LASER TREATMENT SYSTEMS AND METHODS FOR IN-SITU LASER SHOCK PEENING (LSP) TREATMENT OF PARTS DURING PRODUCTION THEREOF BY A SELECTIVE LASER SINTERING OR MELTING (SLS/SLM) PROCESS, AND ADDITIVE MANUFACTURING SYSTEMS AND METHODS IMPLEMENTING THE SAME
20220395906 · 2022-12-15
Inventors
Cpc classification
B22F10/32
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/60
PERFORMING OPERATIONS; TRANSPORTING
B22F10/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y40/20
PERFORMING OPERATIONS; TRANSPORTING
B22F3/24
PERFORMING OPERATIONS; TRANSPORTING
B22F10/00
PERFORMING OPERATIONS; TRANSPORTING
B22F2998/10
PERFORMING OPERATIONS; TRANSPORTING
B23K31/003
PERFORMING OPERATIONS; TRANSPORTING
B22F12/41
PERFORMING OPERATIONS; TRANSPORTING
B22F3/24
PERFORMING OPERATIONS; TRANSPORTING
B22F2003/247
PERFORMING OPERATIONS; TRANSPORTING
B22F2003/247
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/28
PERFORMING OPERATIONS; TRANSPORTING
B22F2998/10
PERFORMING OPERATIONS; TRANSPORTING
B23K26/16
PERFORMING OPERATIONS; TRANSPORTING
B33Y40/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/50
PERFORMING OPERATIONS; TRANSPORTING
International classification
B22F10/50
PERFORMING OPERATIONS; TRANSPORTING
B22F12/41
PERFORMING OPERATIONS; TRANSPORTING
B23K26/16
PERFORMING OPERATIONS; TRANSPORTING
B23K26/70
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y40/20
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A laser treatment system and method for imparting beneficial residual stresses into a desired part during production thereof by a Selective Laser Sintering or Melting (SLS/SLM) process, the method including repeatedly subjecting the part to an in-situ Laser Shock Peening (LSP) treatment during the SLS/SLM process. The in-situ LSP treatment includes selectively bringing an LSP module in contact with a surface of the part during the SLS/SLM process, and subjecting the LSP module to the action of a first laser beam to impart beneficial residual stresses into the part. The LSP module is movable between a building chamber where the part is being produced for the purpose of carrying out the in-situ LSP treatment, and a separate storage chamber when the LSP module is not used for the purpose of carrying out the in-situ LSP treatment. The invention is also implementable in a corresponding additive manufacturing system and method.
Claims
1.-70. (canceled)
71. A laser treatment system configured to impart beneficial residual stresses into a desired part during production thereof by a Selective Laser Sintering or Melting (SLS/SLM) process, the laser treatment system comprising: a powder bed configured to receive powder particles and in which the desired part can be gradually produced, layer after layer, in accordance with the SLS/SLM process; a first laser unit configured to produce a first laser beam that is selected to carry out an in-situ Laser Shock Peening (LSP) treatment on the desired part as the desired part is gradually being produced in the powder bed; an LSP module operable in conjunction with the first laser unit and configured to be selectively brought, during the in-situ LSP treatment, in contact with a surface of the powder bed; and a laser guiding system configured to guide the first laser beam, during the in-situ LSP treatment, over selected portions of the surface of the powder bed to impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam, wherein the powder bed is located in a building chamber and wherein the LSP module is configured to be selectively brought into the building chamber for the purpose of carrying out the in-situ LSP treatment and to be temporarily stored, when not used for the purpose of carrying out the in-situ LSP treatment, into a separate storage chamber located adjacent to the building chamber.
72. The laser treatment system according to claim 71, wherein the storage chamber is isolated from the building chamber to protect the LSP module temporarily stored therein from process residues.
73. The laser treatment system according to claim 72, wherein the storage chamber is isolated from the building chamber by overpressure to prevent entry of process residues into the storage chamber.
74. The laser treatment system according to claim 72, wherein the storage chamber is isolated from the building chamber by an operable door separating the building chamber from the storage chamber, and wherein the LSP module is conveyable through a passageway defined by the door.
75. The laser treatment system according to claim 74, wherein the passageway of the door is provided with one or more brush elements configured to remove process residues from the LSP module as the LSP module is conveyed through the passageway.
