DEVICE AND METHOD FOR CRIMPING CONNECTION ELEMENTS, AND CRIMPING CONNECTION
20190157825 · 2019-05-23
Inventors
Cpc classification
H01R43/0482
ELECTRICITY
International classification
Abstract
A device (1) for crimping connection elements (2). The device (1) comprises a machine frame (5), at least one punch, a drive assembly, at least one anvil (17), and a working chamber (31). The punch (3) is preferably arranged in a movable manner in relation to the machine frame (5). The punch (3) contains at least one working surface (4) for deforming a connection element (2). The drive assembly for moving the punch (3) is connected to the punch. The anvil (17) is connected to the machine frame (5) and has a receiving surface (8) for the connection element (2). The working chamber is located between the punch and the anvil and is opened and closed by a relative movement between the punch and the anvil. The device has at least one sonotrode, by which the receiving surface (8) of the anvil (17) is supplied with ultrasound.
Claims
1. A device for crimping of connection elements, wherein the device comprises: at least one die, having a recess for deforming crimping tabs, with at least one working surface for deforming a connection element, a drive assembly for moving the die, at least one anvil, wherein the anvil has a receiving surface for the connection element, a working area between die and anvil, which are openable and closeable by a relative movement between die and anvil, wherein the device has at least one sonotrode, by which ultrasound is introducible into at least the receiving surface of the anvil.
2. The device according to claim 1, wherein the device comprises a single anvil or at least two anvils, the anvils are decoupled from each other with regard to vibration and each of the anvils has a receiving surface for the crimping, and ultrasound is introducible into at least one of the receiving surfaces.
3. The device according to claim 1, wherein the at least one anvil is releasably connectable to the sonotrode.
4. The device according to claim 1, wherein the sonotrode at least partially forms the anvil.
5. The device according to claim 1, wherein torsional vibrations about an axis perpendicular to the receiving surface or longitudinal vibrations along an axis parallel or transverse to the receiving surface are introducible into the receiving surface, and the sonotrode vibrates with a frequency greater than or equal to 20 kHz.
6. The device according to claim 1, wherein at least a portion of the anvil is decoupled from a machine frame with regard to vibration and the anvil is not moveable relative to the machine frame during a crimping process.
7. The device according to claim 1, wherein the working surface is curved such that a contact surface between the die and the anvil is minimized.
8. A use of a device according to claim 1, for compressing a stranded conductor.
9. A method for producing a connection between an electrical conductor, involving the following steps: Introducing a connection element into an opened working area, which is defined by an anvil and a movable due Inserting one end of an electrical conductor into the connection element Closing the working area with the movable die wherein during the closing at least one working surface of the die and at least one receiving surface of the anvil deform the connection element so that a non-positive locking contact is created between the electrical line and the connection element; Introducing ultrasound by a sonotrode into the receiving surface of the anvil during and/or after a crimping process.
10. The method according to claim 9, wherein, upon closing the working area, a first segment of a connection element is connected to a portion of the electrical line by the first receiving surface of the anvil and the first working surface of the die, and upon closing of the working area a second segment of a connection element is connected to the electrical line by a second receiving surface of the anvil or a receiving surface of a second anvil and a second working surface of the die or a working surface of a second die.
11. The method according to claim 10, wherein ultrasound is introduced into the first receiving surface.
12. The method according to claim 9, wherein torsional ultrasound vibrations are introduced into the connection element.
13. The method according to claim 9, wherein an ultrasound pulse is transmitted into the connection element at least upon maximum force application between die and connection element.
14. A crimping connection produced by a method according to claim 9.
15. An anvil for a method for producing a connection between an electrical conductor, wherein the anvil has a receiving surface for a connection element, wherein the anvil has an interface by which the anvil is releasably connectable to a sonotrode.
Description
[0068] The invention shall be explained more closely below with the aid of figures, which show only exemplary embodiments. There are shown schematically:
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[0075] The perspective view in
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[0077] The device 1 contains a machine frame 5, by which all the machine portions are connected. The connection elements are crimped at a lower tool 7 and a die 3 (see
[0078] When the die 3 (see
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[0080] While the connection element 2 is being plastically deformed by the die 3, at the same time ultrasound is introduced into the connection element 2 and into the single conductors 22 via the receiving surface 8. The tool 7 vibrates about an axis 27 in a direction of vibration 22. The vibration is transmitted from the anvil 18 to the receiving surface 8 and from the receiving surface 8 to the connection element 2 and the single conductors 22. This vibration at ultrasound frequency produces friction between the individual single conductors 22 and between the crimping tabs 10 and the single conductors 22. The friction brings about a welding and breaks up an oxide layer on the outside of the conductor. In this way, the single conductors 23 are welded and an electrical resistance at the junction between single conductors 23 to the connection element 2 is reduced.
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[0083] The torsional oscillator 14 is held by a zero-point mounting with a flange 35. The flange 35 is shrink-fitted on the torsional oscillator at an oscillatory node of the torsional oscillator 14. The flange 35 holds the torsional oscillator 14 by resting against beams 36. At the same time, the flange 35 is pressed from above against the beams 36 by clamping devices 37.
[0084] The torsional oscillator is connected to a transformation piece 24, configured according to the desired amplitude of vibration. The transformation piece 24 is adjoined by a sonotrode 19, forming the anvil 28 for the crimping.
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