COOLING AND VENTILATION DEVICE, COOLING HAT, COOLING SHOES, AND COOLING BACKPACK

Abstract

A cooling and ventilation device (10), a cooling hat (20), a cooling shoe and a cooling backpack. The cooling and ventilation device (10) comprises: a housing (100), a ventilation assembly (200), a heat conduction frame (300) and a cooling assembly (400). Two ends of the housing (100) are respectively provided with an air inlet (110) and an air outlet (120). The ventilation assembly (200) is arranged at the position of the air inlet (110), and is used for bringing air into the housing (100). The heat conduction frame (300) is arranged within the housing (100). The cooling assembly (400) comprises semiconductor cooling plates (410) and heat conduction film layers (420), the semiconductor cooling plates (410) being arranged on the heat conduction frame (300), the heat conduction film layers (420) being attached to the side surfaces of the semiconductor cooling plates (410) away from the heat conduction frame (300). When the semiconductor cooling plates (410) are turned on, the sides of the semiconductor cooling plates (410) connected to the heat conduction film layers (420) are cooling ends, and heat in the air entering from the external environment can be absorbed by the heat conduction frame (300) in a rapid and timely manner. Thus, a cooling operation is performed on the air entering from the external environment in a rapid and timely manner, thereby ensuring that an airflow discharged from the air outlet (120) is a cold airflow.

Claims

1. A cooling and ventilation device, characterized by comprising: an outer housing, with an air inlet and an air outlet being defined at two ends of the outer housing, respectively; a ventilation component, the ventilation component being provided at a position of the air inlet, for blowing air into the outer housing; a thermally conductive rack, the thermally conductive rack being provided inside the outer housing; and a cooling component, the cooling component comprising a semiconductor cooling sheet and a thermally conductive film, the semiconductor cooling sheet being provided on the thermally conductive rack, and the thermally conductive film being attached onto a side face of the semiconductor cooling sheet away from the thermally conductive rack.

2. The cooling and ventilation device according to claim 1, characterized in that the cooling and ventilation device further comprises a circuit module, an installation cavity is defined between the thermally conductive rack and an inside wall of the outer housing, the circuit module is received inside the installation cavity, and the circuit module is in electrical connection to the ventilation component and the semiconductor cooling sheet, respectively.

3. The cooling and ventilation device according to claim 1, characterized in that the ventilation component comprises a motor and fan blades, the fan blades are provided at a position of the air inlet, and the motor is connected to the fan blades for driving the fan blades to rotate.

4. The cooling and ventilation device according to claim 1, characterized in that the cooling and ventilation device further comprises an installation base, and the outer housing is provided on the installation base.

5. The cooling and ventilation device according to claim 4, characterized in that the cooling and ventilation device further comprises a circuit module, the circuit module is received in the installation base, and the circuit module is in electrical connection to the ventilation component and the semiconductor cooling sheet, respectively.

6. The cooling and ventilation device according to claim 5, characterized in that a heat dissipation passage is defined in the installation base, and the heat dissipation passage is in communication with an outside environment and an inside space of the installation base, respectively.

7. The cooling and ventilation device according to claim 1, characterized in that the thermally conductive rack is in a hollow triangular-prism structure, and an outer surface of the thermally conductive rack is provided with three installation faces sequentially connected; the cooling and ventilation device is provided with a plurality of the cooling components, the semiconductor cooling sheets of the cooling components are provided on the installation faces in one-to-one correspondence, and the thermally conductive films are attached, in one-to-one correspondence, onto side faces of the semiconductor cooling sheets away from corresponding thermally conductive racks.

8. The cooling and ventilation device according to claim 7, characterized in that an inside wall of the outer housing is provided a clamping rail, the thermally conductive rack is provided with a clamping position at a connection point between two neighboring ones of the installation faces, and the clamping rail is embedded inside the clamping position in a sliding manner.

9. The cooling and ventilation device according to claim 7, characterized in that the thermally conductive rack is provided therein with a plurality of thermally conductive fins, and the thermally conductive fins are provided at intervals.