76. The laser treatment system according to claim 74, wherein the passageway of the door is provided with one or more nozzle elements configured to subject the LSP module to a gas flow to remove process residues from the LSP module as the LSP module is conveyed through the passageway.
77. A laser treatment system configured to impart beneficial residual stresses into a desired part during production thereof by a Selective Laser Sintering or Melting (SLS/SLM) process, the laser treatment system comprising: a powder bed configured to receive powder particles and in which the desired part can be gradually produced, layer after layer, in accordance with the SLS/SLM process; a first laser unit configured to produce a first laser beam that is selected to carry out an in-situ Laser Shock Peening (LSP) treatment on the desired part as the desired part is gradually being produced in the powder bed; an LSP module operable in conjunction with the first laser unit and configured to be selectively brought, during the in-situ LSP treatment, in contact with a surface of the powder bed; and a laser guiding system configured to guide the first laser beam, during the in-situ LSP treatment, over selected portions of the surface of the powder bed to impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam, wherein the LSP module includes: a confining window transparent to the first laser beam; and consumable confining material which is positioned and guided between the confining window and the surface of the powder bed, the consumable confining material including a consumable confining layer transparent to the first laser beam, and wherein the consumable confining material is positioned and guided in such a way that the consumable confining layer surrounds the confining window on top and bottom surfaces thereof and protects the confining window from contamination by process residues.
78. The laser treatment system according to claim 77, wherein the LSP module further includes consumable ablative material, separate from the consumable confining material, which is positioned and guided between the consumable confining material and the surface of the powder bed, the consumable ablative material including a consumable ablative layer that is selected to interact with the first laser beam and impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam.
79. The laser treatment system according to claim 71, wherein the LSP module is configured, at least temporarily, to be at least partially located within a stream of gas produced by an associated protective gas flow arrangement when not used for the purpose of carrying out the in-situ LSP treatment.
80. The laser treatment system according to claim 77, wherein the LSP module is configured, at least temporarily, to be at least partially located within a stream of gas produced by an associated protective gas flow arrangement when not used for the purpose of carrying out the in-situ LSP treatment.
81. A laser treatment system configured to impart beneficial residual stresses into a desired part during production thereof by a Selective Laser Sintering or Melting (SLS/SLM) process, the laser treatment system comprising: a powder bed configured to receive powder particles and in which the desired part can be gradually produced, layer after layer, in accordance with the SLS/SLM process; a first laser unit configured to produce a first laser beam that is selected to carry out an in-situ Laser Shock Peening (LSP) treatment on the desired part as the desired part is gradually being produced in the powder bed; an LSP module operable in conjunction with the first laser unit and configured to be selectively brought, during the in-situ LSP treatment, in contact with a surface of the powder bed; and a laser guiding system configured to guide the first laser beam, during the in-situ LSP treatment, over selected portions of the surface of the powder bed to impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam, wherein the LSP module is configured, at least temporarily, to be at least partially located within a stream of gas produced by an associated protective gas flow arrangement when not used for the purpose of carrying out the in-situ LSP treatment.
82. A laser treatment system configured to impart beneficial residual stresses into a desired part during production thereof by a Selective Laser Sintering or Melting (SLS/SLM) process, the laser treatment system comprising: a powder bed configured to receive powder particles and in which the desired part can be gradually produced, layer after layer, in accordance with the SLS/SLM process; a first laser unit configured to produce a first laser beam that is selected to carry out an in-situ Laser Shock Peening (LSP) treatment on the desired part as the desired part is gradually being produced in the powder bed; an LSP module operable in conjunction with the first laser unit and configured to be selectively brought, during the in-situ LSP treatment, in contact with a surface of the powder bed; and a laser guiding system configured to guide the first laser beam, during the in-situ LSP treatment, over selected portions of the surface of the powder bed to impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam, wherein the laser treatment system further comprises a fan and/or mechanical elements, such as brush elements, to remove process residues from the LSP module.
83. The laser treatment system according to claim 71, wherein the LSP module includes: a confining window transparent to the first laser beam; and consumable confining material which is positioned and guided between the confining window and the surface of the powder bed, the consumable confining material including a consumable confining layer transparent to the first laser beam.
84. The laser treatment system according to claim 83, wherein the consumable confining material further includes a consumable ablative layer that is selected to interact with the first laser beam, which consumable ablative layer is brought, during the in-situ LSP treatment, in contact with the surface of the powder bed to impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam.
