Flexible conductive diaphragm, flexible vibration sensor and preparation method and application thereof

Abstract

A flexible conductive diaphragm comprises at least one conductive film, and the conductive film comprises a flexible support layer (1), a flexible sensitive layer (2) overlapped on the flexible support layer (1), a flexible conductive layer (3) overlapped on the flexible sensitive layer (2), and an electrode (4) electrically connected with the flexible conductive layer (3). A method for preparing the flexible conductive diaphragm and a flexible vibration sensor based on the flexible conductive diaphragm are provided. With the combination of the techniques such as the flexible material, the nano-material and the arrayed micro-structure, the flexible vibration sensor has the characteristics of high sensitivity, low preparation cost, light weight, small thickness, small size, and being foldable and flexible, and can be applied in wearable or adherable electronic devices.

Claims

1. A flexible conductive diaphragm, characterized in that: it comprises two or more conductive films which are overlapped, wherein each conductive film comprises a flexible support layer, a flexible sensitive layer overlapped on the flexible support layer, a flexible conductive layer overlapped on the flexible sensitive layer, and an electrode electrically connected with the flexible conductive layer, an arrayed micro-structure is provided on a surface of the flexible sensitive layer, and the micro-structure includes a non-planar micro-structure, wherein the flexible conductive layers of adjacent conductive films are contacted with each other to form a contact resistance layer with a resistance being adjustable.

2. The flexible conductive diaphragm according to claim 1, characterized in that: it comprises a plurality of conductive films which are overlapped, and more than two contact resistance layers are formed between the plurality of conductive films.

3. The flexible conductive diaphragm according to claim 1, characterized in that: the flexible sensitive layer is adhered and fixed to the flexible support layer; or, the flexible sensitive layer and the flexible support layer are combined with each other.

4. The flexible conductive diaphragm according to claim 1, characterized in that: the flexible sensitive layer has a thickness of 0.1200 m.

5. The flexible conductive diaphragm according to claim 1, characterized in that: more than one flexible layer is further arranged between the flexible support layer and the flexible sensitive layer and/or between the flexible sensitive layer and the flexible conductive layer.

6. The flexible conductive diaphragm according to claim 1, characterized in that: the non-planar micro-structure includes pyramid, rectangular pyramid, triangular pyramid, hemisphere, or cylinder micro-structure.

7. The flexible conductive diaphragm according to claim 6, characterized in that: the flexible conductive layer is conformally adhered on a surface of the flexible sensitive layer.

8. The flexible conductive diaphragm according to claim 7, characterized in that: wherein a top point of a non-planar micro-structure of one flexible conductive layer is electrically contacted with another matching flexible conductive layer.

9. The flexible conductive diaphragm according to claim 8, characterized in that: wherein a top point of a non-planar micro-structure of one flexible conductive layer is electrically contacted with a planar area of another matching flexible conductive layer.

10. The flexible conductive diaphragm according to claim 1, characterized in that: the material of the flexible sensitive layer or the flexible support layer includes high polymer material which is at least selected from polyethylene terephthalate, polydimethylsiloxane, polyimide, polyurethane, polyvinyl alcohol, polyvinyl formal, and polyethylene.

11. A method for preparing the flexible conductive diaphragm according to claim 1, characterized in that it comprises steps of: at first, preparing two or more conductive films, wherein steps of preparing each of the conductive films comprise: (1) preparing a template for a flexible sensitive layer and forming a flexible sensitive layer on a surface of the template; (2) forming a flexible support layer on the flexible sensitive layer; (3) removing the flexible sensitive layer and the flexible support layer from the template; (4) forming a flexible conductive layer on the flexible sensitive layer, and electrically connecting an electrode to the flexible conductive layer, wherein, in the step (1), preparing the template with the surface having a micro-pattern structure, and forming, on a surface of the flexible sensitive layer, an arrayed micro-structure which corresponds with the micro-pattern structure and includes a non-planar micro-structure, then, overlapping the conductive films in such a manner that the flexible conductive layers of adjacent conductive films are contacted with each other to form a contact resistance layer with a resistance being adjustable.

12. The method for preparing the flexible conductive diaphragm according to claim 11, characterized in that the step (2) comprises: performing surface treatment for the flexible support layer or the flexible sensitive layer, then combining the flexible support layer and the flexible sensitive layer, wherein the surface treatment is performed in a manner including strong acid oxidation, plasma treatment, or ultraviolet and ozone treatment.

13. A flexible vibration sensor, characterized in that: it comprises the flexible conductive diaphragm according to claim 1.

