WORKING SUBSTANCE CONTACTED COOLING SYSTEM FOR COMPUTER AND DATA CENTER
20190132997 ยท 2019-05-02
Inventors
Cpc classification
H05K7/20781
ELECTRICITY
H05K7/20745
ELECTRICITY
International classification
Abstract
A working substance contacted cooling system for computer and data center is disclosed. The system includes a server cabinet; a liquid working substance box arranged at a bottom of the server cabinet; a plurality of parallel and horizontally arranged partition plates with holes or grooves, on which server components are mounted; a main conduit dispenser vertically arranged, and communicated with the liquid working substance box through a main conduit; and a plurality of liquid working substance spraying pipes, a plurality of spray orifices being uniformly arranged on each said liquid working substance spraying pipe, each said liquid working substance spraying pipe being horizontally arranged above the server components for each layer and communicated with the main conduit dispenser; spraying directions of the spray orifices being corresponding to positions of server components; liquid working substance sprayed on the server components flowing back into the liquid working substance box.
Claims
1. A working substance contacted cooling system for computer and data center, wherein the system comprises: a server cabinet; a liquid working substance box arranged at a bottom of the server cabinet; a plurality of parallelly and horizontally arranged partition plates with holes or grooves, on which server components are mounted; a main conduit dispenser vertically arranged, which is in communication with the liquid working substance box through a main conduit; and a plurality of liquid working substance spraying pipes, a plurality of spray orifices being uniformly arranged on each said liquid working substance spraying pipe, each said liquid working substance spraying pipe being horizontally arranged above the server components for each layer and being in communication with the main conduit dispenser; spraying directions of the spray orifices being corresponding to positions of the server components; liquid working substance from the liquid working substance box sprayed on the server components flowing back into the liquid working substance box.
2. The working substance contacted cooling system for computer and data center according to claim 1, wherein a top of the liquid working substance box is opened, a side wall of a lower part of the server cabinet extends to form a side wall of the liquid working substance box, so that the side wall of the liquid working substance box and the side wall of the lower part of the server cabinet are formed in one piece; or, the liquid working substance box comprises a first liquid working substance box and a second liquid working substance box, a top of the first liquid working substance box is opened, a side wall of a lower part of the server cabinet extends to form a side wall of the first liquid working substance box, so that the side wall of the first liquid working substance box and the side wall of the lower part of the server cabinet are formed in one piece, and the second liquid working substance box arranged outside the server cabinet is in communication with the first liquid working substance box.
3. The working substance contacted cooling system for computer and data center according to claim 1, wherein the system further comprises a liquid working substance pump arranged in or outside the liquid working substance box and the liquid working substance pump is in communication with the main conduit dispenser.
4. The working substance contacted cooling system for computer and data center according to claim 3, wherein the system further comprises a filter installed at a front end of a liquid inlet of the liquid working substance pump.
5. The working substance contacted cooling system for computer and data center according to claim 1, wherein the system further comprises a liquid working substance cooling device to cool the liquid working substance in the liquid working substance box.
6. The working substance contacted cooling system for computer and data center according to claim 5, wherein the liquid working substance cooling device comprises a water chiller; the water chiller comprising a refrigerant compressor, a refrigerant conveying tube, a refrigerant returning tube and an evaporator; an outlet of the refrigerant compressor being in communication with one end of the evaporator through the refrigerant conveying tube, and an inlet of the refrigerant compressor being in communication with the other end of the evaporator through the refrigerant returning tube; the evaporator being arranged in the liquid working substance box.
7. The working substance contacted cooling system for computer and data center according to claim 5, wherein the liquid working substance cooling device is a radiating fin installed outside the liquid working substance box.
8. The working substance contacted cooling system for computer and data center according to claim 5, wherein the liquid working substance cooling device comprises a first heat exchange section arranged outside the liquid working substance box and a second heat exchange section arranged in the liquid working substance box; a refrigerant outlet of the first heat exchange section being in communication with a refrigerant inlet of the second heat exchange section, and a refrigerant outlet of the second heat exchange section being in communication with a refrigerant inlet of the first heat exchange section.
9. The working substance contacted cooling system for computer and data center according to claim 7, wherein the system further comprises a blower to cool the radiating fin.