85. The laser treatment system according to claim 81, wherein the LSP module includes: a confining window transparent to the first laser beam; and consumable confining material which is positioned and guided between the confining window and the surface of the powder bed, the consumable confining material including a consumable confining layer transparent to the first laser beam.
86. The laser treatment system according to claim 85, wherein the consumable confining material further includes a consumable ablative layer that is selected to interact with the first laser beam, which consumable ablative layer is brought, during the in-situ LSP treatment, in contact with the surface of the powder bed to impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam.
87. The laser treatment system according to claim 82, wherein the LSP module includes: a confining window transparent to the first laser beam; and consumable confining material which is positioned and guided between the confining window and the surface of the powder bed, the consumable confining material including a consumable confining layer transparent to the first laser beam.
88. The laser treatment system according to claim 87, wherein the consumable confining material further includes a consumable ablative layer that is selected to interact with the first laser beam, which consumable ablative layer is brought, during the in-situ LSP treatment, in contact with the surface of the powder bed to impart beneficial residual stresses into the desired part upon being subjected to the action of the first laser beam.
89. The laser treatment system according to claim 77, wherein the LSP module is configured, at least temporarily, to be at least partially located within a stream of gas produced by an associated protective gas flow arrangement when not used for the purpose of carrying out the in-situ LSP treatment, and wherein the confining window as a whole is configured to be located within the stream of gas when the LSP module is not used for the purpose of carrying out the in-situ LSP treatment.
90. The laser treatment system according to claim 83, wherein the LSP module is configured, at least temporarily, to be at least partially located within a stream of gas produced by an associated protective gas flow arrangement when not used for the purpose of carrying out the in-situ LSP treatment, and wherein the confining window as a whole is configured to be located within the stream of gas when the LSP module is not used for the purpose of carrying out the in-situ LSP treatment.
91. The laser treatment system according to claim 85, wherein the LSP module is configured, at least temporarily, to be at least partially located within a stream of gas produced by an associated protective gas flow arrangement when not used for the purpose of carrying out the in-situ LSP treatment, and wherein the confining window as a whole is configured to be located within the stream of gas when the LSP module is not used for the purpose of carrying out the in-situ LSP treatment.
92. The laser treatment system according to claim 87, wherein the LSP module is configured, at least temporarily, to be at least partially located within a stream of gas produced by an associated protective gas flow arrangement when not used for the purpose of carrying out the in-situ LSP treatment, and wherein the confining window as a whole is configured to be located within the stream of gas when the LSP module is not used for the purpose of carrying out the in-situ LSP treatment.
93. The laser treatment system according to claim 81, wherein the stream of gas flows in an essentially closed loop from a gas flow outlet to a gas flow inlet of the protective gas flow arrangement.
94. The laser treatment system according to claim 81, wherein the stream of gas is a stream of inert gas, such as nitrogen or argon.
95. The laser treatment system according to claim 81, wherein the stream of gas flows in an open loop out of a gas flow outlet of the protective gas flow arrangement.
96. The laser treatment system according to claim 81, wherein the protective gas flow arrangement is stationary and wherein the LSP module is configured to be movable out of the stream of gas produced by the protective gas flow arrangement, when used for the purpose of carrying out the in-situ LSP treatment, and into the stream of gas produced by the protective gas flow arrangement, when not used for the purpose of carrying out the in-situ LSP treatment.
97. The laser treatment system according to claim 81, wherein the protective gas flow arrangement is an integral part of the LSP module and is movable together with the LSP module.
98. The laser treatment system according to claim 77, wherein the consumable confining material is supplied in the form of rolls and wherein the laser treatment system comprises a supply roll from which fresh confining material is unwound and a recovery roll onto which used confining material is wound after use.
99. The laser treatment system according to claim 83, wherein the consumable confining material is supplied in the form of rolls and wherein the laser treatment system comprises a supply roll from which fresh confining material is unwound and a recovery roll onto which used confining material is wound after use.
100. The laser treatment system according to claim 85, wherein the consumable confining material is supplied in the form of rolls and wherein the laser treatment system comprises a supply roll from which fresh confining material is unwound and a recovery roll onto which used confining material is wound after use.
101. The laser treatment system according to claim 87, wherein the consumable confining material is supplied in the form of rolls and wherein the laser treatment system comprises a supply roll from which fresh confining material is unwound and a recovery roll onto which used confining material is wound after use.
