Class 1 compliant lens assembly
10274181 ยท 2019-04-30
Assignee
Inventors
Cpc classification
F21V17/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V5/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V25/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V31/005
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V5/007
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V3/0625
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2105/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V17/101
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21V15/01
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V3/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V17/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V17/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
An lighting unit including a mounting board and first and second LEDs coupled to the mounting board. First and second optic components are coupled to the mounting board and enclose the LEDs. First and second shield members are respectively associated with the first and second LEDs.
Claims
1. An lighting unit comprising: a module housing positioned in the lighting unit; a mounting board positioned in the module housing; a first LED connected to the mounting board; a second LED connected to the mounting board; a first optic component connected to the mounting board, enclosing the first LED, and having a central lens portion; a second optic component connected to the mounting board, enclosing the first LED, and having a central lens portion; a first shield member having an opening for receiving the first LED, a first surface in contact with the mounting board, and a second surface in contact with the first optic component; and a second shield member having an opening for receiving the second LED, a first surface in contact with the mounting board, and a second surface in contact with the second optic component, wherein the first and second shield members respectively provide a Class 1 compliant enclosure between the mounting board and the first and second optic components.
2. The lighting unit of claim 1, wherein the first and second shield members include 5 VA rated material.
3. The lighting unit of claim 1, wherein the first optic component comprises a tab and the first shield member comprises an aperture for receiving the tab.
4. The lighting unit of claim 1, wherein the first optic component comprises a recess for receiving the first shield member.
5. The lighting unit of claim 1, wherein the first LED comprises a Class 1 compliant LED package including a light-generating semiconductor element, a housing enclosing the light-generating semiconductor element, and a primary lens coupled to the housing.
6. The lighting unit of claim 1, wherein the module housing includes a resilient layer and an enclosure.
7. An LED lighting unit comprising: a mounting board positioned in the lighting unit; an LED package connected to the mounting board; an optic component enclosing the LED package having a central lens portion, an edge, and a pin at least partially inserted into the mounting board; and a shield member having a central opening for receiving the LED, an outer opening for receiving the pin, a first surface in contact with the mounting board, and a second surface in contact with the optic component, wherein the shield member comprises an inner region having a first thickness and an outer region having a second thickness less than the first thickness, the pin has an inner portion, and the inner region extends to the inner portion of the pin and the outer region extends to the optic component edge.
8. The LED lighting unit of claim 7, wherein the pin comprises an inwardly extending tab and the outer opening comprises a keyhole slot for receiving the pin and the tab.
9. The LED lighting unit of claim 7, wherein the optic component edge is substantially circular and the shield member is substantially disk-shaped.
10. The LED lighting unit of claim 7, wherein the optic component comprises a flange and the LED assembly further comprises a silicone gasket resting on the flange and a metal enclosure positioned over the silicone gasket.
11. The LED lighting unit of claim 7, wherein the optic component comprises a material selected from the group consisting of PMMA and silicone.
12. The LED lighting unit of claim 7, further comprising a second LED package coupled to the mounting board, a second optic component enclosing the second LED package, and a second shield member having a central opening receiving the second LED.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The aspects and features of various exemplary embodiments will be more apparent from the description of those exemplary embodiments taken with reference to the accompanying drawings, in which:
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DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
(28) According to various exemplary embodiments, Reference will now be made in detail to exemplary embodiments and methods of the invention as illustrated in the accompanying drawings, in which like reference characters designate like or corresponding parts throughout the drawings. It should be noted, however, that the invention in its broader aspects is not limited to the specific details, representative devices and methods, and illustrative examples shown and described in connection with the exemplary embodiments and methods.
(29) As best shown in
(30) The mounting board 12 may be a variety of different substrates depending on the desired application. In various exemplary embodiments, the mounting board 12 is a printed circuit board that supports various electrical and mechanical components of the LED module 10. The printed circuit board also includes pathways to power electrical components. Different components may include the LEDs 12 and other drive and control electronics (not shown) associated with operating the LED module 10. The number and type of LEDs 14 and the number and type of additional components will vary depending on the application and device as would be understood by one of ordinary skill in the art.
