Sealant composition and method for curing the same, display device and sealing method, and use thereof
10259979 ยท 2019-04-16
Assignee
- Boe Technology Group Co., Ltd. (Beijing, CN)
- Beijing Boe Optoelectronics Technology Co., Ltd. (Beijing, CN)
Inventors
Cpc classification
C09J163/10
CHEMISTRY; METALLURGY
International classification
C09J163/00
CHEMISTRY; METALLURGY
C08G59/18
CHEMISTRY; METALLURGY
C09J163/10
CHEMISTRY; METALLURGY
Abstract
Disclosed is a sealant composition. The sealant composition is composed of an epoxy resin having an active group, -cyanoacrylate, an initiator wrapped with an inert sheathing material, a thermal curing agent, a filler, a coupling agent and an epoxy resin having no active groups. In the invention, a method for initiating sealant curing via a chemical initiator is employed, thus the UV irradiation process may be avoided, the cell alignment process may be simplified, and the cost of UV process and UV Mask, etc., may be saved; additionally, the sealant cure effect is uniform and controllable, and the risk of sealant break and liquid crystal pollution may be avoided.
Claims
1. A sealant composition, comprising: an epoxy resin composed of an epoxy resin having a polymerizable group and an epoxy resin having no polymerizable groups; 10-20 mass % of -cyanoacrylate; 5-10 mass % of a thermal curing agent; 15-20 mass % of a filler; 2-5 mass % of a coupling agent; and 0.5-1 mass % of an initiator wrapped with an inert sheathing material, wherein the sealant composition includes 20-30 mass % of the epoxy resin having the polymerizable group and 20-30 mass % of the epoxy resin having no polymerizable groups.
2. The sealant composition according to claim 1, wherein the initiator wrapped with the inert sheathing is an initiator microsphere particle that includes the initiator as a core material wrapped with a brittle resin material.
3. The sealant composition according to claim 2, wherein the initiator microsphere particle is formed by self-organization, in situ polymerization, co-mixing deposition, or a solvent-thermal or hydrothermal method; the brittle resin is one selected from the group consisting of polystyrene, acrylic resin, phenolic resin, and polyester resin; and the initiator is an anionic initiator.
4. The sealant composition according to claim 3, wherein, the anionic initiator is one or more selected from weak base, ROR, NR.sub.3, pyridine and water in which the R in the ROR and the R in NR.sub.3 are each an alkyl group.
5. The sealant composition according to claim 3, wherein, a diameter of the initiator microsphere particle is 4-10 m.
6. The sealant composition according to claim 1, wherein, the structural formula of -cyanoacrylate is as follows: ##STR00018## wherein, R is chain alkane or arene.
7. The sealant composition according to claim 1, wherein, the structural formula of the epoxy resin having the polymerizable group is as follows: ##STR00019## wherein, R is chain alkane or arene.
8. The sealant composition according to claim 1, wherein, the epoxy resin having no polymerizable groups is an epoxy resin having neither a highly active carbon-carbon double bond nor a highly active carbon-carbon triple bond that can be initiated to polymerize by a weak base.
9. The sealant composition according to claim 1, wherein, the coupling agent is one selected from aminosilane coupling agent, vinylsilane coupling agent and epoxysilane coupling agent.
10. The sealant composition according to claim 1, wherein, the filler is at least one selected from silicon dioxide microsphere and elastomer microsphere.
11. A method for curing the sealant composition of claim 1, comprising: applying a pressure to the sealant composition to release the initiator via a cell alignment process; and, heating at 110-130 C. for 1-2 h to cure the sealant composition.
12. A method for sealing a display device, comprising: sealing a substrate of the display device by employing the sealant composition of claim 1; releasing the initiator by pressure during the cell alignment process; and heating at 110-130 C. for 1-2 h to cure the sealant composition.
13. A display device, which employs the sealant composition of claim 1 as a peripheral sealant of a substrate of the display device.
Description
BRIEF DESCRIPTION
(1)
(2)
(3)
(4)
DETAILED DESCRIPTION
(5) One embodiment of the invention provides a sealant composition, which includes an epoxy resin and an initiator wrapped with an inert sheathing material.