10. The cooling and ventilation device according to claim 1, characterized in that the thermally conductive film is a nano-graphite sheet or a nano-graphene sheet.

11. The cooling and ventilation device according to claim 1, characterized in that a thermal conductivity coefficient of the thermally conductive film is greater than 400 W(m.Math.K).

12. The cooling and ventilation device according to claim 1, characterized in that the outer housing has a cross section in a ring-shape structure, and the ring-shape structure has an inner diameter of 8 cm10 cm; the outer housing is in an ellipsoid-shape structure, and the outer housing has a length of 10 cm13 cm; the thermally conductive film has a cross section in a rectangular shape, and the rectangular shape has a length of 8 cm10 cm, and a width of 5 cm8 cm; the semiconductor cooling sheet has a cross section in a square shape, and the square shape has a length of 4 cm6 cm.

13. The cooling and ventilation device according to claim 1, characterized in that the air inlet has an area greater than that of the air outlet, an inside wall of the outer housing is in an arc-shape structure, an enhancement air passage is defined between the inside wall of the outer housing and the thermally conductive film, and the enhancement air passage is in communication with the air inlet and the air outlet, respectively.

14. A cooling hat, characterized by comprising: a hat body, and a cooling component, the cooling component comprising a semiconductor cooling sheet and a thermally conductive film, the semiconductor cooling sheet being provided on an inside wall of the hat body, and the thermally conductive film being attached onto a side face of the semiconductor cooling sheet away from the inside wall of the hat body.

15. The cooling hat according to claim 14, characterized in that the hat body comprises a hat shell and an inner cloth layer, the semiconductor cooling sheet is provided on an inside wall of the hat shell, the thermally conductive film is attached onto a side face of the semiconductor cooling sheet away from the inside wall of the hat shell, and the inner cloth layer is attached onto a side face of the thermally conductive film away from the semiconductor cooling sheet.

16. The cooling hat according to claim 14, characterized in that a plurality of micro ventilation holes are defined on the hat shell, and all of the micro ventilation holes communicate with an outside environment and a side face of the semiconductor cooling sheet away from the thermally conductive film, respectively.

17. The cooling hat according to claim 14, characterized in that the cooling hat further comprises a solar cell module and a brim, the brim is clamped onto the hat body, the solar cell module is provided on the brim, and the solar cell module is in electrical connection to the semiconductor cooling sheet; the cooling hat further comprises a circuit module, an installation area is provided on the hat body, the circuit module is installed on the installation area, and the circuit module is in electrical connection to the semiconductor cooling sheet.

18. (canceled)

19. The cooling hat according to claim 18, characterized in that the cooling hat further comprises a push switch, the push switch is provided on the hat body, the push switch is in electrical connection to the circuit module and the semiconductor cooling sheet, respectively, for controlling connection or disconnection of the semiconductor cooling sheet to or from the circuit module.

20. The cooling hat according to claim 14, characterized in that the cooling hat further comprises a metal support sheet, the metal support sheet is in an arc-shape structure, the metal support sheet is provided on the hat body, and a surface of the metal support sheet is provided with a nano-silver coating.

21. The cooling hat according to claim 14, characterized in that the cooling hat further comprises a miniature fan, and the miniature fan is provided on the hat body, for blowing out air inside the hat body to an external environment; the thermally conductive film is provided with an air change passage, and the air change passage is used to introduce air in the external environment into the hat body.

22-24. (canceled)

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0049] FIG. 1 is a structural schematic diagram of a cooling and ventilation device according to an embodiment of the present invention;

[0050] FIG. 2 is a structural schematic diagram of the cooling and ventilation device illustrated in FIG. 1 from another angle;

[0051] FIG. 3 is a structural schematic diagram of the cooling and ventilation device illustrated in FIG. 1 from another angle;

[0052] FIG. 4 is a structural schematic diagram of the cooling and ventilation device according to another embodiment of the present invention;

[0053] FIG. 5 is a structural schematic diagram of inside of the cooling and ventilation device according to an embodiment of the present invention;

[0054] FIG. 6 is a structural schematic diagram of inside of the cooling and ventilation device according to another embodiment of the present invention;

