TOOL, DEVICE, AND METHOD FOR POLISHING LENSES

Abstract

A tool, a device, and a method for zonal polishing of optical workpieces, wherein the tool has a preformed cap for forming a polishing surface, and the tool is placed against the workpiece that is to be polished in such a way that the tilt angle of the axis of rotation of the tool to the normal of the contact surface on the workpiece remains at least essentially constant and/or the size of the contact surface remains at least essentially constant.

Claims

1-30. (canceled)

31. A tool for polishing of optical workpieces, comprising: a curved head having a curved end surface and an elastic cap arranged on the curved end surface of the curved head to form a polishing surface, the elastic cap being mounted so as to conform to the shape of the curved end surface of the head in a stress-free manner.

32. The tool according to claim 31, wherein the cap is formed of multiple layers.

33. The tool according to claim 31, wherein the cap has an intermediate element and a polishing element.

34. The tool according to claim 33, wherein at least one of the intermediate element or the polishing element is a preformed element that has been adapted to the shape of the curved end surface.

35. The tool according to claim 33, wherein the polishing element is a preformed element that is matched to the shape of the intermediate element.

36. The tool according to claim 31, wherein the cap has an at least essentially constant thickness.

37. The tool according to claim 31, further comprising a collar or other stop in proximity to the head for support of the cap on the peripheral side or for positioning of the cap.

38. A device for polishing of optical workpieces, comprising: a tool spindle for rotating a tool and a workpiece drive for rotating a workpiece that is to be polished, wherein the tool spindle and the workpiece drive are movable relative to one another, so that a polishing surface of the tool can be placed partially in an area of a contact surface against the workpiece that is to be polished, wherein the device has at least one of the following features: the tool being movable from an edge of a surface of the workpiece that is to be polished over the center of the workpiece to the opposite side of the edge, or at least one of a diameter of the contact surface or a tilt angle of between an axis of rotation of the tool and the normal of the contact surface being kept at least essentially constant during the polishing.

39. The device according to claim 38, wherein the tool is moved relative to the workpiece in such a way that the diameter of the contact surface is larger by a factor of at least 10 or 20, than a distance between adjacent tracks of a polishing path of the contact surface on a surface of the workpiece that is to be polished.

40. The device according to claim 38, wherein the workpiece drive forms a controlled axis of rotation for the workpiece.

41. The device according to claim 38, wherein the rotational speed of the workpiece is variable or controllable or feedback controllable during a rotation depending on at least one of rotating position, a profile of the workpiece, a diameter of the contact surface, an indentation depth of the polishing surface, contact pressure of the tool on the workpiece or locally desired dwell time or polishing time.

42. The device according to claim 38, wherein a plurality of different tools for use with different radii of curvature of the polishing surface are mountable to the tool spindle.

43. The device according to claim 42, wherein a distance of a swivel axis for swiveling the tool relative to the workpiece from a point of intersection of the axis of rotation of the tool spindle with the polishing surface is less than 100 mm.

44. The device according to claim 42, wherein a distance of a swivel axis for swiveling the tool relative to the workpiece from a point of intersection of the axis of rotation of the tool spindle with the polishing surface is at least essentially the same for all tools.

45. A method for polishing of a surface of an optical workpiece, comprising: swiveling or advancing a tool with a curved polishing surface relative to the workpiece, so that a polishing surface of the rotating tool is placed partially by indentation in the area of a contact surface against the rotating workpiece to be polished, the method further comprising at least one of the following steps: moving the tool from an edge of the surface of the workpiece that is to be polished over the center of the workpiece to the opposite side of the edge, keeping at least one of a diameter of the contact surface or a tilt angle between an axis of rotation of the tool and the normal of the contact surface at least essentially constant during the polishing of the workpiece, varying an indentation depth of the polishing surface by advancing the tool during the polishing of the workpiece, keeping a distance between adjacent tracks of a polishing path at least essentially constant, or varying rotational speed of the workpiece during a rotation.

46. The method according to claim 45, wherein the diameter of the contact surface is kept at least essentially constant by variation of the indentation depth.

