Systems and methods for combining or dividing microwave power

10276906 ยท 2019-04-30

    Inventors

    Cpc classification

    International classification

    Abstract

    A power combiner/divider includes a main conductor defining an axis; an input connector having a center conductor, adapted to be coupled to a signal source, electrically coupled to the main conductor and having an axis aligned with the main conductor axis, and having a second conductor electrically coupled to a ground conductor; a plurality of satellite conductors radially exterior of and spaced apart from the main conductor, the satellite conductors defining the general shape of a slotted hollow cylinder having a cylinder axis aligned with the main conductor axis; a plurality of output connectors having center conductors electrically coupled to respective satellite conductors and having respective second conductors electrically coupled to a second ground conductor; and a multiconductor transmission line, including the satellite conductors, defined between the input connector and the output connectors. Methods of manufacturing are also disclosed.

    Claims

    1. A power divider/combiner comprising: a main conductor defining an axis; a coax RF input connector having a center conductor, adapted to be coupled to a signal source, electrically coupled to the main conductor and having an axis coincident with the main conductor axis, and having an outer conductor configured to be electrically coupled to a first ground conductor; a plurality of satellite conductors radially exterior of and spaced apart from the main conductor, each satellite conductor being parallel to the main conductor axis, the satellite conductors defining the general shape of a slotted hollow cylinder having a cylinder axis along its length coincident with the main conductor axis; an exterior ground conductor radially exterior of the satellite conductors; a plurality of coax RF output connectors, the output connectors having center conductors electrically coupled to respective satellite conductors and having respective outer conductors electrically coupled to the exterior ground conductor; and a multiconductor transmission line, including the satellite conductors, the exterior ground conductor, and the main conductor, the exterior ground conductor and the main conductor being parallel to the main conductor axis.

    2. A power divider/combiner in accordance with claim 1 and further comprising an outer conductor radially exterior of the main conductor and electrically coupled to the exterior conductor of the input connector to define the first ground conductor.

    3. A power divider/combiner in accordance with claim 1 wherein the satellite conductors are respectively electrically about one-quarter wavelength long at a passband midband frequency.

    4. A power divider/combiner in accordance with claim 1 and having a first end defined by the input connector and having a second end, the output connectors being proximate the second end, and further comprising an inner backplate that is electrically and thermally conducting, between the first and second ends, radially exterior of the main conductor, and wherein the satellite conductors have inner ends electrically coupled to the backplate and outer ends that are electrically coupled to the center conductors of the output connectors.

    5. A power divider/combiner in accordance with claim 4 and further comprising an electrically and thermally conducting outer backplate at the second end electrically coupled to the main conductor and spaced apart from the satellite conductors by a gap.

    6. A power divider/combiner in accordance with claim 5 wherein a radial transmission line is defined between the outer backplate and the outer ends of the satellite conductors.

    7. A power divider/combiner in accordance with claim 4 and further comprising an outer conductor radially exterior of the main conductor and connected to the second conductor of the input connector to define the first ground conductor, and a second outer ground conductor radially exterior of the satellite conductors, spaced apart from the first outer ground conductor by the inner backplate, and electrically coupled to the second conductors of the output connectors.

    8. A power divider/combiner in accordance with claim 7 wherein the multiconductor transmission line is defined by the satellite conductors, the exterior ground conductor, and the main conductor.

    9. A power divider/combines in accordance with claim 1 wherein the main conductor is stepped.

    10. A power divider/combiner comprising: a main conductor defining an axis, and having a length along the axis, the main conductor having multiple different diameters along its length defining multiple portions; a coax RF input connector having a center conductor, adapted to be coupled to a signal source, electrically coupled to the main conductor and having an axis coincident with the main conductor axis, and having an outer conductor, the input connector defining a first end of the divider/combiner, the divider/combiner having a second end axially spaced apart from the first end; a first ground conductor radially exterior of the main conductor and coupled to the outer conductor of the input connector; an electrically and thermally conducting inner backplate, axially between the first ground conductor and the second end, radially exterior of the main conductor; a plurality of satellite conductors radially exterior of and radially spaced apart from one of the portions of the main conductor, the satellite conductors defining the general shape of a slotted hollow cylinder having a cylinder axis coincident with the main conductor axis, the satellite conductors having inner ends electrically connected to the inner backplate and outer ends extending towards the second end; a plurality of coax RF output connectors having center conductors electrically coupled to respective outer ends of the satellite conductors and having respective outer conductors electrically coupled to an exterior ground conductor; an exterior ground conductor radially exterior of the satellite conductors and axially between the inner backplate and the second end; and an electrically and thermally conducting outer backplate at the second end electrically coupled to the main conductor and spaced apart from the satellite conductors by a gap.

