RELAY, AND METHOD FOR OPERATING A RELAY

Abstract

A relay. The relay includes a housing and a microelectromechanical (MEMS) component having a MEMS switch that can be switched between two stable states. The relay further comprises an application-specific integrated circuit (ASIC) component which, along with the MEMS component, is arranged in the housing. The ASIC component is configured to control the MEMS switch and/or to monitor a functionality of the MEMS switch.

Claims

1-13. (canceled)

14. A relay, comprising: a housing; a microelectromechanical (MEMS) component including a MEMS switch that can be switched between two stable states; an application-specific integrated circuit (ASIC) component, which is arranged together with the MEMS component in the housing, wherein the ASIC component is configured to control the MEMS switch and/or monitor a functionality of the MEMS switch.

15. The relay according to claim 14, wherein the ASIC component is configured as a cap of the MEMS component.

16. The relay according to claim 14, wherein the ASIC component is configured to monitor a switching state of the MEMS switch.

17. The relay according to claim 14, wherein the ASIC component is configured to monitor a closing voltage and/or opening voltage of the MEMS switch.

18. The relay according to claim 14, wherein the ASIC component is configured to monitor a relay current through the MEMS switch.

19. The relay according to claim 14, wherein the ASIC component is configured to monitor a contact resistance of a contact area of electrodes of the MEMS switch.

20. The relay according to claim 14, wherein the ASIC component is configured to monitor a switch-on time and/or switch-off time of the MEMS switch.

21. The relay according to claim 14, wherein the ASIC component is configured to calculate an expected lifetime of the relay based on the monitored functionality of the MEMS switch.

22. The relay according to claim 14, wherein the ASIC component includes an interface to output an electrical signal in dependence on the monitored functionality of the MEMS switch.

23. The relay according to claim 22, wherein the ASIC component is configured to output an error signal when the monitored functionality of the MEMS switch does not meet predetermined requirements.

24. The relay according to claim 14, further comprising an electrode for capacitively ascertaining a state of motion of a movable structure of the MEMS switch.

25. The relay according to claim 14, wherein the functionality of the MEMS switch monitored by ASIC component includes a switching delay of the MEMS switch, and wherein the ASIC component is configured to compensate for the switching delay of the MEMS switch and/or to output a signal based on the monitored switching delay of the MEMS switch.

26. A method for operating a relay, wherein the relay includes a microelectromechanical (MEMS) component including a MEMS switch that can be switched between two stable states, and wherein the relay includes an application-specific integrated circuit (ASIC) component arranged together with the MEMS component in a housing, the method comprising: controlling and/or monitoring a functionality of the MEMS switch by the ASIC component.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG. 1 shows a schematic cross-sectional view of a relay according to one embodiment of the present invention.

[0042] FIG. 2 shows a schematic cross-sectional view of a relay according to a further embodiment of the present invention.

[0043] FIG. 3 shows a flowchart of a method for operating a relay according to one embodiment of the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0044] In all figures, identical or functionally identical elements and devices are provided with the same reference signs. The numbering of the method steps is used for reasons of clarity and is generally not intended to imply any particular temporal order. It is in particular also possible to perform multiple method steps simultaneously.

[0045] FIG. 1 shows a schematic cross-sectional view of a relay 100. The relay 100 comprises a MEMS component 1 with a MEMS switch (not shown) that can be switched between two stable states. Further, the relay comprises an ASIC component 2, which is configured as a cap of the MEMS component 1.

[0046] The MEMS component 1 comprises an active structure 3 facing the ASIC component 2, which active structure 3 comprises, for example, the MEMS switch. Accordingly, the ASIC component 2 comprises an active structure 5 facing the MEMS component 1, which active structure 5 comprises, for example, the computing unit. The MEMS component 1 and the ASIC component 2 are connected to each other via an interconnect layer 4, creating a hermetically-sealed space. ASIC component 2 thus serves as a cap of MEMS component 1.

