Tile cutter

Abstract

Vinyl tile cutting devices are described herein. The described tile cutting devices include a base element. The base element is configured to support a tile thereon. The described tile cutting devices further include a cutting assembly. The cutting assembly includes a rotatable cutting blade for cutting said tile along an arc. In some embodiments, the cutting assembly includes an adjustment mechanism for changing the radius of the arc. The vinyl tile cutting device further includes a heating element. The heating element is configured to heat said tile prior to the cutting of said tile.

Claims

1. A vinyl tile cutting device configured to cut vinyl tiles along an arc, said vinyl tile cutting device comprising: a base element, said base element comprising a first side and a second side and said base element being conductive and configured to support a vinyl tile thereon during a cutting process; a first articulated arm comprising a first end and a second end, the first end being positionable along the first side of the base in a first configuration, the first end being maintained in a fixed position relative to the base in a second configuration, the first articulated arm configured to rotate about the first end in the second configuration; A first cutting assembly fixedly disposed at the second end of the first articulated arm above said base element, said first cutting assembly comprising a first non-motorized, toothless, rotatable cutting blade, a rotational axis of the first cutting blade being substantially parallel to a longitudinal axis of the first articulated arm, the first cutting blade operative to cut said vinyl tile in a curved first cutting path when the first articulated arm is rotated about the first end; and a heating element disposed beneath said base element and substantially spanning the first cutting path of said first cutting assembly, said heating element configured to adjustably heat the first cutting path of said vinyl tile prior to and contemporaneous with the cutting of said vinyl tile.

2. The vinyl tile cutting device according to claim 1, wherein said vinyl tile cutting device comprises a second cutting assembly comprising second non-motorized, toothless, rotatable cutting blade for cutting said vinyl tile along a second curved cutting path.

3. The vinyl tile cutting device according to claim 2, wherein said base element comprises a pair of spaced-apart rails, namely a first rail and a second rail, for supporting said cutting assemblies.

4. The vinyl tile cutting device according to claim 3, wherein the first cutting assembly further comprises a first rail guide which engages the first rail, the first rail guide supporting the first articulated arm which supports the first cutting blade, the first articulated arm configured to rotate with respect to the first rail guide.

5. The vinyl tile cutting device according to claim 4 wherein the first articulated arm comprises a first adjustment mechanism operative to change a radius of the first cutting path.

6. The vinyl tile cutting device according to claim 4 wherein the second articulated arm comprises a second adjustment mechanism operative to change a radius of the second cutting path.

7. The vinyl tile cutting device according to claim 3, wherein the second cutting assembly further comprises a second rail guide which engages the second rail, the second rail guide supporting the second articulated arm which supports the second cutting blade, the second articulated arm configured to rotate with respect to the second rail guide.

8. The vinyl tile cutting device according to claim 1, wherein said first cutting assembly further includes a first safety cover disposed over at least a portion of said first cutting blade so as to protect a user of said tile cutting device from being inadvertently cut by said first cutting blade.

9. The vinyl tile cutting device according to claim 1, wherein said base element includes one or more securing elements for holding said tile in place relative to said base element.

10. The vinyl tile cutting device according to claim 1, wherein said second cutting assembly further includes a second safety cover disposed over at least a portion of said second cutting blade so as to protect a user of said tile cutting device from being inadvertently cut by said second cutting blade.

11. A vinyl tile cutting device configured to cut arcs in vinyl tiles, said vinyl tile cutting device comprising: a base element, said base element being conductive and configured to support a vinyl tile thereon during a cutting process, said base element comprising a pair of parallel, spaced-apart rails namely a first rail and a second rail, fixed in relation to the base element; a first cutting assembly disposed above said base element, the first cutting assembly comprising a first rail guide, the first rail guide engaging the first rail, the first rail guide supporting a first articulated arm which supports a first cutting blade, the first cutting blade is fixedly attached to one end the first articulated arm such that a rotational axis of the first cutting blade is substantially parallel to a longitudinal axis of the first articulated arm, the first articulated arm configured to rotate with respect to the first rail guide; a second cutting assembly disposed above said base element, the second cutting assembly comprising a second rail guide, the second rail guide engaging the second rail, the second rail guide supporting a second articulated arm which supports a first cutting blade, the second cutting blade is fixedly attached to one end the first articulated arm such that a rotational axis of the second cutting blade is substantially parallel to a longitudinal axis of the second articulated arm, the second articulated arm configured to rotate with respect to the second rail guide; and a heating element disposed beneath said base element and substantially spanning a cutting path of each cutting assembly, said heating element configured to adjustably heat the cutting paths of said vinyl tile prior to and contemporaneous with the cutting of said vinyl tile.

