SPRAY NOZZLE CHIP

Abstract

A spray nozzle chip is presented having a substrate with a spray side and a sieve side, a spray membrane provided on the spray side, a sieve membrane provided on the sieve side, wherein the spray membrane is provided with spray orifices and the sieve membrane is provided with sieve orifices, wherein the substrate has a fluid channel which connects the spray orifices with the sieve orifices, and a pressure sensing device configured to measure deformation of the spray membrane to obtain a measure of pressure on the spray membrane.

Claims

1-15. (canceled)

16. A spray nozzle chip comprising: a substrate having a spray side and a sieve side, a spray membrane provided on the spray side, a sieve membrane provided on the sieve side, wherein the spray membrane is provided with spray orifices and the sieve membrane is provided with sieve orifices, wherein the substrate has a fluid channel which connects the spray orifices with the sieve orifices, and a pressure sensing device configured to measure deformation of the spray membrane to obtain a measure of pressure on the spray membrane.

17. The spray nozzle chip as claimed in claim 16, wherein the spray orifices are provided in a spray orifice region of the spray membrane, and wherein the pressure sensing device is configured to detect deformation of the spray orifice region.

18. The spray nozzle chip as claimed in claim 16, wherein the pressure sensing device comprises one of a strain gauge sensor, a capacitive pressure sensor and a piezoresistive pressure sensor.

19. The spray nozzle chip as claimed in claim 16, wherein the pressure sensing device is a microelectromechanical system, MEMS pressure sensor.

20. The spray nozzle chip as claimed in claim 16, wherein the pressure sensing device is arranged on the spray membrane.

21. The spray nozzle chip as claimed in claim 16, comprising a reference pressure sensing device, wherein the substrate has a closed cavity which is delimited by a reference pressure region of the spray membrane, wherein the reference pressure sensing device is configured to measure deformation of the reference pressure region.

22. The spray nozzle chip as claimed in claim 21, wherein the cavity is a vacuum cavity.

23. The spray nozzle chip as claimed in claim 21, wherein the reference pressure sensing device comprises one of a strain gauge sensor, a capacitive pressure sensor and a piezoresistive pressure sensor.

24. The spray nozzle chip as claimed in claim 21, wherein the reference pressure sensing device is a MEMS pressure sensor.

25. The spray nozzle chip as claimed in claim 21, wherein the reference pressure sensing device is arranged on the spray membrane.

26. A spray nozzle device comprising: the spray nozzle chip as claimed in claim 16, and a contact interface configured to be electrically connected to the pressure sensing device to supply power to and obtain pressure measurement signals from the pressure sensing device.

27. The spray nozzle device as claimed in claim 26, comprising the spray nozzle chip, wherein the contact interface is configured to be electrically connected to the reference pressure sensing device to supply power to and obtain pressure measurement signals from the reference pressure sensing device.

28. An aerosol dispenser comprising the spray nozzle device as claimed in claim 26.

29. The aerosol dispenser as claimed in claim 28, wherein the aerosol dispenser is a medicament delivery device.

30. The aerosol dispenser as claimed in claim 29, wherein the medicament delivery device is an inhaler or eye dispenser.

31. A spray nozzle chip comprising: a substrate having a spray side and a sieve side; a sieve membrane comprising a sieve orifice that is provided on the sieve side; and a spray membrane provided on the spray side, where the spray membrane comprises, a spray orifice; a pressure sensing device that measures deformation of the spray membrane to obtain a measure of pressure on the spray membrane; and a reference pressure sensing device that measures deformation of a reference pressure region associated with reference pressure sensing device, wherein the substrate has a fluid channel which connects the spray orifice with the sieve orifice

32. The spray nozzle chip as claimed in claim 31, wherein the substrate comprises a closed cavity operatively associated with the reference pressure region.

