Pane comprising an electrical connection element

Abstract

A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90.

Claims

1. A pane with at least one electrical connection element, comprising: a substrate for applying an electrically conductive structure on a region of the substrate, the substrate having a first coefficient of thermal expansion from 810.sup.6/ C. to 910.sup.6/ C.; a layer of a leadfree solder material on a region of the electrically conductive structure; and a connection element on the layer of solder material, wherein the connection element has a second coefficient of thermal expansion from 1010.sup.6/ C. to 1310.sup.6/ C., the connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 16 wt.-% to 20 wt.-% chromium, and one or more selected form the group of carbon, nickel, manganese, molybdenum, and titanium, the difference between the first coefficient of thermal expansion of the substrate and the second coefficient of thermal expansion of the connection element is less than 510.sup.6/ C., the connection element contains a first and a second foot region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface are located on a bottom of the first and the second foot region, wherein the first and second foot region, the first and second transition region and the bridge region have a same width, the first and second contact surface and surfaces of the first and the second transition region facing the substrate are directly connected to the electrically conductive structure by the layer of solder material, wherein the surface of the first transition region facing the substrate directly adjoins the first contact surface and the surface of the second transition region facing the substrate directly adjoins the second contact surface; an angle between a surface of the substrate and each tangent plane of the surfaces of the first and the second transition regions facing the substrate is greater than 0 and less than 90 , and a cavity that is delimited by the electrically conductive structure, the transition regions, and the bridge region is completely or not completely filled with solder material.

2. The pane according to claim 1, wherein the substrate contains glass, polymers, or mixtures of glass and polymers.

3. The pane according to claim 2, wherein the glass is flat glass, float glass, quartz glass, borosilicate glass, and soda lime glass.

4. The pane according to claim 2, wherein the polymers are polyethylene, polypropylene, polycarbonate, and polymethyl methacrylate.

5. The pane according to claim 1, wherein an angle between a surface of the substrate and each tangent plane of surfaces of the first and the second transition region facing the substrate is between 2 and 75.

6. The pane according to claim 5, wherein the angle between the surface of the substrate and each tangent plane of the surfaces of the first and the second transition region facing the substrate is between 5 and 50 .

7. The pane according to claim 1, wherein the first transition region, the second transition region, and the bridge region are shaped flat in sections.

8. The pane according to claim 1, wherein the first transition region, the second transition region, and / or the bridge region are curved.

9. The pane according to claim 8, wherein the first transition region, the second transition region, and/or the bridge region have the same direction of curvature.

10. The pane according to claim 1, wherein the first transition region and the second transition region are shaped flat and the bridge region is shaped angled.

11. The pane according to claim 1, wherein spacers are arranged on the first and the second contact surfaces.

12. The pane according to claim 1, wherein the solder material contains tin and i) bismuth, ii) indium, iii) zinc, iv) copper, v) silver, or compositions of i)-v).

13. The pane according to claim 12, wherein a proportion of tin in the solder material is 3 wt.-% to 99.5 wt.-% and the proportion of i) bismuth, ii) indium, iii) zinc, iv) copper, v) silver, or compositions of i)-v) is 0.5 wt.-% to 97 wt.-%.

14. The pane according to claim 1, wherein the connection element is coated with nickel, tin, copper, and/or silver.

15. The pane according to claim 14, wherein the connection element is coated with 0.1 m to 0.3 m nickel and or 3 m to 20 m silver.

16. The pane according to claim 1, wherein the connection element has a second coefficient of thermal expansion from 1010.sup.6/ to 11.510.sup.6/ C.

17. A method for production of a pane with at least one electrical connection element, comprising: a) arranging and applying a leadfree solder material on contact surfaces of a connection element as a platelet with a fixed layer thickness, volume, and shape; b) applying an electrically conductive structure to a region of a substrate, the substrate having a first coefficient of thermal expansion from 810.sup.6/ C. to 910.sup.-6/ C.; c) arranging the connection element with the solder material on the electrically conductive structure, the connection element having a second coefficient of thermal expansion from 1010.sup.6/ C. to 1310.sup.6/ C., wherein the connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 16 wt.-% to 20 wt.-% chromium, and one or more selected form the group of carbon, nickel, manganese, molybdenum, and titanium, and wherein the difference between the first coefficient of thermal expansion of the substrate and the second coefficient of thermal expansion of the connection element is less than 510.sup.6/ C., and d) soldering the connection element to the electrically conductive structure, wherein a cavity that is delimited by the electrically conductive structure, the transition regions, and the bridge region is completely or not completely filled with solder material, the connection element contains a first and a second foot region, a first and a second transition region, and a bridge region between the first and the second transition region, wherein the first and foot region, the first and second transition region and the bridge region have a same width, a first and a second contact surface are located on a bottom of the first and the second foot region, the first and second contact surface and surfaces of the first and the second transition region facing the substrate are directly connected to the electrically conductive structure by the layer of solder material, wherein the surface of the first transition region facing the substrate directly adjoins the first contact surface and the surface of the second transition region facing the substrate directly adjoins the second contact surface, an angle between a surface of the substrate and each tangent plane of the surfaces of the first and the second transition regions facing the substrate is greater than 0 and less than 90.