47. The method according to claim 45, wherein the diameter of the contact surface decreases starting from an edge to the center of the surface that is to be polished and increases in the opposite direction.

48. The method according to claim 45, wherein the rotational speed of the workpiece increases starting from polishing on the edge to the center of the surface and decreases in the opposite direction.

49. The method according to claim 45, wherein the center of the contact surface traverses a spiral polishing path relative o the workpiece.

50. The method according to claim 45, wherein the contact surface is significantly smaller than the surface of the workpiece.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG. 1 is a diagrammatic depiction of a proposed device for polishing an optical workpiece, wherein different positions of a proposed tool with assigned tool spindles are depicted;

[0035] FIG. 2 is a schematic sectional view of the proposed tool;

[0036] FIG. 3 is a schematic top view of a surface of the workpiece that is to be polished, wherein a contact surface of the tool and the polishing path traversed on the workpiece are schematically indicated; and

[0037] FIG. 4 is an enlarged view showing the tool head resting on the workpiece.

BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In a schematic depiction, FIG. 1 shows a proposed device 1 for zonal polishing of an optical workpiece 2, in particular a lens, a mirror or the like, especially preferably made of glass.

[0039] The device 1 is designed for polishing the workpiece 2 by means of a proposed tool 3 or another tool. The preferred design of the proposed polishing tool 3 is in particular explained in more detail based on FIG. 2.

[0040] In the depiction according to FIG. 1, the tool 3 together with an assigned tool spindle 13 of the device 1 is depicted in three different positions to illustrate the movability of the tool 3 or a preferred process sequence.

[0041] The proposed tool 3 is depicted in a schematic section in FIG. 2. It preferably has a carrier 4 with a curved head 5 as well as a hemispherical or cone-shaped cap 6.

[0042] The cap 6 is preferably built up of multiple layers and in the illustrative example preferably has an intermediate element 7 and a polishing element 8.

[0043] The tool 3, the cap 6 or the intermediate element 7 thereof is attached to the head 5 of the tool 3, in particular bonded to said head.

[0044] The cap 6 or the polishing element 8 thereof forms a polishing surface 9.

[0045] The polishing surface 9 of the tool 3 or the cap 6 or the element 8 is preferably curved in a convex manner, in particular curved geometrically similar to the head 5 or matched thereto and/or designed preferably has a spherical, hemispheric and/or conic shape.

[0046] The polishing element 8 is attached to the intermediate element 7, in particular bonded to the latter.

[0047] As an alternative, however, the cap 6 can also be formed in one piece and/or produced in multiple layers by bi-injection or the like.

[0048] The cap 6 and/or the intermediate element 7 and/or the polishing element 8 is or are produced preferably from plastic or foamed material and/or from an elastic and/or flexible material.

[0049] Especially preferably, the intermediate element 7 is produced from a preferably closed-cell foam, in particular from polyurethane.

[0050] The cap 6 and/or the intermediate element 7 preferably has a static modulus of elasticity of more than 0.5 N/mm.sup.2, preferably more than 1 N/mm.sup.2, in particular more than 1.5 N/mm.sup.2, and/or less than 30 N/mm.sup.2, preferably less than 15 N/mm.sup.2, in particular less than 7.0 N/mm.sup.2, at a static permanent load; and/or a dynamic modulus of elasticity of more than 0.5 N/mm.sup.2, preferably more than 1 N/mm.sup.2, in particular more than 1.3 N/mm.sup.2, and/or less than 20 N/mm.sup.2, preferably less than 10 N/mm.sup.2, in particular less than 8.0 N/mm.sup.2, at a dynamic permanent load of 10 Hz; and/or a compression hardness of more than 0.05 N/mm.sup.2, preferably more than 0.1 N/mm.sup.2, in particular more than 0.2 N/mm.sup.2, and/or less than 3 N/mm.sup.2, preferably less than 2 N/mm.sup.2, in particular less than 1 N/mm.sup.2, at 10% deformation, in each case in particular measured according to DIN 53513:1990-03.

[0051] The polishing element 8 is preferably produced from a harder and/or stiffer material than the intermediate element 7.