(6) Optionally, the initiator wrapped with an inert sheathing is a microsphere obtained by wrapping an initiator with a brittle resin.
(7) For example, the initiator wrapped with an inert sheathing is an initiator microsphere particle formed by taking an initiator as the core material and a brittle resin material as the sheathing via self-organization, in situ polymerization, co-mixing deposition, solvent-thermal or hydrothermal method; wherein, the brittle resin is one selected from polystyrene, acrylic resin, phenolic resin, polyester resin; optionally, the initiator is an anionic initiator; optionally, the anionic initiator is one of a series of low active anionic initiators, for example, pyridine, NR.sub.3 (wherein R may be an alkyl, for example, ethyl), a weak base, ROR (wherein R may be an alkyl, for example, ethyl) and H.sub.2O, etc.
(8) A content of the initiator wrapped with an inert sheathing may be set reasonably as required; specifically, it may be 0.1-10% of the total weight of the sealant composition, and optionally, 0.5-5%, and more optionally, 0.5-1%. In one embodiment of the invention, the diameter of the initiator microsphere particle is 4-10 m, for example, 5-10 m.
(9) In another embodiment of the invention, the sealant composition further includes -cyanoacrylate.
(10) The structural formula of -cyanoacrylate is as follows:
(11) ##STR00004##
(12) Wherein, R is chain alkane or arene. For example, R may be C1-18 chain alkane.
(13) The epoxy resin is composed of an epoxy resin having an active group and an epoxy resin having no active groups.
(14) Optionally, for the epoxy resin having an active group, and the active group may be -cyanoacrylate group, the molecular weight of the epoxy resin is 500-1000, specifically, the structural formula of the epoxy resin having an active group may be:
(15) ##STR00005##
wherein, R is chain alkane or arene. For example, R may be C1-18 chain alkane.
(16) Optionally, the epoxy resin having no active groups is an epoxy resin having neither a highly active carbon-carbon double bond nor a highly active carbon-carbon triple bond that can be initiated to polymerize by a weak base, with a skeleton symbol of
(17) ##STR00006##
wherein, R is chain alkane or arene, for example, R may be C1-18 chain alkane.
(18) In one embodiment of the invention, the sealant composition is composed of an epoxy resin having an active group, -cyanoacrylate, an initiator wrapped with an inert sheathing material, a thermal curing agent, a filler, a coupling agent and an epoxy resin having no active groups.
(19) In one embodiment of the invention, the epoxy resin having no active groups carries neither a highly active carbon-carbon double bond nor a highly active carbon-carbon triple bond that can be initiated to polymerize by a weak base, with a skeleton symbol of
(20) ##STR00007##
(21) In one embodiment of the invention, the initiator wrapped with an inert sheathing is a microsphere obtained by wrapping an initiator with a brittle resin.
(22) For example, the initiator wrapped with an inert sheathing is an initiator microsphere particle formed by taking an initiator as the core material and a brittle resin material as the sheathing via self-organization, in situ polymerization, co-mixing deposition, solvent-thermal or hydrothermal method; wherein, the brittle resin is one selected from polystyrene, acrylic resin, phenolic resin, polyester resin; optionally, the initiator is an anionic initiator; for example, the anionic initiator is one of a series of low active anionic initiators such as pyridine, NR.sub.3, weak base, ROR and H.sub.2O, etc.
(23) In another embodiment of the invention, the diameter of the initiator microsphere particle is 4-10 m, for example, 5-10 m. The structure of the initiator microsphere particle is as shown in
(24) The initiator microsphere is doped in the sealant, and due to the protection of the resin, the initiator cannot initiate the sealant to cure; during the cell alignment process, the brittle resin is crushed under the action of the cell alignment pressure, and the initiator is released to the sealant system (as shown in
(25) In yet another embodiment of the invention, the structural formula of -cyanoacrylate is as follows:
(26) ##STR00008##
(27) wherein, R is chain alkane or arene;
(28) Optionally, the coupling agent is one selected from aminosilane coupling agent, vinylsilane coupling agent and epoxysilane coupling agent.