12. The vinyl tile cutting device according to claim 11, wherein the first cutting assembly further includes a first safety cover disposed over at least a portion of the first cutting blade so as to protect a user of said tile cutting device from being inadvertently cut by said first cutting blade.

13. The vinyl tile cutting device according to claim 11, wherein said base element includes one or more securing elements for holding said tile in place relative to said base element.

14. The vinyl tile cutting device according to claim 11 wherein the first articulated arm comprises a first adjustment mechanism operative to change a radius of a respective cutting path of the first cutting assembly.

15. The vinyl tile cutting device according to claim 11, wherein the second assembly further includes a second safety cover disposed over at least a portion of the second cutting blade so as to protect a user of said tile cutting device from being inadvertently cut by said second cutting blade.

16. The vinyl tile cutting device according to claim 11 wherein the first articulated arm comprises a second adjustment mechanism operative to change a radius of a respective cutting path of the second cutting assembly.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The invention will now be described, by way of example, with reference to the accompanying drawings, which are incorporated in and constitute a part of the specification, in which:

(2) FIG. 1 is an orthographic top view of a first example tile cutting device.

(3) FIG. 2 is a top plan view of the first example tile cutting device.

(4) FIG. 3 is a bottom plan view of the first example tile cutting device.

(5) FIG. 4 is a front side view of the first example tile cutting device.

(6) FIG. 5 is a rear side view of the first example tile cutting device.

(7) FIG. 6 is a left side view of the first example tile cutting device.

(8) FIG. 7 is a right side view of the first example tile cutting device.

(9) FIG. 8 is a 3D exploded view of the first example tile cutting device.

(10) FIG. 9 is an orthographic view of the tile cutting device of FIG. 1 configured to cut a tile at a 45 degree angle.

(11) FIG. 10 is an orthographic view of the tile cutting device of FIG. 1 configured to cut a tile at a 90 degree angle.

(12) FIG. 11 is an orthographic view of the tile cutting device of FIG. 1 configured to cut a tile portion at a 90 degree angle.

(13) FIG. 12 is an orthographic view of the tile cutting device of FIG. 1 illustrating the user force required to cut a tile portion at a 90 degree angle.

(14) FIGS. 13a and 13b are magnified and detail front views of a portion of the cutting device during operation.

(15) FIG. 14 is an orthographic view of the tile cutting device of FIG. 1 being transported by a user.

(16) FIG. 15 is an orthographic view of the tile cutting device of FIG. 1 configured to cut a tile at a 22.5 degree angle.

(17) FIG. 16 is an orthographic view of the tile cutting device of FIG. 1 configured to cut a tile portion at a 90 degree angle.

(18) FIG. 17 is an orthographic view of the tile cutting device of FIG. 1 used in conjunction with a hot tile remover.

(19) FIG. 18 is an environmental view of a box of cut tiles used in conjunction with the hot tile remover.

(20) FIG. 19 is an orthographic top view of a second example tile cutting device.

(21) FIG. 20 is an exploded orthographic top view of the second example tile cutting device.

(22) FIG. 21 is a top plan view of the second example tile cutting device illustrating two independently configurable arc cutting blades.

(23) FIG. 22 is a top plan view of the second example tile cutting device illustrating operation using a single configurable arc cutting blade.

(24) FIG. 23 is a top plan view of the second example tile cutting device illustrating operation using two independently configurable arc cutting blades with different radii.

(25) FIG. 24A is a top plan view of a tile showing proposed cutting arcs having various radii.

(26) FIG. 24B is a top plan view of a plurality of tile portions cut from the tile of FIG. 24A.

DRAWING REFERENCE NUMERALS

(27) The following reference characters identify the associated elements depicted in the drawings describing the present invention:

(28) TABLE-US-00001 100 First Example Tile 900 User Cutting Device 102 Tile 1700 Hot Tile Mover 110 Base Element 1702 Handle 112 Top Surface 1704 Frame 114 Bottom Surface 1706 Suction Cup 116 Rear Handle 1900 Second Example Tile Cutting Device 118 Front Handle 1902A Cutting Assembly 120A Left Rail 1902B Cutting Assembly 120B Right Rail 1910B Rail Guide 122 Ruler 1912B Angled Connector 130 Cutting Assembly 1914B Fastener 132 Axial Support 1916B Adjustable Arm 134 Blade 1918B Cutting Blade 136 Guard 1920B Blade Guard 138A Left Handle 1930 Tile 138B Right Handle 1940A Arc 140A Left Rail Guide 1940B Arc 140B Right Rail Guide 1950 Arc 142 Guard Support 1960A Arc 150 Securing Element 1960B Arc 160 Support Leg 1932A Tile showing proposed cuts 170 Heating Element 1932B Tile Portions

DETAILED DESCRIPTION

(29) To address the deficiencies of the prior art, the present application discloses an improved tile cutting device. The tile cutting device of the present application embodies several improvements over the prior art. According to one aspect of the present application, the disclosed tile cutter may comprise a heating element for heating a tile during cutting to make cutting the tile easier. According to another aspect of the present application, the disclosed tile cutter may comprise a plurality of spaced-apart rotatable cutting blades for cutting the tile in a generally linear manner.