    11. A power divider/combiner in accordance with claim 10 wherein a multiconductor transmission line is defined by the satellite conductors, the main conductor, and the exterior ground conductor.

    12. A power divider/combiner in accordance with claim 11 wherein the main conductor has a first portion proximate the first end, a second portion having a diameter greater than the diameter of the first portion, adjacent the first portion and proximate the inner backplate, and a third portion having a diameter greater than the diameter of the second portion, adjacent the second portion and proximate the satellite conductors.

    13. A power divider/combiner in accordance with claim 12 wherein a first coaxial element transmission line, in signal communication with the multiconductor transmission line, is defined by the second portion of the main conductor and the first ground conductor.

    14. A power divider/combiner in accordance with claim 12 and including a plurality of coaxial element transmission lines, in signal communication with the multiconductor transmission line.

    15. A power divider/combiner in accordance with claim 14 wherein the multiconductor transmission line and the coaxial element transmission lines are electrically modeled to define a passband filter.

    16. A method of manufacturing a power divider/combiner, the method comprising: providing a main conductor defining an axis; providing a coax RF input connector having a center conductor, adapted to be coupled to a signal source and having an axis coincident with the main conductor axis; electrically coupling the input connector to the main conductor; providing a plurality of satellite conductors radially exterior of and spaced apart from the main conductor, the satellite conductors defining the general shape of a slotted hollow cylinder having a cylinder axis coincident with the main conductor axis; providing a plurality of coax RF output connectors having center conductors; providing an electrically and thermally conducting inner backplate, radially exterior of the main conductor; electrically coupling the respective center conductors of the output connectors to the satellite conductors; defining a multiconductor transmission line between the inner backplate and the output connectors; and defining a passband filter between the input connector and the output connectors.

    17. A method in accordance with claim 16 wherein defining a passband filter comprises defining steps in the main conductor.

    18. A method in accordance with claim 16 wherein the input connector includes an outer conductor, wherein the output connectors include respective outer conductors, the method further comprising providing a first ground conductor radially exterior of the main conductor; coupling the first ground conductor to the second conductor of the input connector; providing an exterior ground conductor radially exterior of the satellite conductors and axially between the inner backplate and the outer conductors of the output connectors; and electrically coupling the exterior ground conductor to the outer conductors of the output connectors, wherein the inner backplate is provided axially between the first ground conductor and the output connectors.

    19. A method in accordance with claim 18 wherein the multiconductor transmission line is defined by the main center conductor, the satellite conductors, and the exterior ground conductor.

    Description

    BRIEF DESCRIPTION OF THE VIEWS OF THE DRAWINGS

    (1) FIG. 1 is a side view of a commercially available prior art reactive-type divider/combiner.

    (2) FIG. 2 is an end view of the prior art divider/combiner of FIG. 1.

    (3) FIG. 3 is a circuit schematic diagram of an equivalent circuit of a prior art divider/combiner of the type of FIGS. 1 and 2.

    (4) FIG. 4 is a top view of a prior art reactive-type two-stage multiconductor transmission line divider/combiner.

    (5) FIG. 5 is an end view of the prior art divider/combiner of FIG. 4.

    (6) FIG. 6a is a sectional view taken along line a1-a1 of FIG. 4.

    (7) FIG. 6b is a sectional view taken along line a2-a2 of FIG. 4.

    (8) FIG. 7 is an equivalent circuit diagram for the prior art divider/combiner shown in FIGS. 4, 5, when it is operated as a power divider.

    (9) FIG. 8 is a side view of a combiner/divider in accordance with various embodiments, partly in section.

    (10) FIG. 9 is a sectional view taken along line 9-9 of FIG. 8.

    (11) FIG. 10 is a partial view of FIG. 8.