14. The method for preparing the flexible conductive diaphragm according to claim 11, characterized in that the step (2) comprises: adhering the flexible support layer with the flexible sensitive layer to achieve a combination thereof, or combining solidified or partially solidified flexible support layer with solidified or partially solidified flexible sensitive layer through a cross-linking reaction.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In order to illustrate embodiments of the invention or existing technical solutions more clearly, drawings of the embodiments and the existing technical solutions are briefly described below. It is apparent that the described drawings below merely illustrate some embodiments of the invention. Other drawings can be derived from these drawings by those skilled in the art without involving any inventive step.

(2) FIG. 1 is a schematic drawing of a double-layer flexible conductive diaphragm according to an embodiment of the present invention;

(3) FIG. 2 is a schematic drawing of a multi-layer flexible conductive diaphragm according to an embodiment of the present invention;

(4) FIG. 3 is an SEM image illustrating an arrayed micro-structure on a surface of a flexible sensitive layer in an embodiment of the invention;

(5) FIG. 4 depicts a graph that shows the changes in voltage of a flexible vibration sensor according to an embodiment of the present invention in response to sound vibration, over time;

(6) FIG. 5 depicts a graph that shows the changes in resistance of a flexible vibration sensor according to an embodiment of the present invention in response to water velocity, over time;

(7) FIG. 6 depicts a comparison graph that shows a flexible vibration sensor according to an embodiment of the present invention responds to sound, in which the flexible vibration sensor is provided with a flexible sensitive layer with a thickness of 200 m or 10 m.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

(8) Aiming at the existing problems, the inventors provide the technical solutions of the invention after long-term research and numerous practices. The technical solutions according to the embodiments of the present invention will be explained below in detail in conjunction with figures of the embodiments. It is apparent that the described embodiments are merely some embodiments of the present invention, but are not to limit the invention in any form. On the basis of these embodiments of the present invention, those skilled in the art may get other equivalent embodiments without involving any inventive step. The present invention is intended to cover all equivalent arrangements included within the scope of the present invention.

(9) Referring to FIG. 1, a double-layer flexible conductive diaphragm is provided in an embodiment of the present invention. Herein, each layer of conductive film comprises a flexible support layer 1, a flexible sensitive layer 2 formed on an upper surface of the flexible support layer 1, a flexible conductive layer 3 formed on the flexible sensitive layer 2, and an electrode 4 electrically connected to the flexible conductive layer 3.

(10) Herein, the materials of individual layer are described above and are not repeatedly described.

(11) Furthermore, the conductive film may be prepared by a method as follows, comprising:

(12) S1. Forming an Organic Molecular Layer on a Surface of a Template

(13) Processing (such as by vapor deposition or fume coating) a thin organic molecular layer (trimethylchlorosilane or perfluorooctyl trichlorosilane) on the surface of the template such as a silicon wafer, so as to make sure that the flexible sensitive layer formed on the surface of the template can be separated from the template readily and integrally.

(14) S2. Forming a Flexible Sensitive Layer on the Organic Molecular Layer

(15) Then, spin coating unpolymerized polymer precursor or a mixture of various polymer precursors (e.g. one or a mixture of more of polyethylene terephthalate, polyimide, polydimethylsiloxane, polyurethane, polyvinyl alcohol, polyvinyl formal, and polyethylene) on the organic molecular layer to form a uniform film of flexible sensitive layer.

(16) S4. Providing Surface Treatment for the Flexible Support Layer

(17) Providing surface treatment for the film of the flexible support layer by anyone or any combination of strong acid oxidation, plasma treatment, and ultraviolet and ozone pretreatment.

(18) S5. Forming a Flexible Support Layer on the Flexible Sensitive Layer

(19) After that, overlapping a surface-treated flexible support layer on a surface of the above mentioned film of flexible sensitive layer.

(20) S6. Heat-Treating, and Removing the Solidified Flexible Sensitive Layer and Flexible Support Layer From the Template

(21) Heating the flexible sensitive layer and the flexible support layer in a vacuum environment for a period of time, until the flexible support layer and the flexible sensitive layer are fully integrated with each other. Then, removing a film of the flexible support layer and the flexible sensitive layer which are fully integrated with each other from the surface of the template, whereby molding the flexible sensitive layer with the micro-pattern of the template to form a micro-structure.

(22) S7. Forming a Flexible Conductive Layer on the Flexible Sensitive Layer

(23) Then, preparing a layer of conductive material on the flexible sensitive layer by means of a spray gun. For example, FIG. 3 shows a surface appearance of an exemplary device formed in this way when viewed through an electron microscope.

(24) In one of the preferred embodiments, the flexible conductive layer is conformally adhered on a surface of the flexible sensitive layer.