(29) Optionally, the filler is at least one selected from silicon dioxide microsphere and elastomer microsphere.
(30) In one embodiment of the invention, the sealant composition is composed of constituents with the following mass percentages:
(31) TABLE-US-00002 the epoxy resin having an active group 20~30%; the -cyanoacrylate 10~20%; the initiator wrapped with an inert sheathing material 0.5-1%; the thermal curing agent .sup.5-10%; the filler 15-20%; the coupling agent .sup.2-5%; and the epoxy resin having no active groups 20~30%.
(32) The sealant composition is composed of an epoxy resin having an active group (for example, having an active -cyanoacrylate group, with a molecular weight of 500-1000), -cyanoacrylate (which is cured rapidly under the action of an initiator), an initiator wrapped with an inert sheathing (a microsphere with a diameter of 4-10 m, which is released during a cell alignment process to initiate polymerization), a thermal curing agent (a polyamine-type curing agent) and a filler, a coupling agent, and an epoxy resin having no active groups.
(33) The specific principle by which the sealant composition of the invention is applied to the peripheral sealant of the substrate of a liquid crystal display device is as follows.
(34) The process flow of a curing process that employs the above sealant is as shown in
(35) The curing mechanism of the sealant is as follows:
(36) the epoxy resin having an active group:
(37) ##STR00009##
(38) the -cyanoacrylate:
(39) ##STR00010##
(40) the thermal curing agent (polyamine-type): a polyamine-type thermal curing agent, for example, an aromatic polyamine-type, aliphatic diamine.
(41) Curing Process
(42) 1-1) Preliminary curing under the action of an anionic initiator:
(43) ##STR00011##
(44) The speed of this reaction is very fast, and it is usually completed in 1 min. At this time, preliminary curing of the sealant is completed, the molecular weight of the sealant increases to 500010000, and it has a certain strength and hardness, thus sealant puncturation and liquid crystal pollution may be effectively avoided.
(45) 1-2) Thermal curing under the action of a thermal crosslinking agent
(46) The reaction speed of reaction 1-1 is fast, and the use of UV light irradiation is avoided; however, the reaction time is short, the polymer cures incompletely, and the molecular weight is low.
(47) Under the action of high temperature, the epoxy groups in the resin further crosslink with the polyamine, the molecular weight increases, and the strength is enhanced, and finally the object of sealing is ottained.
(48) Reaction Process
(49) Mechanism of Single Reaction
(50) ##STR00012##
(51) Overall Crosslinking and Curing Mechanism
(52) ##STR00013##
(53) With the progress of the thermal curing reaction, the whole macromolecules are crosslinked to form a large crosslinking network, the molecular weight increases rapidly, the strength is enhanced, and the curing process of the sealant is completed.
(54) In the invention, a novel sealant system is employed, wherein an initiator wrapped with an inert sheathing is doped, and during a cell alignment process, the inert sheathing is broken under the action of an external force, and the initiator is released to initiate sealant prepolymerization. This method may be used to replace the UV curing process currently employed, and the cell alignment process may be simplified.
EMBODIMENTS
Embodiment 1
(55) In this embodiment, the sealant composition is composed of constituents with the following mass percentages:
(56) TABLE-US-00003 epoxy resin having an active group 30%; -cyanoacrylate 15%; initiator wrapped with an inert sheathing material 0.7%; thermal curing agent 10%; filler 15%; coupling agent .sup.5%; and epoxy resin having no active groups 24.3%..sup.
(57) The structural formula of the above epoxy resin having an active group is as follows:
(58) ##STR00014##
wherein, R is propyl.
(59) -cyanoacrylate: methyl -cyanoacrylate.
(60) Thermal curing agent: aliphatic polyamine (ethylene diamine).
(61) Filler: silicon dioxide microsphere.
(62) Coupling agent: aminosilane coupling agent.