[0047] ASIC component 2 can control the MEMS switch, such as turning the MEMS switch on or off. Additionally or alternatively, the ASIC component 2 may monitor a functionality of the MEMS switch. Thus, the ASIC component 2 can ascertain a switching state of the MEMS switch. Further, the ASIC component 2 can measure a change in capacitance at control electrodes of the MEMS switch. The ASIC component 2 may be further configured to measure a closing voltage and/or opening voltage of the MEMS switch. The ASIC component 2 can additionally or alternatively ascertain a switch-on time and/or switch-off time of the MEMS switch. The ASIC component 2 can measure a relay current through the MEMS switch. Further, the ASIC component 2 can ascertain a contact resistance of a contact area of electrodes of the MEMS switch.

[0048] The ASIC component 2 comprises a digital and analog logic part, i.e., a computing unit for evaluating data, such as the measurement data for calculating the functionalities of the MEMS switch described above. The logic part of the ASIC component 2 may comprise standard functions, such as an SPI interface for controlling multiple relays or a charge pump for a higher control voltage. The connection to external devices can be made through a connection structure 6 and solder balls 7, through which electrical signals can be sent and received.

[0049] The ASIC component 2 may be configured to perform a built-in self-test or online test. The ASIC component 2 can further ascertain critical system information. The ASIC component 2 can calculate a lifetime of components of the relay, such as a contact area of the MEMS switch or the contact resistance, based on the monitored functionality of the MEMS switch.

[0050] The ASIC component 2 may also be configured to control multiple MEMS switches.

[0051] Further, the ASIC component 2 may be configured to monitor a power supply. The ASIC component 2 can also control the switching operation, for example by measuring and taking into account delays during switching.

[0052] FIG. 2 shows a schematic cross-sectional view of another relay 200. The relay 200 also comprises a MEMS component 1 and an ASIC component 2. The MEMS component 1 comprises a substrate 14 and a first electrode 13 arranged on the substrate 14 via an intermediate layer 15. The MEMS component 1 further comprises a MEMS switch comprising a lower contact structure 19 and an upper contact structure 17.

[0053] Via a second electrode 22 that can be controlled by the ASIC component 2, the first electrode 13 can be moved in the direction of the second electrode 22 so that the upper contact structure 17 contacts the lower contact structure 19, thus closing the MEMS switch.

[0054] The MEMS component 1 is connected to the ASIC component 2 via an interconnect layer 11. The ASIC component 2 comprises semiconductor structures 16, 23, via which the second electrode 22 can be controlled. Further, through connections 20 and solder balls 21 are provided, the through connections 20 extending through a substrate 18 of the ASIC component 2.

[0055] There is also an electrical connection 12 between the ASIC component 2 and the MEMS component 1.

[0056] FIG. 3 shows a flowchart of a method for operating a relay, such as the relay 100, 200 described in FIG. 1 or 2. In particular, the relay 100, 200 comprises a MEMS component 1 with a MEMS switch that can be switched between two stable states. Further, the relay 100, 200 comprises an ASIC component 2, which is configured as a cap of the MEMS component 1.

[0057] In a first method step S1, the ASIC component 2 controls the MEMS switch 17, 19 and the ASIC component 2 monitors a functionality of the MEMS switch 17, 19.

[0058] In a further method step S2, the ASIC component 2 can adjust the control of the MEMS switch 17, 19 depending on the monitored functionality of the MEMS switch 17, 19. In particular, delay times during opening and closing can be taken into account. Further, depending on the monitored functionality, the ASIC component 2 may output error signals if certain characteristics of the MEMS switch 17, 19 are outside predetermined specifications.

[0059] The monitored functionality of the MEMS switch 17, 19 comprises, for example, at least one of a switching state of the MEMS switch 17, 19, a capacitance change at control electrodes of the MEMS switch 17, 19, a closing voltage of the MEMS switch 17, 19, an opening voltage of the MEMS switch 17, 19, a switch-on time of the MEMS switch 17, 19, a switch-off time of the MEMS switch 17, 19, a relay current through the MEMS switch 17, 19, or a contact resistance in a contact area of electrodes of the MEMS switch 17, 19.