18. The method of production according to claim 17, wherein the connection element has a second coefficient of thermal expansion from 1010.sup.6/ C to 11.510.sup.6/ C.

19. A method, comprising: using a pane with at least one electrical connection element, for vehicles with electrically conductive structures, preferably with heating conductors and/or antenna conductors, the pane including a substrate for applying an electrically conductive structure on a region of the substrate, the substrate having a first coefficient of thermal expansion from 810.sup.6/ C. to 910.sup.6/ C., a layer of a leadfree solder material on a region of the electrically conductive structure, and a connection element on the layer of solder material, wherein the connection element has a second coefficient of thermal expansion from 1010.sup.6/ to 1310.sup.6/ C., the connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 16 wt.-% to 20 wt.-% chromium, and one or more selected form the group of carbon, nickel, manganese, molybdenum, and titanium, the difference between the first coefficient of thermal expansion of the substrate and the second coefficient of thermal expansion of the connection element is less than 510.sup.6/ C., the connection element contains a first and a second foot region, a first and a second transition region, and a bridge region between the first and the second transition region, wherein the first and second foot region, the first and second transition region and the bridge region have a same width, a first and a second contact surface are located on a bottom of the first and the second foot region, the first and second contact surface and surfaces of the first and the second transition region facing the substrate are directly connected to the electrically conductive structure by the layer of solder material, wherein the surface of the first transition region facing the substrate directly adjoins the first contact surface and the surface of the second transition region facing the substrate directly adjoins the second contact surface, an angle between a surface of the substrate and each tangent plane of the surfaces of the first and the second transition regions facing the substrate is greater than 0 and less than 90 , and a cavity that is delimited by the electrically conductive structure, the transition regions, and the bridge region is completely or not completely filled with solder material.

20. The method according to claim 19, wherein the connection element has a second coefficient of thermal expansion from 1010.sup.6/ to 11.510.sup.6/ C.

Description

(1) The invention is explained in detail with reference to drawings and exemplary embodiments. The drawings are a schematic representation and not true to scale. The drawings do not restrict the invention in any way. They depict:

(2) FIG. 1 a perspective view of a first embodiment of the pane according to the invention,

(3) FIG. 1a a cross-section C-C through the pane of FIG. 1,

(4) FIG. 2 a cross-section A-A through the pane of FIG. 1,

(5) FIG. 3 a cross-section A-A through an alternative pane according to the invention,

(6) FIG. 4 a cross-section A-A through another alternative pane according to the invention,

(7) FIG. 5 a cross-section A-A through another alternative pane according to the invention,

(8) FIG. 6 a perspective view of an alternative embodiment of the pane according to the invention,

(9) FIG. 7 a cross-section B-B through the pane of FIG. 6,

(10) FIG. 8 a cross-section C-C through an alternative pane according to the invention,

(11) FIG. 9 a cross-section C-C through another alternative pane according to the invention,

(12) FIG. 10 a cross-section C-C through another alternative pane according to the invention,

(13) FIG. 11 a cross-section C-C through another alternative pane according to the invention,

(14) FIG. 12 a cross-section C-C through another alternative pane according to the invention,

(15) FIG. 12a a cross-section C-C through another alternative pane according to the invention,

(16) FIG. 13 a plan view of an alternative embodiment of the connection element,

(17) FIG. 14 a perspective view of an alternative embodiment of the connection element, and

(18) FIG. 15 a detailed flow chart of the method according to the invention.

(19) FIG. 1, FIG. 1a, and FIG. 2 show, in each case, a detail of a heatable pane 1 according to the invention in the region of the electrical connection element 3. The pane 1 is a 3-mm-thick thermally prestressed single-pane safety glass made of soda lime glass. The pane 1 has a width of 150 cm and a height of 80 cm. An electrically conductive structure 2 in the form of a heating conductor structure 2 is printed on the pane 1. The electrically conductive structure 2 contains silver particles and glass frits. In the edge region of the pane 1, the electrically conductive structure 2 is widened to a width of 10 mm and forms a contact surface for the electrical connection element 3. In the edge region of the pane 1, there is also a covering serigraph (not shown). In the region of the contact surfaces 8 and 8 and the surfaces 9 and 11 of the transition regions 9 and 11 facing the substrate 1, the solder material 4 effects a durable electrical and mechanical connection between the connection element 3 and the electrically conductive structure 2. The solder material 4 contains 57 wt.-% bismuth, 40 wt.-% tin, and 3 wt.-% silver. The solder material 4 is arranged through a predefined volume and shape completely between the electrical connection element 3 and the electrically conductive structure 2. The solder material 4 has a thickness of 250 m. The electrical connection element 3 is made from steel of the material number 1.4509 in accordance with EN 10 088-2 (ThyssenKrupp Nirosta 4509) with a coefficient of thermal expansion of 10.010.sup.61 C. The electrical connection element 3 has a width of 4 mm and a length of 24 mm. The transition regions 9 and 11 and the bridge region 10 are formed flat. The surface of the substrate 1 and the surface 9 of the transition region 9 facing the substrate 1 enclose an angle .sub.1=40. The surface of the substrate and the surface 11 of the transition region 11 facing the substrate 1 enclose an angle .sub.2=40. The bridge region 10 is arranged parallel to the surface of the substrate 1.