[0055] FIG. 7 is a structural schematic diagram of inside of the cooling and ventilation device according to another embodiment of the present invention;

[0056] FIG. 8 is a structural schematic diagram of a thermally conductive rack according to an embodiment of the present invention;

[0057] FIG. 9 is a structural schematic diagram of a semiconductor cooling sheet and a thermally conductive film according to an embodiment of the present invention;

[0058] FIG. 10 is a structural schematic diagram of a cooling hat according to an embodiment of the present invention;

[0059] FIG. 11 is a structural schematic diagram of inside of the cooling hat illustrated in FIG. 10 from another angle;

[0060] FIG. 12 is a partial structural schematic diagram of the cooling hat according to another embodiment of the present invention;

[0061] FIG. 13 is a schematic diagram illustrating an operation state of the cooling hat according to another embodiment of the present invention.

DETAILED DESCRIPTION

[0062] In order to facilitate the understanding to the present invention, the present invention will be described more comprehensively below with reference to relevant accompanying drawings. Preferable embodiments of the present invention are given in the accompanying drawings. However, the present invention may be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, these embodiments are provided for more thorough and more comprehensive understanding to the contents disclosed in the present invention.

[0063] It should be indicated that when an element is referred to as being fixed to another element, it may be directly on another element, and there also may be an intermediate element. When one element is referred to as being connected to another element, it may be directly connected to another element, and there also may be an intermediate element. Terms used herein vertical, horizontal, left, right, and like expressions are merely for a descriptive purpose, rather than indicating a unique embodiment.

[0064] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as generally understood by a person skilled in the art of the present invention. Terms used in the description of the present invention herein are merely for the purpose of describing specific embodiments, but do not aim at limiting the present invention. Terms and/or used herein include any and all combinations of one or more relevant listed items.

[0065] Referring to FIG. 1 and FIG. 7, a cooling and ventilation device 10 includes an outer housing 100, a ventilation component 200, a thermally conductive rack 300, and a cooling component 400. All of the ventilation component 200, the thermally conductive rack 300, and the cooling component 400 are received inside the outer housing 100. The cooling component 400 is provided on the thermally conductive rack 300. The ventilation component 200 is used to blow air into the outer housing 100.

[0066] Referring to both FIG. 1 and FIG. 2, at two ends of the outer housing 100, an air inlet 110 and an air outlet 120 are defined, respectively, external air enters through the air inlet 110, and discharges through the air outlet 120, and in this process, air entering the outer housing 100 will contact the cooling component 400, such that a cooling operation is performed for the air, in this way, referring to FIG. 5 together, air discharging from the air outlet 120 has a temperature lower than that of air entering through the air inlet 110, thus producing cooling and ventilation effects.

[0067] In an embodiment, the air inlet has an area greater than that of the air outlet, an inside wall of the outer housing is in an arc-shape structure, an enhancement air passage is defined between the inside wall of the outer housing and the thermally conductive film, and the enhancement air passage is in communication with the air inlet and the air outlet, respectively, for example, the outer housing is in an ellipsoid-shape structure, in this way, according to aerodynamics, when air in an external environment enters the outer housing, and contacts the cooling component, that is, when the air is cooled suddenly, a flow rate of the air entering the air inlet can be forced to be increased, thus air-supply intensity is improved, furthermore, an amount of air supply can be increased and an air velocity flowing out from the air outlet can be increased.

[0068] Referring to FIG. 1, the ventilation component 200 is provided at a position of the air inlet 110, and the ventilation component 200 is used to blow air into the outer housing 100.

[0069] In an embodiment, referring to both FIG. 3 and FIG. 4, the ventilation component 200 includes a motor 210 and fan blades 220, the fan blades are provided at a position of the air inlet, and the motor is connected to the fan blades for driving the fan blades to rotate, in this way, by driving the fan blades to rotate through the motor, air in the external environment can be blown into the outer housing through the air inlet.

[0070] Referring to FIG. 7, the thermally conductive rack 300 is provided inside the outer housing 100, and the thermally conductive rack 300 is used to absorb heat produced by the cooling component 400 during cooling.

