Linear regulator with temperature compensated bias current
11526185 · 2022-12-13
Assignee
Inventors
Cpc classification
International classification
Abstract
A solid-state circuit is presented which may comprise a pass device, a control circuit, and a leakage current compensation circuit. The pass device may have a first terminal, a second terminal and a drive terminal, wherein the first terminal of the pass device is coupled with an input terminal of the solid-state circuit, and wherein the second terminal of the pass device is coupled with an output terminal of the solid-state circuit. The control circuit may be coupled with the drive terminal of the pass device and may be configured to drive the pass device with a driving voltage. The leakage current compensation circuit may be configured to receive a leakage current of the pass device and may be configured to forward said leakage current as a bias current to said control circuit.
Claims
1. A solid-state circuit comprising: a pass device having a first terminal, a second terminal and a drive terminal, wherein the first terminal of the pass device is coupled with an input terminal of the solid-state circuit, and wherein the second terminal of the pass device is coupled with an output terminal of the solid-state circuit; a control circuit coupled with the drive terminal of the pass device and configured to drive the pass device with a driving voltage; and a leakage current compensation circuit configured to receive a leakage current of the pass device and to forward said leakage current as a bias current to said control circuit.
2. The solid-state circuit of claim 1, wherein the leakage current compensation circuit is coupled to the second terminal of the pass device to receive the leakage current of the pass device.
3. The solid-state circuit of claim 1, wherein the control circuit comprises a differential amplifier stage configured to generate an intermediate signal based on a difference between a reference signal and a feedback signal indicative of an output voltage at the output terminal of the solid-state device.
4. The solid-state circuit of claim 3, wherein the leakage current compensation circuit is configured to forward the leakage current to said differential amplifier stage.
5. The solid-state circuit of claim 3, wherein the control circuit comprises a further amplifier stage coupled between the differential amplifier stage and the pass device, and wherein the leakage current compensation circuit is configured to forward the leakage current to said differential amplifier stage and said further amplifier stage.
6. The solid-state circuit of claim 1, wherein the leakage current increases as a function of temperature.
7. The solid-state circuit of claim 1, wherein the control circuit is characterized by a minimum bias current, and wherein the solid-state circuit is configured to provide only the leakage current to the control circuit when the leakage current is greater than the minimum bias current.
8. The solid-state circuit of claim 7, wherein the solid-state circuit is configured to provide the minimum leakage current to the control circuit when the leakage current is smaller than the minimum bias current.
9. A method for operating a solid-state circuit, wherein the solid-state circuit comprises a pass device having a first terminal, a second terminal and a drive terminal, wherein the first terminal of the pass device is coupled with an input terminal of the solid-state circuit, and wherein the second terminal of the pass device is coupled with an output terminal of the solid-state circuit, wherein the solid-state circuit comprises a control circuit coupled with the drive terminal of the pass device, the method comprising driving, by the control circuit, the pass device with a driving voltage; receiving, by a leakage current compensation circuit, a leakage current of the pass device; and forwarding, by the leakage current compensation circuit, said leakage current as a bias current to said control circuit.
10. The method of claim 9, wherein the leakage current compensation circuit is coupled to the second terminal of the pass device to receive the leakage current of the pass device.
11. The method of claim 9, wherein the control circuit comprises a differential amplifier stage for generating an intermediate signal based on a difference between a reference signal and a feedback signal indicative of an output voltage at the output terminal of the solid-state device, the method further comprising forwarding, by the leakage current compensation circuit, the leakage current to said differential amplifier stage.
12. The method of claim 11, wherein the control circuit comprises a further amplifier stage coupled between the differential amplifier stage and the pass device, and wherein the method further comprises forwarding, by the leakage current compensation circuit, the leakage current to said differential amplifier stage and said further amplifier stage.
13. The method of claim 9, wherein the leakage current increases as a function of temperature.
14. The method of claim 9, wherein the control circuit is characterized by a minimum bias current, and wherein the method further comprises providing only the leakage current to the control circuit when the leakage current is greater than the minimum bias current.
15. The method of claim 14, wherein the method further comprises providing the minimum leakage current to the control circuit when the leakage current is smaller than the minimum bias current.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar or identical elements, and in which
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DETAILED DESCRIPTION
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P.sub.LOSS=V.sub.DD×(I.sub.QI.sub.LEAK).
(12) A specific example of a solid-state circuit is a linear regulator.
(13) In the example of
(14) The linear regulator 300 may employ direct feedback, as the bias currents for the control and compensation circuits 32, 33 are provided directly from the output of the LDO. This has many advantages, including superior noise immunity. Further, the main pass element(s), shown as a single device S1 31 in
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(17) As can be seen, the differential amplifier stage 52 and the further amplifier stage 53 are driven by respective bias currents IBIAS_1 and IBIAS_2 which are generated by the leakage current compensation circuit 500 which is configured to receive a leakage current of the pass device 51 and to forward said leakage current as a bias current to the differential amplifier stage 52 and the further amplifier stage 53 of control circuit 50. Also, the driver 54 may be driven by a respective bias current which generated by leakage current compensation circuit 500 (not shown in
(18) As mentioned above, the present invention increases the bias current without increasing I.sub.Q. This may be achieved by integrating the I.sub.LEAK compensation circuit with the I.sub.BIAS source. The leakage current, instead of being sourced directly to GND, is further used as a bias current source. There is an added benefit in that the leakage current may increase as a function of temperature. At the same time, the transconductance may decrease as a function of temperature. By using the leakage current as a bias current source, the bias current can be increased as the temperature increases, which is very beneficial. The result is greater LDO performance, including improving dynamic response, increase noise immunity over a greater bandwidth, and reducing noise on the output.
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When (IBIAS_1+IBIAS_2)>ILEAK IQ=(IBIAS_1+IBIAS_2).
(21) During the period when the bias current is less than the leakage current 720, the following relations hold:
When (IBIAS_1+IBIAS_2)<ILEAK IQ=IBIAS_1+IBIAS_2=ILEAK
(22) This results in minimizing I.sub.Q while still increasing I.sub.BIAS.
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(24) It should be noted that the description and drawings merely illustrate the principles of the proposed methods and systems. Those skilled in the art will be able to implement various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its spirit and scope. Furthermore, all examples and embodiment outlined in the present document are principally intended expressly to be only for explanatory purposes to help the reader in understanding the principles of the proposed methods and systems. Furthermore, all statements herein providing principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass equivalents thereof.