METHOD OF FORMING COPPER METAL LAYER ON NON-METALLIC MATERIAL

Abstract

A method of forming a copper metal layer on a non-metallic material contains: a. providing a carbon-based electroless-plating inks; b. spraying the carbon-based electroless-plating inks on the non-metallic material; c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution. Thereby, the copper metal layer is formed on the carbon-based electroless-plating inks of the non-metallic material.

Claims

1. A method of forming a copper metal layer on a non-metallic material comprising: a. providing a carbon-based electroless-plating inks; b. spraying the carbon-based electroless-plating inks on the non-metallic material; c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution so as to form the copper metal layer on the carbon-based electroless-plating inks of the non-metallic material.

2. The method as claimed in claim 1, wherein the non-metallic material is any one of plastic, ceramic, wood, glass, and cloth.

3. The method as claimed in claim 1, wherein the carbon-based electroless-plating inks are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent

4. The method as claimed in claim 3, wherein the functional carbon powder material consists of oxygen-functional carbon powders, an oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders.

5. The method as claimed in claim 4, wherein a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders, a content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks, and a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks.

6. The method as claimed in claim 3, wherein the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus, wherein a content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material.

7. The method as claimed in claim 4, wherein the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon.

8. The method as claimed in claim 3, wherein the carbon-based electroless-plating inks further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder, wherein a content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks.

9. The method as claimed in claim 3, wherein the dispersant is ionic dispersant or nonionic dispersant, and the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG. 1 is a flow chart of a method of forming a copper metal layer on a non-metallic material according to the present invention.

[0021] FIG. 2-1 is a cross sectional view showing the copper metal layer on the non-metallic material according to the present invention.

[0022] FIG. 2-2 is another cross sectional view showing the copper metal layer on the non-metallic material according to the present invention.

[0023] FIG. 3A is a schematic view showing a sample A of a first embodiment of the present invention.

[0024] FIG. 3B is a schematic view showing a sample B of the first embodiment of the present invention.

[0025] FIG. 4A is a schematic view showing a sample A of a second embodiment of the present invention.

[0026] FIG. 4B is a schematic view showing a sample B of the second embodiment of the present invention.

[0027] FIG. 5A is a schematic view showing a sample A of a third embodiment of the present invention.

[0028] FIG. 5B is a schematic view showing a sample B of the third embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] With reference to FIG. 1, a method of forming a copper metal layer on a non-metallic material according to the present invention comprises steps:

[0030] a. providing a carbon-based electroless-plating inks 10;

[0031] b. spraying or printing the carbon-based electroless-plating inks 10 on the non-metallic material 20, as shown in FIG. 2-1, wherein the non-metallic material 20 is any one of plastic, ceramic, wood, glass, and cloth;

[0032] c. dry spraying the carbon-based electroless-plating inks 10 on the non-metallic material 20; and

[0033] d. dipping the non-metallic material 20 on which the carbon-based electroless-plating inks 10 dry sprayed in an electroless plating solution so as to form a copper metal layer 30 on the carbon-based electroless-plating inks 10 of the non-metallic material 20, as shown in FIG. 2-2.

[0034] Preferably, the carbon-based electroless-plating inks 10 are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent. Preferably, the functional carbon powder material consists of oxygen-functional carbon powders, wherein the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon. An oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders.

[0035] A content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders.

[0036] A content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks, wherein the dispersant is ionic dispersant or nonionic dispersant.

[0037] The solvent is any one of organic solvent, inorganic solvent, and aqueous solvent, and a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks.

[0038] The oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus. A content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material.

[0039] Preferably, the carbon-based electroless-plating inks 10 further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder. A content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks 10. Preferably, when the adhesive is made of the polymer or the resin, the binder is added with the polymer or the resin. Preferably, when the oxygen-functional carbon powders are graphene flakes or graphene oxides, the adhesive is not the polymer or the resin. A content of the thicker is 0.01 wt % to 10 wt % of the carbon-based electroless-plating inks 10.

[0040] Referring to FIG. 3A, in a first sample A of a first embodiment, the carbon-based electroless-plating inks 10 are baked in a temperature of 100 C. for 20 minutes, and the carbon-based electroless-plating inks 10 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50 C. to 70 C. for 30 minutes to 120 minutes, thus obtaining copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the first embodiment of FIG. 3B.

[0041] Referring to FIG. 4A, in a first sample A of a second embodiment, the non-metallic material 20 is the ceramic, the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20, the non-metallic material 20 on which the carbon-based electroless-plating inks 10 are baked in a temperature 100 C. for 20 minutes, and the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50 C. to 70 C. for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the second embodiment of FIG. 4B.

[0042] Referring to FIG. 5A, in a first sample A of a third embodiment, the non-metallic material 20 is the wood, the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20, the non-metallic material 20 on which the carbon-based electroless-plating inks 10 are baked in a temperature 100 C. for 20 minutes, and the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50 C. to 70 C. for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the third embodiment of the second embodiment of FIG. 5B.

[0043] Thereby, the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.

[0044] While the preferred embodiments of the invention have been set forth for the purpose of disclosure, modifications of the disclosed embodiments of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.