SUBSTRATE HOLDER FOR COATING EQUIPED WITH MOVEABLE SHUTTERS AND METHOD FOR USING THE SAME
20190136364 ยท 2019-05-09
Inventors
- Haipeng Zheng (Dallas, TX, US)
- David Thornhill (Dallas, TX, US)
- Igor VESELINOVIC (Dallas, TX, US)
- Matthew James LOCKWOOD (Dallas, TX, US)
- Walter Charles BRALEY (Dallas, TX, US)
- Cesar Maksoud (Dallas, TX, US)
- Narendra Borgharkar (Dallas, TX, US)
- Chris DEMING (Dallas, TX, US)
- Xavier GRANDJEAN (Dallas, TX, US)
- Nicholas MALZAC (Dallas, TX, US)
Cpc classification
B29D11/00865
PERFORMING OPERATIONS; TRANSPORTING
B29D11/00432
PERFORMING OPERATIONS; TRANSPORTING
International classification
C23C14/04
CHEMISTRY; METALLURGY
C23C16/458
CHEMISTRY; METALLURGY
Abstract
Vapor deposition apparatuses, systems, and methods for selectively coating, with one or more functional layers, a substrate through the use of moveable shutters are described. Embodiments of the present disclosure can be useful for coating eyeglass lenses. Still other embodiments are described.
Claims
1. A method of masking a substrate during a substrate coating process comprising moving one or more shutters to a closed position to shield fully or partially one or more substrates from an evaporation source, wherein the one or more substrates are a first portion of a plurality of substrates disposed in a substrate holder; and applying one or more functional layers to exposed surfaces of the plurality of substrates, where exposed surfaces are surfaces of a second portion of the plurality of substrates not shielded by the one or more shutters, wherein, at the end of the coating process, the first portion of the plurality of substrates has a different functional layer profile than the second portion.
2. The method of claim 1, further comprising moving the one or more shutters to a retracted position to expose surfaces of the one or more substrates to an evaporation source; and applying one or more functional layers to exposed surfaces of the plurality of substrates.
3. The method of claim 1, further comprising rotating the substrate holder while applying the one or more functional layers to the exposed surfaces.
4. The method of claim 1, wherein moving the one or more shutters comprises manually moving the one or more shutters or wherein moving the one or more shutters comprises remotely actuating the one or more shutters.
5. The method of claim 1, wherein the movement of the one or more shutters to a closed position occurs while other shutters are not moved.
6. The method of claim 1, inputting at least two substrate coating protocols, a first protocol associated with the first portion of substrates and the second protocol associated with the second portion of the substrates, wherein each protocol comprises position data of each portion of substrates and coating instructions for each portion of substrates.
7. The method of claim 1, wherein: (a) the substrate is an optical lens, a thin film device, a film, or ophthalmic lenses; (b) the evaporation source is disposed in an evaporator configured for at least one of electron beam evaporation, ion-assisted evaporation, ion beam sputtering, chemical vapor deposition, physical vapor deposition, atomic vapor deposition, and resistive evaporation; or (c) the substrate holder is coupled to a rotary driver configured to rotate the substrate holder.
8. The method claim 1, further comprising removing at least one of the shutters from the substrate holder and replacing the removed shutter with a new shutter.
9. A system for vapor depositing one or more functional layers onto one or more substrates, the system comprising: a substrate holder; one or more evaporators spaced apart from the substrate holder, the substrate holder comprising holders, each holder configured to hold one or more substrates; and one or more shutters coupled to the substrate holder and configured to move between a retracted position and a closed position such that in the closed position, the one or more shutters shield at least a portion of one or more substrates from the one or more evaporators, and in the retracted position, the one or more substrates are exposed to the one or more evaporators; a system controller comprising: a microprocessor and memory, wherein the system controller is in communication with the one or more evaporators and the one or more shutters and is configured to execute a process comprising: receiving at least two substrate coating protocols, each protocol associated with a distinct group of holders and comprising position data for each distinct group of holders.
10. The system of claim 9, wherein the system controller is further configured to execute a process comprising at least one of the following: actuating at least one of the one or more evaporators according to at least one of or both of the coating protocols and actuating at least one of the one or more shutters to move the shutter to the retracted position or the closed position according to at least one of the protocols.
