PLATING APPARATUS AND PLATING PROCESSING METHOD

Abstract

A plating module 400 includes a plating tank 410, a substrate holder 440, an elevating mechanism 480, and a moving mechanism 490. The plating tank 410 is for housing a plating solution. The substrate holder 440 is for holding a substrate Wf with a surface to be plated Wf-a facing the plating solution housed in the plating tank 410. The elevating mechanism 480 is for elevating the substrate holder 440. The moving mechanism 490 is for moving the substrate holder 440 in a direction perpendicular to an elevating direction of the substrate holder 440.

Claims

1. A plating apparatus comprising: a plating tank for housing a plating solution; a substrate holder for holding a substrate with a surface to be plated facing the plating solution housed in the plating tank; an elevating mechanism for elevating the substrate holder; and a moving mechanism for moving the substrate holder in a direction perpendicular to an elevating direction of the substrate holder.

2. The plating apparatus according to claim 1, wherein the moving mechanism includes: a first moving mechanism for moving the substrate holder in a first direction perpendicular to the elevating direction; and a second moving mechanism for moving the substrate holder in a second direction perpendicular to the elevating direction and the first direction.

3. The plating apparatus according to claim 2, wherein the first moving mechanism includes a first linear guide extending in the first direction, a first support table disposed on the first linear guide, and a first driving member for moving the first support table along the first linear guide, the second moving mechanism includes a second linear guide extending in the second direction, a second support table disposed on the second linear guide, and a second driving member for moving the second support table along the second linear guide, the first moving mechanism and the second moving mechanism are disposed to be stacked on a base, and the elevating mechanism includes an elevating linear guide and an elevating driving member, the elevating linear guide being mounted to the first support table or the second support table, and extending in the elevating direction, the elevating driving member being for moving a holding member holding the substrate holder along the elevating linear guide.

4. The plating apparatus according to claim 1, wherein the moving mechanism moves the substrate holder such that a shaft center of an anode disposed inside the plating tank and a shaft center of the substrate held by the substrate holder are aligned.

5. The plating apparatus according to claim 1, wherein the plating apparatus further comprises a sensor for measuring a plating film thickness formed on the surface to be plated of the substrate by the plating process, and the moving mechanism is configured to move the substrate holder based on the plating film thickness measured by the sensor.

6. The plating apparatus according to claim 1, comprising a plurality of plating modules each including the plating tank, the substrate holder, the elevating mechanism, and the moving mechanism.

7. A plating processing method comprising: a moving step of moving a substrate holder for holding a substrate with a surface to be plated facing a plating solution housed in a plating tank in a direction perpendicular to an elevating direction of the substrate holder; a lowering step of lowering the substrate holder into the plating tank; and a plating step of performing a plating process on the substrate held by the substrate holder lowered into the plating tank.

8. The plating processing method according to claim 7, wherein the moving step includes: a first moving step of moving the substrate holder in a first direction perpendicular to the elevating direction; and a second moving step of moving the substrate holder in a second direction perpendicular to the elevating direction and the first direction.

9. The plating processing method according to claim 7, wherein the moving step includes a first moving step of moving the substrate holder such that a shaft center of an anode disposed inside the plating tank and a shaft center of the substrate held by the substrate holder are aligned.

10. The plating processing method according to claim 7, wherein the plating processing method further comprises a measuring step of measuring a plating film thickness formed on the surface to be plated of the substrate by the plating step, and the moving step includes a second moving step of moving the substrate holder based on the plating film thickness measured by the measuring step.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0009] FIG. 1 is a perspective view illustrating an overall configuration of a plating apparatus of this embodiment.

[0010] FIG. 2 is a plan view illustrating the overall configuration of the plating apparatus of this embodiment.

[0011] FIG. 3 is a vertical cross-sectional view schematically illustrating a configuration of a plating module of this embodiment.

[0012] FIG. 4 is a perspective view schematically illustrating the configuration of the plating module of this embodiment.

