COMPACT RADIAL CONDENSER
20240183589 ยท 2024-06-06
Assignee
Inventors
Cpc classification
F28F3/048
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D9/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F13/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D21/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D9/0081
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D2021/0021
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F3/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2250/08
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2250/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D2021/007
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B39/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F25B39/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D21/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A compact radial condenser is disclosed. The compact radial condenser includes a first plate; a second plate; and a plurality of structures disposed between the first plate and the second plate. In the compact radial condenser, heat from a first fluid flowing between the first plate and the second plate and around the plurality of structures is transferred from the first fluid to at least one of the first plate, the second plate, or the plurality of structures. In the compact radial condenser, the plurality of structures includes a first set of structures, the first set of structures extending radially from an inner edge of an opening in the first plate to an outer edge of the first plate.
Claims
1. A compact radial condenser, comprising: a first plate; a second plate; and a plurality of structures disposed between the first plate and the second plate, wherein heat from a first fluid flowing between the first plate and the second plate and around the plurality of structures is transferred from the first fluid to at least one of the first plate, the second plate, or the plurality of structures, wherein the plurality of structures comprises a first set of structures, and wherein the first set of structures extends radially from an inner edge of an opening in the first plate to an outer edge of the first plate.
2. The compact radial condenser of claim 1, wherein the plurality of structures further comprises a second set of structures, wherein the second set of structures extends radially a distance D from the inner edge of the opening in the first plate to the outer edge of the first plate.
3. The compact radial condenser of claim 1, wherein the plurality of structures are configured to provide a density of passages between the plurality of structures that optimizes a flow of the first fluid as the first fluid transitions from a gaseous state to a liquid state.
4. The compact radial condenser of claim 1, wherein the first plate and the second plate are circular disk shaped, wherein the first plate comprises the opening in a center of the first plate, and wherein the second plate is a solid.
5. The compact radial condenser of claim 1, wherein the first plate, the second plate, and the plurality of structures are manufactured from a thermally conductive material, and wherein the thermally conductive material is at least one of aluminum, copper, titanium, Inconel alloy, a thermally conductive polymer, or a thermally enhanced polymer.
6. The compact radial condenser of claim 1, wherein a first edge of each of the plurality of structures is coupled to a first side of the first plate and wherein a second edge of each of the plurality of structures is coupled to a first side of the second plate.
7. The compact radial condenser of claim 1, further comprising: an impeller; and a plurality of cooling fins, wherein the plurality of cooling fins are coupled to a second side of the second plate, and wherein the impeller draws in a second fluid and rejects the second fluid out through spaces between the plurality of cooling fins.
8. The compact radial condenser of claim 7, wherein the impeller is disposed in a center of the second side of the second plate, wherein the plurality of cooling fins extend radially outward from an outer radial edge of the impeller to an outer edge of the second plate, and, wherein the plurality of cooling fins are configured to have a radius R1 as the plurality of cooling fins extend radially outward from the outer radial edge of the impeller to the outer edge of the second plate.
9. The compact radial condenser of claim 7, wherein the first fluid is refrigerant, and wherein the second fluid is air.
10. The compact radial condenser of claim 7, wherein the plurality of cooling fins are manufactured from a thermally conductive material, and wherein the thermally conductive material is at least one of aluminum, copper, titanium, Inconel alloy, a thermally conductive polymer, or a thermally enhanced polymer.
11. A heat transfer system, comprising: an expansion device; a heat exchanger that is fluidly coupled to the expansion device; a compressor that is fluidly coupled to the heat exchanger; and a compact radial condenser that is fluidly coupled to the expansion device and the compressor, wherein the compact radial condenser comprises: a first plate; a second plate; and a plurality of structures disposed between the first plate and the second plate, wherein heat from a first fluid flowing between the first plate and the second plate and around the plurality of structures is transferred from the first fluid to at least one of the first plate, the second plate, or the plurality of structures, wherein the plurality of structures comprises a first set of structures, and wherein the first set of structures extends radially from an inner edge of an opening in the first plate to an outer edge of the first plate.
12. The heat transfer system of claim 11, wherein the plurality of structures further comprises a second set of structures, wherein the second set of structures extends radially a distance D from the inner edge of the opening in the first plate to the outer edge of the first plate.
13. The heat transfer system of claim 11, wherein the plurality of structures are configured to provide a density of passages between the plurality of structures that optimizes a flow of the first fluid as the first fluid transitions from a gaseous state to a liquid state.
14. The heat transfer system of claim 11, wherein the first plate and the second plate are circular disk shaped, wherein the first plate comprises the opening in a center of the first plate, and wherein the second plate is a solid.