11. The system of claim 9, wherein: (a) the one or more shutters are configured such that, when in the closed position, each shutter shields at least an entire substrate from the one or more evaporators; (b) the one or more shutters are configured such that, when in a closed position, zero to negligible material is applied to shuttered substrates during use; (c) the one or more shutters are configured such that, when in the closed position, a substantially uniform layer of evaporated material is applied to non-shuttered substrates; (d) the one or more shutters is a plurality of shutters and each shutter is configured to be actuatable between the retracted position and the closed position independent of the other shutters' position; (e) each shutter is configured to shield a portion of one or more substrates, a single substrate, at least two substrates, a row of substrates, a ring of substrates, or a sector of substrates; (f) each shutter is configured to slide or rotate between the retracted position and the closed position; (g) each shutter is configured to fold and unfold between the retracted position and the closed position; (h) each shutter is releasably coupled to the substrate holder, or (i) the substrate holder is configured to rotate.
12. The system of claim 9, further comprising one or more drivers, each driver coupled to one or more shutters and configured to move the one or more coupled shutters between the retracted position and the closed position.
13. The system of claim 12, further comprising one or more controllers, each controller in communication with one or more drivers and configured to actuate one or more drivers.
14. The system of claim 13, further comprising one or more wireless or wired receivers, each receiver in communication with at least one of the one or more controllers and configured to receive a wireless or wired signal comprising a driver actuation command.
15. A method of selectively masking a substrate during a substrate coating process comprising applying one or more functional layers to only a portion of a plurality of substrates disposed in a substrate holder without repositioning any of the plurality of substrates, wherein a functional layer can include any one of the following: a hydrophobic layer, an anti-reflective layer, a high reflectance layer, a high refractive index layer, a low refractive index layer, an antistatic layer, an anti-fog layer, a pad control layer, a gradient layer, a light manipulating layer.
16. The method of claim 2, further comprising rotating the substrate holder while applying the one or more functional layers to the exposed surfaces.
17. The method of claim 2, wherein moving the one or more shutters comprises manually moving the one or more shutters or wherein moving the one or more shutters comprises remotely actuating the one or more shutters.
18. The method of claim 3, wherein moving the one or more shutters comprises manually moving the one or more shutters or wherein moving the one or more shutters comprises remotely actuating the one or more shutters.
19. The method of claim 2, wherein the movement of the one or more shutters to a closed position occurs while other shutters are not moved.
20. The method of claim 3, wherein the movement of the one or more shutters to a closed position occurs while other shutters are not moved.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The following drawings illustrate by way of example and not limitation. For the sake of brevity and clarity, every feature of a given structure may not be labeled in every figure in which that structure appears. Identical reference numbers do not necessarily indicate an identical structure. Rather, the same reference number may be used to indicate a similar feature or a feature with similar functionality, as may non-identical reference numbers.
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DETAILED DESCRIPTION
[0030] Referring now to the drawings and more particularly to
[0031]
[0032] In various embodiments, the one or more evaporators 10 comprise an evaporation source and are configured to apply one or more functional layers to an exposed surface of one or more substrates 8. In some embodiments, an evaporator 10 is configured for electron beam evaporation, ion-assisted evaporation, ion beam sputtering, chemical vapor deposition, physical vapor deposition, atomic vapor deposition, or resistive evaporation. In some embodiments, the functional layers can include one or more of the following: an anti-reflective layer, a high refractive index layer, a low refractive index layer, an anti-static layer, a hydrophilic layer (e.g., an anti-fog layer), a hydrophobic layer, an anti-scratch layer, a high reflectance layer (e.g., a mirror layer), a tinted/colored layer, an adhesive layer for facilitating adhesion to the substrate or between the layer, a pad control layer, a gradient layer, a light manipulating layer, and/or a hardening layer. In some embodiments, substrate holder 6 can be configured to flip substrate 8 so that an opposing surface is exposed to the one or more evaporators 10.