[0013] FIG. 5 is a diagram illustrating a plating film thickness profile of a substrate when adjusting a position in the X direction of a substrate holder.

[0014] FIG. 6 is a flowchart illustrating a plating processing method of this embodiment.

DESCRIPTION OF EMBODIMENTS

[0015] The following will describe an embodiment of the present invention with reference to the drawings. In the drawings described later, the identical reference numerals are assigned for the identical or equivalent constituent elements, and therefore such elements will not be further elaborated here.

[0016] <Overall Configuration of Plating Apparatus>

[0017] FIG. 1 is a perspective view illustrating the overall configuration of the plating apparatus of this embodiment. FIG. 2 is a plan view illustrating the overall configuration of the plating apparatus of this embodiment. As illustrated in FIGS. 1 and 2, a plating apparatus 1000 includes load ports 100, a transfer robot 110, aligners 120, pre-wet modules 200, pre-soak modules 300, plating modules 400, cleaning modules 500, spin rinse dryers 600, a transfer device 700, and a control module 800.

[0018] The load port 100 is a module for loading a substrate housed in a cassette, such as a FOUP, (not illustrated) to the plating apparatus 1000 and unloading the substrate from the plating apparatus 1000 to the cassette. While the four load ports 100 are arranged in the horizontal direction in this embodiment, the number of load ports 100 and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring the substrate that is configured to grip or release the substrate between the load port 100, the aligner 120, and the transfer device 700. The transfer robot 110 and the transfer device 700 can perform delivery and receipt of the substrate via a temporary placement table (not illustrated) to grip or release the substrate between the transfer robot 110 and the transfer device 700.

[0019] The aligner 120 is a module for adjusting a position of an orientation flat, a notch, and the like of the substrate in a predetermined direction. While the two aligners 120 are disposed to be arranged in the horizontal direction in this embodiment, the number of aligners 120 and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 wets a surface to be plated of the substrate before a plating process with a process liquid, such as pure water or deaerated water, to replace air inside a pattern formed on the surface of the substrate with the process liquid. The pre-wet module 200 is configured to perform a pre-wet process to facilitate supplying the plating solution to the inside of the pattern by replacing the process liquid inside the pattern with a plating solution during plating. While the two pre-wet modules 200 are disposed to be arranged in the vertical direction in this embodiment, the number of pre-wet modules 200 and arrangement of the pre-wet modules 200 are arbitrary.

[0020] For example, the pre-soak module 300 is configured to remove an oxidized film having a large electrical resistance present on a surface of a seed layer formed on the surface to be plated of the substrate before the plating process by etching with a process liquid, such as sulfuric acid and hydrochloric acid, and perform a pre-soak process that cleans or activates a surface of a plating base layer. While the two pre-soak modules 300 are disposed to be arranged in the vertical direction in this embodiment, the number of pre-soak modules 300 and arrangement of the pre-soak modules 300 are arbitrary. The plating module 400 performs the plating process on the substrate. There are two sets of the 12 plating modules 400 arranged by three in the vertical direction and by four in the horizontal direction, and the total 24 plating modules 400 are disposed in this embodiment, but the number of plating modules 400 and arrangement of the plating modules 400 are arbitrary.

[0021] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove the plating solution or the like left on the substrate after the plating process. While the two cleaning modules 500 are disposed to be arranged in the vertical direction in this embodiment, the number of cleaning modules 500 and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for rotating the substrate after the cleaning process at high speed and drying the substrate. While the two spin rinse dryers are disposed to be arranged in the vertical direction in this embodiment, the number of spin rinse dryers and arrangement of the spin rinse dryers are arbitrary. The transfer device 700 is a device for transferring the substrate between the plurality of modules inside the plating apparatus 1000. The control module 800 is configured to control the plurality of modules in the plating apparatus 1000 and can be configured of, for example, a general computer including input/output interfaces with an operator or a dedicated computer.