(20) Steel of the material number 1.4509 in accordance with EN 10 088-2 has good cold forming properties and good welding properties with all methods except gas welding. The steel is used for construction of sound suppressor systems and exhaust gas detoxification systems and is particularly suited for that due to its scaling resistance to more than 950 C. and corrosion resistance against the stresses occurring in the exhaust gas system.

(21) FIG. 3 depicts, in continuation of the exemplary embodiment of FIGS. 1 and 2, an alternative embodiment of the connection element 3 according to the invention. The electrical connection element 3 is provided on the surface facing the solder material 4 with a silver-containing coating 5. This prevents spreading of the solder material out beyond the coating 5 and limits the outflow width b. In another embodiment, an adhesion-promoting layer made, for example, of nickel and/or copper, can be located between the connection element 3 and the silver-containing layer 5. The outflow width b of the solder material 4 is less than 1 mm. No critical mechanical stresses are observed in the pane 1 due to the arrangement of the solder material 4. The connection of the pane 1 to the electrical connection element 3 via the electrically conductive structure 2 is durably stable.

(22) FIG. 4 depicts, in continuation of the exemplary embodiment of FIGS. 1 and 2, another alternative embodiment of the connection element 3 according to the invention. The electrical connection element 3 contains, on the surface facing the solder material 4, a recess with a depth of 250 m that forms a solder depot for the solder material 4. It is possible to completely prevent outflow of the solder material 4 from the intermediate space. The thermal stresses in the pane 1 are noncritical and a durable electrical and mechanical connection is provided between the connection element 3 and the pane 1 via the electrically conductive structure 2.

(23) FIG. 5 depicts, in continuation of the exemplary embodiment of FIGS. 1 and 2, another alternative embodiment of the connection element 3 according to the invention. The electrical connection element 3 is bent upward on the edge regions. The height of the upward bend of the edge region of the glass pane 1 is a maximum of 400 m. This forms a space for the solder material 4. The predefined solder material 4 forms a concave meniscus between the electrical connection element 3 and the electrically conductive structure 2. It is possible to completely prevent outflow of solder material 4 from the intermediate space. The outflow width b, at roughly 0, is less than zero, largely because of the meniscus formed. The thermal stresses in the pane 1 are noncritical, and a durable electrical and mechanical connection is provided between the connection element 3 and the pane 1 via the electrically conductive structure 2.

(24) FIG. 6 and FIG. 7 depict, in each case, a detail of another embodiment of the pane 1 according to the invention with connection element 3. The connection element 3 contains an iron-containing alloy with a coefficient of thermal expansion of 810.sup.61 C. The material thickness is 2 mm. In the region of the contact surfaces 8 and 8 of the connection element 3, hat-shaped compensation members 6 are applied with chromium-containing steel of the material number 1.4509 in accordance with EN 10 088-2 (ThyssenKrupp Nirosta 4509). The maximum layer thickness of the hat-shaped compensation members 6 is 4 mm. By means of the compensation members, it is possible to adapt the coefficients of thermal expansion of the connection element 3 to the requirements of the pane 1 and of the solder material 4. The hat-shaped compensation members 6 result in improved heat flow during the production of the solder connection 4. The heating occurs primarily in the center of the contact surfaces 8 and 8. It is possible to further reduce the outflow width b of the solder material 4. Because of the low outflow width b of <1 mm and the adapted coefficient of expansion, it is possible to further reduce the thermal stresses in the pane 1. The thermal stresses in the pane 1 are noncritical, and a durable electrical and mechanical connection is provided between the connection element 3 and the pane 1 via the electrically conductive structure 2.

(25) FIG. 8 depicts, in continuation of the exemplary embodiment of FIGS. 1 and 1a, an alternative embodiment of the connection element 3 according to the invention. The two transition regions 9 and 11 and the bridge region 10 are curved and have the same direction of curvature. Together, they form the profile of a circular arc with a radius of curvature of 12 mm. The connections 16 and 16 between the contact surfaces 8 and 8 and the surfaces 9 and 11 of the curved transition regions 9 and 11 facing the substrate are formed as edges. The thermal stresses in the pane 1 are noncritical and a durable electrical and mechanical connection is provided between the connection element 3 and the pane 1 via the electrically conductive structure 2.

(26) FIG. 9 depicts, in continuation of the exemplary embodiment of FIGS. 1 and 1a, another alternative embodiment of the connection element 3 according to the invention. The two transition regions are formed flat; the bridge region is formed angled. The surface of the substrate 1 and the surface 9 of the transition region 9 facing the substrate enclose an angle .sub.1=20. The surface of the substrate 1 and the surface 11 of the transition region 11 facing the substrate 1 enclose an angle .sub.2=20. The angle of the bridge region is 140. The thermal stresses in the pane 1 are noncritical and a durable electrical and mechanical connection is provided between the connection element 3 and the pane 1 via the electrically conductive structure 2.