15. The heat transfer system of claim 11, wherein the first plate, the second plate, and the plurality of structures are manufactured from a thermally conductive material, and wherein the thermally conductive material is at least one of aluminum, copper, titanium, Inconel alloy, a thermally conductive polymer, or a thermally enhanced polymer.
16. The heat transfer system of claim 11, wherein a first edge of each of the plurality of structures is coupled to a first side of the first plate and wherein a second edge of each of the plurality of structures is coupled to a first side of the second plate.
17. The heat transfer system of claim 11, further comprising: an impeller; and a plurality of cooling fins, wherein the plurality of cooling fins are coupled to a second side of the second plate, and wherein the impeller draws in a second fluid and rejects the second fluid out through spaces between the plurality of cooling fins.
18. The heat transfer system of claim 17, wherein the impeller is disposed in a center of the second side of the second plate, wherein the plurality of cooling fins extend radially outward from an outer radial edge of the impeller to an outer edge of the second plate, and, wherein the plurality of cooling fins are configured to have a radius R1 as the plurality of cooling fins extend radially outward from the outer radial edge of the impeller to the outer edge of the second plate.
19. The heat transfer system of claim 17, wherein the first fluid is refrigerant, and wherein the second fluid is air.
20. The heat transfer system of claim 17, wherein the plurality of cooling fins are manufactured from a thermally conductive material, and wherein the thermally conductive material is at least one of aluminum, copper, titanium, Inconel alloy, a thermally conductive polymer, or a thermally enhanced polymer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The subject matter of the present disclosure is particularly pointed out and distinctly claimed in the concluding portion of the specification. A more complete understanding of the present disclosure, however, may best be obtained by referring to the following detailed description and claims in connection with the following drawings. While the drawings illustrate various embodiments employing the principles described herein, the drawings do not limit the scope of the claims.
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DETAILED DESCRIPTION
[0019] The following detailed description of various embodiments herein makes reference to the accompanying drawings, which show various embodiments by way of illustration. While these various embodiments are described in sufficient detail to enable those skilled in the art to practice the disclosure, it should be understood that other embodiments may be realized and that changes may be made without departing from the scope of the disclosure. Thus, the detailed description herein is presented for purposes of illustration only and not of limitation. Furthermore, any reference to singular includes plural embodiments, and any reference to more than one component or step may include a singular embodiment or step. Also, any reference to attached, fixed, connected, or the like may include permanent, removable, temporary, partial, full or any other possible attachment option. Additionally, any reference to without contact (or similar phrases) may also include reduced contact or minimal contact. It should also be understood that unless specifically stated otherwise, references to a, an or the may include one or more than one and that reference to an item in the singular may also include the item in the plural. Further, all ranges may include upper and lower values and all ranges and ratio limits disclosed herein may be combined.
[0020] Disclosed herein is a compact radial condenser. In various embodiments, a circular heat exchanger with radially outward airflow and a baseplate is combined with a radially inward refrigerant flow arrangement. In various embodiments, the radially inward refrigerant flow passages are embedded in a base of the circular heat exchanger. In various embodiments, the radially inward refrigerant flow arrangement for the compact radial condenser provides an improvement over current heat exchanger configurations since the reduction in flow area compensates for reduction in volumetric flow as vapor condenses into liquid, thereby maintaining a high flow velocity and effective heat transfer. In various embodiments, various complex flow passages may be incorporated within the compact radial condenser through additive fabrication of the baseplate. In various embodiments, interrupted surfaces within the compact radial condenser may produce thin liquid film and high condensation heat transfer. can
[0021] Referring now to
[0022] Referring now to
[0023] In various embodiments, during operation of the HVAC system 100, second fluid, i.e. referred to as air hereafter, flows through the inlet port 112 (i.e., pulled in via the fan 142) into cavity 113. In response to flowing through the inlet port 112, first fluid, i.e. referred to as refrigerant hereafter, flows through the compact radial condenser 127, which adds heat to the airflow and thus heating the airflow. The heated airflow is then released out the outlet port 116 back to a cabin in the fuselage 20 of the aircraft 10 from
[0024] In various embodiments, during operation, a refrigerant travels through plumbing system 120. In this regard, the refrigerant travels through the expansion device 122. The expansion device 122 controls an amount of refrigerant and rapidly reduces the refrigerant pressure and temperature released to an evaporator section of the plumbing system 120, in accordance with various embodiments. After going through the expansion device 122, the refrigerant travels through the heat exchanger 128 which transitions the refrigerant from a liquid state to a gas state in response to heat being absorbed from the chilled air coming from the galley of the aircraft 10 from
[0025] Referring now to