10. The working substance contacted cooling system for computer and data center according to claim 1, wherein the liquid working substance is selected from the group consisting of natural mineral oil, silicone oil, vegetable oil, transformer oil, heat transfer oil and mixtures thereof.
11. The working substance contacted cooling system for computer and data center according to claim 2, wherein the system further comprises a liquid working substance pump arranged in or outside the liquid working substance box and the liquid working substance pump is in communication with the main conduit dispenser.
12. The working substance contacted cooling system for computer and data center according to claim 11, wherein the system further comprises a filter installed at a front end of a liquid inlet of the liquid working substance pump.
13. The working substance contacted cooling system for computer and data center according to claim 2, wherein the system further comprises a liquid working substance cooling device to cool the liquid working substance in the liquid working substance box.
14. The working substance contacted cooling system for computer and data center according to claim 13, wherein the liquid working substance cooling device comprises a water chiller; the water chiller comprising a refrigerant compressor, a refrigerant conveying tube, a refrigerant returning tube and an evaporator; an outlet of the refrigerant compressor being in communication with one end of the evaporator through the refrigerant conveying tube, and an inlet of the refrigerant compressor being in communication with the other end of the evaporator through the refrigerant returning tube; the evaporator being arranged in the liquid working substance box.
15. The working substance contacted cooling system for computer and data center according to claim 13, wherein the liquid working substance cooling device is a radiating fin installed outside the liquid working substance box.
16. The working substance contacted cooling system for computer and data center according to claim 13, wherein the liquid working substance cooling device comprises a first heat exchange section arranged outside the liquid working substance box and a second heat exchange section arranged in the liquid working substance box; a refrigerant outlet of the first heat exchange section being in communication with a refrigerant inlet of the second heat exchange section, and a refrigerant outlet of the second heat exchange section being in communication with a refrigerant inlet of the first heat exchange section.
17. The working substance contacted cooling system for computer and data center according to claim 8, wherein the system further comprises a blower to cool the first heat exchange section.
18. The working substance contacted cooling system for computer and data center according to claim 15, wherein the system further comprises a blower to cool the radiating fin.
19. The working substance contacted cooling system for computer and data center according to claim 16, wherein the system further comprises a blower to cool the first heat exchange section.
20. The working substance contacted cooling system for computer and data center according to claim 2, wherein the liquid working substance is selected from the group consisting of natural mineral oil, silicone oil, vegetable oil, transformer oil, heat transfer oil and mixtures thereof.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0035]
[0036]
[0037]
[0038]
[0039]
LIST OF REFERENCE NUMERALS
[0040] 1. liquid working substance box [0041] 101. insulated liquid working substance [0042] 2. partition plates [0043] 3. server components [0044] 4. main conduit dispenser [0045] 5. main conduit [0046] 6. liquid working substance spraying pipes [0047] 7. spraying nozzles [0048] 8. liquid working substance pump [0049] 9. filter [0050] 10. refrigerant compressor [0051] 11. refrigerant conveying tube [0052] 12. refrigerant returning tube [0053] 13. evaporator [0054] 14. radiating fin [0055] 15. blower [0056] 16. the first heat exchange section [0057] 17. the second heat exchange section
DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS
[0058] The principles and features of the present invention will be described in the following with reference to the drawings. The embodiments to be described are intended to be illustrative only and not to limit the scope of the present invention.
[0059] With reference to
[0060] In the embodiment of the present invention, one end of the main conduit dispenser 4 is connected with the liquid working substance pump 8, and N (N1) three-way joints are arranged at different heights, on which liquid working substance spraying pipes 6 for the same heights are mounted. Each said liquid working substance spraying pipe is provided with a plurality of spraying nozzles 7; each said spraying nozzle sprays towards the components that need heat dissipation. The spraying nozzles should be made of materials with good insulation and engineering strength; According to one embodiment of the present invention, the low-temperature, insulated and heat-conducting liquid working substance in the liquid working substance box 1 is directly sprayed onto the server components 3 through the spray orifices, and the sprayed fog liquid heat-conducting working substance directly contacts with the surface of the components, absorbs the heat generated by the components, and then falls back into the liquid working substance box 1. In this cycle, the liquid working substance ceaselessly transfers heat of the electronic device, and the cooling liquid working substance directly contacts the server component that need heat dissipation and no phase change exists in the process of heat transferring, as well as any intermediate medium and heat transfer conversion. The spraying structure can be simpler, thus saving cost, extending device working life and improving the cooling effect.
