Grounding apparatus and methods for grounding

Abstract

A method for electrically grounding structures or equipment includes providing an open-topped enclosure having peripheral sidewalls defining an interior cavity, positioning the enclosure over an in situ soil mass, placing a selected soil material in the cavity, and installing a grounding device in the soil contained in the cavity, so as to establish electrically-conductive continuity between the grounding device and the soil material in the cavity, and between the soil material in the cavity and the underlying in situ soil mass. Electrical cables can then be run between the grounding device and a structure or equipment to effect electrical grounding thereof. The effectiveness of the resultant electrical grounding may be enhanced by moistening the soil material in the enclosure and/or the in situ soil mass. The enclosure may have an open bottom, or may have a floor element with apertures allowing passage of moisture.

Claims

1. A method for electrically grounding a structure or equipment component, said method comprising the steps of: (a) providing an open-topped enclosure having peripheral sidewalls defining an enclosure cavity and a floor element, wherein the floor element is made from an electrically-conductive material, and interconnects two or more adjacent or opposing sidewalls; (b) positioning the enclosure over an in situ soil mass; (c) placing a selected quantity of a selected soil material in the enclosure cavity, so as to establish electrically-conductive continuity between the soil material in the enclosure cavity and the in situ soil mass; and (d) connecting an electrical cable between the structure or equipment component and a grounding terminal having electrically-conductive continuity with the soil material in the enclosure cavity; wherein: (e) the grounding terminal is in electrical communication with the floor element and projects above the soil material in the enclosure cavity; and (f) one of the peripheral sidewalls is an electrically-conductive sidewall and serves as the grounding terminal.

2. A method as in claim 1 wherein the floor element has at least one aperture.

3. A method as in claim 1, comprising the further step of moistening the soil material in the enclosure cavity.

4. A method as in claim 1, comprising the further step of moistening the in situ soil mass.

5. A grounding apparatus for electrically grounding a structure or equipment component, said grounding apparatus comprising an open-topped enclosure having peripheral sidewalls defining an enclosure cavity, wherein the enclosure includes a floor element made from an electrically-conductive material interconnecting two or more adjacent or opposing sidewalls, wherein: (a) the enclosure is positioned over an in situ soil mass; (b) a selected quantity of a selected soil material is disposed within the enclosure cavity, so as to establish electrically-conductive continuity between the soil material in the enclosure cavity and the in situ soil mass; and (c) an electrical cable is connected between the structure or equipment component and a grounding terminal having electrically-conductive continuity with the soil material in the enclosure cavity; (d) the grounding terminal is in electrical communication with the floor element and projects above the soil material in the enclosure cavity; and (e) one of the peripheral sidewalls is an electrically-conductive sidewall and serves as the grounding terminal.

6. A grounding apparatus as in claim 5 wherein the floor element has at least one aperture.

7. A grounding apparatus as in claim 5 wherein the soil mass in the enclosure cavity has been moistened.

8. A grounding apparatus as in claim 5 wherein the in situ soil mass has been moistened.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Embodiments will now be described with reference to the accompanying Figures, in which numerical references denote like parts, and in which:

(2) FIG. 1 is an isometric view of one embodiment of a grounding apparatus in accordance with the present disclosure.

(3) FIG. 2 is a cross-section through the grounding apparatus in FIG. 1.

(4) FIG. 3 is an isometric view of the grounding apparatus in FIG. 1, covered by a weatherproof cover.

(5) FIG. 4 is a cross-section through an alternative embodiment of a grounding apparatus in accordance with the present disclosure.

DETAILED DESCRIPTION

(6) FIGS. 1 and 2 illustrate an embodiment of a grounding apparatus 100 in accordance with the present disclosure. In the illustrated embodiment, grounding apparatus 100 comprises an enclosure 12 having peripheral sidewalls 14 defining an interior cavity 18. Optionally, a floor element 16 having at least one aperture 20 may interconnect adjacent and/or opposite sidewalls 14.

(7) FIG. 2 illustrates grounding apparatus 100 in use in accordance with one method in accordance with the present disclosure, with enclosure 12 positioned over an in situ soil surface SS and with its interior cavity 18 filled with soil 50. A selected electrical grounding device 24 is shown installed with its electrodes 32 penetrating into the soil 50 within enclosure 12. The size and shape of enclosure 12 may be varied as appropriate to suit the particular type of grounding device 24 to be used with grounding apparatus 100. The grounding device 24 in the illustrated embodiment corresponds to a grounding device disclosed in U.S. Pat. No. 8,420,929, but this is by way of non-limiting example only, as embodiments in accordance with the present disclosure are not limited or restricted to use with any particular type of grounding apparatus or device.

