Lighting system of a microlithographic projection exposure system and method for operating such a lighting system
10274828 ยท 2019-04-30
Assignee
Inventors
- Markus Deguenther (Aalen, DE)
- Vladimir DAVYDENKO (Bad Herrenalb, DE)
- Thomas Korb (Schwaebisch Gmuend, DE)
- Johannes Eisenmenger (Ulm, DE)
Cpc classification
G03F7/70116
PHYSICS
G03F7/70075
PHYSICS
G03F7/7005
PHYSICS
International classification
Abstract
A microlithography illumination system includes a first light source configured to generate pulses of light, a second light source configured to generate further pulses of light offset temporally relative to the pulses of light generated by the first light source, an array of optical elements digitally switchable between first and second switching positions, and a control device to drive the optical elements so that during use the switching position of the optical elements is unchanged while any of the first and second light sources generates a light pulse. In the first switching position of the optical elements, the array couples light pulses generated by the first light source into a common beam path of the illumination system. In the second switching position of the optical elements, the array couples light pulses generated by the second light source into a common beam path of the illumination system.
Claims
1. An illumination system, comprising: a first light source configured to generate pulses of light; a second light source configured to generate further pulses of light that are offset temporally with respect to the pulses of light generated by the first light source; an array of optical elements which are digitally switchable between first and second switching positions; and a control device configured to drive the optical elements so that during use of the illumination system the switching position of the optical elementsis unchanged while any of the first light source and the second light source generates a light pulse, wherein: in the first switching position of the optical elements, the array couples light pulses generated by the first light source into a common beam path of the illumination system; and in the second switching position of the optical elements, the array couples light pulses generated by the second light source into a common beam path of the illumination system; and the illumination system is a microlithography illumination system.
2. The illumination system of claim 1, wherein the control device is configured to drive the optical elements so that during use of the illumination system the switching position of at least one optical element is identical during two or more successive pulses of light generated by the first light source.
3. The illumination system of claim 2, wherein: the control device is configured to drive the optical elements so that during use of the optical system the switching position changes 2.Math.n times between the two or more successive pulses of light generated by the first light source; and n is an integer having a value of at least one.
4. The illumination system of claim 1, wherein the target surface is a surface of an optical integrator.
5. The illumination system of claim 4, wherein the illumination system is configured to illuminate a mask during use of the illumination system.
6. The illumination system of claim 5, wherein the control device is configured to drive the optical elements so that during use of the optical system the switching position changes 2.Math.n times between the two or more successive pulses of light generated by the first light source, and n is an integer having a value of at least one.
7. The illumination system of claim 4, wherein the control device is configured to drive the optical elements so that during use of the optical system the switching position changes 2.Math.n times between the two or more successive pulses of light generated by the first light source, and n is an integer having a value of at least one.
8. The illumination system of claim 1, further comprising a lens in a path of the light pulses generated by the first light source between the array and a target surface, wherein the lens is configured to image the array onto the target surface during use of the illumination system.
9. The illumination system of claim 2, further comprising a lens in a path of the light pulses generated by the first light source between the array and a target surface, wherein the lens is configured to image the array onto the target surface during use of the illumination system.
10. The illumination system of claim 3, further comprising a lens in a path of the light pulses generated by the first light source between the array and a target surface, wherein the lens is configured to image the array onto the target surface during use of the illumination system.
11. The illumination system of claim 4, further comprising a lens in a path of the light pulses generated by the first light source between the array and a target surface, wherein the lens is configured to image the array onto the target surface during use of the illumination system.
12. The illumination system of claim 5, further comprising a lens in a path of the light pulses generated by the first light source between the array and a target surface, wherein the lens is configured to image the array onto the target surface during use of the illumination system.
13. The illumination system of claim 6, further comprising a lens in a path of the light pulses generated by the first light source between the array and a target surface, wherein the lens is configured to image the array onto the target surface during use of the illumination system.
14. The illumination system of claim 7, further comprising a lens in a path of the light pulses generated by the first light source between the array and a target surface, wherein the lens is configured to image the array onto the target surface during use of the illumination system.
15. The illumination system of claim 1, wherein the illumination system is configured to illuminate a mask during use of the illumination system.
16. The illumination system of claim 2, wherein the illumination system is configured to illuminate a mask during use of the illumination system.
17. The illumination system of claim 3, wherein the illumination system is configured to illuminate a mask during use of the illumination system.
18. The illumination system of claim 5, wherein the illumination system is configured to illuminate a mask during use of the illumination system.
19. An apparatus, comprising: an illumination system according to claim 1; and a projection lens, wherein the apparatus is a microlithographic projection exposure apparatus.
20. A method of operating a microlithographic projection exposure apparatus comprising an illumination system and a projection lens, the method comprising: using the illumination system to illuminate a pattern of a mask; and using the projection lens to image at least some of the illuminated pattern of the mask onto a light sensitive material, wherein the illumination system is an illumination system according to claim 1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Further features and advantages of the disclosure will become apparent from the following description of exemplary embodiments with reference to the drawings, in which:
(2)
(3)
(4)
(5)
(6)
DESCRIPTION OF PREFERRED EXEMPLARY EMBODIMENTS
(7)
(8) Structures 18 on the mask 14 lying within the illumination field 16 are imaged on a light-sensitive layer 22 with the aid of a projection lens 20, which contains a plurality of lens elements L1 to L4. The light-sensitive layer 22, which may be e.g. a resist, is applied to a wafer 24 or another suitable substrate and is situated in the image plane of the projection lens 20. Since the projection lens 20 generally has an imaging scale ||<1, the structures 18 lying within the illumination field 16 are imaged with reduced size on a projection field 18.
(9) In the depicted projection exposure apparatus 10, the mask 14 and the wafer 24 are displaced along a direction denoted by Y during the projection. The ratio of the displacement speeds in this case equals the imaging scale of the projection lens 20. If the projection lens 20 inverts the image (i.e. <0), the displacement movements of the mask 14 and of the wafer 24 extend counter to one another, as indicated in
(10)
(11)
(12) In the graph in
(13) Multiply changing the switching position between successive light pulses 42-1 to 42-3 fosters the movement of the air (or some other gas) surrounding the micromirrors 32 and thus the cooling of the micromirrors 32. There is generally a desire for cooling because an (albeit a small) part of the high-energy projection light 30 incident on the micromirrors 32 is absorbed by the reflective coating of the micromirrors 32 and converted into heat. Cooling across micromirrors 32 solely via the carrier 26 may therefore not suffice for the cooling. Cooling by convection is particularly effective if the surrounding air is moved by the micromirrors 32 changing their switching position.
(14)
(15) For this purpose, the control unit 34 drives the micromirror array 28 such that, in a first switching position, the micromirrors 32 couple exclusively the first light pulses of the first light source LS1 and, in a second switching position of the micromirrors 32, couple exclusively the second light pulses of the second light source LS2 into a common beam path of the illumination system.
(16) At the folding mirror 36, therefore, the first and second light pulses are incident exactly from the same direction, but with a pulse frequency that is doubled in comparison with the pulse frequency of each individual light source LS1, LS2.
(17) This is illustrated by the graph shown in
(18) In this exemplary embodiment, too, the micromirror 32 is switched between its two switching positions multiply between two successive light pulses 42-1, 42-2, 42-3, 52-1, 52-2 originating from different light sources LS1, LS2, in order to improve the cooling by the surrounding air.