(27) FIG. 10 depicts, in continuation of the exemplary embodiment of FIGS. 1 and 1a, another alternative embodiment of the connection element 3 according to the invention. The two transition regions 9 and 11 and the bridge region 10 are curved. The structure made of the transition regions 9 and 11 and the bridge region 10 changes its direction of curvature twice. Adjacent the foot regions 7 and 7, the direction of curvature of the transition regions 9 and 11 turns away from the substrate 1. Thus, there are no edges on the connections 16 and 16 between the contact surfaces 8 and 8 and the surfaces 9 and 11 of the curved transition regions 9 and 11 facing the substrate. The bottom of the connection element has a continuous progression. The thermal stresses in the pane 1 are noncritical and a durable electrical and mechanical connection is provided between the connection element 3 and the pane 1 via the electrically conductive structure 2.

(28) FIG. 11 depicts another alternative embodiment of the connection element 3 according to the invention. The two transition regions 9 and 11 are curved, with the direction of curvature turning away from the substrate 1. The bridge region 10 consists of two subelements. The subelements have, in each case, a curved subregion 17 and 17 and a flat subregion 18 and 18. The bridge region 10 is connected via the subregion 17 to the transition region 9 and via the subregion 17 to the transition region 11. The curved subregions 17 and 17 have the same direction of curvature as the adjacent transition region. The flat subregions 18 and 18 are arranged perpendicular to the surface of the substrate and are in direct contact with each other.

(29) FIG. 12 depicts, in continuation of the exemplary embodiment of FIGS. 1 and 1a, an alternative embodiment of the connection element 3 according to the invention. The foot regions 7 and 7, the transition regions 9 and 11, and the bridge region 10 are formed as in FIG. 1a. The contact surfaces 8 and 8 have a width of 4 mm and a length of 4 mm. Spacers 19 are applied on the contact surfaces 8 and 8. The spacers are formed as hemispheres and have a height h of 2.510.sup.4 m and a width l of 510.sup.4 m.

(30) The spacers 19 can, in alternative embodiments, also be designed, for example, as a cube, as a pyramid, or as a segment of a rotational ellipsoid and preferably have a width of 0.510.sup.4 m to 1010.sup.4 m and a height of 0.510.sup.4 m to 510.sup.4 m, particularly preferably of 110.sup.4 m to 310.sup.4 m. By means of the spacers 19, the formation of a uniform layer of solder material 4 is favored. That is particularly advantageous with regard to the adhesion of the connection element 3.

(31) FIG. 12a depicts, in continuation of the exemplary embodiment of FIG. 12, another alternative embodiment of the connection element 3 according to the invention. On each of the surfaces of the foot regions 7, 7 facing away from the substrate 1, a contact bump 22 is arranged. The contact bumps 22 are formed, in the embodiment shown, as hemispheres and have a height of 2.510.sup.4 m and a width of 510.sup.4 m. The centers of the contact bumps 22 are arranged roughly in the geometric center of the surfaces of the foot regions 7, 7 facing away from the substrate 1. Because of their convex surface, the contact bumps 22 enable an advantageously improved soldering of the connection element to the electrically conductive structure 2. For the soldering, electrodes whose contact side is flat can be used. The electrode surface is brought into contact with the contact bump 22, with the contact region between the electrode surface and the contact bump 22 forming the soldering point. The position of the soldering point is thus determined preferably by the point on the convex surface of the contact bump 22 that has the greatest vertical distance from the surface of the substrate 1. The position of the soldering point is independent of the position of the solder electrode on the connection element 3. That is particularly advantageous with regard to a reproducible, uniform heat distribution during the soldering process.

(32) The heat distribution during the soldering process is determined by the position, the size, the arrangement, and the geometry of the contact bump 22. In alternative embodiments, the contact bump 22 can be shaped, for example, as a segment of a rotational ellipsoid or as a cuboid, with the surface of the cuboid turned away from the substrate curved convexly. The contact bumps 22 preferably have a height of 0.1 mm to 2 mm, particularly preferably of 0.2 mm to 1 mm. The length and width of the contact bumps 22 is preferably between 0.1 and 5 mm, very particularly preferably between 0.4 mm and 3 mm.

(33) The contact bumps 22 and spacers 19 can, in an advantageous embodiment, be formed in one piece with the connection element 3. The contact bumps 22 and the spacers 19 can, for example, be formed by reshaping a connection element 3 with a flat surface in the initial state on the surface, for example, by stamping or deep drawing. In the process, a corresponding depression can be created on the surface of the connection element 3 opposite the contact bump 22 or the spacer 19.

(34) By means of the contact bumps 22 and the spacers 19, a homogeneous, uniformly thick, and uniformly fuzed layer of the solder material 4 is obtained. Thus, mechanical stresses between the connection element 3 and substrate 1 can be reduced. This is particularly advantageous with the use of a leadfree solder material that can compensate mechanical stresses less well due to its lower ductility compared to lead-containing solder materials.