102. The laser treatment system according to claim 78, wherein the consumable ablative material is supplied in the form of rolls and wherein the laser treatment system comprises a supply roll from which fresh ablative material is unwound and a recovery roll onto which used ablative material is wound after use.
103. The laser treatment system according to claim 78, wherein the consumable confining material is supplied in the form of rolls, wherein the laser treatment system comprises a first supply roll from which fresh confining material is unwound, a second supply roll from which fresh ablative material is unwound, and a common recovery roll onto which used confining material and used ablative material are is wound after use.
104. An additive manufacturing system for production of a desired part by a Selective Laser Sintering or Melting (SLS/SLM) process, the additive manufacturing system comprising a laser treatment system in accordance with claim 71 acting as in-situ laser treatment system during the SLS/SLM process, the additive manufacturing system further comprising: a movable platform located below the powder bed and configured to be gradually lowered as the desired part is being gradually produced in the powder bed; a second laser unit configured to produce a second laser beam that is selected to interact with the powder particles contained in the powder bed to carry out the SLS/SLM process; and a powder deposition system configured to deposit a fresh layer of powder particles over the surface of the powder bed prior to treatment with the second laser beam.
105. The additive manufacturing system according to claim 104, wherein the laser guiding system is further configured to guide the second laser beam over selected portions of the surface of the powder bed during the SLS/SLM process to cause local fusing or melting of the powder particles.
106. The additive manufacturing system according to claim 104, further comprising a beam splitter configured to direct the first laser beam to the laser guiding system during the in-situ LSP treatment and/or to a secondary laser treatment system configured to perform an in-line post-treatment of a produced part, which secondary laser treatment system is configured to subject the produced part to an LSP post-treatment, namely, an in-line LSP post-process.
107. An additive manufacturing system for production of a desired part by a Selective Laser Sintering or Melting (SLS/SLM) process, the additive manufacturing system comprising a laser treatment system in accordance with claim 77 acting as in-situ laser treatment system during the SLS/SLM process, the additive manufacturing system further comprising: a movable platform located below the powder bed and configured to be gradually lowered as the desired part is being gradually produced in the powder bed; a second laser unit configured to produce a second laser beam that is selected to interact with the powder particles contained in the powder bed to carry out the SLS/SLM process; and a powder deposition system configured to deposit a fresh layer of powder particles over the surface of the powder bed prior to treatment with the second laser beam.
108. The additive manufacturing system according to claim 107, wherein the laser guiding system is further configured to guide the second laser beam over selected portions of the surface of the powder bed during the SLS/SLM process to cause local fusing or melting of the powder particles.
109. The additive manufacturing system according to claim 107, further comprising a beam splitter configured to direct the first laser beam to the laser guiding system during the in-situ LSP treatment and/or to a secondary laser treatment system configured to perform an in-line post-treatment of a produced part, which secondary laser treatment system is configured to subject the produced part to an LSP post-treatment, namely, an in-line LSP post-process.
110. An additive manufacturing system for production of a desired part by a Selective Laser Sintering or Melting (SLS/SLM) process, the additive manufacturing system comprising a laser treatment system in accordance with claim 81 acting as in-situ laser treatment system during the SLS/SLM process, the additive manufacturing system further comprising: a movable platform located below the powder bed and configured to be gradually lowered as the desired part is being gradually produced in the powder bed; a second laser unit configured to produce a second laser beam that is selected to interact with the powder particles contained in the powder bed to carry out the SLS/SLM process; and a powder deposition system configured to deposit a fresh layer of powder particles over the surface of the powder bed prior to treatment with the second laser beam.
111. The additive manufacturing system according to claim 110, wherein the laser guiding system is further configured to guide the second laser beam over selected portions of the surface of the powder bed during the SLS/SLM process to cause local fusing or melting of the powder particles.
112. The additive manufacturing system according to claim 110, further comprising a beam splitter configured to direct the first laser beam to the laser guiding system during the in-situ LSP treatment and/or to a secondary laser treatment system configured to perform an in-line post-treatment of a produced part, which secondary laser treatment system is configured to subject the produced part to an LSP post-treatment, namely, an in-line LSP post-process.