(31) The mounting board 12 has a top surface 20 and a plurality of primary openings 22 formed in the top surface. The openings 22 enable attachment of additional components such as the optic component 16. A plurality of spacers 24 may also extend from the mounting board 12 to provide a defined spacing between the top surface 20 and additional casing layers as discussed in greater detail below. Although various sizes and shapes of spacers 24 may be used, cylindrical spacers 24 are efficient for spacing and placement considerations while providing sufficient support. The spacers 24 may be placed in any number or configurations as required
(32) A series of solder masks 25 may be placed over the top surface of the mounting board 12. The solder masks 25 may surround the LEDs 14 and the primary openings 22. The solder masks 25 may have a variety of shapes as convenient for manufacturing. The solder masks 25 may be placed at locations to facilitate attachment of the optic component 16.
(33) The LEDs 14 may be LED packages that contain a semiconductor chip (not shown) which generates light. The semiconductor chip is embedded on a submount (not shown). The submount may include a heat sink and is typically surrounded by an LED housing 26. A primary lens 28 extends from the housing 26 and further encloses the semiconductor chip. Anode and cathode leads, pads, or terminals (not shown) may extend from the housing 26 to conduct electricity to the semiconductor chip. LED packages may be composed of different materials and components as would be understood by one of ordinary skill in the art. The LED packages may be permanently connected to the mounting board 12, for example through soldering or an adhesive. Various LED packages may be rated as Class 1 compliant and therefore may be used with LED devices having higher voltages.
(34) The optic component 16 is supported and coupled to the mounting board 12 and positioned over the LED 14. A cavity 30 formed between the LED 14 and the optic component 16 receives various sized LEDs 14 or LED packages. The optic component 16 includes a secondary lens 32. The secondary lens 32 may have different shapes and sizes to direct or diffuse light from the LED 14 at different directions, angles, and intensities. The optic component 16 may contain other elements apart from the secondary lens 32. As best shown in
(35) As best shown in
(36) The enclosure 47 may be placed over the resilient layer 45. The enclosure 47 may be made from any desired material, such as a metallic, ceramic, or polymer. The enclosure 47 compresses the resilient layer 44 to seal around the secondary lens 32 and may act to seal the resilient layer 44 to and/or around the mounting board 12. The module housing 44 may entirely enclose the mounting board 12 and have an opening through which the optic component 16, or only the secondary lens 32, extends. The module housing 44 may be placed into a lighting unit (not shown) alone or with other LED modules depending on the application. The spacers 24 may provide mechanical stops for the module housing 44, preventing contact with and damage of the mounting board 12. The enclosure 47 may include a set of primary openings 48A and a set of secondary openings 48B. The secondary lens 32 passes through the primary openings 48A to the exterior of the enclosure 47. The secondary openings 48B may receive fasteners (not shown) for attaching the enclosure 47 to the mounting board 12. The secondary openings 48B may be spaced to align with the spacers 24. The spacers 24 may additionally include interior threads to receive the fasteners. Similar openings may be placed in the resilient layer 45.
(37) In various exemplary embodiments the optic component 16 includes pins 50 that may be inserted into the openings 22 in the mounting board 12. The pins 50 may extend from the base 38, or from any part of the optic component 16. The exemplary embodiments shown in the Figures utilize four pins 50, although any number of pins 50 may be used. At least two pins 50, may be utilized to facilitate attachment to the mounting board 20 without rotation. The optic component 16 also may be secured to the mounting board 12 with an adhesive in addition to, or in place of, the pins 50.