(25) S8. Forming an Electrode on the Flexible Conductive Layer

(26) Adhering a layer of conductive material on the flexible conductive layer by silver paste, so that a single layer of flexible conductive film may be formed after some procedures such as solidification.

(27) S9. Forming a Double-Layer Conductive Diaphragm

(28) Finally, overlapping a plurality of conductive diaphragms in such a manner that the micro-structured surfaces of the flexible conductive layers are partially contacted with each other, to form a double-layer conductive diaphragm.

(29) In one of the preferred embodiments, a top point of a non-planar micro-structure of one flexible conductive layer is electrically contacted with another matching flexible conductive layer. With this configuration, fewer contact points are provided and the sensitivity is further increased.

(30) Manufacturing a flexible vibration sensor with the above-mentioned flexible conductive diaphragm and the flexible vibration sensor may be used for detecting flow velocity and capturing sound.

(31) In the above-mentioned procedures, the inventors of the present invention respectively prepared the flexible sensitive layer and the flexible support layer having different thickness with various high polymer materials listed above. It is found that, in the case that the flexible support layer has a thickness more than 1 m, the flexible sensitive layer which has a thickness more than 0.1 m can be removed completely from the template without any damage.

(32) In a sharp contrast, in the case that no flexible support layer is provided, that is, steps S4 and S5 are omitted, when removing the flexible sensitive layer which has a thickness less than 200 m from the template, the damage of the flexible sensitive layer can hardly be avoided.

(33) Whereas, no matter which high polymer material of the flexible sensitive layer is, the devices which are manufactured with the flexible sensitive layer having a thickness more than 200 m have very low signal-to-noise ratios and cannot be used for detecting sound at all. For example, referring to FIG. 6 which depicts a test graph showing a flexible vibration sensor, which employs a flexible sensitive layer mainly consisting of the polydimethylsiloxane and so on and having a thickness of 200 m, responds to sound. In the case a sound is given for the flexible vibration sensor in the 15th second, 20th second, 25th second, 30th second, respectively, the device shows very little response to the sound. Again, referring to FIG. 6, in the case that the flexible sensitive layer has a thickness of 10 m, the device shows very high sensitivity.

(34) The flexible vibration sensor, which is configured with the flexible conductive diaphragm of the present invention, has excellent performances in terms of sensitivity, signal-to-noise ratio, etc. In particular, the less the thickness of the flexible sensitive layer is, the much more excellent performances thereof such as the sensitivity and the signal-to-noise ratio are.

(35) For example, referring to FIG. 4, in the case that an exemplary flexible vibration sensor of the present invention is positioned close to a speaker, when the speaker makes a sound, the flexible vibration sensor automatically collects sound signals, converts the sound signals to voltage signal output. Herein, the similarity degree between the generated voltage signals and original sound signals is very high.

(36) Furthermore, the flexible vibration sensor may be placed in a water tank in which a constant flow is provided by an injection and a stepping motor. When the water flow has different flow velocities, the device has different vibration intensity. Hence, the device shows different response to the water flow with different flow velocities. When such response is converted to resistance signal output, a curve shown in FIG. 5 is obtained. Herein, when the flow velocity changes, the detected-signal intensity of the flexible vibration sensor changes. As the flow velocity is increased, the signal intensity is increased. Thereby, the flexible vibration sensor may be used for detecting fluid flow velocity.

(37) It is also conceived that a plurality of conductive films may be overlapped to form a multi-layer flexible conductive diaphragm as shown in FIG. 2. When the device manufactured with such multi-layer flexible conductive diaphragm is tested in a similar manner as mentioned above, it shows excellent sensitivity and signal-to-noise ratio.

(38) In the present invention, the multi-layer flexible conductive diaphragm is used for sensing vibration as a core component for the flexible vibration sensor. Compared with traditional vibration sensors, the device has much higher sensitivity, lower thickness and mass, and good flexibility. Therefore, the flexible vibration sensor may be integrated into wearable devices and may be used for detecting flow velocity, capturing sound, etc.

(39) It should be explained that, in this document, the terms such as comprise, include or any other variants are intended to cover non-exclusive inclusions, such that a process, method, article or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article or apparatus. The element, limited by a description comprise a but without further limitations, shall not exclude other identical elements existed in the process, method, article or apparatus which comprises the elements.

(40) The embodiments described above are merely some specific embodiments of the present invention. It is apparent that the described embodiments are merely some embodiments of the present invention, but are not to limit the invention in any form. It should be noted that, those skilled in the art may change or modify it without departing from the principle of the present invention. The present invention is intended to cover all changes and modifications included within the scope of the present invention.