[0052] The polishing element 8 is preferably thin-walled and/or film-like.

[0053] The bulk densitypreferably according to DIN EN ISO 845:2009-10of the polishing element 8 is preferably more than 300 kg/m.sup.3, in particular more than 500 kg/m.sup.3, especially preferably more than 700 kg/m.sup.3, and/or preferably less than 4,000 kg/m.sup.3, in particular less than 3,000 kg/m.sup.3, especially preferably less than 2,000 kg/m.sup.3.

[0054] The polishing element 8 or the cap 6 or polishing surface 9 preferably has a Shore A hardness of more than 5, in particular more than 10, especially preferably more than 20, and/or preferably less than 90, in particular less than 80, especially preferably less than 70, in particular according to DIN ISO EN 868:2003-10 and/or DIN ISO 7619-1:2012-02.

[0055] The polishing element 8 preferably has a thickness of more than 0.1 mm, in particular more than 0.3 mm, especially preferably more than 0.4 mm, and/or preferably less than 3 mm, in particular less than 2 mm, especially preferably less than 1 mm.

[0056] The thickness of the intermediate element 7 is preferably more than 2 mm and/or less than 10 mm, in particular approximately 3 to 7 mm.

[0057] The thickness of the intermediate element 7 is preferably at least 5 times, in particular approximately 10 times, the thickness of the polishing element 8 or more.

[0058] The cap 6, the intermediate element 7 and/or the polishing element 8 has or have preferably each an at least essentially constant thickness.

[0059] The polishing element 8 or the polishing surface 9 is preferably formed or produced from an open-cell or closed-cell plastic or composite material or the like.

[0060] In the illustrative example, the polishing element 8 is preferably produced from a plastic film and/or from polyurethane.

[0061] The cap 6 and/or the intermediate element 7 and/or polishing element 8 is or are preformed or shape-processed to adapt the shape to the curvature of the head 5 and/or to achieve a desired curvature or other shape, such as a spherical shape, preferably inside and/or outside, thus, adapted in its/their shape to the head 5 before being affixed on the tool 3 or head 5, provided in particular with a complementary curvature to the head 5 and/or intermediate element 7.

[0062] The tool 3 and/or the head 5 preferably forms a solid or non-flexible surface made of metal or another suitable material for supporting and in particular also fastening the cap 6 and/or elements 7, 8 arranged thereon.

[0063] The shaping or shape-processing of the cap 6 and/or the intermediate element 7 and/or polishing element 8 is done especially preferably mechanically, in particular by turning and/or milling.

[0064] Especially preferably, solid material is mechanically processed for the desired shaping.

[0065] The mechanical processing has the advantage that a very uniform material layer without material compression, deformation or other material irregularities can be produced with the desired shape, here in particular a cap-like or spherical shape, if desired also with another shape.

[0066] As an alternative, the above-mentioned shaping can be carried out, for example, also by corresponding foaming or other primary forming.

[0067] The preformed and/or shape-processed cap 6 or correspondingly preformed or shape-processed elements 7 and 8 is or are applied on the tool 3 or head 5, in particular by bonding.

[0068] Especially preferably, the polishing element 8 is also applied on the intermediate element 7 by bonding. However, it can also be connected in another way.

[0069] Especially preferably, the cap 6 and/or the intermediate element 7 is or sits on the head 5 in a stress-free manner.

[0070] According to the invention, stress-free is to be understood in particular as no local material deformations or stresses occurring in the material of the cap 6 or elements 7, 8, in the attached state, by adapting to the curvature, which would develop due to deformation in adapting to the curved shape and which negatively influence a uniform and in particular defined springing and damping behavior of the cap 6 or elements 7, 8.

[0071] Preferably, in this sense, the polishing element 8 is also correspondingly to be affixed in a stress-free manner, in particular also to avoid possible folding.

[0072] Especially preferably, the polishing element 8 is adapted to the curvature of the outside of the intermediate element 7 by corresponding preforming, in particular shape-processing, before the affixing to or connection with the intermediate element 7.