(35) FIG. 13 depicts a plan view of an alternative embodiment of the connection element 3 according to the invention. The transition regions 9 and 11 and the bridge region 10 are formed as in FIG. 1a. Each foot region 7 and 7 has a width of 8 mm and is twice as wide as the transition regions 9 and 11 and the bridge region 10. It has been surprisingly demonstrated that foot regions 7,7 that are designed wider than the transition regions 9.11 and the bridge region 10 result in a reduction of mechanical stresses in the pane 1. The width of the foot regions 7,7 is preferably from 150% to 300% of the width of the bridge region 10.

(36) FIG. 14 depicts a perspective view of an alternative embodiment of the connection element 3 according to the invention. The foot regions 7 and 7 have, for example, a length of 7 mm and a width of 5 mm. The bridge region 10 is designed flat and has, for example, a length of 12 mm and a width of 10 mm. The bridge region 10 is wider than the foot regions 7,7 and has a production-related indentation 21. The indentation 21 runs all the way to the edge of the bridge region 10, to which the first foot region 7 is connected via the transition region 9. The indentation 21 corresponds in shape and size to the segment of the connection element 3 from the first foot region 7 and the transition region 9. The contact surfaces 8 and 8 on the bottoms of the foot regions 7 and 7 have a rectangular shape, with the two corners turned away from the bridge region 10 beveled in each case. By means of the beveling, angles that are too small, in particular 90-angles along the surrounding side edges of the contact surfaces 8, 8 are avoided. It has been demonstrated that mechanical stresses in the pane can thus be reduced.

(37) The connection element 3 includes a plug connector 20 arranged on the bridge region 10. The plug connector 20 is connected to the bridge region 10, on the side edge of the bridge region 10 adjacent the transition region 9. The plug connector 20 is designed as a standardized tab connector to which the coupling of a connection cable (not shown) to the onboard electronics, for instance, can be attached.

(38) The particular advantage of the embodiment of the invention resides in simple production of the connection element 3, providing, at the same time, a convenient interface for electrical contacting (plug connector 20). The foot regions 7, 7, the transition region 9, the bridge region 10, and the plug connector 20 are formed in one piece. The connection element 3 is provided in a flat initial state, in which the segments provided as the transition region 9 and as the foot region 7 are arranged inside the indentation 21. In the initial state, the transition region 11 and the foot region 7 are arranged in the same plane as the bridge region 10. The plug connector 20 is also arranged, in the initial state, in the same plane as the bridge region 10. The region provided as the foot region 7 and transition region 9 can be separated from the bridge region 10, for example, by punching, laser beam machining, or waterjet machining, with a connection remaining between the transition region 9 and the bridge region 10 via the connecting edge. The plug connector 20 is bent around the connecting line between the plug connector 20 and the bridge region 10 into the position depicted, with the surface that faces upward in the initial state then facing the bridge region 10. The transition region 9 and the foot region 7 are bent above the connecting line between the transition region 8 and the bridge region 10 into the position depicted, with the surface that faces upward in the initial state then forming the bottom side of the foot region 7 and of the transition region 9. The indentation 21 is formed by the bending of the transition region 9 and the foot 7 region. The transition region 11 and the foot region 7 are also bent from the flat initial state into the position depicted.

(39) FIG. 15 depicts in detail a method according to the invention for manufacture of a pane 1 with an electrical connection element 3. An example of the method according to the invention for manufacture of a pane with an electrical connection element 3 is presented there. As the first step, it is necessary to portion the solder material 4 according to shape and volume. The portioned solder material 4 is arranged on the contact surfaces 8 and 8 of the electrical connection element 3. The electrical connection element 3 is arranged with the solder material 4 on the electrically conductive structure 2. A durable connection of the electrical connection element 3 to the electrically conductive structure 2 and, thus, to the pane 1 takes place through the input of energy.

EXAMPLE

(40) Test specimens were produced with the pane 1 (thickness 3 mm, width 150 cm, and height 80 cm), the electrically conductive structure 2 in the form of a heating conductor structure, the electrical connection element 3 according to FIG. 1, the silver layer 5 on the contact surfaces 8 and 8 of the connection element 3, and the solder material 4. The angle between the surface of the substrate 1 and the surface 9 of the transition region 9 facing the substrate 1 or between the surface of the substrate 1 and the surface 11 of the transition region 11 facing the substrate 1 was =40. The material thickness of the connection element 3 was 0.8 mm. The connection element 3 contained steel of the material number 1.4509 in accordance with EN 10 088-2 (ThyssenKrupp Nirosta 4509). The contact surfaces 8 and 8 of the connection elements 3 had a width of 4 mm and a length of 4 mm. The solder material 4 was applied in advance as a platelet with fixed layer thickness, volume, and shape on the contact surfaces 8 and 8 of the connection element 3. The connection element 3 was applied with the solder material 4 applied on the electrically conductive structure 2. The connection element 3 was soldered onto the electrically conductive structure 2 at a temperature of 200 C. and a processing time of 2 seconds. Outflow of the solder material 4 from the intermediate space between the electrical connection element 3 and the electrically conductive structure 2, which exceeded a layer thickness t of 50 m, was observed only to a maximum outflow width of b=0.4 mm. The dimensions and compositions of the electrical connection element 3, the silver layer 5 on the contact surfaces 8 and 8 of the connection element 3, and the solder material 4 are found in Table 1. No critical mechanical stresses were observed in the pane 1 due to the arrangement of the solder material 4, predefined by the connection element 3 and the electrically conductive structure 2. The connection of the pane 1 to the electrical connection element 3 via the electrically conductive structure 2 was durably stable.