113. An additive manufacturing system for production of a desired part by a Selective Laser Sintering or Melting (SLS/SLM) process, the additive manufacturing system comprising a laser treatment system in accordance with claim 82 acting as in-situ laser treatment system during the SLS/SLM process, the additive manufacturing system further comprising: a movable platform located below the powder bed and configured to be gradually lowered as the desired part is being gradually produced in the powder bed; a second laser unit configured to produce a second laser beam that is selected to interact with the powder particles contained in the powder bed to carry out the SLS/SLM process; and a powder deposition system configured to deposit a fresh layer of powder particles over the surface of the powder bed prior to treatment with the second laser beam.
114. The additive manufacturing system according to claim 113, wherein the laser guiding system is further configured to guide the second laser beam over selected portions of the surface of the powder bed during the SLS/SLM process to cause local fusing or melting of the powder particles.
115. The additive manufacturing system according to claim 113, further comprising a beam splitter configured to direct the first laser beam to the laser guiding system during the in-situ LSP treatment and/or to a secondary laser treatment system configured to perform an in-line post-treatment of a produced part, which secondary laser treatment system is configured to subject the produced part to an LSP post-treatment, namely, an in-line LSP post-process.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0068] Other features and advantages of the present invention will appear more clearly from reading the following detailed description of embodiments of the invention which are presented solely by way of non-restrictive examples and illustrated by the attached drawings in which:
[0069]
[0070]
[0071]
[0072]
[0073]
[0074]
[0075]
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
[0076] The present invention will be described in relation to various illustrative embodiments as illustrated in particular by
[0077] As described herein, when two or more parts or components are described as being connected, attached, secured or coupled to one another, they can be so connected, attached, secured or coupled directly to each other or through one or more intermediary parts.
[0078]
[0079] The in-situ LSP treatment system 10.1 is used to carry out an in-situ Laser Shock Peening (LSP) treatment on the desired part being produced during the SLS/SLM process in a manner similar to the approach described with reference to
[0080] In essence, the LSP module 20 can be similar to the LSP module 20 discussed with reference to
[0081] In accordance with this first aspect of the invention, the LSP module 20 is configured to be selectively brought into the building chamber 30 for the purpose of carrying out the in-situ LSP treatment and to be temporarily stored, when not used for the purpose of carrying out the in-situ LSP treatment, into a separate storage chamber 35 located adjacent to the building chamber 30. In that regard,
[0082] By way of preference, the storage chamber 35 is more specifically isolated from the building chamber 30 to protect the LSP module 20 temporarily stored therein form process residues. Various means can be contemplated and combined to ensure optimal protection of the LSP module 20. Advantageously, the storage chamber 35 may be isolated from the building chamber by overpressure to prevent entry of process residues into the storage chamber 35. In that regard, reference numeral 350 in
[0083] Alternatively or additionally, the storage chamber 35 may be isolated from the building chamber 30 by an operable door 300 separating the building chamber 30 from the storage chamber 35, the LSP module 20 being conveyable though a passageway defined by the door 300, thereby achieving total physical separation between the two chambers. In this context, the passageway of the door 300 may be provided with one or more brush elements configured to remove process residues that may be present on the LSP module as the LSP module is being conveyed through the passageway. Similarly, the passageway may additionally or alternatively be provided with one or more nozzle elements configured to subject the LSP module 20 to a gas flow to remove process residues from the LSP module as it is being conveyed through the passageway.
[0084]
[0085] The in-situ LSP treatment system 10.2 shown in
[0086] In contrast with the known solution shown in
[0087]
[0088] In accordance with this third embodiment, the LSP module 20 further includes consumable ablative material 25b, here separate from the consumable confining material 25, which is positioned and guided between the consumable confining material 25 and the surface S of the powder bed 15. This consumable ablative material 25b includes a consumable ablative layer that is selected to interact with the LSP laser beam L.sub.LSP and impart beneficial residual stresses into the desired part P upon being subjected to the action of the LSP laser beam L.sub.LSP. In effect, the consumable ablative material 25b is not an integral part of the consumable confining material 25 (as discussed e.g. in connection with the known solution shown in
[0089] The consumable ablative material 25b may advantageously be supplied in the form of rolls. More specifically, a dedicated supply roll 253 may be provided from which fresh ablative material 25b may be unwound. A dedicated recovery roll may likewise be provided to allow used ablative material 25b to be rewound. In the illustrated example, used ablative material 25b is advantageously wound on the same recovery roll 252 as used for recovering the used confining material 25 bearing the used confining layer 25a.