[0073] The tool 3, the cap 6, the polishing element 8 and/or the polishing surface 9 is designed in particular in such a way that a polishing agent, not shown, is transported via the polishing surface 9 and thus the workpiece 2 can be processed in a mechanical-chemical removal process and thus can be polished as already described above.

[0074] To facilitate the affixing and/or positioning of the cap 6 and/or elements 7, 8, the tool 3 or its carrier 4 preferably has a collar 10 or other stop, which projects in particular laterally from the head 5 and/or forms a preferably circumferential shoulder or the like.

[0075] The tool 3 and/or the carrier 4 preferably has a connecting portion 11 and/or a stop 12 for defined fastening or holding of the tool 3 on the assigned tool spindle 13 or the tool chuck 14 thereof or the like.

[0076] Especially preferably, the tool 3 is clamped or fastened by means of the tool chuck 14 on the tool spindle 13. The stop 12 in this case serves in particular to ensure a defined axial position of the tool 3 on the tool spindle 13 or on the tool chuck 14. Other structural solutions are also possible, however.

[0077] Preferably, tools 3 with different radii of curvature of the head 5 or the cap 6 or the polishing surface 9 are used depending on the shape of the surface 2A that is to be polished.

[0078] The radius of curvature of the polishing surface 9 is preferably more than 2 mm, in particular more than 3 mm or 5 mm, and/or preferably less than 1,000 mm, in particular less than 500 mm, especially preferably less than 100 mm, preferably based on the (maximum) curvature of the surface 2A that is to be polished and/or the desired use. During correction polishing, namely tools 3 with smaller radii of curvature of preferably below 100 mm are used.

[0079] The distance from the polishing surface 9, in particular at the point of intersection with the axis of rotation R, to the stop 12 is preferably the same in all tools 3 even with varying curvature or bend.

[0080] The proposed device 1 has the tool spindle 13 for rotating the assigned or clamped tool 3 around an axis of rotation R, as indicated in FIG. 1.

[0081] The rotational speed is preferably approximately 1,000 to 5,000 rpm.

[0082] The rotational speed is preferably controlled or feedback controlled.

[0083] Preferably, the rotational speed during the polishing process is kept constant. However, in principle, a change in the rotational speed during a polishing process or an adaptation of the rotational speed to a respective tool 3 and/or workpiece 2 or for each polishing process is also possible.

[0084] The rotation of the tool 3 is done preferably without detecting the angle of rotation. This is thus in particular not a controlled axis of rotation in the sense of a CNC control.

[0085] The tool spindle 13 and thus the tool 3 can be swiveled around a swivel axis B. In particular, this is a controlled or feedback-controlled swivel axis or CNC axis, also called a rotary axis. In particular, the swiveling position is detected. Thus, a defined swiveling is made possible, as depicted by way of example by the three different positions in FIG. 1.

[0086] In the illustrative example, the swivel axis B runs crosswise and in particular perpendicular to the axis of rotation R or drawing plane.

[0087] The swivel axis B is preferably arranged as close as possible to the tool 3 or to the polishing surface 9 and/or to the tool chuck 14.

[0088] The device 1 has a workpiece drive 15, in particular a workpiece spindle, for the workpiece 2, so that the workpiece 2 that is to be polished can be rotated around the axis of rotation C with a defined angular position.

[0089] Preferably, the workpiece 2 is held by means of a holder 16, such as a block piece, and/or by means of a chuck on the workpiece drive 15 with a defined angular position or is coupled thereto.

[0090] The axis of rotation C is in particular a controlled or feedback-controlled axis or a CNC axis, also called a rotary axis. Preferably, here, the position of the angle of rotation is thus also detected. Especially preferably, an angle-dependent variation of the rotational speed is also made possible within a rotation.

[0091] The rotational speed of the workpiece drive 15 or the workpiece 2 is in general variable, in particular, for example, from approximately 10 or 20 rpm (for polishing on the edge 2C of the side 2A of the workpiece 2 that is to be polished) up to approximately 2,000 to 3,000 rpm (for polishing in the area of the center 2B of the workpiece 2).