    (12) FIG. 11 is an alternate partial view of FIG. 8.

    (13) FIG. 12 is an equivalent circuit diagram for the combiner/divider shown in FIG. 8, when it is operated as a power divider.

    (14) FIG. 13 is a sectional view taken along line 13-13 of FIG. 8.

    (15) FIG. 14 is a table showing an admittance matrix Y of the multiconductor transmission line shown in FIG. 13.

    (16) FIG. 15 is a graph showing typical input port return loss and output port insertion loss vs. frequency for embodiments of the combiner/divider of FIG. 8 that have one input port and ten output ports (when being used as a power divider).

    (17) FIG. 16 is a perspective view showing embodiments of the combiner/divider of FIG. 8 that have an Electronic Industries Association (EIA) flange main port, and ten Type N (female) connectors for the output ports (when being used as a power divider).

    (18) FIG. 17 shows measured RF performance of FIG. 16 of the combiner/divider of FIG. 16, tested as a power divider.

    (19) FIG. 18 is an exploded perspective view of the power combiner/divider of FIG. 8.

    DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

    (20) Attention is directed to U.S. patent application Ser. No. 15/043,570, filed Feb. 14, 2016 (now U.S. Pat. No. 9,673,503), from which this application claims priority. Attention is also directed to U.S. patent application Ser. No. 15/493,074, now U.S. Pat. No. 9,812,756 to Aster, incorporated herein by reference, and to U.S. patent application Ser. No. 15/493,591, now U.S. Pat. No. 9,793,593 to Aster, incorporated herein by reference.

    (21) FIG. 8 shows a microwave power divider 800, which can alternatively be used as a power combiner, in accordance with various embodiments. It will hereinafter be referred to as a power divider-combiner 800.

    (22) Hereinafter described as if for use as a power divider, the power divider-combiner 800 has (see FIGS. 8, 9, 10, 11, 16, 18) a single main input connector or port flange 812, a center conductor bullet 813, and a quantity NS of output port connectors 801. It is to be understood that, for convenience, the terms input and output, when used herein and in the claims, assume that the divider-combiner is being used as a power divider. The roles of the inputs and outputs are reversed when the divider-combiner is being used as a power combiner. In the illustrated embodiments, the input port flange 812 is a EIA (Electronic Industries Association) flange; however, other sizes or connector types are possible. The power divider-combiner 800 further has (see FIG. 16 and FIGS. 8, 9) ten Type N (female) connectors for the output ports 801. In other embodiments, the input connector possibilities are 7-16 DIN, 4.1-9.5 DIN, Type N (female or male), TNC (female or male), or possibly larger EIA flange types. Other types of output and input RF connectors are possible.

    (23) The power divider-combiner 800 includes a plurality of satellite conductors 803 defining, in the illustrated embodiments, the general shape of a slotted hollow cylinder (see FIG. 18 exploded view). Other cross-section shapes are possible for each conductor 803, such as a circular cross-section, for example. Respective output RF connectors 801 have a center conductor 802 electrically connected with an outer end of one of the satellite conductors 803. FIG. 10 shows center conductor 802 with its end slotted (815) compression fit into a receiving bore 817 located near the end of conductor 803. In an alternate connection method, FIG. 11 shows center conductor 802 attached with solder or braze alloy 816 into the bore 817 to form the electrical and thermal connection to satellite conductor 813. The power divider-combiner 800 includes a stepped diameter main conductor including portions 808, 809, and 806 which are electrically connected to each other. The portions 808, 809, and 806 are cylindrical in the illustrated embodiments; however, other shapes are possible. The power divider-combiner 800 further includes an electrically and thermally conducting outer backplate 807 to which portion 806 of the main center conductor connects.

    (24) In the illustrated embodiments, there is a quantity NS of such satellite conductors 803 uniformly spaced about the main center conductor portion 806, and positioned radially exteriorly of the portion 806. The power divider-combiner 800 further includes a sidewall or exterior ground conductor 805. The output RF connectors 801 are radially spaced apart relative to the portion 806, mounted to the sidewall 805, and have center conductors 802 passing through the sidewall 805. Further, the RF connector center conductors 802 define respective axes that are all perpendicular to an axis defined by the portion 806 of the main center conductor, in some embodiments. Other angles are possible, including in-line orientation of the RF output connectors out the outer back plate 807, rather than through the sidewall conductor 805.

