [0121] 803 Spacer [0122] 202 Conductor structure [0123] 602a Conductor layer [0124] 602b Conductor layer [0125] 702a Circuit board material [0126] 702b Circuit board material [0127] 901 Adhesive layer [0128] 203 Conductor structure [0129] 603a Conductor layer [0130] 603b Conductor layer [0131] 703a Circuit board material [0132] 703b Circuit board material [0133] 703c Circuit board material [0134] 204 Conductor structure [0135] 604a Conductor layer [0136] 604b Conductor layer [0137] 704a Circuit board material [0138] 704b Circuit board material [0139] 704c Circuit board material [0140] 904 Adhesive layer [0141] 205 Conductor structure [0142] 605a Conductor layer [0143] 605b Conductor layer [0144] 705 Insulating layer [0145] 1000 Molding form [0146] 1001 Cover [0147] 1100 Molding material