(30) Referring now to FIGS. 1 and 2, there is shown an orthographic view of an example tile cutting device 100. Example tile cutting device 100 comprises a base element 110 having an upper surface 112 for supporting a tile to be cut. As illustrated, base element 110 may form one or more handles, such as for example front handle 118 and rear handle 116, for moving, adjusting and/or carrying device 100.

(31) Example tile cutting device 100 further comprises a cutting assembly 130 for performing the cutting operation. Cutting assembly 130 is supported by and movable along two rails, left rail 120A and right rail 120B. Cutting assembly 130 includes a left handle 138A and a right handle 138B which may be grasped by a user to move the cutting assembly to and fro along rails 120A and 120B. In the illustrative embodiment, the handles 138A and 138B pivot between the operative positions of FIG. 1 and the stowed positions of FIG. 14. A ruler 122 is disposed along the front of the upper cutting surface 112. Base element 110 and cutting assembly 130 are supported by a plurality of support legs 160. In the example tile cutting device 100, each of the support legs 160 is collapsible so as to make the tile cutting device 100 more compact for transporting the cutting device 100 (see FIG. 14).

(32) FIG. 3 depicts a bottom plan view of example cutting device 100. The bottom plan view illustrates a bottom surface 114 of base element 110 and a heating element 170 which is disposed beneath the base element 110 when cutting device 100 is properly oriented. Placement of heating element 170 beneath, and in close proximity to the bottom surface 114 of base element 110 enables heating element 170 to heat base element 110 which conducts the heat to the tile being cut. The front, rear, left and right views of FIGS. 4-7, respectively, also illustrate the relationship between heating element 170 and base element 110. As shown in the side view of FIG. 6, the illustrative heating element 170 comprises a temperature dial and a power switch proximate to one end thereof.

(33) FIG. 8 depicts a 3D exploded view of the example tile cutting device 100. As illustrated, the example tile cutting device 100 comprises base element 110, rails 120A and 120B, and cutting assembly 130. Cutting assembly 130 includes axial support 132, left and right rail guides 140A and 140B, respectively, rotatable cutting blades 134, guard support 142 and guards 136. In operation, cutting blades 134 are adjustable along axial support 132. A user may employ ruler 122 to position each cutting blade 134 as desired. Cutting blades 134 are not required to be positioned symmetrically with respect to the center of ruler 122.

(34) FIG. 8 further depicts support legs 160 and heating element 170. Finally, there is illustrated a tile 102 and a plurality of securing elements 150 for securing the tile 102 to the cutting device 100.

(35) FIG. 9 is an orthographic view of the example tile cutting device configured to cut a tile at a 45 degree angle. FIG. 10 is an orthographic view of the example tile cutting device configured to cut a tile at a 90 degree angle. FIG. 11 is an orthographic view of the example tile cutting device configured to cut a tile portion at a 90 degree angle. FIG. 12 is an orthographic view of the example tile cutting device illustrating a force required by a user to cut a tile portion at a 90 degree angle.

(36) FIGS. 13a and 13b are magnified and detail front views of a portion of the cutting device during operation.

(37) FIG. 13a is a magnified front view of a portion of the cutting device during operation. Specifically, FIG. 13a illustrates a tile 102 secured to base element 110 using securing element 150. One of the blades 134 is shown cutting tile 102. The blade 134 is suspended from axial support 132. Blade 134 is covered by guard 136 which is suspended from guard support 142. Guard support 142 additionally adds rigidity to the cutting assembly 130 so as to stabilize the cutting assembly 130 and prevent the cutting assembly 130 from jamming during the displacement of the blades 134 by a user. Heating element 170 is illustrated as radiating heat directly to base element 110 which, in turn, applies heat to tile 102 during the cutting operation. The cutting operation is even more clearly shown in FIG. 13b.

(38) FIG. 14 is an orthographic view of tile cutting device being transported by a user 900. In FIG. 14, the handles 138A and 138B of the cutting assembly 130 been folded into their stowed positions to make the tile cutting device 100 more compact for transportation by the user 900.

(39) FIG. 15 is an orthographic view of the example tile cutting device configured to cut a tile at a 22.5 degree angle.

(40) FIG. 16 is an orthographic view of the example tile cutting device configured to cut a tile portion at a 90 degree angle. Note that the cutting blades 134 are positioned closer to the center than those shown in FIG. 12.