    (25) Main center conductor portions 808, 809, 806, and satellite conductors 803 are substantially one-quarter an electrical wavelength long at the passband midband frequency f.sub.O.

    (26) The power divider-combiner 800 further includes an inner flange 804 that is electrically and thermally conducting, in the illustrated embodiment. Satellite conductors 803 have respective inner ends that are electrically and thermally connected to the inner backplate 804.

    (27) In various embodiments, the portion 806 of the main center conductor, the quantity N.sub.S satellite conductors, and the exterior ground conductor 805 define a multiconductor transmission line (MTL). In the illustrated embodiments, the multiconductor transmission line (MTL) section is preceded by two unit element (quarter-wave) coaxial transmission lines with stepped diameter main conductor portions 808, and 809, and a first or cylindrical ground conductor 810.

    (28) Collectively, the two unit element transmission lines with characteristic admittances Y.sub.1 and Y.sub.2, and the MTL section are electrically modeled, in a generalized form, as a passband filter equivalent circuit shown in FIG. 12. A passband is a portion of the frequency spectrum that allows transmission of a signal with a desired minimum insertion loss by means of some filtering device. In other words, a passband filter passes a band of frequencies to a defined passband insertion loss vs. frequency profile. Desired filter passband performance is achieved by a two-step process:

    (29) 1) Given a source admittance quantity Y.sub.S, divider quantity (number of outputs) N.sub.S, load admittance quantity N.sub.S*Y.sub.L, and desired passband a) bandwidth, and b) input port return loss peaks within the passband, calculate the unit element transmission line characteristic admittances Y.sub.1, Y.sub.2, . . . , Y.sub.T and MTL unit element characteristic admittance values N.sub.S|Y.sub.12|, Y.sub.10, and N.sub.S*Y.sub.20. This may be accomplished, as one approach, using the design theory as described in M. C. Horton and R. J. Wenzel, General theory and design of quarter-wave TEM filters, IEEE Trans. on Microwave Theory and Techniques, May 1965, pp. 316-327.

    (30) 2) After determining the above desired electrical transmission line characteristic admittances, then find corresponding diameters for conductors 808, 809, 810 and determine MTL cross-section dimensions (referring to FIG. 8, and Section 13-13, FIG. 13) that achieve MTL matrix admittance Y element values that give the desired characteristic admittance values N.sub.S|Y.sub.12|, Y.sub.10, and N.sub.S*Y.sub.20. These unit element transmission line characteristic admittances will be described below in greater detail.

    (31) For a homogeneous dielectric MTL, its characteristic admittance matrix Y is proportional to a MTL cross-section capacitance matrix C. Referring to the numbered conductors of FIG. 13, the 1111 capacitance matrix C is defined as follows:

    (32) The row 1, column 1 capacitance element C(1,1) hereinafter C11, is found from Q1=C11*V1 where V1 is a voltage applied to conductor 1 (say, 1 volt), with all other conductors 2, 3, . . . up to conductor 11 held at zero volts (the ground conductor shield is always held at zero volts). Q1 is the total surface charge on conductor 1a positive charge for V1 being positive. Row 1, column 1 element C11=Q1/V1.

    (33) The row 1, column 2 element C12 is found from C12=Q2/V1 where V1 is a voltage applied to conductor 1, with all other conductors 2, 3, . . . , 11 held at zero voltsas before. Q2 is the total induced surface charge on conductor 2. This is always a negative value, when V1 is positive.

    (34) The row 2, column 2 element C22 is found from Q2=C22*V2 where V2 is a voltage applied to conductor 2 (say, I volt), with all other conductors 1, 3, . . . , 11 held at zero volts. Q2 is the total surface charge on conductor 2a positive number for V2 positive. Then C22=Q2/V2.

    (35) The row 2, column 3 element C23 is found from C23=Q3/V2 where V2 is a voltage applied to conductor 2 (say, I volt), with all other conductors 1, 3, . . . , 11 held at zero volts, as before. Q3 is the total surface charge induced on conductor 3, a negative quantity for positive V2.