[0026] In various embodiments, disposed between and coupled to the first plate 302 and the second plate 304 are a plurality of structures 306. In various embodiments, the plurality of structures 306 are manufactured from a thermally conductive material. In various embodiments, the thermally conductive material of the plurality of structures 306 may be aluminum, copper, titanium, Inconel alloy, or other metals and metal alloys. In various embodiments, the thermally conductive material may be a thermally conductive polymer or thermally enhanced polymer such as a composite material that includes other materials to improve thermal conductivity. For example, a thermally enhanced polymer may include a fibrous polymeric material having thermal conductive enhancement materials impregnated or embedded within, the thermal conductive enhancement materials including, for example, metals and metal alloys. In various embodiments, the plurality of structures 306 form a set of passages that reduce a flow area such that, when refrigerant in a gaseous state, as provided by the a compressor, such as compressor 126 of
[0027] In various embodiments, in order to dissipate heat that is drawn from the refrigerant in the gaseous state by the first plate 302, the second plate 304, and the plurality of structures 306, air is drawn in by impeller 308 and rejected out between a plurality of cooling fins 310. In various embodiments, the plurality of cooling fins 310 are manufactured from a thermally conductive material. In various embodiments, the thermally conductive material may be aluminum, copper, titanium, Inconel alloy, or other metal material. In various embodiments, the thermally conductive material may be a thermally conductive polymer or thermally enhanced polymer such as a composite material that includes other materials to improve thermal conductivity. In various embodiment, a base edge of the plurality of cooling fins 310 may be coupled to a second side of second plate 304 opposite to a first side of the second plate 304 to which the plurality of structures 306 are coupled. In various embodiments, a third plate, described hereafter in FIG.
[0028] Referring now to
[0029] Referring now to
[0030] Referring now to
[0031] Referring now to
[0032] Referring now to
[0033] Benefits, other advantages, and solutions to problems have been described herein with regard to specific embodiments. Furthermore, the connecting lines shown in the various figures contained herein are intended to represent exemplary functional relationships and/or physical couplings between the various elements. It should be noted that many alternative or additional functional relationships or physical connections may be present in a practical system. However, the benefits, advantages, solutions to problems, and any elements that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as critical, required, or essential features or elements of the disclosure. The scope of the disclosure is accordingly to be limited by nothing other than the appended claims, in which reference to an element in the singular is not intended to mean one and only one unless explicitly so stated, but rather one or more. Moreover, where a phrase similar to at least one of A, B, or C is used in the claims, it is intended that the phrase be interpreted to mean that A alone may be present in an embodiment, B alone may be present in an embodiment, C alone may be present in an embodiment, or that any combination of the elements A, B and C may be present in a single embodiment; for example, A and B, A and C, B and C, or A and B and C. Different cross-hatching is used throughout the figures to denote different parts but not necessarily to denote the same or different materials.
[0034] Systems, methods, and apparatus are provided herein. In the detailed description herein, references to one embodiment, an embodiment, various embodiments, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. After reading the description, it will be apparent to one skilled in the relevant art(s) how to implement the disclosure in alternative embodiments.
[0035] Numbers, percentages, or other values stated herein are intended to include that value, and also other values that are about or approximately equal to the stated value, as would be appreciated by one of ordinary skill in the art encompassed by various embodiments of the present disclosure. A stated value should therefore be interpreted broadly enough to encompass values that are at least close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least the variation to be expected in a suitable industrial process, and may include values that are within 10%, within 5%, within 1%, within 0.1%, or within 0.01% of a stated value. Additionally, the terms substantially, about or approximately as used herein represent an amount close to the stated amount that still performs a desired function or achieves a desired result. For example, the term substantially, about or approximately may refer to an amount that is within 10% of, within 5% of, within 1% of, within 0.1% of, and within 0.01% of a stated amount or value.
[0036] Furthermore, no element, component, or method step in the present disclosure is intended to be dedicated to the public regardless of whether the element, component, or method step is explicitly recited in the claims. No claim element herein is to be construed under the provisions of 35 U.S.C. 112(f) unless the element is expressly recited using the phrase means for. As used herein, the terms comprises, comprising, or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0037] Finally, it should be understood that any of the above-described concepts can be used alone or in combination with any or all of the other above-described concepts. Although various embodiments have been disclosed and described, one of ordinary skill in this art would recognize that certain modifications would come within the scope of this disclosure. Accordingly, the description is not intended to be exhaustive or to limit the principles described or illustrated herein to any precise form. Many modifications and variations are possible in light of the above teaching.