[0090]
[0091] The in-situ LSP treatment system 10.4 shown in
[0092] The protective gas flow arrangement 200 can be designed to operate in an essentially closed loop or, alternatively, in an open loop. A closed loop arrangement is particularly advantageous in the event that an inert gas, such as nitrogen or—especially—argon, is adopted, as consumption of the inert gas and/or release thereof in the environment should be kept under control and/or restricted. A closed loop arrangement may additionally be provided with a suitable filtration system to ensure that process residues are not being sucked in and reemitted.
[0093] The protective gas flow arrangement 200 may be stationary with respect to the LSP module 20, meaning that the LSP module 20 is selectively moved out of the stream of gas, when used for the purpose of carrying out the in-situ LSP treatment, and into the stream of gas, when not used for the purpose of carrying out the in-situ LSP treatment.
[0094] Alternatively, the protective gas flow arrangement 200 could be an integral part of the LSP module 20 and be movable together with the LSP module 20. In this context, it may be desirable (but not necessary) to switch off the stream of gas during the in-situ LSP treatment, when the LSP module 20 is brought in contact with the surface S of the powder bed 15 to prevent any interference between the stream of gas and the powder particles contained in the powder bed 15.
[0095] As shown in the schematic top view of
[0096] As already mentioned above, the protective gas flow arrangement 200 could alternatively be designed to operate in an open loop, in which case the gas flow inlet 220 could be omitted.
[0097] The third aspect of the invention described with reference to
[0098] In accordance with a fourth aspect of the invention, not specifically illustrated, one could also contemplate to make use of a fan and/or mechanical elements, such as brush elements, to remove process residues from the LSP module, especially from the top surface of the confining window.
[0099]
[0100] The in-situ LSP treatment system 10.5 may in essence be any suitable laser treatment system, including the known in-situ LSP treatment system 10 of
[0101] Some components of the SLS/SLM system 1.5 used for the purpose of carrying out layer-by-layer production of the desired part (not shown in
[0102] The SLS/SLM system 1.5 depicted in
[0103] The SLS/SLM system 1.5 of
[0104] As the secondary laser treatment system 100 makes use of the same LSP laser L.sub.LSP as the in-situ LSP treatment system 10.5, overall processing time is significantly decreased. Parts are initially produced in the main building chamber 30 (as previously described). Once the SLS/SLM process is completed, the part P* (still attached e.g. to a baseplate) can be moved through the optional modules 40, 50, 60 for carrying out e.g. powder removal, heat treatment, as well as detachment/cutting from the baseplate, as well as potentially other post-processing steps. Once the part is ready for the LSP post-process, it can be conveyed to the secondary laser treatment system 100.
[0105] Schematically shown in
[0106] Advantageously, water is used as confining medium for the in-line LSP post-process and a suitable water supply 150 is provided to that end. Exceptionally, the in-line LSP post-process may be carried out using a solid confinement as confining medium.
[0107] The LSP laser beam L.sub.LSP produced by the LSP laser unit 21 can be used selectively and separately for the purpose of carrying out the in-situ laser treatment of the desired part P, during SLS/SLM production thereof, or for the purpose of carrying out the in-line LSP post-treatment of the produced part P*. In that context, the beam splitter 80 is specifically configured to switch and direct the LSP laser beam L.sub.LSP to the laser guiding system 12 or to the laser guiding system 110.
[0108] Alternatively, depending on the energy of the LSP laser unit 21 and the relevant energy requirements of the in-situ LSP treatment system 10.5 and of the secondary laser treatment system 100 used for the in-line LSP post-process, the beam splitter 80 could be configured to split the LSP laser beam L.sub.LSP to direct part of the energy thereof to the laser guiding system 12 and another part to the laser guiding system 110. The ratio of energies could be adjusted on the run during production using the beam splitter 80.
[0109] Various modifications and/or improvements may be made to the above-described embodiments without departing from the scope of the invention as defined by the appended claims. For instance, with regard to the embodiments shown in
LIST OF REFERENCE NUMERALS AND SIGNS USED THEREIN
[0110] 1 additive manufacturing system (prior art) [0111] 1′ additive manufacturing system with in-situ LSP treatment system (prior art) [0112] 1.1 additive manufacturing system with in-situ LSP treatment system (first embodiment of