    (36) The analysis of the above for an arbitrary multiconductor cross-section is based on theory presented by C. Wei, R. Harrington, J. Mautz, and T. Sarkar, Multiconductor transmission lines in multilayered dielectric media, AEEE Trans. on Microwave Theory and Techniques, Vol. MTT-32, pp. 439-450, April 1984.

    (37) The multiconductor transmission line characteristic admittance matrix Y=v*C, where v is the velocity of light. Air dielectric is assumed. The quantity Y.sub.12 is from the first row, second column of matrix Y. The quantity Y.sub.12 is seen in FIGS. 7, 12, 14, and 15.

    (38) The transmission line characteristic admittances Y.sub.10 and Y.sub.20 are derived from elements of the matrix Y, and are defined in FIG. 12 (and also in FIG. 14).

    (39) The MTL physical cross-section dimensions (FIG. 13) are chosen to give the desired values of Y.sub.11=v*C11, Y.sub.12=v*C12, Y.sub.22=v*C22, and Y.sub.23=v*C23, and thus the desired values for unit elements characteristic admittances Y.sub.10 and Y.sub.20, referring to the numbering of conductors shown in FIG. 13. The quantity v is the speed of light in air, and the capacitance matrix elements C11, C12, C22, and C23 have units of farads/meter. The units of Y.sub.11, Y.sub.12, Y.sub.22, Y.sub.23, Y.sub.10, and Y.sub.20 are in mhos.

    (40) As an example, given: N.sub.S=10, Y.sub.S=Y.sub.L=0.02 mho, 23 dB return loss peaks are desired for a bandwidth F.sub.2/F.sub.1=2.91, where F.sub.1, F.sub.2 represent the lower and upper edges of the passband, respectively. Using the Horton & Wenzel technique, unit element characteristic admittances Y.sub.1, Y.sub.2, and MTL unit element characteristic admittance values N.sub.S*|Y.sub.12|, Y.sub.10, and Y.sub.20 were found. FIG. 15 shows calculated response using these derived characteristic admittances used in the equivalent circuit in FIG. 12. Cross-section dimensions throughout the filter device were then determined so as to achieve these unit element characteristic admittances. While the illustrated embodiments show two coaxial transmission lines preceding the MTL, alternative embodiments built for lesser or broader bandwidth employ only one (narrower bandwidth) or three or more coax unit elements (broader bandwidth) that precede the MTL.

    (41) FIG. 17 shows measured RF performance of the combiner/divider of FIG. 16. Tested as a power divider, measured RF performance shows good correlation with predicted main port return loss |S.sub.11| and typical output port insertion loss |S.sub.n1| vs. frequency.

    (42) The total physical length of conductors 808, 809, and 806 (FIG. 8) corresponds to approximately three unit element lengths, whereas the prior art shown in FIGS. 1, 2, (and equivalent circuit FIG. 3) requires a simple quarter-wave impedance transformer length equivalent to four unit elements in order to achieve the same electrical performance, assuming a ten-way divider/combiner. In comparison with prior art shown in FIGS. 4, 5 (and equivalent circuit FIG. 7), the F.sub.2/F.sub.1=2.9 bandwidth was achieved using only one MTL section, rather than the necessity of using at least three MTL modules for the two-stage prior art device shown in FIGS. 4, 5 (and equivalent circuit FIG. 7)assuming a two-way MTL (Stage B) module followed by two five-way MTL (Stage A) modules. The prototype shown in FIGS. 8, 9, and 16 is therefore more compact and less expensive to fabricate.

    (43) Various conductive materials could be employed for the conductive components of the power divider-combiner 200. For example, in the illustrated embodiments, parts are fabricated from 6061 alloy aluminum. For corrosion resistance, some of these parts may be a) alodine coated, or b) electroless nickel flash-coated and MILspec gold plated. In other embodiments, parts are made of brass or magnesium alloy, also MILspec gold plated Another possibility is MILspec silver plated, with rhodium flash coating to improve corrosion resistance.

    (44) FIG. 18 shows an exploded view of the power divider-combiner 800, in accordance with various embodiments.

    (45) The main stepped diameter main conductor, defined by portions 808, 809, and 806, is fabricated as one piece, in the illustrated embodiments. It is bolted to the outer backplate 807 using a single -20 stainless steel cap screw SC3. Other size screws or other methods of attachment can be employed. Portions 808 and 809 are the center conductors for two unit element coaxial transmission lines.