[0071] Referring to FIG. 7, the cooling component 400 includes a semiconductor cooling sheet 410 and a thermally conductive film 420, the semiconductor cooling sheet 410 is provided on the thermally conductive rack 300, and the thermally conductive film 420 is attached onto a side face of the semiconductor cooling sheet 410 away from the thermally conductive rack 300, in this way, when the semiconductor cooling sheet 410 is powered on, a side of the semiconductor cooling sheet 410 connected to the thermally conductive rack 300 is a heating end, and the thermally conductive rack 300 is operated to absorb the heat produced by the cooling component 400 during cooling. A side of the semiconductor cooling sheet 410 connected to the thermally conductive film 420 is a cooling end, and since the thermally conductive film 420 has extremely good thermally conductive performances, when the air entering from the external environment contacts the thermally conductive film 420, that is, when the air entering from the external environment strikes a side face of the thermally conductive film 420 away from the semiconductor cooling sheet 410, the heat in the air entering from the external environment can be absorbed by the thermally conductive film 420 in a rapid and timely manner, furthermore, a cooling operation is performed for the air entering from the external environment in a rapid and timely manner, ensuring that an air flow discharging through the air outlet 120 is a cold air flow, in this way, a relatively good ventilation and cooling operation can be performed, and the structure is simpler and more compact.

[0072] It should be indicated that the semiconductor cooling sheet is not limited to the implementation of the cooling operation. When a positive electrode and a negative electrode of a current provided to the semiconductor cooling sheet are exchanged, the heating end and the cooling end of the semiconductor cooling sheet can be exchanged, and air flowing from outside can be heated through the thermally conductive film 420 in a rapid and timely manner, thus producing the ventilation and cooling effects.

[0073] In an embodiment, the thermally conductive film is a nano-graphite sheet or a nano-graphene sheet. For another example, a thermal conductivity coefficient of the thermally conductive film is greater than 400 W(m.Math.K), thus a rate of heat transfer of the thermally conductive film can be improved, for improving the cooling or heating effects on the whole.

[0074] In an embodiment, referring to both FIG. 7 and FIG. 8, the thermally conductive rack 300 is in a hollow triangular-prism structure, and an outer surface of the thermally conductive rack 300 is provided with three installation faces 310 sequentially connected. The cooling and ventilation device is provided with a plurality of the cooling components 400, the semiconductor cooling sheet 410 of the cooling component 400 is provided on the installation face 310 in one-to-one correspondence, and the thermally conductive film 420 is attached, in one-to-one correspondence, onto a side face of the semiconductor cooling sheet 410 away from a corresponding thermally conductive rack 300, thus an overall structure of the thermally conductive rack 300 can be optimized, the amount of air supply can be increased, cooling or heating smoothness can be improved, and the overall structure has a higher degree of simplification and a higher degree of compactness. Besides, an efficient surface area in a heat exchanging process further can be improved, for improving the cooling or heating effects.

[0075] In an embodiment, the inside wall of the outer housing 100 is provided a clamping rail 130, the thermally conductive rack 300 is provided with a clamping position 320 at a connection point between two neighboring ones of the installation faces, and the clamping rail 130 is embedded inside the clamping position 320 in a sliding manner, in this way, not only the convenience of installation and detaching operations can be improved, but also reliability of the overall structure can be improved.

[0076] In an embodiment, the thermally conductive rack 300 is provided therein with a plurality of thermally conductive fins 330, and the thermally conductive fins 300 are provided at intervals, in this way, heat absorbing capability of the thermally conductive rack 300 can be extremely improved by providing the thermally conductive fins 330. For example, each thermally conductive rack 300 has a thickness of 1 mm1.5 mm, which thickness can produce both effects of light weight and stable structure, and render extremely good thermally conductive effects.

[0077] In an embodiment, the thermally conductive rack is further provided with a heat-dissipation extension portion. One end of the heat-dissipation extension portion is located on the thermally conductive rack, and the other end of the heat-dissipation extension portion extends to the outside of the outer housing, for improving the heat dissipation effects, and reducing the problem of accumulation of heat on the thermally conductive rack. For example, one end of the heat-dissipation extension portion is provided with multiple thermally conductive connection sheets, the thermally conductive connection sheets are connected to the thermally conductive fins in one-to-one correspondence, the other end of the heat-dissipation extension portion is provided with multiple heat-dissipation sheets, and the heat-dissipation heats are exposed to the outside of the outer housing, in this way, the heat dissipation effects are better.

