MEMs membrane structure and method of fabricating same

Abstract

Disclosed is a method of fabricating a MEMS membrane structure. The method comprises: forming a silicon oxide film dam structure on a silicon substrate; depositing an adhesive layer and then forming a sacrificial layer; depositing a surface protective film on the sacrificial layer; etching the surface protective film and the sacrificial layer, thus forming trenches of first to third rows on the silicon oxide film dam structure; depositing a support film inside of the trenches of first to third rows and on the surface protective film of the sacrificial layer, thus forming a membrane; and removing the sacrificial layer disposed inside the support film deposited inside of the trench of first row, thus forming an empty space.

Claims

1. A MEMS membrane structure, comprising: a silicon substrate; a silicon oxide film dam structure formed on the silicon substrate in a polygonal or circular cylindrical shape; a membrane formed by depositing a support film on a sacrificial layer and inside of a plurality of trenches formed from the sacrificial layer in a polygonal or circular cylindrical shape on top of the silicon oxide film dam structure; and an empty space formed by removing only a central portion of the sacrificial layer disposed inside the support film deposited between the plurality of trenches, and the portions of the sacrificial layer surrounding the trenches remain.

2. The MEMS membrane structure of claim 1, further comprising: an adhesive layer formed on the silicon oxide film dam structure.

3. The MEMS membrane structure of claim 1, wherein the polygonal cylindrical shape is one of quadrangular, hexagonal, and octagonal cylindrical shapes.

4. The MEMS membrane structure of claim 1, wherein the sacrificial layer is formed by forming an amorphous carbon layer flat on a surface of the substrate.

5. The MEMS membrane structure of claim 1, wherein the support film is formed by forming a silicon oxide film or a silicon nitride film or laminating the silicon oxide film and the silicon nitride film together.

6. The MEMS membrane structure of claim 1, further comprising: a MEMS device formed on the membrane.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The above and other objects, features and advantages will be more clearly understood from the following detailed description when taken in conjunction with the accompanying drawings, in which:

(2) FIGS. 1A to 1G are cross-sectional views showing a process of fabricating a MEMS membrane structure according to an embodiment; and

(3) FIG. 2 is a plan view showing the MEMS membrane structure according to an embodiment and a MEMS device formed thereon.

DETAILED DESCRIPTION

(4) Hereinbelow, exemplary embodiments will be described in detail with reference to the accompanying drawings such that the disclosure can be understood by one of ordinary skill in the relevant art. However, modifications to the following embodiments are possible and the scope of the present disclosure is not limited to the following embodiments.

(5) A MEMS membrane structure and a method of fabricating the same according to an embodiment will be described in detail.

(6) FIGS. 1A to 1G are cross-sectional views showing a process of fabricating the MEMS membrane structure according to an embodiment; and FIG. 2 is a plan view showing the MEMS membrane structure according to an embodiment and a MEMS device formed thereon.

(7) The process of fabricating the MEMS membrane structure will be described. First, referring to FIG. 1A, a silicon oxide film is deposited or grown on a silicon substrate 10, and then a silicon oxide film dam structure 20 with a height of several micrometers μm and a width of several to several tens of micrometers μm is formed via exposure and etching processes. Herein, the silicon oxide film dam structure 20 is formed in a polygonal or circular cylindrical shape, preferably a quadrangular, hexagonal, octagonal, or circular cylindrical shape.

(8) Thereafter, referring to FIG. 1B, a silicon oxide film with a thickness of several tens to several hundreds nanometers nm, which serves as an adhesive layer 30, is deposited on the entire surface of the substrate via a chemical vapor deposition (hereinafter referred to as “CVD”) method.

(9) Thereafter, referring to FIG. 1C, an amorphous carbon layer with a thickness of several micrometers μm, which serves as a sacrificial layer 40, is formed on the adhesive layer 30 via a liquid spin-coating method and is baked at a temperature of 200 to 400° C. for several minutes, preferably for 1 to 10 minutes and then heat treated at a temperature of 300 to 400° C. for several tens of minutes, preferably for 10 to 50 minutes.

(10) Thereafter, referring to FIG. 1D, a silicon oxide film with a thickness of several tens to several hundreds of nanometers nm, which serves as a surface protective film 50, is deposited via the CVD method and then a trench is formed in the sacrificial layer 40 on the silicon oxide film dam structure 20 via exposure and etching processes. Herein, the trench is formed as trenches of first to third rows, but is not limited thereto. The trenches have a width of 1 to 2 μm.

(11) Herein, a sacrificial layer 40a formed by the trenches is configured as a closed structure formed by connecting parts having a polygonal or circular cylindrical shape together. The polygonal cylindrical shape may be one of quadrangular, hexagonal, and octagonal cylindrical shapes.

(12) Thereafter, referring to FIG. 1E, a support film 60 is deposited on the surface protective film 50 of the sacrificial layer 40a and inside of the trenches of first to third rows. Herein, the support film 60 with a thickness of 0.5 to 2 μm is formed by depositing a silicon oxide film or a silicon nitride film or by depositing a composite film via the CVD method, the composite film being comprised of the silicon oxide film and the silicon nitride film which are laminated together.

(13) Herein, the support film 60 serves as a membrane M of the MEMS structure, and the depth of the trench is lowered by the help of the silicon oxide film dam structure 20 thereunder, thus improving filling characteristics and thus securing mechanical stability of the membrane structure. Furthermore, the support film 60 serves as an upper protective film of the sacrificial layer 40a and serves to support the upper MEMS device so as to ensure stability against stress due to operation.

(14) Thereafter, referring to FIG. 1F, the MEMS device 70 such as a microheater, a gas sensor, and the like and a pad portion 71 are formed on the support film 60 and then a protective film 80 is formed. Herein, the protective film 80 with a thickness of 0.5 to 3 μm is formed by depositing a silicon oxide film or a silicon nitride film or depositing a composite film via the CVD method, the composite film being comprised of the silicon oxide film and the silicon nitride film which are laminated together.

(15) Thereafter, referring to FIG. 1G, a part of the protective film 80 and a part of the support film 60 are selectively removed via exposure and etching processes as shown in FIG. 2 to expose the sacrificial layer 40a on the surface of the substrate, and then the amorphous carbon layer as the sacrificial layer 40a under the membrane M is removed via an oxygen (O.sub.2) plasma stripping process which is dry etching, thus forming an empty space C. In other words, only the amorphous carbon layer, which is the sacrificial layer 40a disposed inside the support film 60 of a polygonal or circular cylindrical shape having a closed structure filled in a trench line of first row, is selectively removed, thus forming a freestanding membrane M structure while the remaining sacrificial layer 40a is left. This makes it possible for the upper MEMS device to maintain stability against mechanical stress.

(16) As described above in the foregoing embodiments, improvement of the filling characteristics in the trenches can increase the thickness of the sacrificial layer and the height of the empty space C from which the sacrificial layer is removed. As a result, the upper MEMS device 70 is excellent in heat retention characteristics, leading to an improvement of thermal stability and device characteristics of the upper MEMS device 70.

(17) Although exemplary embodiments have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the disclosure as defined by the appended claims.