    (46) In the filter circuit synthesis technique as presented in the Horton & Wenzel reference, a desired circuit response (return loss over a passband as shown in FIG. 15, for example) results from the synthesis of transmission line characteristic admittances for a sequence of one or more unit element (substantially quarter-wave at the mid-band frequency f.sub.O) transmission lines followed by final unit element transmission line which is preceded and followed with unit element shorted shunt stub transmission lines, as shown in FIG. 12 for this example.

    (47) Referring to FIGS. 8, 9 and the equivalent circuit shown in FIG. 12, inner conductor 808 and outer conductor 810 form a unit element (substantially quarter-wave) transmission line with characteristic admittance Y.sub.1. Inner conductor 809 and outer conductor 810 form a unit element transmission line with characteristic admittance Y.sub.2. The multiconductor transmission line (MTL) consists of outer conductor 805, the quantity N.sub.S satellite conductors 803, and inner conductor 806. The equivalent circuit for this MTL is as follows (see G. Matthaei, L. Young, and E. M. T. Jones, Microwave Filters, Impedance-matching Networks, and Coupling Structures, Artech House Books, Dedham, M A, 1980, FIG. 5.09-1a Schematic and Equivalent Circuit, p. 220): 1) Electrical reference plane a-a (FIG. 12) corresponds to the physical reference plane a-a shown in FIG. 8. The outer backplate 807 in FIG. 8 serves as the short circuit for the unit element shorted shunt stub 121 in FIG. 12. The characteristic admittance is Y.sub.10=Y.sub.11+N.sub.S*Y.sub.12 for the unit element within stub 121 (FIG. 12). 2) Electrical reference plane b-b (FIG. 12) corresponds to the physical reference plane b-b shown in FIG. 8. The inner backplate 804 in FIG. 8 serves as the short circuit for the unit element shorted shunt stub 122 (FIG. 12). The characteristic admittance is N.sub.S*Y.sub.20 for the unit element within stub 122 (FIG. 12), where Y.sub.20=Y.sub.22+Y.sub.12+Y.sub.23+Y.sub.24+ . . . +Y.sub.2,11 (see FIG. 13 for numbering of the conductors, and FIG. 14 for the MTL admittance matrix Y). 3) Between reference planes a-a and b-b (FIG. 12) is a unit element with characteristic admittance N.sub.S*Y.sub.12, and having a unit element midband frequency phase length =+.sub.R where .sub.R is the phase length of the radial transmission line 814 (FIGS. 10, 11) formed by the tip of each conductor 803 and the outer backplate 807, there being quantity N.sub.S such radial transmission lines. All the above described unit elements are substantially one-quarter wavelength long at the passband mid-band frequency f.sub.O. One way of interpreting a quarter-wavelength transmission line (at the midband frequency f.sub.O) is that it transforms the wave admittance on a Smith Chart along a circle about the origin (where the reflection coefficient magnitude is zero) exactly 180 degrees.

    (48) In the illustrated embodiments, the quantity N.sub.S output RF connectors equals ten, and the corresponding quantity N.sub.S of satellite conductors 803 is each equal to ten, requiring the modeling of an 1111 characteristic admittance matrix Y as shown in FIG. 14. Other values of N.sub.S=2, 3, . . . , 12 or more are possible. For example, a two-way divider-combiner has quantity N.sub.S=2 satellite conductors (and therefore N.sub.S=2 output RF connectors) requiring the modeling of a 33 admittance matrix Y.