[0022] An example of a sequence of the plating processes by the plating apparatus 1000 will be described. First, the substrate housed in the cassette is loaded on the load port 100. Subsequently, the transfer robot 110 grips the substrate from the cassette at the load port 100 and transfers the substrate to the aligners 120. The aligner 120 adjusts the position of the orientation flat, the notch, or the like of the substrate in the predetermined direction. The transfer robot 110 grips or releases the substrate whose direction is adjusted with the aligners 120 to the transfer device 700.

[0023] The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wet module 200. The pre-wet module 200 performs the pre-wet process on the substrate. The transfer device 700 transfers the substrate on which the pre-wet process has been performed to the pre-soak module 300. The pre-soak module 300 performs the pre-soak process on the substrate. The transfer device 700 transfers the substrate on which the pre-soak process has been performed to the plating module 400. The plating module 400 performs the plating process on the substrate.

[0024] The transfer device 700 transfers the substrate on which the plating process has been performed to the cleaning module 500. The cleaning module 500 performs the cleaning process on the substrate. The transfer device 700 transfers the substrate on which the cleaning process has been performed to the spin rinse dryer 600. The spin rinse dryer 600 performs the drying process on the substrate. The transfer device 700 grips or releases the substrate on which the drying process has been performed to the transfer robot 110. The transfer robot 110 transfers the substrate received from the transfer device 700 to the cassette at the load port 100. Finally, the cassette housing the substrate is unloaded from the load port 100.

[0025] <Configuration of Plating Module>

[0026] Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 according to this embodiment have the identical configuration, only one plating module 400 will be described. FIG. 3 is a vertical cross-sectional view schematically illustrating the configuration of the plating module of this embodiment. As illustrated in FIG. 3, the plating module 400 includes a plating tank 410 to house the plating solution. The plating module 400 includes a membrane 420 that separates an inside of the plating tank 410 in the vertical direction. The inside of the plating tank 410 is partitioned into a cathode region 422 and an anode region 424 by the membrane 420. The cathode region 422 and the anode region 424 are each loaded with the plating solution. An anode 430 is disposed on the bottom surface of the plating tank 410 in the anode region 424. An ionically resistive element 450 facing the membrane 420 is disposed in the cathode region 422. The ionically resistive element 450 is a member to uniformize the plating process on a surface to be plated Wf-a of a substrate Wf and is made of a plate-shaped material on which many pores are formed. The plating module 400 may contain a paddle (not illustrated) to agitate the plating solution in an upper portion of the ionically resistive element 450. The plating module 400 also includes a sensor 455 to measure the plating film thickness formed on the surface to be plated Wf-a of the substrate Wf by the plating process. While the sensor 455 is disposed in the center of the upper surface of the ionically resistive element 450 of this embodiment, the arranged position of the sensor 455 is not limited thereto and in any place.

[0027] The plating module 400 includes a substrate holder 440 to hold the substrate Wf with the surface to be plated Wf-a facing downward. The substrate holder 440 includes a power feeding contact to feed power to the substrate Wf from a power source (not illustrated). A shaft 442 is secured to an upper surface of the substrate holder 440. A holding member 448 to hold the substrate holder 440 is mounted on the shaft 442. The holding member 448 includes a horizontal holder base 444 to hold the substrate holder 440 and a perpendicular holder base 446 to hold the horizontal holder base 444 via the shaft 442. The perpendicular holder base 446 is mounted to an elevating linear guide 482 to be movable in the vertical direction.

[0028] The plating module 400 includes a rotation mechanism 460 to rotate the substrate holder 440 such that the substrate Wf rotates around a virtual rotation axis that extends perpendicularly through the center of the surface to be plated Wf-a. The rotation mechanism 460 can be achieved by the known mechanism, such as a motor. In this embodiment, a pulley 462 is mounted to the shaft 442, and a belt 464 is mounted to the pulley 462. The rotation mechanism 460 is configured to rotate the substrate holder 440 by rotating the shaft 442 via the belt 464 and the pulley 462.