[0033] The one or more moveable shutters 9 are configured to move between a retracted position and a closed position. In the closed position, the one or more shutters 9 shield at least a portion of the one or more substrates 8 from the evaporators 10 by physically blocking the vapor path (which emanates from the evaporation source 13) adjacent to the substrate(s) 8. In the retracted position, the one or more substrates 8 are exposed to the one or more evaporators 10. The shutter 9, when in the closed position, comprises a continuous section of material that is sufficiently close to the shuttered substrate(s) so that zero to negligible material is applied to the shuttered substrates during operation of evaporator 10. However, the shutter 9 can be spaced apart from the shuttered substrate a distance that would not interfere with the deposition of a non-shuttered substrate(s). In some embodiments, the shutter 9, when in the closed position, is spaced apart from the substrate 8, a distance less than 3 cm, 2.5 cm, 2 cm, 1.7 cm, 1.5 cm, 1.2 cm, 1 cm, 0.8 cm, 0.5 cm, 0.2 cm, or 0.1 cm. A shutter 9 can be sized to shield only a portion of a substrate 8, it can be sized to shield an entire substrate 8, or it can be sized to shield a plurality of substrates 8. In addition, in some embodiments, a shutter 9 can be configured to have a shape that shields a row of substrates 8 (see e.g., row of substrates R in
[0034] Shutter 9 can be configured in a variety of ways to be moveable between the closed position and the retracted position. In some embodiments, each shutter 9 is configured to slide and/or rotate between the retracted position and the closed position. In some embodiments, each shutter is configured to fold and unfold between the retracted position and the closed position. Apparatus 1 can further comprise one or more auxiliary components to facilitate the function of the shutter. Such components can include a rail or other attachment configured to secure the shutter to the substrate holder when in the closed position such that the turbulence caused by a spinning substrate does not impeded the function of the shutter. The rail can also facilitate a sliding movement of the shutter. Such components can include a hinge that couples the shutter to the substrate holder and/or a lever to facilitate rotation of the shutter relative to the substrate holder. Shutter 9 can comprise a mechanical iris or a rotatable blade array like that of a mechanical iris. Still other components can include a driver configured to move the shutter between a retracted position and a closed position, a wired or wireless receiver in communication with the driver and configured to receive a shutter actuation command from a controller (discussed below), a power supply connector, and/or power supply.
[0035] For example, in the embodiment shown in
[0036] As another example, in the embodiment shown in
[0037] In some embodiments, a shutter 9 and the auxiliary components (e.g., driver, receiver, rails), if any, can be configured to retrofit onto a substrate holder 6. The shutter 9 can also be configured for easy replacement, as performance of the shutter may be impeded with excessive coatings. In some embodiments, the shutter 9 is configured to couple to the substrate holder and/or auxiliary components through a quick release-type attachment.
[0038] Referring momentarily to
[0039] In some embodiments, particularly where a substrate holder 6 is retrofitted to contain a moveable shutter 9a, base 36 is disposed above or within a holder that is adjacent to another holder in which the substrate to be shielded is disposed. Battery 32, driver 12a, wireless receiver 14a, and microcontroller 34 are disposed above base 36 such that the base shields them from evaporator 10.
[0040] In some embodiments, as shown in
[0041] Similarly, the auxiliary components may also be configured to not interfere with the pump down of the vacuum chamber 2, particularly in embodiments without enclosure 38. For example, in some embodiments, the auxiliary components are composed of low-outgassing material(s). In some embodiments, battery 32 can be configured to be leak-free under the pressures of vacuum chamber 2. Shutter 9 can also be composed of low-outgassing materials.
[0042] Referring momentarily to
[0043] Referring back to
[0044] In some embodiments, where apparatus 1 comprises a plurality of shutters 9, a shutter can be selectively actuated independently from the other shutters. Stated another way, a portion of one or more shutters 9 can be actuated to change position while another portion of shutters 9 do not change, and vice versa. For example, as shown in
[0045] In order to control the driver, in some embodiments, a controller is in communication with one or more drivers and configured to actuate the one or more drivers. In some embodiments, the controller is a system controller 20. For example, with reference to
[0046] In some embodiments, the system controller 20 can be configured to execute a substrate coating process. Moreover, the system controller 20 can be in communication with the one or more evaporators, the driver configured to rotate the substrate holder 6, and the one or more shutters. The coating process to be executed can comprise receiving at least two substrate-coating protocols, each protocol associated with a different group of holders 7. The protocol includes position data of each distinct group of holders 7 within the substrate holder 6 and data indicative of the layers to be applied to the substrate 8. By way of example, a first protocol can be associated with the substrates in position A-E of a substrate holder and indicates that only an anti-scratch coating is applied. The second protocol can be associated with the substrates in position F-Z and indicates that an anti-scratch coating and an anti-reflective coating is applied. According to one or both of the coating protocols, the system controller 20 can actuate at least one of the one or more evaporators 10, the driver 11, and/or at least one of the one or more shutters 9, as needed.