(8) Electrical conductivity established between the soil 50 within enclosure 12 and the underlying in situ soil mass SM makes it possible to install grounding means (such as grounding device 24) without penetrating or otherwise significantly disturbing the in situ soil mass SM. The conductivity between the soil 50 within enclosure 12 and the in situ soil mass SM can be enhanced by adding water to soil 50, and preferably in sufficient quantity such that some of the water can seep out of soil 50 (through apertures 20 in floor 16, if present) into the in situ soil mass SM, thus enhancing electrical continuity between soil 50 within enclosure 12 and the in situ soil mass SM below.

(9) In the illustrated exemplary embodiment, grounding device 24 comprises a main body 26 having a top surface 28, a bottom surface 30, and a plurality of laterally-spaced electrodes 32 mounted to and extending downward from main body 26. Grounding device 24 may incorporate a water reservoir 36 and an inlet 42 for filling reservoir 36. Outlets 38 in the bottom of reservoir 36 allow water to drip into soil 50 contained in enclosure 12 to enhance electrical conductivity between electrodes 32 and soil 50. However, this is by way of non-limiting example only; it is not essential for grounding device 24 to include a water reservoir, as water can be added to soil 50, if desired, by any effective alternative means.

(10) The exemplary grounding device 24 illustrated in the Figures includes at least one grounding terminal 34 in electrically-conductive communication with electrodes 32, to facilitate connection of grounding cables 44 from structures or equipment requiring either temporary or permanent electrical grounding. Grounding terminals 34 can be provided in any form functionally effective to establish electrical communication with electrodes 32. Grounding cables 44 may be connected to grounding terminals 34 by means of alligator clips 46 or any other functionally effective means for establishing an electrical connection between grounding cables 44 and electrodes 32 via grounding terminals 34 and main body 26 (including bolted connections).

(11) As shown in FIG. 3, grounding device 24 may be provided with a weatherproof cover 40 as appropriate for the conditions in which grounding apparatus 100 is to be used. As well, a heater (not shown) may be provided (preferably in conjunction with a cover 40) to prevent freezing of soil in and around grounding device 24.

(12) The method used to install the selected grounding device may vary according to the particular type of grounding device being used. When the illustrated grounding device 24 is used, main body 26 of grounding device 24 may be impacted either manually (such as by a sledge hammer) or mechanically (such as by the bucket of a backhoe or a front-end loader) to force electrodes 32 into the soil 50 within enclosure 12. Grounding device 24 optionally may incorporate impact abutments 23 to facilitate application of force to grounding device 24 for this purpose.

(13) FIG. 4 illustrates an alternative embodiment of a grounding apparatus 200 in accordance with the present disclosure, in which enclosure 12 has one or more electrically-conductive perimeter sidewalls 14 and optionally may have a perforated or apertured floor element 16 (which optionally may be electrically conductive and in electrical communication with sidewalls 14). Enclosure 12 is positioned on the ground (i.e., earth) surface, and then a selected soil material 22 is deposited into cavity 18 of enclosure 12 (and compacted as may be appropriate). One or more grounding cables may be connected directly to electrically-conductive sidewall 14 of enclosure 12 of grounding apparatus 200 to establish electrical continuity between cables 44 and floor 16 and, thereby, with the in situ soil underlying enclosure 12. Alternatively, grounding cables could be connected to apparatus 200 by suitable terminal means such as (but not limited to) a conductive metal terminal plate 19 welded to sidewall 14 as shown in FIG. 4.

(14) Preferably, the use of grounding apparatus 200 will moistening soil 18 as well as the in situ soil to enhance the effectiveness of the electrical continuity with the in situ soil. Although not specifically illustrated in the Figures, the use of this grounding method would appear generally as shown in FIG. 2 but without grounding device 24, and with grounding cable 44 connected to sidewall 14 (or to terminal plate 19).

(15) In a variant of grounding apparatus 200, grounding cable 44 could be connected to grounding terminal means in electrical communication with an electrically-conductive floor element 16 and projecting above soil 50 in enclosure 12, or otherwise projecting from enclosure 12 to facilitate connection with grounding cable 44. In this variant embodiment, sidewalls 14 optionally could be made from a non-electrically-conductive material.