(41) FIG. 17 is an orthographic view of the example tile cutting device used in conjunction with a hot tile remover 1700. Hot tile remover 1700 comprises a frame 1704 supported by a pair of handles 1702. Hot tile remover further comprises a plurality of suction cups 1706 which may each be independently positioned along frame 1704. Hot tile remover 1700 is depicted supporting three tiles 102 recently cut by cutting device 100.

(42) FIG. 18 is an environmental view of a box of cut tiles 102 used in conjunction with hot tile remover 1700.

(43) Referring now to FIG. 19 there is shown an orthographic view of a second example tile cutting device 1900. Similar to the first example cutting device 100, described above, second example tile cutting device 1900 comprises base element 110 having an upper surface 112 for supporting a tile to be cut. As illustrated, base element 110 may form one or more handles, such as for example front handle 118 and rear handle 116, for moving, adjusting and/or carrying device 100. Second example tile cutting device 1900 comprises two cutting assemblies 1902A and 1902B that, unlike the cutting assembly described above, allows a tile to be cut along an arc.

(44) Referring now to FIG. 20, there is illustrated an exploded orthographic top view of the second example tile cutting device 1900. Specifically, the components of cutting assembly 1902B are illustrated in an exploded fashion. Cutting assembly 1902B comprises a rail guide 1910B, an angled connector 1912B, a fastener 1914B, an adjustable arm 1916B, a rotatable, non-motorized, cutting blade 1918B, and a blade guard 1920B.

(45) Rail guide 1910B is operative to engage a side rail, such as rail 120B. Rail guide 1910B may be positioned and fixed at any location along rail 120B. Although rail guide 1910B is illustrated as engaging with rail 120B, it is also operative to instead engage with rail 120A. Rail guide 1910B supports angled connector 1912B which is configured to rotate with respect to rail guide 1910B.

(46) Angled connector 1912B is connected to arm 1916B using fastener 1914B. Fastener 1914B operates as an adjustment mechanism for fixing a radius of cutting assembly 1902B by securing a proximate end of arm 1916B to angled connector 1912B using one of a plurality of spaced apart apertures along the length of arm 1916B. A rotatable, non-motorized cutting blade is supported at the distal end of arm 1916B along with a blade guard 1920B.

(47) Referring now to FIG. 21, there is shown a top plan view of the second example tile cutting device illustrating the operation of the two independently configurable cutting assemblies 1902A and 1902B. As shown, cutting assembly 1902A will cut tile 1930 along arc 1940A, and cutting assembly 1902B will cut tile 1930 along arc 1940B. Arcs 1940A and 1940B have equal radii because cutting assemblies 1902A and 1902B are similarly configured.

(48) FIG. 22 is a top plan view of the second example tile cutting device 1900 illustrating operation using a single cutting assembly 1902B. As illustrated, cutting assembly 1902B will cause tile 1930 to be cut along arc 1950. Cutting assembly 1902A has been rotated into a non-operative position.

(49) FIG. 23 is a top plan view of the second example tile cutting device 1902B configured such that cutting assemblies 1902A and 1902B are adjusted to cut arcs 1960A and 1960B, respectively, having different radii.

(50) FIG. 24A is a top plan view of an example tile 1932A showing a plurality of proposed cutting arcs having various radii. FIG. 24B is a top plan view of a plurality of tile portions 1932B cut from tile 1932 in accordance with the proposed cutting arcs shown in FIG. 24A.

(51) While the devices, systems, methods, and so on have been illustrated by describing examples, and while the examples have been described in considerable detail, it is not the intention of the applicant to restrict, or in any way, limit the scope of the appended claims to such detail. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the devices, systems, methods, and so on provided herein. Additional advantages and modifications will readily appear to those skilled in the art. Therefore, the invention, in its broader aspects, is not limited to the specific details and illustrative examples shown and described. Accordingly, departures may be made from such details without departing from the spirit or scope of the applicant's general inventive concept. Thus, this application is intended to embrace alterations, modifications, and variations that fall within the scope of the appended claims. The preceding description is not meant to limit the scope of the invention. Rather, the scope of the invention is to be determined by the appended claims and their equivalents.

(52) Finally, to the extent that the term includes or including is employed in the detailed description or the claims, it is intended to be inclusive in a manner similar to the term comprising, as that term is interpreted when employed as a transitional word in a claim. Furthermore, to the extent that the term or is employed in the claims (e.g., A or B) it is intended to mean A or B or both. When the applicants intend to indicate only A or B, but not both, then the term only A or B but not both will be employed. Similarly, when the applicants intend to indicate one and only one of A, B, or C, the applicants will employ the phrase one and only one. Thus, use of the term or herein is the inclusive, and not the exclusive use. See Bryan A. Garner, A Dictionary of Modern Legal Usage 624 (2d. Ed. 1995).