[0092] The C-axis preferably runs in a plane with the axis of rotation R (independently from the swiveling position of the tool spindle 13) and/or crosswise or perpendicular to the swivel axis B.

[0093] The workpiece drive 15 and thus the workpiece 2 is preferably movable and/or adjustable linearly in the Z-direction, as indicated in FIG. 1. The adjustment is made in particular by means of a not shown slide and adjustment drive or the like.

[0094] The Z-axis preferably runs parallel to the C-axis and/or crosswise or perpendicular to the swivel axis B.

[0095] The tool spindle 13 and thus the tool 3 is preferably adjustable crosswise in the X-direction, in particular by means of a slide, not shown, and an assigned drive. This slide then preferably also carries the B-axis and the corresponding swivel drive for swiveling the tool spindle 13.

[0096] The X-axis and Z-axis are preferably each designed as a controlled or feedback-controlled axis or as a CNC axis or linear axis, so that an exact positioning in the X- and Z-direction is made possible.

[0097] The X-axis preferably runs crosswise or perpendicular to the C-axis, B-axis and/or Z-axis.

[0098] The X-axis preferably runs inor parallel tothe common plane of the C-axis and R-axis.

[0099] The axes can also be stacked or distributed in a different way. For example, the Z-axis can be assigned to the tool spindle 13 instead of the workpiece drive 15. As an alternative or in addition, it is also possible that the B-axis and/or X-axis is/are not implemented on the tool side but rather on the workpiece side.

[0100] It is desirable, however, to distribute the axes on the tool side and workpiece side in order to make possible a greater processing accuracy.

[0101] The device 1 is in particular a polishing machine or CNC machine with X-, Z-, B- and C-axes.

[0102] The X-axis and/or the B-axis preferably run(s) horizontally.

[0103] Especially preferably, the C-axis and/or the Z-axis run(s) vertically.

[0104] Especially preferably, the polishing tools 3 are each located with their polishing surfaces 9 at the level of or near the B-axis, so that the contact surface A can be swiveled if possible with a minimum radius.

[0105] The B-axis is preferably spaced less than 100 or 50 mm, in particular less than 30 or 15 mm, especially preferably less than 10 mm, from the polishing surface 9 and/or contact surface A, in particular from the point of intersection between the axis of rotation R and the polishing surface 9. In particular, this distance is preferably at least essentially the same value even in the case of tools 3 with other radii of curvature of the polishing surface 9.

[0106] The B-axis intersects the axis of rotation R preferably inside the cap 6 and/or polishing surface 9.

[0107] By a corresponding relative adjustment, thus in particular by moving in the X- and Z-directions as well as by swiveling around the B-axis, the tool 3 can be moved over the workpiece 2 or the surface 2A that is to be polished in particular as schematically indicated by arrow W in FIG. 1 and in FIG. 3.

[0108] Especially preferably, the tool 3 is moved starting from an edge 2C of the workpiece 2 or the surface 2A to the center 2B and over the latter up to the opposite side of the edge 2C, as illustrated in FIGS. 1 and 3. In this manner, an interruption or ending of the polishing process in the area of the center 2B, as is common in the state of the art, is avoided, and thus more optimal processing and/or a more defined material removal is made possible or ensured.

[0109] During polishing, the polishing surface 9 of the tool 3 abuts only section-wise with a contact surface A on the workpiece 2 that is to be polished or its surface 2A, as schematically depicted in particular also in FIG. 4, which depicts a sectional enlargement of the circular area of FIG. 1 indicated in dashed-dotted lines.

[0110] The contact surface A is preferably at least essentially circular, wherein this (also) depends on the three-dimensional shape of the surface 2A. In the schematic top view according to FIG. 3, the contact surface A, with which the polishing surface 9 lies against the workpiece 2 or the surface 2A thereof, is also indicated.

[0111] The surface normal N preferably intersects the axis of rotation R of the tool 3 under a (relative) tilt angle K, as indicated in FIGS. 1 and 4. In particular, polishing is carried out with the tool 3 in such a way that the contact surface A lies on the polishing surface 9 eccentrically with respect to the axis of rotation R. In other words, the processing or polishing is thus (preferably always) done at a tilt angle K of more than 0, in particular more than 2, especially preferably more than 5 or 10, and/or preferably less than 50, in particular less than 30, especially preferably less than 25.