    (49) In the illustrated embodiments where quantity N.sub.S equals ten, broadband performance of an octave or more is achieved different to the design of the combiner/divider described in U.S. Pat. No. 8,508,313. This is because the unit element shorted shunt stub 121 in FIG. 12 is not essential for broadband operation of the equivalent circuit of FIG. 12, whereas the shorted shunt stubs with transmission line characteristic admittances Y.sub.10.sup.(B) and N.sub.S.sup.(B)Y.sub.10.sup.(A) (FIG. 7) must have non-zero values in order to achieve broadband performance of the ladder filter shown in FIG. 7(see FIG. 4c, U.S. Pat. No. 8,508,313 for an example of octave-performance of a two-stage MTL 8-way power divider). To show this, the characteristic admittance Y.sub.10 for the unit element shorted shunt stub 121 (FIG. 12) is 0.00001843 mho (see FIG. 14), or essentially zero. This implies that the shorted shunt stub 121 is, for all practical consideration, deleted from the equivalent circuit FIG. 12 and that TEM waves propagating on the outer diameter of center conductor 806 (FIG. 8) see only the ground conductor inner diameter of satellite conductors 803, and not at all the inner diameter of ground conductor 805. More importantly, this also means that outer backplate 807 (FIG. 8) no longer serves also as a short circuit (for deleted stub 121, FIG. 12) but instead serves (along with the end tips of satellite conductors 803) primarily as the ground conductor for radial transmission line 814 (FIGS. 10, 11) which feeds in parallel: 1) the unit element shorted shunt stub 122 (FIG. 12), and 2) the load admittance N.sub.SY.sub.L. The calculated scattering parameters graphed in FIG. 15 (with Y10=0) demonstrates broadband performance (f.sub.2/f.sub.1=2.91) even with the absence of the unit element shorted shunt stub 121 of FIG. 12.

    (50) In the illustrated embodiments, there are two coax unit elements having transmission line characteristic admittances Y1 and Y2 (FIG. 12) with respective main conductor portions 808, 809 (FIG. 8) that precede the multiconductor transmission line (MTL) having center conductor portion 806. However, for designs requiring less bandwidth, only one coax unit element preceding the MTL may be used. Alternatively, three or more coax unit elements preceding the MTL may be required for very broad-band designs requiring very low VSWR (voltage standing wave ratio) throughout the passband, as measured at the divider input port.

    (51) In various embodiments, the flange 812 and coax outer conductor 810 are machined as one piece. Alternatively, flange 812 and coax outer conductor 810 may be separate pieces soldered, brazed, or bolted together. Bolted to the coax outer conductor 810 is flange 811, which may also be alternatively brazed or soldered instead of bolted together. Using four stainless steel cap screws SC1 from behind (see FIG. 18), flange 811 sandwiches inner backplate 804 to thread into four corresponding threaded holes in the back face (hidden from view) of MTL outer conductor 805, in various embodiments. Other mechanical attachment methods can be employed.

    (52) In the illustrated embodiments, the satellite conductors 803 form one piece with conducting inner backplate 804this is one solid piece. However, satellite conductors 803 might be bolted, soldered, or brazed, or press fit onto conducting inner back plate 804.

    (53) Divider output connectors 801 (FIGS. 8, 9, 18) are shown as flange mounted Type N (female) connectors. Each output connector (only one of ten connectors 801 is shown in FIG. 18) mounts to the MTL outer conductor 805 using two 4-40 3/16 cap screws SC4 (FIG. 18). Other Type N (female, or male) mounting types and other mechanical attachments can be employed. Other kinds of output RF connectors, such as TNC, SMA, SC, 7-16 DIN, 4.3-10 DIN male or female, and other EIA-type flanges can be employed. The mating end of center conductor 802 of the output connector 801 is slotted in the illustrated embodiments (see FIGS. 8, 9, 10, 18) to provide a snug fit to the receiving hole 817 (FIGS. 10, 11) reamed in its respective satellite conductor 803. This is a removable RF connector approach, but solder or braze alloy 816 (FIG. 11) may be otherwise used to form a permanent connection.

    (54) In the illustrated embodiments, the stepped main center conductor plus backplate 808, 809, 806, 807 assembly is bolted to the end interior of MTL ground conductor 805 by means of five 6-32 stainless steel cap screws SC2 (FIG. 18). Other mechanical attachment methods can be employed.

    (55) Referring to FIG. 13, the MTL cross-section dimensions were adjusted, in various embodiments, so that the MTL admittance matrix Y shown in FIG. 14 yielded the desired quantities for Y.sub.12, Y.sub.10, and Y.sub.20.

    (56) In compliance with the patent statutes, the subject matter disclosed herein has been described in language more or less specific as to structural and methodical features. However, the scope of protection sought is to be limited only by the following claims, given their broadest possible interpretations. Such claims are not to be limited by the specific features shown and described above, as the description above only discloses example embodiments.