[0029] The plating module 400 includes an inclination mechanism 470 to incline the substrate holder 440. In this embodiment, the inclination mechanism 470 includes a cylinder 472 connected to the perpendicular holder base 446 via a rotation shaft, a piston rod 474 connected to the horizontal holder base 444 via a rotation shaft. The inclination mechanism 470 can adjust an angle of the substrate holder 440 by pressing and pulling the piston rod 474 with the cylinder 472. The inclination mechanism 470 can be achieved by the known mechanism, such as a tilt mechanism, without being limited to the above-described configuration.

[0030] The plating module 400 includes an elevating mechanism 480 that elevates the substrate holder 440 along the Z-axis (vertical direction). In this embodiment, the elevating mechanism 480 includes the elevating linear guide 482 that extends in an elevating direction and an elevating driving member 484 that moves the perpendicular holder base 446 in the vertical direction along the elevating linear guide 482. The elevating driving member 484 can be achieved by the known mechanism, such as a motor. The elevating mechanism 480 is configured to elevate the substrate holder 440 by moving the perpendicular holder base 446 in the vertical direction along the elevating linear guide 482. The plating module 400 is configured to perform a plating process on the surface to be plated Wf-a of the substrate Wf by immersing the substrate Wf in the plating solution of the cathode region 422 using the elevating mechanism 480 and applying a voltage between the anode 430 and the substrate Wf

[0031] The plating module 400 includes a moving mechanism 490 to move the substrate holder 440 in a direction perpendicular to the elevating direction of the substrate holder 440. The following describes the moving mechanism 490. FIG. 4 is a perspective view schematically illustrating a configuration of the plating module of this embodiment. In FIG. 4, the rotation mechanism 460, the inclination mechanism 470, the elevating mechanism 480, and the like are omitted for clarification of illustration.

[0032] As illustrated in FIG. 4, the moving mechanism 490 includes a first moving mechanism 490-1 to move the substrate holder 440 in a first direction (Y-axis direction) perpendicular to the elevating direction (Z-axis direction), and a second moving mechanism 490-2 to move the substrate holder 440 in a second direction (X-axis direction) perpendicular to the elevating direction and the first direction.

[0033] The first moving mechanism 490-1 includes a first linear guide 492 that extends in the first direction, a first support table 493 disposed on the first linear guide 492, and a first driving member 491 to move the first support table 493 along the first linear guide 492. The second moving mechanism 490-2 includes a second linear guide 496 that extends in the second direction, a second support table 497 disposed on the second linear guide 496, and a second driving member 495 to move the second support table 497 along the second linear guide 496. The first moving mechanism 490-1 and the second moving mechanism 490-2 can be achieved by the known mechanism, such as a linear motion guide.

[0034] The first moving mechanism 490-1 and the second moving mechanism 490-2 are disposed to be stacked on a base 494. In this embodiment, the first moving mechanism 490-1 is disposed on the base 494 and the second moving mechanism 490-2 is disposed on the first moving mechanism 490-1. The elevating linear guide 482 is secured onto the second support table 497. The positions of the first moving mechanism 490-1 and the second moving mechanism 490-2 may be interchanged. Only one of the first moving mechanism 490-1 and the second moving mechanism 490-2 may be disposed. The rotation mechanism 460, the inclination mechanism 470, the elevating mechanism 480, and the moving mechanism 490 may be controlled via the control module 800.

[0035] Since the plating module 400 of this embodiment includes the moving mechanism 490, the substrate holder 440 can be easily moved in a direction perpendicular (X-axis direction and Y-axis direction) to the elevating direction (Z-axis direction) of the substrate holder 440. Accordingly, the plating module 400 can easily perform the positional adjustment of the substrate holder 440. For example, since the plating module 400 is a large-sized device and has many components, due to a tolerance of each component and an assembling tolerance, it is difficult to align the shaft center of the substrate holder 440 (substrate Wf held by the substrate holder 440) and the shaft center of the anode 430 when installing the plating module 400. In this respect, according to the plating module 400 of this embodiment, the moving mechanism 490 can move the substrate holder 440 such that the shaft center of the anode 430 and the shaft center of the substrate Wf held by the substrate holder 440 are aligned. For example, the substrate holder 440 can be moved in the X-axis direction and the Y-axis direction via an input interface included in the control module 800. Therefore, the plating module 400 of this embodiment can easily align the shaft centers to keep the uniformity of the plating film thickness of the whole substrate.