[0061] According to a working substance contacted cooling system for computer and data center in one embodiment of the present invention, a top of the liquid working substance box 1 is opened, a side wall of lower part of the server cabinet 301 extends to form a side wall of the liquid working substance box 1, so that the side wall of the liquid working substance box 1 and the side wall of the lower part of the server cabinet 301 are formed in one piece; or, the liquid working substance box 1 comprises a first liquid working substance box and a second liquid working substance box, a top of the first liquid working substance box is opened, a side wall of lower part of the server cabinet 301 extends to form a side wall of the first liquid working substance box and the side wall of the first liquid working substance box, so that the side wall of the lower part of the server cabinet 301 are formed in one piece, and the second liquid working substance box arranged outside the server cabinet 301 is in communication with the first liquid working substance box 1. According to the above structure, a liquid working substance box 1 can be formed by directly taking advantage of the original space of the server cabinet 301, and the liquid sprayed on the server components 3 from a plurality of liquid working substance spraying pipes 6 directly flows back into the liquid working substance box 1 formed by the lower part of the cabinet. The system framework is simple, and the heat exchange area of the liquid working substance and the heating surface will increase, so that the theoretical heat transfer efficiency will be improved, the effective utilization ratio of the liquid working substance is higher, and the cooling efficiency is improved.
[0062] In the above embodiments, specifically, the main conduit dispenser 4 is vertically arranged, a plurality of liquid working substance spraying pipes 6 are uniformly arranged on the main conduit dispenser 4, one end of each liquid working substance spraying pipe is communicated with the main conduit dispenser 4, the other end of each liquid working substance spraying pipe is blocked.
[0063] In one preferred embodiment of the present invention, the system further comprises a liquid working substance pump 8, the liquid working substance pump 8 is arranged in the liquid working substance box 1 and communicated with the main conduit dispenser 4; specifically, the system further comprises a filter 9, which is installed at a front end of a liquid inlet of the liquid working substance pump 8. By arranging the liquid working substance pump 8 and the filter 9, it will ensure circulation performance and purity of the liquid working substance, thus preventing damage to the pump body and clogging of the nozzle caused by impurities. The system adaptability and reliability are higher.
[0064] In the above embodiments, a plurality of liquid working substance spraying pipes 6 may also be vertically arranged on three sides of the server components 3. The liquid can be sprayed towards three sides of the server components 3 to improve the cooling efficiency.
[0065] In preferred embodiments of the present invention, specifically, the system comprises a liquid working substance cooling device, which is used to cool liquid working substance in the liquid working substance box 1. The working substance in the liquid working substance box 1 is cooled continuously, so as to ensure an effective temperature difference for heat exchange (usually 5 to 10 C.) between the liquid working substance and the server components 3 for effective cooling.
[0066] The above liquid working fluid cooling device can be realized in the following manners: Firstly, with reference to
[0067] In one preferred embodiment of the present invention, the insulated liquid working substance 2 is selected from the group consisting of natural mineral oil, silicone oil, vegetable oil, transformer oil, heat transfer oil and mixtures thereof. The above liquid working substance should be heat conducting liquid working substance with good insulation, to ensure the insulating performance of the working substance and avoid contact with the server components and then conducting electricity, resulting in electronic devices damage and system scrapping. The liquid working substance generally has a high thermal conductivity, and can directly contact with the heat-generating electronic devices in the spraying way, thereby realizing efficient heat dissipation of server
[0068] The server components 3 of the present invention comprise a processor, a hard disk, a memory, a system bus, etc. The heat generated by the server components 3 is mainly derived from CPU, GPU, memory and other components. By adopting the cooling medium, which is insulated liquid heat conducting working substance, as non-polar material, to spray directly on the server components 3, the electronic, electrical equipment and circuit will not be affected and the hardware will not be damaged.
[0069] The above are only preferred embodiments of the present invention and are not intended to limit the scope thereof. Any modification, equivalent substitution, improvement, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.