[0112] Especially preferably, the tilt angle K is kept constant during the respective polishing process. This is achieved by corresponding swiveling of the tool spindle 13 or the tool 3. The pivoting angle S (angle of the axis of rotation R to the C-axis) then consequently varies along the tool path W, as indicated schematically in FIG. 1, for example from a small pivoting angle S in the left position to a medium pivoting angle S in the central position to a large pivoting angle S in the right position.

[0113] In terms of this invention, a polishing process in particular refers to the complete polishing of the surface 2A of the workpiece 2 that is to be polished with a tool 3. In such a process, as already explained, the tool path W is preferably traversed or run through by the tool 3, while on the one hand the tool 3 rotates and on the other hand the workpiece 2 rotates.

[0114] In the polishing process, the contact surface A or the center point AM thereof then sweeps over the surface 2A that is to be polished in an in particular spiral polishing path P, as only schematically indicated, however, in FIG. 3. The spiral polishing path P is namely traversed once, when the tool 3 or the contact surface A moves starting from the edge area 2C to the center 2B or to the axis of rotation C. The same or a corresponding spiral polishing path P is then traversed again, however, when the tool 3 or the contact surface A continues to move along the tool path W from the center 2B again back out to the edge area 2C.

[0115] Especially preferably, the device 1 is designedor control or feedback control is donein such a way that a uniform spiral or an at least essentially constant distance PA between adjacent polishing tracks PS of the polishing path P is achieved or traversed, as indicated in FIG. 3. The distance PA is thus especially preferably kept at least essentially constant. However, alternatively, the distance PA can vary, in particular depending on the workpiece radius, in which the center of the contact surface A is (just) located.

[0116] Especially preferably, the diameter AD of the contact surface A is greater by at least the factor 10 or 20 than the spiral distance or distance PA between adjacent polishing tracks PS.

[0117] The tool 3 preferably rotates opposite to the workpiece 2. However, rotation in the same direction is also possible.

[0118] The tool 3 preferably rotates (much) faster than the workpiece 2.

[0119] To achieve a dwell time of the tool 3 or the contact surface A that is similar or if applicable as identical as possible over a surface area of the surface 2A, in the case of the uniform rotational speed of the tool 3, the rotational speed of the workpiece 2, thus consequently also the speed of movement of the workpiece 2 along the tool path W starting from the edge 2C to the center 2B, is increased and then decreased again to the edge.

[0120] As an alternative or in addition, the rotational speed of the workpiece 2 can also be varied during a rotation in particular depending on the rotation position, the diameter AD of the contact surface A, the contact pressure of the tool 3 on the workpiece 2, the indentation depth E of the polishing surface 9 and/or the profile of the workpiece 2, in order to achieve an especially uniform material removal and/or a desired polishing result. This makes in particular high-precision polishing processing possible.

[0121] Especially preferably, the device 1 is designed in such a way and/or the proposed method is implemented in such a way that the size or the diameter AD of the contact surface A is kept at least essentially constant during the polishing process. This is conducive to a uniform and/or defined material removal.

[0122] The size or the diameter AD of the contact surface A is determined in particular also by the indentation depth E of the polishing surface 9 that is schematically indicated in FIG. 4 by corresponding advancing of the tool 3 during the polishing process, but it also depends on the surface form of the workpiece 2, in particular the respective curvature, and on the curvature of the polishing surface 9.

[0123] By varying the advancing of the tool 3 during the polishing process, the indentation depth E of the polishing surface 9 and thus also the size or diameter AD of the contact surface A is varied accordingly.

[0124] Especially preferably, the indentation depth E of the polishing surface 9 is varied by corresponding advancing of the tool 3 during a polishing process so that in particular even in the case of varying curvatures of the surface 2A that is to be polished, especially preferably in the case of an aspherical surface 2A, an at least essentially constant diameter AD of the contact surface A is achieved. This is conducive to a uniform and/or defined material removal throughout the entire polishing process.