33. The spray nozzle chip as claimed in claim 32, wherein the closed cavity is a vacuum cavity.

34. The spray nozzle chip as claimed in claim 31, wherein the pressure sensing device and the reference pressure sensing device each comprise one of a strain gauge sensor, a capacitive pressure sensor, a piezoresistive pressure sensor, and a MEMS pressure sensor.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The specific embodiments of the inventive concept will now be described, by way of example, with reference to the accompanying drawings, in which:

[0024] FIG. 1 is a perspective view of an example of a spray nozzle chip depicting a spray side thereof;

[0025] FIG. 2 is a perspective view of the spray nozzle chip in FIG. 1 showing a sieve side thereof;

[0026] FIG. 3 shows a longitudinal cross section of the spray nozzle chip;

[0027] FIG. 4 is a perspective view of the spray nozzle chip mounted to a contact interface;

[0028] FIG. 5 is a perspective view of the spray nozzle chip mounted to the contact interface from another perspective;

[0029] FIG. 6 depicts the spray nozzle chip and contact interface mounted to a carrier;

[0030] FIG. 7 shows the carrier in FIG. 6 from another perspective;

[0031] FIG. 8 shows a perspective view of a spray nozzle device;

[0032] FIG. 9 is a cross sectional view of the spray nozzle device in FIG. 8;

[0033] FIG. 10 is a top view of the spray nozzle device in FIG. 8; and FIG. 11 shows a side view of an aerosol dispenser comprising the spray nozzle device in FIG. 8.

DETAILED DESCRIPTION

[0034] The inventive concept will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplifying embodiments are shown. The inventive concept may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided by way of example so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Like numbers refer to like elements throughout the description.

[0035] FIG. 1 shows an example of a spray nozzle chip 1. The spray nozzle 1 may be configured to be used in an aerosol dispenser. The spray nozzle 1 may be configured to be arranged in an aerosol dispenser.

[0036] The spray nozzle chip 1 comprises a substrate 3. The substrate 3 has a spray side 3a and a sieve side 3b. The spray side 3a and the sieve side 3b are arranged opposite to each other.

[0037] The substrate 3 may for example comprise a ceramic material such as silicon. The exemplified substrate 3 comprises a spray side substrate 3c and a sieve side substrate 3d which are joined or bonded, and which form the substrate 3. Alternatively, the substrate 3 could be made of a single piece of substrate material.

[0038] The spray nozzle chip 1 comprises a spray membrane 7. The spray membrane 7 may for example comprise silicon or a nitride. The spray membrane 7 is provided on the spray side 3a of the substrate 3. The spray membrane 7 may be bonded with the substrate 3; or formed by etching through the substrate 3 directly. The spray membrane 7 comprises a plurality of spray orifices 11. The spray membrane 7 has a spray orifice region comprising the spray orifices 11.

[0039] The spray nozzle chip 1 comprises a sieve membrane 9. The sieve membrane 9 may for example comprise silicon or a nitride. The sieve membrane 9 is provided on the sieve side 3b of the substrate 3. The sieve membrane 9 is bonded with the substrate 3, or formed by etching through the substrate 3 directly. The sieve membrane 9 comprises a plurality of sieve orifices 13, shown in FIG. 2.

[0040] FIG. 3 shows a section of the spray nozzle chip 1. The substrate 3 has a fluid channel 15, which extends through the substrate 3 from the spray side 3a to the sieve side 3b. The fluid channel 15 connects the spray orifices 11 with the sieve orifices 13. The fluid channel 15 is configured to set the spray orifices 11 in fluid communication with the sieve orifices 13.

[0041] The spray orifice region is defined by the borders or boundary formed by the inner walls of the fluid channel 15 relative to the spray membrane 7.

[0042] Turning back to FIG. 1, the spray nozzle chip 1 comprises a pressure sensing device 12. The pressure sensing device 12 is configured to detect deformation of the spray membrane 7. The amount of deformation of the spray membrane 7 provides a measure of the pressure that the spray membrane 7 is subjected to. The pressure sensing device 12 is arranged on the spray membrane 7.

[0043] The pressure sensing device 12 is configured to detect deformation of the spray orifice region of the spray membrane 7. The pressure sensing device 12 or a portion thereof is arranged on the spray orifice region of the spray membrane 7.

[0044] The pressure sensing device 12 may be a MEMS pressure sensor.

[0045] In the example shown in FIG. 1, the pressure sensing device 12 is a strain gauge. The pressure sensing device 12 comprises a Wheatstone bridge. The pressure sensing device 12 comprises resistive elements 12b which form the Wheatstone bridge. The resistive elements 12b are provided on the spray orifice region of the spray membrane 7. The resistive elements 12b may for example extend adjacent to and parallel with the spray orifices 11. The pressure sensing device 12 may comprise contact pads 12C in electrical contact with the resistive elements 12b. The contact pads 12C may be configured to be electrically connected to a power source and configured to relay current flow i.e. pressure measurement signals from the resistive elements 12b. Any deformation of the resistive elements 12b causes a change in electrical resistance of the resistive elements 12b. This in turn causes a change in the magnitude of the current flow through the Wheatstone bridge. The change in the current flow provides a measure of the deformation and hence of a pressure applied to the spray membrane 7.