[0036] Especially, like the plating apparatus 1000 of this embodiment, when a plurality (24 units) of the plating modules 400 are included, a considerable labor is taken to align the shaft centers of the substrate holder 440 and the anode 430 of each plating module 400. In this respect, if the moving mechanism 490 is included like in this embodiment, the shaft centers can be easily aligned in a plurality of the plating modules 400.

[0037] The moving mechanism 490 of the plating module 400 of this embodiment can be configured to move the substrate holder 440 based on the plating film thickness measured by the sensor 455. That is, with an object to improve the uniformity of the plating film thickness of the substrate Wf, in order to, for example, finely adjust the film thickness of the outer edge portion of the substrate Wf, it has been known to adjust a distance (distance in the Z direction) between the anode 430 and the substrate Wf. However, when the distance between the anode 430 and the substrate Wf is increased, a distance between the substrate and the paddle is also increased and it is concerned that the agitating efficiency of the plating solution near the surface to be plated Wf-a declines. In contrast, the inventors of this application have found that the positional relationship between the shaft center of the anode 430 and the shaft center of the substrate Wf affects the profile of the plating film thickness.

[0038] FIG. 5 is a diagram illustrating the plating film thickness profile of the substrate when adjusting the position in the X direction of the substrate holder. In FIG. 5, the horizontal axis is a radius (mm) of the substrate Wf and the vertical axis is the plating film thickness (arbitrary unit). FIG. 5 indicates the profile of the plating film thickness when aligning the shaft center of the substrate Wf and the shaft center of the anode 430 (X=0), and when shifting the shaft center of the substrate Wf in the X direction with respect to the shaft center of the anode 430 (X=0.2, 0.4, 0.6, 1.0).

[0039] As illustrated in FIG. 5, w % ben the shaft center of the substrate Wf is purposely shifted in the X direction with respect to the shaft center of the anode 430, the film thickness of the substrate Wf changes especially in the outer edge portion. In this embodiment, when the plating process was performed with the shaft center of the substrate Wf shifted 0.6 mm with respect to the shaft center of the anode 430, the uniformity of the plating film thickness of the substrate Wf improved. According to this embodiment, since the position of the shaft center of the substrate holder 440 can be adjusted with respect to the shaft center of the anode 430, the uniformity of the plating film thickness can be improved without increasing the distance between the substrate Wf and the paddle, that is, without the agitating efficiency of the plating solution declining.

[0040] Even with an initial setting of the uniformity of the plating film thickness for improvement, due to changes over time of the plating module 400, changes in the plating process, or the like, it is difficult to continuously keep the uniformity of the plating film thickness. In this case, a readjustment operation of the plating module 400 by a maintenance work is necessary. In this respect, according to this embodiment, the shaft center on the side of the substrate holder 440 (substrate Wf) can be adjusted via the control module 800, and therefore, the positions of the substrate holders 440 of the plurality of plating modules 400 can be managed by parameters, and the positions of the substrate holders 440 can be adjusted instantly.

[0041] Next, the plating processing method in this embodiment will be described. FIG. 6 is a flowchart illustrating the plating processing method of this embodiment. The flowchart of FIG. 6 illustrates, as one example, a process of installing the plating module 400.