[0078] In an embodiment, the cooling and ventilation device further includes a circuit module, an installation cavity is defined between the thermally conductive rack and the inside wall of the outer housing, the circuit module is received inside the installation cavity, and the circuit module is in electrical connection to the ventilation component and the semiconductor cooling sheet, respectively. For example, the circuit module includes a power supply, a circuit board, and other electronic elements, as long as a power can be supplied to the semiconductor cooling sheet.

[0079] Referring to FIG. 6, the cooling and ventilation device further includes an installation base 500, and the outer housing 100 is provided on the installation base 500, in this way, by providing the installation base 500, a supporting and fixing function can be provided for the outer housing 100. For example, the outer housing and the installation base are in rotational connection, in this way, it is more convenient to adjust an air-out direction.

[0080] In an embodiment, the cooling and ventilation device further includes a circuit module, the circuit module is received in the installation base, and the circuit module is in electrical connection to the ventilation component and the semiconductor cooling sheet, respectively, in this way, it is easier to install and fix the circuit module.

[0081] In an embodiment, a heat dissipation passage is defined in the installation base, and the heat dissipation passage is in communication with an outside environment and an inside space of the installation base, respectively, in this way, heat produced by the circuit module can be discharged to the outside in a rapid and timely manner. For example, a miniature fan is provided inside the heat dissipation passage or at an opening of the heat dissipation passage, for improving heat dissipation efficiency.

[0082] In an embodiment, the outer housing has a cross section in a ring-shape structure, and the ring-shape structure has an inner diameter of 8 cm-10 cm; the outer housing is in an ellipsoid-shape structure, and the outer housing has a length of 10 cm-13 cm. Referring to FIG. 9, the thermally conductive film 420 has a cross section in a rectangular shape, and the rectangular shape has a length of 8 cm-10 cm, and a width of 5 cm-8 cm; the semiconductor cooling sheet 410 has a cross section in a square shape, and the square shape has a length of 4 cm-6 cm, in this way, with various parts adopting the above parameters as an entirety can effectively improve the cooling or heating effects.

[0083] When the semiconductor cooling sheet 410 of the above cooling and ventilation device 10 is powered on, a side of the semiconductor cooling sheet 410 connected to the thermally conductive rack 300 is a heating end, and the thermally conductive rack 300 is operated to absorb heat produced by the cooling component 400 during cooling. A side of the semiconductor cooling sheet 410 connected to the thermally conductive film 420 is a cooling end. Since the thermally conductive film 420 has extremely good thermally conductive performances, the heat in the air entering from the external environment can be absorbed by the thermally conductive film 420 in a rapid and timely manner, furthermore, a cooling operation is performed for the air entering from the external environment in a rapid and timely manner, ensuring that an air flow discharging through the air outlet 120 is a cold air flow. Besides, when the positive electrode and the negative electrode of the current provided to the semiconductor cooling sheet are exchanged, the heating end and the cooling end of the semiconductor cooling sheet can be exchanged, and air flowing in from outside can be heated through the thermally conductive film 420 in a rapid and timely manner, thus producing the ventilation and heating effects.

[0084] Referring to both FIG. 10 and FIG. 11, a cooling hat 20 includes a hat body 600 and a cooling component 700, the cooling component 700 includes a semiconductor cooling sheet 710 and a thermally conductive film 720, the semiconductor cooling sheet 710 is provided on an inside wall of the hat body 600, and the thermally conductive film 720 is attached onto a side face of the semiconductor cooling sheet 710 away from the inside wall of the hat body 600, in this way, on the basis of cooling or heating effects of the semiconductor cooling sheet 710, and rapid thermally conductive effects of the thermally conductive film 720, cooling effects can be achieved by the cooling hat 20, thus improving a degree of comfort and heat dissipation effects. Besides, by exchanging the positive electrode and the negative electrode of the current provided to the semiconductor cooling sheet 710, heating effects can be further achieved in cold weather.