[0046] The pressure sensing device 12 may alternatively to a strain gauge comprise a capacitive pressure sensor or a piezoresistive pressure sensor.

[0047] In the example of the spray nozzle chip 1 shown in FIG. 3, the substrate 3 comprises a closed cavity or chamber 17. The cavity 17 is delimited by the spray membrane 7. The cavity 17 is delimited by a reference pressure region of the spray membrane 7. The spray membrane 7 hence forms the wall on one side of the cavity 17. The other walls defining the cavity 17 may be formed by the substrate 3. The cavity 17 may be a vacuum cavity. The cavity 17 may hence contain a vacuum. The cavity 17 could alternatively be a pressurised chamber, i.e. a chamber which is not vacuum.

[0048] The exemplified spray nozzle chip 1 comprises a reference pressure sensing device 19, also depicted in FIG. 1. The reference pressure sensing device 19 is provided on the spray membrane 7. The reference pressure sensing device 19 is provided on the reference pressure region of the spray membrane 7. The reference pressure sensing device 19 is configured to measure deformation of the reference pressure region of the spray membrane 7.

[0049] According to the example shown in FIGS. 1 and 3, the reference pressure sensing device 19 is a strain gauge. The reference pressure sensing device 19 comprises a Wheatstone bridge. The reference pressure sensing device 19 comprises reference resistive elements 19b which form the Wheatstone bridge. The reference resistive elements 19b are provided on the reference pressure region of the spray membrane 7. The reference pressure sensing device 19 may comprise reference contact pads 19c in electrical contact with the reference resistive elements 19b. The reference contact pads 19c may be configured to be electrically connected to a power source and configured to relay current flow i.e. pressure measurement signals from the reference resistive elements 19b. Any deformation of the reference resistive elements 19b causes a change in electrical resistance of the reference resistive elements 19b. This in turn causes a change in the magnitude of the current flow through the Wheatstone bridge. The change in the current flow provides a measure of the deformation of the spray membrane 7 in the reference pressure region. The reference pressure sensing device 19 can be used for monitoring inhalation when the spray nozzle chip 1 is mounted in an inhaler. When the user inhales over the spray nozzle chip 1 the reference pressure region will be subjected to a suction force, deflecting or causing a deformation of the reference pressure region. The reference pressure sensing device 19 will thereby provide a measure of the user's inhalation technique.

[0050] The reference pressure sensing device 19 may alternatively to a strain gauge comprise a capacitive pressure sensor or piezoresistive pressure sensor.

[0051] FIG. 4 shows the spray nozzle chip 1 mounted to a contact interface 21. The spray nozzle chip 1 and the contact interface 21 form part of a spray nozzle device 29 shown in FIG. 8. The contact interface 21 is a substrate. The contact interface 21 may for example comprise ceramic. The contact interface 21 comprises first conductive paths 23 configured to electrically connected to the pressure sensing device 12. The first conductive paths 23 may be connected to the contact pads 12b. The first conductive paths 23 may be configured to carry current to the pressure sensing device 12 and to transport current or pressure measurement signals from the pressure sensing device 12.

[0052] The contact pads 12b may for example be connected to the first conductive paths 23 by soldering or conductive glue.

[0053] The contact interface 21 comprises second conductive paths 25 configured to be electrically connected to the reference pressure sensing device 19. The second conductive paths 25 may be connected to the reference contact pads 19b. The second conductive paths 25 may be configured to carry current to the reference pressure sensing device 19 and to transport current or pressure measurement signals from the reference pressure sensing device 19.

[0054] The reference contact pads 19b may for example be connected to the second conductive paths 25 by soldering or conductive glue.

[0055] FIG. 5 depicts the opposite side of the contact interface 21 relative to the side shown in FIG. 4. In the present example, the spray membrane 7 faces the contact interface 21. The contact interface 21 is provided with a first through-opening 21a. The first through-opening 21 is aligned with the spray orifice region of the spray membrane 7. The spray orifices 11 are arranged within the first through-opening 21. The spray orifices 11 are accessible via the first through-opening 21 of the contact interface 21.