(41) With all specimens, it was possible to observe, with a temperature difference from +80 C. to 30 C., that no glass substrate 1 broke or showed damage. It was possible to demonstrate that, shortly after soldering, these panes 1 with the soldered connection element 3 were stable against a sudden temperature drop.

(42) In addition, test specimens were executed with a second composition of the electrical connection element 3. Here, the connection element 3 contained an iron-nickel-cobalt alloy. The dimensions and compositions of the electrical connection element 3, the silver layer 5 on the contact surfaces 8 and 8 of the connection element 3, and the solder material 4 are found in Table 2. With the outflow of the solder material 4 from the intermediate space between the electrical connection element 3 and the electrically conductive structure 2, which exceeded a layer thickness t of 50 m, an average outflow width b=0.4 mm was obtained. Here as well, it was possible to observe that, with a temperature difference from +80 C. to 30 C., no glass substrate 1 broke or showed damage. It was possible to demonstrate that, shortly after soldering, these panes 1 with the soldered connection element 3 were stable against a sudden temperature drop.

(43) In addition, test specimens were executed with a third composition of the electrical connection element 3. Here, the connection element 3 contained an iron-nickel alloy. The dimensions and compositions of the electrical connection element 3, the silver layer 5 on the contact surfaces 8 and 8 of the connection element 3, and the solder material 4 are found in Table 3. With the outflow of the solder material 4 from the intermediate space between the electrical connection element 3 and the electrically conductive structure 2, which exceeded a layer thickness t of 50 m, an average outflow width b=0.4 mm was obtained. Here as well, it was possible to observe that, with a temperature difference from +80 C. to 30 C., no glass substrate 1 broke or showed damage. It was possible to demonstrate that, shortly after soldering, these panes 1 with the soldered connection element 3 were stable against a sudden temperature drop.

(44) TABLE-US-00001 TABLE 1 Components Material Example Connection Steel of material no. 1.4509 in accordance element 3 with EN 10 088-2 with the composition: Iron (wt.-%) 78.87 Carbon (wt.-%) 0.03 Chromium (wt.-%) 18.5 Titanium (wt.-%) 0.6 Niobium (wt.-%) 1 Manganese (wt.-%) 1 CTE (coefficient of thermal expansion) 10 (10.sup.6/ C. for 0 C.-100 C.) Difference between CTE of the connection 1.7 element and substrate (10.sup.6/ C. for 0 C.-100 C.) Thickness of the connection element (m) 8.0 10.sup.4 Angle () 40 Wetting Silver (wt.-%) 100 layer 5 Thickness of the layer (m) 7.0 10.sup.6 Solder Tin (wt.-%) 40 material 4 Bismuth (wt.-%) 57 Silver (wt.-%) 3 Thickness of the solder layer in (m) 250 10.sup.6 The thickness of the wetting layer and the 257 10.sup.6 solder layer (m) Glass CTE (10.sup.6/ C. for 0 C.-320 C.) 8.3 substrate 1 (Soda lime glass)

(45) TABLE-US-00002 TABLE 2 Components Material Example Connection Iron (wt.-%) 54 element 3 Nickel (wt.-%) 29 Cobalt (wt.-%) 17 CTE (coefficient of thermal expansion) 5.1 (10.sup.6/ C. for 0 C.-100 C.) Difference between CTE of the connection 3.2 element and substrate (10.sup.6/ C. for 0 C.-100 C.) Thickness of the connection element (m) 8.0 10.sup.4 Angle () 40 Wetting Silver (wt.-%) 100 layer 5 Thickness of the layer (m) 7.0 10.sup.6 Solder Tin (wt.-%) 40 material 4 Bismuth (wt.-%) 57 Silver (wt.-%) 3 Thickness of the solder layer in (m) 250 10.sup.6 The thickness of the wetting layer and the 257 10.sup.6 solder layer (m) Glass CTE (10.sup.6/ C. for 0 C.-320 C.) 8.3 substrate 1 (Soda lime glass)