[0047] In some embodiments, the system 10 further comprises one or more wireless or wired receivers 14 (shown in
[0048] Some embodiments comprise a method of masking a substrate 8 during a substrate coating process. In some embodiment, the method is executed using the apparatus and/or system described herein. Such method facilitates applying different types of film coatings to two different substrates 8 without having to interrupt the coating process, such as by opening the vacuum chamber 2 of the apparatus 1 to remove a substrate 8 that should not receive a particular functional layer.
[0049] In some embodiments, the method of masking a substrate 8 can comprise moving one or more shutters 9 to a closed position to shield fully or partially one or more substrates 8 from the evaporation source 13 of an evaporator 10; the one or more substrates 8 are a portion of a plurality of substrates 8 disposed in a substrate holder 6. After shutters 9 are moved into position, a first round of one or more functional layers can be applied to exposed surfaces of the plurality of substrates. Exposed surfaces are surfaces of the plurality of substrates not shielded by the one or more shutters. Exposed surfaces 17 as compared with shuttered surfaces (not visible) are shown in
[0050] With such method, the movement of the one or more shutters to a closed position can occurs while other shutters are not moved. Stated another way, the shutters can be selected to move independently of other shutters. Such selection of when to move a shutter and which shutter to move may be based on a coating protocol. For example, at least two coating protocols can be communicated to the system controller (e.g., by user input). The first protocol associated with the first portion of substrates and the second protocol associated with the second portion of the substrates, wherein each protocol comprises position data of each portion of substrates and coating instructions for each portion of substrates.
[0051] Other embodiments comprise a method of selectively masking a substrate during a substrate coating process comprising applying one or more functional layers to only a portion of a plurality of substrates disposed in a substrate holder without repositioning any of the plurality of substrates.
[0052] Yet other some embodiments comprise a method of applying a gradient coating to a substrate through the movement of a shutter. Instead of moving a shutter in between the application of functional layers, the shutter can move during the application of a functional layer thereby creating a gradient coating of the functional layer, e.g. a gradient tinted layer. System controller 20 can be configured to execute a gradient coating protocol. The protocol can include data associated with the rate at which the shutter moves. The protocol can include data associated with the rate at which vapor is deposited. It can be appreciated that the degree of gradient can be influenced by these factors.
[0053] The shape at the edge of the shutter can influence the gradient pattern. For example, an iris shutter like that shown in
[0054] In some embodiments, shutters 9 receive multiple coatings over the course of using them, and it may be desired to replace them. Thus, a method can comprise removing at least one of the shutters from the substrate holder and replacing the removed shutter with a new shutter. In such embodiments, the shutter 9 is releasably coupled to the substrate holder 6 to facilitate removing, such as with a quick-release type attachment.
[0055] Still other embodiments comprise methods of validating an automated shutter device, a shutter, and/or auxiliary components (e.g., control and automation components) for use in a vacuum chamber. Such control and automation components can include a battery, a driver, a wireless receiver, and a microcontroller. Other auxiliary components can comprise an enclosure with the control and automation components disposed therein. An automated shutter device comprises the shutter operatively coupled to the control and automation components, which may or may not be sealed within an enclosure. The method comprises the steps of placing a shutter device, a shutter, and/or auxiliary components into a vacuum chamber and reducing the pressure to a vacuum pressure of a lens coating machine.
Example
[0056] A device like that shown in
[0057] The above specification provides a complete description of the structure and use of exemplary embodiments. Although certain embodiments have been described above with a certain degree of particularity, or with reference to one or more individual embodiments, those skilled in the art could make numerous alterations to the disclosed embodiments without departing from the scope of this invention. As such, the illustrative embodiments of the present vapor deposition apparatuses and methods are not intended to be limiting. Rather, the present devices, systems, and methods include all modifications and alternatives falling within the scope of the claims, and embodiments other than those shown may include some or all of the features of the depicted embodiments. For example, components may be combined as a unitary structure and/or connections may be substituted. Further, where appropriate, aspects of any of the examples described above may be combined with aspects of any of the other examples described to form further examples having comparable or different properties and addressing the same or different problems. Similarly, it will be understood that the benefits and advantages described above may relate to one embodiment or may relate to several embodiments.
[0058] The claims are not to be interpreted as including means-plus- or step-plus-function limitations, unless such a limitation is explicitly recited in a given claim using the phrase(s) means for or step for, respectively.