[0042] As illustrated in FIG. 6, the plating processing method moves the substrate holder 440 in a direction perpendicular to the elevating direction of the substrate holder 440 using the moving mechanism 490 (a first moving step 110). Specifically, the first moving step 110 moves the substrate holder 440 such that the shaft center of the anode 430 disposed inside the plating tank 410 and the shaft center of the substrate Wf held by the substrate holder 440 are aligned. The first moving step 110 includes the first moving step of moving the substrate holder 440 in the first direction (X-axis direction) perpendicular to the elevating direction (Z-axis direction), and the second moving step of moving the substrate holder 440 in the second direction (Y-axis direction) perpendicular to the elevating direction and the first direction. The first moving step 110 can be performed by, for example, an operator inputting a movement amount in the X-axis direction and the Y-axis direction of the substrate holder 440 via the input interface of the control module 800. The alignment of the shaft centers of the substrate Wf and the anode 430 is completed by the first moving step 110.

[0043] Subsequently, the plating processing method installs the substrate Wf on the substrate holder 440 (a step 120). Then, the plating processing method lowers the substrate holder 440 into the plating tank 410 using the elevating mechanism 480 (a lowering step 130). Then, the plating processing method rotates the substrate holder 440 using the rotation mechanism 460 while performing the plating process on the substrate Wf held by the substrate holder 440 lowered into the plating tank 410 (a plating step 140).

[0044] Subsequently, the plating processing method measures the plating film thickness formed on the surface to be plated Wf-a of the substrate Wf by the plating step 140 (a measuring step 150). The measuring step 150 measures the plating film thickness using the sensor 455.

[0045] Subsequently, the plating processing method moves the substrate holder 440 using the moving mechanism 490 based on the plating film thickness measured by the measuring step 150 (a second moving step 160). The second moving step 160 can, for example, move the substrate holder 440 to a position with the highest uniformity of the plating film thickness by shifting the shaft center of the substrate Wf in the X-direction and/or the Y-direction with respect to the shaft center of the anode 430.

[0046] Subsequently, the plating processing method determines whether the plating process should be terminated or not (a determining step 170). The determining step 170 can determine whether the plating process should be terminated or not based on, for example, if a predetermined time has elapsed since the plating process started, or if a predetermined plating film thickness has been formed. If the plating processing method determines that the plating process should not be terminated (the determining step 170, No), it returns to the plating step 140 and repeats the process. On the other hand, if the plating processing method determines that the plating process should be terminated (the determining step 170, Yes), it terminates the process.

[0047] Since the flowchart of FIG. 6 illustrates the process of installing the plating module 400, the alignment of the shaft centers of the substrate Wf and the anode 430 (the first moving step 110) is performed first, but the first moving step 110 may be omitted. Furthermore, the flowchart of FIG. 6 illustrates an example of moving the substrate holder 440 while executing the plating process (the second moving step 160), but it is not limited thereto. For example, as illustrated in FIG. 5, the plating module 400 can perform the plating process on a plurality of substrates by shifting the shaft center of the substrate Wf different amounts with respect to the shaft center of the anode 430. As a result, the plating module 400 can obtain a plurality of the plating film thickness profiles and by comparing these, the optimum movement amount can be obtained. In this case, the plating module 400 can move the substrate holder 440 based on the optimum movement amount before the plating process for substrates on which the same plating process is performed.

[0048] In the foregoing, several embodiments of the present invention have been described above in order to facilitate understanding of the present invention without limiting the present invention. The present invention can be changed or improved without departing from the gist thereof, and of course, the equivalents of the present invention are included in the present invention. It is possible to arbitrarily combine or omit respective constituent elements described in the claims and the specification in a range in which at least a part of the above-described problems can be solved, or a range in which at least a part of the effects can be exhibited.

[0049] As one embodiment, this application discloses a plating apparatus that includes a plating tank, a substrate holder, an elevating mechanism, and a moving mechanism. The plating tank is for housing a plating solution. The substrate holder is for holding a substrate with a surface to be plated facing the plating solution housed in the plating tank. The elevating mechanism is for elevating the substrate holder. The moving mechanism is for moving the substrate holder in a direction perpendicular to an elevating direction of the substrate holder.