(46) TABLE-US-00003 TABLE 3 Components Material Example Connection Iron (wt.-%) 65 element 3 Nickel (wt.-%) 35 CTE (coefficient of thermal expansion) 1.7 (10.sup.6/ C. for 0 C.-100 C.) Difference between CTE of the connection 6.6 element and substrate (10.sup.6/ C. for 0 C.-100 C.) Thickness of the connection element (m) 8.0 10.sup.4 Angle () 40 Wetting Silver (wt.-%) 100 layer 5 Thickness of the layer (m) 7.0 10.sup.6 Solder Tin (wt.-%) 40 material 4 Bismuth (wt.-%) 57 Silver (wt.-%) 3 Thickness of the solder layer in (m) 250 10.sup.6 The thickness of the wetting layer and the 257 10.sup.6 solder layer (m) Glass CTE (10.sup.6/ C. for 0 C.-320 C.) 8.3 substrate 1 (Soda lime glass)

COMPARATIVE EXAMPLE 1

(47) The comparative example was carried out the same as the example. The connection element contained steel of the material number 1.4509 in accordance with EN 10 088-2 (ThyssenKrupp Nirosta 4509). The difference resided in the shape of the connection element. The angle was, according to the prior art, 90. With it, no capillary forces could develop on the edges of the contact surfaces 8 and 8. The dimensions and components of the electrical connection element 3, of the metal layer on the contact surfaces 8 and 8 of the connection element 3, and of the solder material 4 are found in Table 4. The connection element 3 was soldered to the electrically conductive structure 2 as in the example by means of the solder material 4. With the outflow of the solder material 4 from the intermediate space between the electrical connection element 3 and the electrically conductive structure 2, which exceeded a layer thickness t of 50 m, an average outflow width b=0.5 mm was obtained.

(48) With all specimens, it was possible to observe, with a temperature difference from +80 C. to 30 C., that no glass substrate 1 broke or showed damage. It was possible to demonstrate that, shortly after soldering, these panes 1 with the soldered connection element 3 were stable against a sudden temperature drop. However, compared to the example, they exhibited a greater average outflow width b.

(49) TABLE-US-00004 TABLE 4 Comparative Components Material example Connection Steel of material no. 1.4509 in accordance element 3 with EN 10 088-2 with the composition: Iron (wt.-%) 78.87 Carbon (wt.-%) 0.03 Chromium (wt.-%) 18.5 Titanium (wt.-%) 0.6 Niobium (wt.-%) 1 Manganese (wt.-%) 1 CTE (coefficient of thermal expansion) 10 (10.sup.6/ C. for 0 C.-100 C.) Difference between CTE of the connection 1.7 element and the substrate (10.sup.6/ C. for 0 C.-100 C.) Thickness of the connection element (m) 8.0 10.sup.4 Angle () 90 Wetting Silver (wt.-%) 100 layer 5 Thickness of the layer (m) 7.0 10.sup.6 Solder Tin (wt.-%) 40 material 4 Bismuth (wt.-%) 57 Silver (wt.-%) 3 Thickness of the solder layer in (m) 250 10.sup.6 The thickness of the wetting layer and the 257 10.sup.6 solder layer (m) Glass CTE (10.sup.6/ C. for 0 C.-320 C.) 8.3 substrate 1 (Soda lime glass)

COMPARATIVE EXAMPLE 2

(50) The comparative example was carried out the same as the example. The difference resided in the use of a different material for the connection element 3. The connection element 3 was 100 wt.-% titanium. The dimensions and components of the electrical connection element 3, the metal layer on the contact surfaces 8 and 8 of the connection element 3, and the solder material 4 are found in Table 5. The connection element 3 was soldered to the electrically conductive structure 2 in accordance with conventional methods by means of the solder material 4. With the outflow of the solder material 4 from the intermediate space between the electrical connection element 3 and the electrically conductive structure 2, which exceeded a layer thickness t of 50 m, an average outflow width b=2 mm to 3 mm was obtained. The large outflow width resulted in critical mechanical stresses in the pane.

(51) With a sudden temperature difference from +80 C. to 30 C., it was observed that the glass substrates 1 had major damage shortly after soldering.

(52) TABLE-US-00005 TABLE 5 Comparative Components Material Example Connection Titanium (wt.-%) 100 element 3 CTE (coefficient of thermal expansion) 8.80 (10.sup.6/ C. for 0 C.-100 C.) Difference between CTE of the connection 0.5 element and the substrate (10.sup.6/ C. for 0 C.-100 C.) Thickness of the connection element (m) 8.0 10.sup.4 Angle () 40 Wetting Silver (wt.-%) 100 layer 5 Thickness of the layer (m) 7.0 10.sup.6 Solder Tin (wt.-%) 40 material 4 Bismuth (wt.-%) 57 Silver (wt.-%) 3 Thickness of the solder layer in (m) 250 10.sup.6 The thickness of the wetting layer and the 257 10.sup.6 solder layer (m) Glass CTE (10.sup.6/ C. for 0 C.-320 C.) 8.3 substrate 1 (Soda lime glass)

COMPARATIVE EXAMPLE 3

(53) The comparative example was carried out the same as the example. The difference resided in the use of a different material for the connection element 3. The connection element 3 was 100 wt.-% copper. The dimensions and components of the electrical connection element 3, the metal layer on the contact surfaces 8 and 8 of the connection element 3, and the solder material 4 are found in Table 5. The connection element 3 was soldered to the electrically conductive structure 2 in accordance with conventional methods by means of the solder material 4. With the outflow of the solder material 4 from the intermediate space between the electrical connection element 3 and the electrically conductive structure 2, which exceeded a layer thickness t of 50 m, an average outflow width b=2 mm to 3 mm was obtained. The large difference in the coefficients of thermal expansion between connection element 3 and substrate 1 as well as the large outflow width resulted in critical mechanical stresses in the pane.