[0085] In an embodiment, the hat body includes a hat shell and an inner cloth layer, the semiconductor cooling sheet is provided on an inside wall of the hat shell, the thermally conductive film is attached onto a side face of the semiconductor cooling sheet away from the inside wall of the hat shell, and the inner cloth layer is attached onto a side face of the thermally conductive film away from the semiconductor cooling sheet, in this way, the semiconductor cooling sheet can be better installed.

[0086] In an embodiment, a plurality of micro ventilation holes are defined on the hat shell, and all of the micro ventilation holes communicate with the outside environment and a side face of the semiconductor cooling sheet away from the thermally conductive film, respectively, in this way, the heat at the heating end of the semiconductor cooling sheet can be rapidly dissipated to the outside.

[0087] Referring to FIG. 10, the cooling hat further includes a solar cell module 800 and a brim 900, the brim is clamped onto the hat body, the solar cell module is provided on the brim, and the solar cell module is in electrical connection to the semiconductor cooling sheet, in this way, a function of supplying power to the semiconductor cooling sheet can be served. Of course, the semiconductor cooling sheet also may be supplied with power through a battery, and it is not limited to the solar cell module.

[0088] In an embodiment, the cooling hat further includes a circuit module, an installation area is provided on the hat body, the circuit module is installed on the installation area, the circuit module is in electrical connection to the semiconductor cooling sheet, and the circuit module is operated to control an operation of the semiconductor cooling sheet.

[0089] Referring to both FIG. 11 and FIG. 12, the cooling hat further includes a push switch 900a, the push switch is provided on the hat body, the push switch is in electrical connection to the circuit module and the semiconductor cooling sheet, respectively, for controlling connection or disconnection of the semiconductor cooling sheet to or from the circuit module, in this way, it is more convenient to operate and control the semiconductor cooling sheet, and a degree of user experience is higher.

[0090] In an embodiment, the cooling hat further includes a metal support sheet, the metal support sheet is in an arc-shape structure, the metal support sheet is provided on the hat body, and a surface of the metal support sheet is provided with a nano-silver coating, in this way, a function of supporting and fixing the overall structure can be served, and a sterilization and bacteriostasis function also can be served, thus facilitating maintaining the cleanliness of the cooling hat.

[0091] Referring to FIG. 13, the cooling hat further includes a miniature fan 900b, and the miniature fan is provided on the hat body, for blowing out air inside the hat body to the external environment, in this way, the heat dissipation and cooling effects can be improved.

[0092] In an embodiment, the thermally conductive film is provided with an air change passage, and the air change passage is used to introduce the air in the external environment into the hat body, in this way, it facilitates ventilation and air exhausting, and improves the heat dissipation and cooling effects.

[0093] Another example provides cooling shoes, including a shoe body and a cooling component. The cooling component includes a semiconductor cooling sheet and a thermally conductive film. The semiconductor cooling sheet is provided on the shoe body. The thermally conductive film is attached onto the semiconductor cooling sheet. For example, the cooling component is the cooling component according to any one of the above embodiments.

[0094] Another example provides a cooling backpack, including the cooling component according to any one of the above embodiments, and further including a backpack body and an installation seat. The installation seat is provided on the backpack body. The cooling component is provided inside the installation seat. The air outlet of the outer housing is in communication with an inside space of the backpack body. For example, the cooling component is the cooling component according to any one of the above embodiments.

[0095] All of the technical features in the above embodiments may be combined in an arbitrary manner. For the sake of concise description, not all of possible combinations of all of the technical features in the above embodiments are described. However, as long as a combination of these technical features has no conflict, such combination should be considered as within the scope of the present description.

[0096] The above-mentioned merely state several embodiments of the present invention, and the description thereof is relatively specific and detailed, but should not be thereby construed as limitation to the patent scope of the present invention. It should be indicated that a person ordinarily skilled in the art, without departing from the concept of the present invention, still can make variations and improvements, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention patent should be based on the claims attached.