[0050] Furthermore, as one embodiment, this application discloses a plating apparatus in which the moving mechanism includes: a first moving mechanism for moving the substrate holder in a first direction perpendicular to the elevating direction, and a second moving mechanism for moving the substrate holder in a second direction perpendicular to the elevating direction and the first direction.

[0051] Furthermore, as one embodiment, this application discloses a plating apparatus in which the first moving mechanism includes a first linear guide extending in the first direction, a first support table disposed on the first linear guide, and a first driving member for moving the first support table along the first linear guide, the second moving mechanism includes a second linear guide extending in the second direction, a second support table disposed on the second linear guide, and a second driving member for moving the second support table along the second linear guide, the first moving mechanism and the second moving mechanism are disposed to be stacked on a base, and the elevating mechanism includes an elevating linear guide and an elevating driving member, the elevating linear guide being mounted to the first support table or the second support table, and extending in the elevating direction, the elevating driving member being for moving a holding member holding the substrate holder along the elevating linear guide.

[0052] Furthermore, as one embodiment, this application discloses a plating apparatus in which the moving mechanism moves the substrate holder such that a shaft center of an anode disposed inside the plating tank and a shaft center of the substrate held by the substrate holder are aligned.

[0053] Furthermore, as one embodiment, this application discloses a plating apparatus that further includes a sensor for measuring a plating film thickness formed on the surface to be plated of the substrate by the plating process, and the moving mechanism is configured to move the substrate holder based on the plating film thickness measured by the sensor.

[0054] Furthermore, as one embodiment, this application discloses a plating apparatus that includes a plurality of plating modules each including the plating tank, the substrate holder, the elevating mechanism, and the moving mechanism.

[0055] Furthermore, as one embodiment, this application discloses a plating processing method that includes: a moving step of moving a substrate holder for holding a substrate with a surface to be plated facing a plating solution housed in a plating tank in a direction perpendicular to an elevating direction of the substrate holder; a lowering step of lowering the substrate holder into the plating tank; and a plating step of performing a plating process on the substrate held by the substrate holder lowered into the plating tank.

[0056] Furthermore, as one embodiment, this application discloses a plating processing method in which the moving step includes: a first moving step of moving the substrate holder in a first direction perpendicular to the elevating direction; and a second moving step of moving the substrate holder in a second direction perpendicular to the elevating direction and the first direction.

[0057] Furthermore, as one embodiment, this application discloses a plating processing method in which the moving step includes a first moving step of moving the substrate holder such that a shaft center of an anode disposed inside the plating tank and a shaft center of the substrate held by the substrate holder are aligned.

[0058] Furthermore, as one embodiment, this application discloses a plating processing method in which the plating processing method further includes a measuring step of measuring a plating film thickness formed on the surface to be plated of the substrate by the plating step, and the moving step includes a second moving step of moving the substrate holder based on the plating film thickness measured by the measuring step.

REFERENCE SIGNS LIST

[0059] 400 . . . plating module [0060] 410 . . . plating tank [0061] 430 . . . anode [0062] 440 . . . substrate holder [0063] 444 . . . horizontal holder base [0064] 446 . . . perpendicular holder base [0065] 448 . . . holding member [0066] 455 . . . sensor [0067] 460 . . . rotation mechanism [0068] 470 . . . inclination mechanism [0069] 480 . . . elevating mechanism [0070] 482 . . . elevating linear guide [0071] 484 . . . elevating driving member [0072] 490 . . . moving mechanism [0073] 490-1 . . . first moving mechanism [0074] 490-2 . . . second moving mechanism [0075] 491 . . . first driving member [0076] 492 . . . first linear guide [0077] 493 . . . first support table [0078] 494 . . . base [0079] 495 . . . second driving member [0080] 496 . . . second linear guide [0081] 497 . . . second support table [0082] 800 . . . control module [0083] 1000 . . . plating apparatus [0084] Wf . . . substrate [0085] Wf-a . . . surface to be plated