[0125] As an alternative, it can also be provided that the diameter AD of the contact surface A decreases starting from the edge 2C to the center 2B and increases in the opposite direction.

[0126] The speed of the C-axis, thus the rotational speed of the workpiece 2, is preferably derived from calculated dwell times of the contact surface A over certain partial surfaces of the surface 2A that is to be polished.

[0127] Preferably, for correcting local rotationally asymmetrical errors of the surface 2A that is to be polished, the track speed or rotational speed of the workpiece 2 is changed within a rotation. In this way, in particular within one rotation, different polishing or dwell times, depending on the necessary correction of errors, can be achieved.

[0128] The speed of the X-axis is adapted in particular so that per rotation, the desired constant spiral distance or distance PA between adjacent polishing tracks PS remains constant. Consequently, the feed in the X-direction is then linked directly to the speed or number of rotations of the C-axis or vice versa.

[0129] Preferably, the optimum dwell time of the tool 3 or the contact surface A is determined in advance by means of a simulation in local areas on the surface 2A that is to be polished. Then, the corresponding track positions and track speeds are determined from the calculated local dwell times.

[0130] The optimum indentation depth E of the polishing surface 9 or the advancing of the tool 3 to the workpiece 2 is optimally determined depending on the tool 3 and the geometry of the surface 2 that is to be polished, in particular by means of corresponding calculations, estimates and/or measurements, wherein the indentation depth E during the polishing process is adapted in particular so that the diameter AD of the contact surface 2A remains as constant as possible.

[0131] The proposed polishing tool 3 is distinguished in particular by a cap 6 or a cap design with defined springing and damping properties. Thus, the size of the contact surface A can be influenced very precisely by the indentation depth E.

[0132] The indentation depth E is preferably more than 0.1 mm and/or less than 0.8 mm.

[0133] The size or the diameter AD of the contact surface A is preferably more than 1 mm, in particular more than 3 mm, and/or less than 25 mm, in particular less than 15 or 10 mm.

[0134] Especially preferably, a zonal polishing of the workpiece 2 is carried out. Zonal is to be understood in that the contact surface A is significantly smaller in comparison to the surface 2A of the workpiece 2 that is to be polished, in particular compared to the radial extension of the workpiece 2. Especially preferably, the mean or maximum diameter AD of the contact surface A is significantly smaller than the mean or maximum radius of the workpiece 2. Especially preferably, the mean or maximum radius of the workpiece 2 is larger by at least a factor 2, 3 or 5 than the mean or maximum diameter AD of the contact surface A.

[0135] In supplementation, during polishing, additional parameters can be taken into consideration, as explained in particular in German Patent Application DE 10 2009 004 787 A1 and corresponding U.S. Pat. No. 8,727,834 B2, which is hereby incorporated by reference as a supplemental disclosure.

[0136] The device 1 in particular also has a feed for polishing agents, not shown, as is common in polishing machines, so that the polishing agents can be fed in a desirable way during polishing.

[0137] The proposed tool 3, the proposed device 1 and/or the proposed method can be used in particular for polishing precision optics or aspherical surfaces or other optical workpieces, wherein the surface shape can preferably be measured before polishing and thus a desired surface shape can be achieved by the polishing. This is also referred to as correction polishing.

[0138] The polishing can be done in particular with an accuracy of 10 to 100 nm.

[0139] Tools 3 with smaller radii of curvature of the polishing surface 9, in particular with radii of curvature of less than 100 mm, especially preferably less than 50 mm, are preferably used for purposes of correction.

[0140] Tools 3 with larger radii of curvature of the polishing surface 9, in particular of up to 1,000 mm, are preferably used for pre-polishing.

[0141] After the optimum pre-polishing, preferably measuring of the surface 2A that is to be processed and then the correction polishing are carried out.

[0142] The proposed device 1 and the proposed method can be used in principle both for pre-polishing and for correction polishing.

[0143] Individual aspects and features of this invention can be implemented independently of one another, but also in any combination.