(38) The optic component 16 may be composed of different materials or it may be unitarily formed or molded of a single material. The secondary lens 32 may include different materials, such as glass or a polymer. In various exemplary embodiments, the secondary lens 32 is made from an acrylic, for example poly-methyl methacrylate (PMMA). PMMA is an example of an ideal material for secondary lenses 32, based partially on cost, moldability, durability, impact resistance, index of refraction, and light transmissivity. For example, PMMA can have a light transmission rate of up to 92%, whereas typical glass has a transmission rate of about 90% or lower. PMMA is also beneficial for outdoor use due to its stability and resistance to discoloration caused by UV radiation. PMMA lenses, however, are not typically suitable for Class 1 compliant devices due to the fact that PMMA does not have suitable anti-flammability and melt characteristics. In other alternative embodiments, the secondary lens 32 may be made from synthetic compounds, for example silicone. Silicone is another example of an ideal material because it has high transparency, good photo-thermal stability, and can be formed to cover a wide range of refractive indices. Silicone is also easy to mold into different shapes and designs and has good impact strength.
(39) In order to use acrylics such as PMMA, synthetic compounds such as silicone, or other noncompliant materials as secondary lenses 32, a shield member 18 may be placed between the mounting board 12 and the optic component 16. The shield member 18 may be removably placed in contact with the base 38, for example during assembly of the LED module 10, or it may be permanently affixed to the base 38, for example with an adhesive. The shield member 18 creates a Class 1 compliant zone between the mounting board 12 and the optic component 16. To create the Class 1 compliant zone, the shield member 18 may be made from a 5 VA rated material as defined by the UL 94 flame rating standard. Examples of 5 VA rated material include various metallic materials of a certain thickness and suitable polymeric materials that meet the UL 94 5 VA standard, such as certain polycarbonate materials.
(40) The shield member 18 has an upper surface 52 and a lower surface 54. The upper surface 52 is proximate the optic component 16, while the lower surface is proximate the mounting board 12. In various exemplary embodiments, the upper surface 52 is in direct, surface-to-surface contact with at least a portion of the optic component 16 and the lower surface 54 is in direct, surface-to-surface contact with at least a portion of the mounting board 12.
(41) A central aperture 56 is formed in the shield member 18 for receiving the LED 14 or an LED package. The central aperture 56 may be sized to receive the LED 14 so that the edge of the shield member 18 bounding the central aperture 56 is in contact with a portion of the LED 14. For example, in an LED module 10 utilizing LED packages, the edge bounding the central aperture 56 contacts the LED housing 26. As best shown in
(42) The shield member 18 and secondary lens 32 have been discussed above in generalized terms. Various exemplary embodiments may include different configurations, shapes, sizes, and materials in utilize the shield members 18 and secondary lenses 32 discussed herein.
(43) In various exemplary embodiments, the secondary lens 32 may include pins 50 having tabs 62. As best shown in
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Embodiment of FIGS. 11-18
(45) In various exemplary embodiments, the secondary lens 132 may include pins 150 having tabs 162. A slot 261 may be provided in the lens 132 to facilitate removal of the shield member 118 from the secondary lens 132 by a user. As best shown in
(46) As best shown in
Embodiment of FIGS. 19-26
(47) In various exemplary embodiments, a secondary lens 232 may include a recess bound by the base 238 for receiving the shield member 218. The recess may be formed so that the shield member 218 fits flush with the bottom surface of the base 238. The pins 250 may extend beyond an inner wall of the base 238 towards the center of the secondary lens 232. The shield member 218 may have corresponding indentations 272 to accommodate the pins 250. In certain embodiments, the pins 250 do not extend beyond the inner wall of the base and the shield member 218 has an entirely constant outer edge. A slot 261 may be provided in the base 238 to facilitate removal of the shield member 218 from the secondary lens 232 by a user.
(48) The foregoing detailed description of the certain exemplary embodiments has been provided for the purpose of explaining the principles of the invention and its practical application, thereby enabling others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated. This description is not necessarily intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Any of the embodiments and/or elements disclosed herein may be combined with one another to form various additional embodiments not specifically disclosed. Accordingly, additional embodiments are possible and are intended to be encompassed within this specification and the scope of the appended claims. The specification describes specific examples to accomplish a more general goal that may be accomplished in another way.
(49) Only those claims which use the words means for are to be interpreted under 35 U.S.C. 112, sixth paragraph.