(54) With a sudden temperature difference from +80 C. to 30 C., it was observed that the glass substrates 1 had major damage shortly after soldering.

(55) TABLE-US-00006 TABLE 6 Comparative Components Material Example Connection Copper 100 element 3 CTE (coefficient of thermal expansion) 16 (10.sup.6/ C. for 0 C.-100 C.) Difference between CTE of the connection 7.7 element and the substrate (10.sup.6/ C. for 0 C.-100 C.) Thickness of the connection element (m) 8.0 10.sup.4 Angle () 40 Wetting Silver (wt.-%) 100 layer 5 Thickness of the layer (m) 7.0 10.sup.6 Solder Tin (wt.-%) 40 material 4 Bismuth (wt.-%) 57 Silver (wt.-%) 3 Thickness of the solder layer in (m) 250 10.sup.6 The thickness of the wetting layer and the 257 10.sup.6 solder layer (m) Glass CTE (10.sup.6/ C. for 0 C.-320 C.) 8.3 substrate 1 (Soda lime glass)

(56) The differences in the above Tables 1 to 6, the advantages of the connection element 3 according to the invention, and the observations are found in Tables 7 and 8.

(57) TABLE-US-00007 TABLE 7 Embodiment According to the Invention, Example Table 1 Table 2 Table 3 Material Steel of Iron Iron material no. (54 wt.-%) (65 wt.-%) 1.4509 in Nickel Nickel accordance (29 wt.-%) (35 wt.-%) with EN Cobalt 10 088-2 (17 wt.-%) CTE (coeffi- 10 5.1 1.7 cient of thermal expansion) of the connection element (10.sup.6/ C. for 0 C.-100 C.) Difference be- 1.7 3.2 6.6 tween CTE of the connection element and the substrate (10.sup.6/ C. for 0 C.-100 C.) Angle () 40 40 40 Outflow width b 0.4 0.4 0.4 (mm) Observation Stable Stable Stable against against against sudden sudden sudden tempera- tempera- tempera- ture drop ture drop ture drop

(58) TABLE-US-00008 TABLE 8 Comparative Comparative Comparative example 1 example 2 example 3 Table 4 Table 5 Table 6 Material Steel of Titanium Copper material no. (100 wt.-%) (100 wt.-%) 1.4509 in accordance with EN 10 088-2 CTE (coeffi- 10 8.8 16 cient of thermal expansion) of the connection element (10.sup.6/ C. for 0 C.-100 C.) Difference be- 1.7 0.5 7.7 tween CTE of the connection element and the substrate (10.sup.6/ C. for 0 C.-100 C.) Angle () 90 40 40 Outflow width b 0.5 2-3 2-3 (mm) Observation Stable Substrate Substrate against with major with major sudden damage damage tempera- ture drop

(59) It was demonstrated that panes according to the invention with glass substrates 1 and electrical connection elements 3 according to the invention had a low outflow width and better stability against sudden temperature differences.

(60) This result was unexpected and surprising for the person skilled in the art.

LIST OF REFERENCE CHARACTERS

(61) (1) Pane (2) Electrically conductive structure (3) Electrical connection element (4) Solder material (5) Wetting layer (6) Compensation member (7) Foot region of the electrical connection element 3 (7) Foot region of the electrical connection element 3 (8) Contact surface of the connection element 3 (8) Contact surface of the connection element 3 (9) Transition region of the electrical connection element 3 (9) Surface of the transition region 9 facing the substrate 1 (10) Bridge region of the electrical connection element 3 (11) Transition region of the electrical connection element 3 (11) Surface of the transition region 11 facing the substrate 1 (12) Tangent plane of the surface 9 (16) Connection of contact surface 8 and surface 9 of the transition region 9 (16) Connection of contact surface 8 and surface 11 of the transition region 11 (17) Subregion of the bridge region 10 (17) Subregion of the bridge region 10 (18) Subregion of the bridge region 10 (18) Subregion of the bridge region 10 (19) Spacer (20) Plug connector (21) Indentation (22) Contact bump .sub.1 Angle between surface of the substrate 1 and surface 9 .sub.2 Angle between surface of the substrate 1 and surface 11 .sub.1 Angle between surface of the substrate 1 and surface 9 .sub.2 Angle between surface of the substrate 1 and surface 11 Angle between the flat segments of an angled bridge element 10 b Maximum outflow width of the solder material t Limiting thickness of the solder material h Height of the spacer 19 l Width of the spacer 19 A-A Section line B-B Section line C-C Section line