[0056] The contact interface 21 is provided with a second through-opening 21b. The second through-opening 21b is aligned with the reference pressure region of the spray membrane 7. The reference pressure region is hence accessible via the second through-opening 21b. Part of the reference pressure sensing device 19 is arranged within the second through-opening 21b.

[0057] FIG. 6 shows a bottom side of a contact interface carrier 27. The contact interface 21 is mounted onto the contact interface carrier 27. The contact interface 21 and the contact interface carrier 27 may alternatively be integrated as one part. The contact interface carrier 21 forms part of the spray nozzle device 29. The contact interface carrier 27 comprises a plurality of through-openings 27a distributed around the contact interface 21. The through-openings 27a may provide protective airflow for the spray nozzle device.

[0058] FIG. 7 shows a top side of the contact interface carrier 27. The contact interface carrier 27 has a carrier first through-opening 27b. The carrier first through-opening 27b is centred on the contact interface carrier 27. A central axis of the contact interface carrier 27 hence extends through the carrier first through-opening 27b. The carrier first through-opening 27b is aligned with the spray orifice region of the spray membrane 7 and the first through-opening 21a. The carrier first through-opening 27b hence leads to the spray orifice region of the spray membrane 7. The spray orifices 11 are hence accessible through the carrier first through-opening 27b and the first through-opening 21a.

[0059] The contact interface carrier 27 has a carrier second through-opening 27c. The carrier second through-opening 27c is aligned with the reference pressure region of the spray membrane 7 and the second through-opening 21b. The carrier second through-opening 27c hence leads to the reference pressure region. The reference pressure sensing device 19 is hence accessible via the carrier second through-opening 27c.

[0060] Fluid flow through the spray orifices 11 is hence enabled. Moreover, the reference pressure sensing device 19 is able to detect deformation of the reference pressure region due to deformation of the reference pressure region caused by suction force generated by user inhalation.

[0061] FIG. 8 shows a perspective view of a spray nozzle device 29. The spray nozzle device 29 is configured to be installed in an aerosol dispenser. The spray nozzle device 29 comprises a holding member 31 and the spray nozzle chip 1. FIG. 9 is a cross-section of the spray nozzle device 29. The holding member 31 is configured to hold the contact interface carrier 27. The contact interface carrier 27 is centred such that the central axis of the contact interface carrier 27 coincides with the central longitudinal axis of the spray nozzle device 29. The fluid channel 15 is hence centred in the spray nozzle device 29. The central longitudinal axis of the spray nozzle device 29 thus extends through the fluid channel 15, as shown in FIG. 10.

[0062] The spray nozzle chip 1 and/or the contact interface carrier 27 may be moulded into the main body of the spray nozzle device 29.

[0063] FIG. 11 shows an example of an aerosol dispenser 33, such as an inhaler. The aerosol dispenser 33 may be a medicament delivery device. The aerosol dispenser 33 comprises the spray nozzle device 29. When an aerosol is to be dispensed by the aerosol dispenser 33, the aerosol is created by the spray nozzle chip 1.

[0064] The aerosol dispenser 33 may comprise an electronics unit configured to power the pressure sensing device 12. The electronics unit may be configured to power the pressure sensing device 12 and to receive pressure measurement signals via the contact pads 12C. The electronics unit may be configured to power the reference pressure sensing device 19 and to receive pressure measurement signals via the reference contact pads 19c.

[0065] The electronics unit may be configured to process the pressure measurement signals from the pressure sensing device 12. For example, the electronics unit may be configured to determine the pressure applied to the spray membrane 7 in the spray orifice region based on the pressure measurement signals. The electronics unit may be configured to process the pressure measurement signals from the reference pressure sensing device 19. For example, the electronics unit may be configured to determine the suction force or pressure applied to the spray membrane 7 in the reference pressure region.

[0066] The electronics unit may according to one variation be configured to transmit the pressure measurement signals from the pressure sensing device 12 and/or the reference pressure sensing device 19 wirelessly to an external unit, such as a smart phone, a tablet computer or to a server in a cloud.

[0067] The inventive concept has mainly been described above with reference to a few examples. However, as is readily appreciated by a person skilled in the art, other embodiments than the ones disclosed above are equally possible within the scope of the inventive concept, as defined by the appended claims.