(63) Initiator wrapped with an inert sheathing material: the initiator is tributylamine, the sheathing is polystyrene, the synthetic method is in situ polymerization, and the wrapping method is specifically as follows:
(64) 1) Blending BPO (a free radical initiator) in tributylamine;
(65) 2) Forming tributylamine particles of 0.53 m via physical vibration separation;
(66) 3) Dispersing the particles in styrene, initiating styrene polymerization via free radical polymerization, and forming a polystyrene sheathing on the surface of tributylamine
(67) Epoxy resin having no active groups:
(68) a skeleton symbol is
(69) ##STR00015##
wherein R is hexyl.
(70) The above raw materials are mixed according to certain mass percentages, and thus a sealant is prepared.
(71) Liquid crystals are sealed by the above sealant, and the specific steps are as shown in
(72) Tests indicate that, the sealant has a good curing performance, the curing speed of the liquid crystal screen is fast (the curing temperature is 120 C., and the cure time is 70 minutes), the sealant has a good antipollution effect, and the liquid crystal screen exhibits an excellent image retention effect.
(73) Curing is complete, and the cured product exhibits no sealant break and liquid leakage phenomena after being boiled with water for 4 hours, and no sealant break and liquid leakage phenomena after being frozen at 400 C. for 4 hours.
(74) Reactivity with liquid crystals: samples of sealants to be tested are trial-produced according to production process conditions, and the photoelectric properties thereof are tested. The sealants do not extend toward the direction of the visible area. The photoelectric parameters of the liquid crystals are not influenced, and the change of the photoelectric properties after the high-temperature and high-humidity reliability test meets the requirements of the product.
Embodiment 2
(75) In this embodiment, the sealant composition is composed of constituents with the following mass percentages:
(76) TABLE-US-00004 epoxy resin having an active group 25%; -cyanoacrylate 20%; initiator wrapped with an inert sheathing material 0.75%;.sup. thermal curing agent 10%; filler 15%; coupling agent .sup.5%; and epoxy resin having no active groups 24.25%.
(77) The structural formula of the above epoxy resin having an active group is as follows:
(78) ##STR00016##
wherein, R is butyl.
(79) -cyanoacrylate: methyl -cyanoacrylate.
(80) Thermal curing agent: aliphatic polyamine (hexanediamine).
(81) Filler: elastomer microsphere.
(82) Coupling agent: aminosilane coupling agent.
(83) Initiator wrapped with an inert sheathing material: the initiator is tributylamine, the sheathing is polystyrene, the synthetic method is in situ polymerization, and the wrapping method is specifically as follows:
(84) 1) Blending BPO (a free radical initiator) in tributylamine;
(85) 2) Forming tributylamine particles of 0.53 m via physical vibration separation;
(86) 3) Dispersing the particles in styrene, initiating styrene polymerization via free radical polymerization, and forming a polystyrene sheathing on the surface of tributylamine.
(87) Epoxy resin having no active groups:
(88) a skeleton symbol is
(89) ##STR00017##
wherein, R is butyl.
(90) The above raw materials are mixed according to certain mass percentages, and thus a sealant is prepared.
(91) Liquid crystals are sealed by the above sealant, and the specific steps are as shown in
(92) Tests indicate that, the sealant has a good curing performance, the curing speed of the liquid crystal screen is fast (the curing temperature is 110 C., and the cure time is 75 minutes), the sealant has a good antipollution effect, and the liquid crystal screen exhibits an excellent image retention effect.
(93) Curing is complete, the cured product exhibits no sealant break and liquid leakage phenomena after being boiled with water for 4 hours, and no sealant break and liquid leakage phenomena after being frozen at 400 C. for 4 hours.
(94) Reactivity with liquid crystals: samples of sealants to be tested are trial-produced according to production process conditions, and the photoelectric properties thereof are tested. The sealants do not extend toward the direction of the visible area. The photoelectric parameters of the liquid crystals are not influenced, and the change of the photoelectric properties after the high-temperature and high-humidity reliability test meets the requirements of the product.
(95) The above description only shows some optional embodiments of the invention. It should be noted that, various improvements and substitutions may also be made by one of ordinary skills in the art without departing from the technical principles of the invention, and all these improvements and substitutions should be regarded as falling into the protection scope of the invention.