(16) The soil 50 to be placed in cavity 18 of enclosure 12 of grounding apparatus 100 (or 200) may be selected taking into consideration the characteristics of the in situ soil mass SM over which apparatus 100 (or 200) is to be positioned. For example, in cases where the in situ soil mass SM is a porous soil (e.g., sand/gravel), soil 50 may be a similar porous material. In cases where the in situ soil mass SM is a cohesive (i.e., clayey) material, it may be beneficial to use a layered soil structure to facilitate controlled seepage of added moisture into soil 50 and the underlying in situ soil mass SM.

(17) In one field test performed during the summer using grounding apparatus in accordance with the present disclosure over a moist clay in situ soil mass in Drayton Valley, Alberta, the following layered materials were placed in cavity 18 of enclosure 12: heavy-duty drainage cloth (over a perforated floor 16); a 6-inch layer of blue clay; a 12-inch layer of sand-mulch mixture over the clay layer; a 12-inch layer of lava rock; and a pattern of -inch PVC piping placed over the clay layer (including at least one riser pipe extending above the clay layer), to facilitate controlled seepage of water into the clay layer and the underlying clayey in situ soil mass.
The optional drainage cloth over floor 16 prevents soil 50 from falling through apertures 20 in floor 16, and facilitates transportation and re-use of apparatus 100 (or 200) without removing soil materials from enclosure cavity 18. The lava rock layer and the sand-mulch layer reduce the total weight of the apparatus, thus further facilitating transportation and re-use.

(18) The soil structure described above is by way of example only. The soil structure for installation in enclosure cavity 18 can be designed to control the rate of water flow as may be appropriate for a given installation. For example, the soil structure described above was designed to drain approximately 30 imperial gallons of at an initial rate of 10 gallons per hour after being initially filled with 60 gallons of water, and then to seep at a rate of 3 gallons per day.

(19) In the Drayton Valley test, 60 imperial gallons of water were added to the apparatus after installation over the in situ clay soil mass, and electrical resistance was measured at 4.0 ohms. The apparatus was tested weekly throughout the summer, with no additional water added, and resistance was consistently measured at 3.6 ohms.

(20) In another field test performed during late autumn (November/December) in Grande Prairie, Alberta, a grounding apparatus as above was positioned over a 50-year-old concrete floor, with a 3-inch layer of wet potting soil sandwiched between the concrete floor and floor 16 of the grounding apparatus. Resistance with this installation was measured at 18 ohms.

(21) In a further field test, a grounding apparatus as above was installed over an in situ soil mass consisting of a hard-packed dirty gravel in the Grande Prairie area, and was then tested periodically between August and November. Measured resistance varied from 13 ohms in August to 30 ohms in November. Heat was then added to the apparatus (by circulating a heated fluid through the PVC tubing). In further tests made during December and January (while the underlying soil was frozen), resistance was measured between 30 ohms and 13 ohms.

(22) It will be readily appreciated by those skilled in the art that various alternative embodiments of the disclosed grounding apparatus and methods may be devised without departing from the scope of the present teachings, including modifications that may use equivalent structures or materials subsequently conceived or developed. It is to be especially understood that it is not intended for grounding apparatus and methods in accordance with the present disclosure to be limited to any described or illustrated embodiment, and that the substitution of a variant of a claimed element or feature, without any substantial resultant change in the working of the apparatus and methods, will not constitute a departure from the scope of the disclosure.

(23) In this patent document, any form of the word comprise is to be understood in its non-limiting sense to mean that any element or feature following such word is included, but elements or features not expressly mentioned are not excluded. A reference to an element by the indefinite article a does not exclude the possibility that more than one such element is present, unless the context clearly requires that there be one and only one such element. Any use of any form of the words connect, engage, couple, attach, or any other term describing an interaction between elements is not intended to limit that interaction to direct interaction between the subject elements, and may also include indirect interaction between the elements such as through secondary or intermediary structure.

(24) In this document, the term ground is used in both noun and verb forms with reference to electrical grounding and electrical ground connections. The term ground may also be used herein with reference to earthen materials (e.g., soil) or a surface of the earth. The intended meaning of any form of the word ground in a given instance will be readily apparent to persons skilled in the art having due regard to the context in which it is used.